Huawei Ascend Y User manual

Y210 Mobile Phone
Maintenance Manual
Issue
1.0
Date
2012-11-28
HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2012-11-28)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
i
Copyright © Huawei Technologies Co., Ltd. 2012. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address:
Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website:
http://www.huawei.com
Email:
[email protected]

Y210 Mobile Phone
Maintenance Manual
About This Document
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About This Document
Author
Prepared by
R&D
Date
-
Reviewed by
Maintenance support team
Date
-
Approved by
Service representative
Date
-
Change History
Date
Version
Change Reason
Section
Description
Author

Y210 Mobile Phone
Maintenance Manual
Contents
Issue 1.0 (2012-11-28)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
iii
Contents
About This Document.................................................................................................................... ii
1 Product Overview .........................................................................................................................1
1.1 Appearance.......................................................................................................................................................1
1.2 Features............................................................................................................................................................2
2 Applicable Scope and Precautions ............................................................................................4
2.1 Applicable Scope..............................................................................................................................................4
2.2 Precautions.......................................................................................................................................................4
2.3 How to Obtain Product and Repair Information ..............................................................................................4
3 Exploded View...............................................................................................................................5
4 Components on the PCBA...........................................................................................................7
5 Software Upgrade .........................................................................................................................9
5.1 Upgrade Preparation.........................................................................................................................................9
5.2 Performing an Upgrade....................................................................................................................................9
6 Maintenance Tools......................................................................................................................11
7 Disassembly Procedure..............................................................................................................13
8 Assembly Procedure...................................................................................................................17
9 Principles and Failure Analysis ...............................................................................................21
9.1 Block Diagram...............................................................................................................................................21
9.1.1 Functions of the PCBA .........................................................................................................................22
9.2 Baseband Unit................................................................................................................................................26
9.2.1 Power-on Management Circuits............................................................................................................26
9.2.2 Charging Management Circuits ............................................................................................................30
9.3 RF Unit...........................................................................................................................................................31
9.3.1 RF Failure .............................................................................................................................................31
9.3.2 GPS.......................................................................................................................................................35
9.3.3 Wi-Fi/Bluetooth/FM Module................................................................................................................35
9.4 Peripheral Circuits..........................................................................................................................................37
9.4.1 Display..................................................................................................................................................37
9.4.2 Camera..................................................................................................................................................40

Y210 Mobile Phone
Maintenance Manual
Contents
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9.4.3 USB.......................................................................................................................................................43
9.4.4 Headset Jack..........................................................................................................................................44
9.4.5 Keys and Buttons ..................................................................................................................................46
9.4.6 Tricolor Indicator and Touch Key Backlight Circuits ...........................................................................47
9.4.7 Battery Connector .................................................................................................................................48
9.4.8 Accelerometer .......................................................................................................................................49
9.4.9 Compass................................................................................................................................................50
9.4.10 Proximity Sensor.................................................................................................................................50
9.4.11 Vibration Motor...................................................................................................................................52
9.4.12 Receiver ..............................................................................................................................................53
9.4.13 Microphone.........................................................................................................................................56
9.4.14 Touch Panel.........................................................................................................................................57
9.4.15 SIM Card.............................................................................................................................................58
9.4.16 microSD Card .....................................................................................................................................59
10 Solder Points on the PCBA and BGA Chip .........................................................................61
11 Functional Tests.........................................................................................................................67
11.1 MMI Test......................................................................................................................................................67
11.2 Voice Call Test..............................................................................................................................................70

Y210 Mobile Phone
Maintenance Manual
1 Product Overview
Issue 1.0 (2012-11-28)
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Copyright © Huawei Technologies Co., Ltd.
1
1 Product Overview
1.1 Appearance
Figure 1-1 shows the appearance of the HUAWEIAscend Y210 mobile phone (Y210 for
short).
Figure 1-1 Y210 mobile phone

Y210 Mobile Phone
Maintenance Manual
1 Product Overview
Issue 1.0 (2012-11-28)
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1.2 Features
Table 1-1 describes the features of the Y210.
Table 1-1 Features
Item
Description
Dimensions (H x W x D)
12.4 mm x 117 mm ×62 mm
Technical standards
Y210-0010: W2100/W900,
GSM900/1800/1900
Y210-0100: W2100/W900,
GSM850/900/1800/1900
Y210-0151: W2100/W1900/W850,
GSM850/900/1800/1900
Y210-0200: W2100/W900,
GSM850/900/1800/1900
Y210-0251: W2100/W1900/W850,
GSM850/900/1800/1900
GSM = Global System for Mobile
Communications
Frequency bands
Y210-0010: W2100/W900,
GSM900/1800/1900
Y210-0100: W2100/W900,
GSM850/900/1800/1900
Y210-0151: W2100/W1900/W850,
GSM850/900/1800/1900
Y210-0200: W2100/W900,
GSM850/900/1800/1900
Y210-0251: W2100/W1900/W850,
GSM850/900/1800/1900
Frequency ranges:
WCDMA 900 MHz: 880–915 MHz (uplink),
925–960 MHz (downlink)
WCDMA 2100 MHz: 1920–1980 MHz
(uplink), 2110–2170 MHz (downlink)
WCDMA 1900 MHz: 1850–1910 MHz
(uplink), 1930–1990 MHz (downlink)
WCDMA 850 MHz: 824–849 MHz (uplink),
869–894 MHz (downlink)
GSM 850 MHz: 824–849 MHz (uplink),
869–894 MHz (downlink)
GSM 900 MHz: 880–915 MHz (uplink),
925–960 MHz (downlink)
GSM 1800 MHz: 1710–1785 MHz (uplink),
1805–1880 MHz (downlink)
GSM 1900 MHz: 1850–1910 MHz (uplink),

Y210 Mobile Phone
Maintenance Manual
1 Product Overview
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Item
Description
1930–1990 MHz (downlink)
WCDMA = Wideband Code Division Multiple
Access
Weight
< 130 g with battery
Type
Bar type
Antenna
Built-in
Card type
Subscriber identity module (SIM) and universal
subscriber identity module (USIM)
Charger
5 V, 550 mA
Battery
1250 mAh Li-ion
Standby time: up to 305 hours
Talk time: up to 670 minutes (depending on
network conditions)
Display
Resolution
320 x 480 pixels
Liquid crystal
display (LCD) type
Thin film transistor (TFT)
Color
262K
LCD size
3.5 inches
Ports
Charging port
Micro Universal Serial Bus (USB) port
USB port
Micro USB port
microSD card slot
microSD card slot
Headset jack
3.5 mm (LRGM)
Maximum
transmit power
23–33 dBm
Static sensitivity
≤–104 dBm
Temperature
Operating temperature: –10°C to +55°C
Storage temperature: –40°C to +70°C
Humidity
Operating humidity: 5% to 95% RH

Y210 Mobile Phone
Maintenance Manual
2 Applicable Scope and Precautions
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2 Applicable Scope and Precautions
2.1 Applicable Scope
This document provides repair instructions for technicians at service centers authorized by
Huawei. Being Huawei proprietary, this document is accessible only for authorized service
centers and companies. Although every effort was made to ensure the accuracy of this
document, errors may still exist. If you find any errors or have any suggestions, please contact
Huawei's customer service.
2.2 Precautions
Only qualified technicians are allowed to perform repair and calibration.
Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
Ensure that all the components, screws, and insulators are properly installed after repair
and calibration, and that all cables and wires are installed and connected correctly.
Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
2.3 How to Obtain Product and Repair Information
To obtain product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/cn/technicaIndex.do.

Y210 Mobile Phone
Maintenance Manual
3 Exploded View
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3 Exploded View
Figure 3-1 shows the exploded view of the Y210.
Figure 3-1 Exploded view
The components listed in the following table are structural parts of the phone and cannot be used as
reference to request spare parts.
Table 3-1 lists the components in the exploded view.
Table 3-1 Components in the exploded view
No.
Description
Quantity
1
Touch panel
1

Y210 Mobile Phone
Maintenance Manual
3 Exploded View
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No.
Description
Quantity
2
Front cover assembly
1
3
Power button flexible printed circuit (FPC) assembly
1
4
Receiver
1
5
LCD
1
6
LCD conductive rubber
2
7
Receiver insulation film
1
8
Printed circuit board assembly (PCBA)
1
9
Volume button FPC assembly
1
10
Motor
1
11
Speaker
1
12
Main antenna support assembly
1
13
Camera support foam
1
14
Camera
1
15
Rear cover assembly
1
16
Battery
1
17
Screws
8
18
Battery cover
1

Y210 Mobile Phone
Maintenance Manual
4 Components on the PCBA
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4 Components on the PCBA
J1101 headset jack
Faults caused if damaged:
Handset malfunctions
L901 motor contact
U6100 Wi-Fi chip
Faults caused if damaged:
Wi-Fi malfunctions
U1303 backlight driver IC
Faults caused if damaged:
Black screen
U6000 Bluetooth & FM chip
Faults caused if damaged:
Bluetooth or FM malfunctions
U601 MCP chip
Faults caused if damaged:
Power-on failure or software
failure
J1605 volume button FPC
port
Faults caused if damaged:
Volume button malfunctions
U401 CPU-MSM7225A
Faults caused if damaged:
Power-on failure or system
not responding
U201 PMIC-PM8029
Faults caused if damaged:
Power failure
J1601 touch panel port
Faults caused if damaged:
Touch panel malfunctions
J1302 LCD port
Faults caused if damaged:
LCD malfunctions
J1401 SD card slot
Faults caused if damaged:
SD card malfunctions
J901 USB port
Faults caused if damaged:
USB connection failure
U1204 Gravity sensor
Faults caused if damaged:
Gravity sensor malfunctions
J1402 SIM card holder
Faults caused if damaged:
SIM card identification failure
J1403 dual card SIM 2 card
holder
Faults caused if damaged:
SIM card identification failure
U3801 WCMDA/GSM
transception chip
Faults caused if damaged:
RF function error
U3302 power module, PA
Faults caused if damaged:
U3501 power module, PA
Faults caused if damaged:
GSM900 transmit error
U3201 RF switch
Faults caused if damaged:
Network registration failure
J3204 RF connector
Faults caused if damaged:
Network registration failure
J902 battery connector
Faults caused if damaged:
Battery power supply failure
SP1501 speaker contact
Faults caused if damaged:
Speaker malfunctions
U3401 power module, PA
Faults caused if damaged:
RF transmit error
U4202 power module, PA
Faults caused if damaged:
RF transmit error

Y210 Mobile Phone
Maintenance Manual
4 Components on the PCBA
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SP1502 receiver contact
J1608 J1608 power button
spring
Faults caused if damaged:
Power button malfunctions
MIC1501 microphone
Faults caused if damaged:
No sounds for recordings
D1602 D1603 D1604 power
button LED
Faults caused if damaged:
Functional keys backlight off
D1601 tri-color indicator
Faults caused if damaged:
Indicator off

Y210 Mobile Phone
Maintenance Manual
5 Software Upgrade
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5 Software Upgrade
5.1 Upgrade Preparation
Prepare the items listed in Table 5-1 before a software upgrade.
Table 5-1 Items to be prepared
Item
Description
Remarks
Upgrade
environment
Computer
The computer is used to copy upgrade
software.
microSD card
The microSD card must have more than 1 GB
free space.
Battery
The battery level must not be lower than 30%.
Upgrade file
Main upgrade package
dload/UPDATE.app
Vendor upgrade
package
vendor_XXX_XXX/UPDATE.app
Upgrade
method
Using the microSD card
Normal upgrade
Forcible upgrade
5.2 Performing an Upgrade
To upgrade theY210, perform the following steps:
Step 1 Format the microSD card.
Step 2 Create a dload folder in the microSD card's root directory.
Step 3 Copy the upgrade file to the dload folder.
Step 4 Insert the microSD card to the Y210, and power on the phone. On the standby screen, enter
*#*#2846579#*#*, select SD card upgrade, and touch Confirm.

Y210 Mobile Phone
Maintenance Manual
5 Software Upgrade
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Before the upgrade, NV items backup is performed (if the phone's NV items has never been
backed up). Then, the phone restarts and the upgrade starts.
The upgrade progress is displayed on the LCD.
Figure 5-1 shows the upgrade progress.
Figure 5-1 Upgrade progress
After the upgrade, the phone restarts and the NV items are restored.
Step 5 After the phone is upgraded using the main upgrade package, upgrade the phone using the
vendor upgrade package in the same way.
----End
If the phone fails to start, use either of the following methods to perform a forcible upgrade:
Install the battery on the phone. If the screen splashes, remove the battery, wait for 5
seconds, and re-install the battery. Press and hold the volume up and down buttons, and
press the power button. The phone then enters forcible upgrade mode. The software
download process is similar to that during a normal upgrade.
If no battery is installed, press and hold the volume up and down buttons, and connect
the charger. The phone then enters forcible upgrade mode. It is recommended that you
upgrade the software using the charger. If the upgrade still fails, replace the microSD
card and try again.

Y210 Mobile Phone
Maintenance Manual
6 Maintenance Tools
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6 Maintenance Tools
Name: constant-temperature heat gun
Usage: to heat components
Name: constant-temperature heat gun
Usage: to heat components
Name: soldering iron
Usage: to maintain and solder components
Name: direct current (DC) power supply
Usage: to supply DC current
Name: soldering table
Usage: to secure the PCBA

Y210 Mobile Phone
Maintenance Manual
6 Maintenance Tools
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Name: lead-free solder wire
Usage: to solder components
Name: digital multimeter
Usage: to measure during repair
Name: toolkit
Usage: to assemble and disassemble phone
Name: electric screwdriver
Usage: to fasten and remove screws

Y210 Mobile Phone
Maintenance Manual
7 Disassembly Procedure
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7 Disassembly Procedure
4. Remove the battery.
3. Remove the battery cover: Press the upper part of
the battery cover and push it towards the bottom.
2. Follow the Y210 disassembly instructions.
1. Wear an electro-static discharge (ESD) wrist strap,
and ensure that the strap is grounded properly.

Y210 Mobile Phone
Maintenance Manual
7 Disassembly Procedure
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10. Release the volume key FPC.
9. Remove the volume key.
8. Use a cover opener to release the latches between
the rear cover and the front cover.
7. Use the disassembly tab to release the latch in the
upper left corner.
6. Use the disassembly tab to release the latch in the
upper left corner.
5. Remove the eight screws from the rear cover.

Y210 Mobile Phone
Maintenance Manual
7 Disassembly Procedure
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16. Apply a protective film on the LCD.
15. Remove the LCD.
14. Release the BTB connector, and remove the
camera.
13. Remove the PCBA.
12. Release the two latches on the PCBA.
11. Release the BTB connector cable between the
touch panel and the LCD.