Huawei MU739 Installation instructions

HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Issue 01
Date 2011-08-24
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Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For
any assistance, please contact our local office or company headquarters.
Huawei Technologies Co., Ltd.
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Notice
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
About This Document
Issue 01 (2011-08-24) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
3
About This Document
History
Version Date Chapter Descriptions
01(Draft1) 2011-06-24 Creation
01(Draft2) 2011-08-24 Updated
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
About This Document
Issue 01 (2011-08-24) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
4
Summary
This document provides information about the major functions, supported services,
system architecture, and technical references of HUAWEI MU739 HSPA+ LGA
Module.
The following table lists the contents of this document.
Chapter Details
1 Introduction Describes the short introduction of the
product.
2 Overall Description Describes the Function overview, Circuit
Block Diagram and Application Block
Diagram of the product.
3 Description of the Application
Interfaces
Describes the external application
interfaces of the product.
4 RF Specifications Describes the RF specifications of the
product.
5 Electrical and Reliability Features Describes the electrical and reliability
features of the interfaces in the product.
6 Mechanical Specifications Describes the Dimension, Label and
Packing System of the product.
7 Certifications Describes the certifications of the
product.
8 Safety Information Lists the safety information when using
the product.
9 Appendix A Circuit of Typical Interface
Lists the circuit of typical interface of the
product.
10 Appendix B Acronyms and
Abbreviations
Lists the acronyms and abbreviations
mentioned in this document.
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Contents
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Copyright © Huawei Technologies Co., Ltd.
5
Contents
1 Introduction....................................................................................................................................8
2 Overall Description ......................................................................................................................9
2.1 About This Chapter........................................................................................................................... 9
2.2 Function Overview............................................................................................................................ 9
2.3 Circuit Block Diagram......................................................................................................................11
2.4 Application Block Diagram ............................................................................................................. 12
3 Description of the Application Interfaces..............................................................................13
3.1 About This Chapter......................................................................................................................... 13
3.2 LGA Interface ................................................................................................................................. 13
3.3 Power Interface .............................................................................................................................. 20
3.3.1 Overview................................................................................................................................ 20
3.3.2 VBAT Interface....................................................................................................................... 20
3.3.3 Output Power Supply Interface ............................................................................................. 21
3.4 Signal Control Interface.................................................................................................................. 21
3.4.1 Overview................................................................................................................................ 21
3.4.2 Input Signal Control Pins ....................................................................................................... 23
3.4.3 Output Signal Control Pins .................................................................................................... 26
3.5 USB Interface ................................................................................................................................. 29
3.6 USIM Card Interface ...................................................................................................................... 30
3.6.1 Overview................................................................................................................................ 30
3.6.2 Circuit Recommended for the USIM Card Interface.............................................................. 31
3.6.3 ESD Protection for the USIM Card Interface......................................................................... 33
3.7 Audio Interface ............................................................................................................................... 33
3.8 IPC Interface .................................................................................................................................. 34
3.8.1 HSIC interface ....................................................................................................................... 34
3.8.2 MIPI_HSI interface ................................................................................................................ 36
3.9 General Purpose I/O Interface ....................................................................................................... 36
3.10 JTAG Interface ............................................................................................................................. 37
3.11 RF Antenna Interface.................................................................................................................... 37
3.12 Reserved Interface ....................................................................................................................... 37
3.13 NC Interfaces ............................................................................................................................... 38
4 RF Specifications.........................................................................................................................39
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4.1 About This Chapter......................................................................................................................... 39
4.2 Antenna Installation Guidelines...................................................................................................... 39
4.3 Operating Frequencies................................................................................................................... 39
4.4 Conducted RF Measurement ......................................................................................................... 40
4.4.1 Test Environment................................................................................................................... 40
4.4.2 Test Standards....................................................................................................................... 40
4.5 Conducted Rx Sensitivity and Tx Power ........................................................................................ 40
4.5.1 Conducted Receive Sensitivity.............................................................................................. 40
4.5.2 Conducted Transmit Power ................................................................................................... 41
4.6 Antenna Design Requirements ...................................................................................................... 42
4.6.1 Antenna Design Indicators..................................................................................................... 42
4.6.2 Interference ........................................................................................................................... 44
4.6.3 GSM/WCDMA Antenna Requirements.................................................................................. 44
4.6.4 Radio Test Environment ........................................................................................................ 45
5 Electrical and Reliability Features ...........................................................................................47
5.1 About This Chapter......................................................................................................................... 47
5.2 Absolute maximum ratings ............................................................................................................. 47
5.3 Operating and Storage Temperatures and Humidity...................................................................... 48
5.4 Electrical Features of Application Interfaces .................................................................................. 48
5.5 Power Supply Features .................................................................................................................. 51
5.5.1 Input Power Supply ............................................................................................................... 51
5.5.2 Power Consumption .............................................................................................................. 51
5.6 Reliability Features......................................................................................................................... 55
5.7 EMC and ESD Features................................................................................................................. 56
6 Mechanical Specifications.........................................................................................................58
6.1 About This Chapter......................................................................................................................... 58
6.2 Dimensions and Interfaces............................................................................................................. 58
6.3 Customer PCB Pad Design............................................................................................................ 60
6.4 Label............................................................................................................................................... 60
6.5 Packing System.............................................................................................................................. 61
7 Certifications................................................................................................................................62
7.1 About This Chapter......................................................................................................................... 62
7.2 Certifications................................................................................................................................... 62
7.3 Environmental Protection Certification and Test ............................................................................ 63
7.3.1 RoHS ..................................................................................................................................... 63
7.3.2 WEEE .................................................................................................................................... 63
7.3.3 PVC-free................................................................................................................................ 64
7.3.4 Packaging .............................................................................................................................. 64
7.4 National Compulsory Certification.................................................................................................. 64
7.4.1 Product Certification .............................................................................................................. 64
7.4.2 Importance of Product Certification ....................................................................................... 64
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7.4.3 Product Certification Test Items............................................................................................. 65
7.4.4 Product Certification Classifications ...................................................................................... 65
7.4.5 Certification Modes................................................................................................................ 66
7.4.6 Certification Types ................................................................................................................. 66
7.4.7 Guide to Product Certification ............................................................................................... 75
7.5 GCF and PTCRB............................................................................................................................ 76
7.5.1 GCF Certification ................................................................................................................... 76
7.5.2 PTCRB Certification .............................................................................................................. 77
7.5.3 Overall-System Certification .................................................................................................. 78
8 Safety Information......................................................................................................................82
8.1 Interference .................................................................................................................................... 82
8.2 Medical Device ............................................................................................................................... 82
8.3 Area with Inflammables and Explosives......................................................................................... 82
8.4 Traffic Security................................................................................................................................ 83
8.5 Airline Security................................................................................................................................ 83
8.6 Safety of Children........................................................................................................................... 83
8.7 Environment Protection .................................................................................................................. 83
8.8 WEEE Approval.............................................................................................................................. 83
8.9 RoHS Approval............................................................................................................................... 83
8.10 Laws and Regulations Observance ............................................................................................. 84
8.11 Care and Maintenance ................................................................................................................. 84
8.12 Emergency Call ............................................................................................................................ 84
8.13 Specific Absorption Rate (SAR) ................................................................................................... 84
8.14 Regulatory Information................................................................................................................. 85
8.14.1 CE Approval (European Union) ........................................................................................... 85
8.14.2 FCC Statement.................................................................................................................... 85
9 Appendix A Circuit of Typical Interface................................................................................86
10 Appendix B Acronyms and Abbreviations ..........................................................................88
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Introduction
Issue 01 (2011-08-24) Huawei Proprietary and Confidential
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1 Introduction
This document describes the hardware application interfaces and air interfaces that
are provided when the HUAWEI MU739 HSPA+ LGA Module (hereinafter referred to
as the MU739 module) is used.
This document helps you to understand the interface specifications, electrical features
and related product information of the MU739 module.
MU739 module is related to the following products:
Product name Description
MU739 WCDMA/HSDPA/HSUPA/HSPA+: 850 MHz/900 MHz/1700 MHz
(AWS) /1900 MHz/2100 MHz
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
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Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU739 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature Description
Physical
Features
Dimensions (L × W × H): 20 mm × 30 mm × 2.0mm
(NOTE : the final vesion will be 2.0mm height, the existing
samples provided may be 2.2mm height.)
Weight: less than 3.1 g
Operating
Bands
WCDMA/HSDPA/HSUPA/HSPA+: 850 MHz/900 MHz/1700 MHz
(AWS) /1900 MHz/2100 MHz
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
Operating
Temperature
Normal working temperature: - 10°C ~ + 55°C
Extreme working temperatures: - 30°C ~ - 10°C and + 55°C ~ +
75°C
Ambient
Temperature
for Storage
- 40°C ~ + 85°C
Moisture RH5% ~ RH95%
Power Voltage 3.3 V ~ 4.2 V (3.8 V is recommended.)
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Hardware Guide
Overall Description
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Feature Description
AT Commands See the HUAWEI MU739 HSPA+ LGA Module AT Command
Interface Specification.
Application
Interface
(114-pin LGA
interface)
One standard Universal Subscriber Identity Module (USIM) card
(3 V or 1.8 V)
Audio: one I2S interface
USB 2.0 (high speed)
Power on
Reset
LED controlling signals x2
Configurable General-purpose I/O (GPIO) x2
Antenna pads x2
Power pins
SMS New message alert, text message receiving, and text message
sending
Management of text messages: read messages, delete
messages, storage status and message list
Supporting MO and MT.
Point-to-point and cell broadcast
Supporting formats of TEXT and PDU
Data Services GSM CS: UL 14.4 kbps/DL 14.4 kbps
GPRS:UL 85.6 kbps/DL 85.6 kbps
EDGE: DL 236.8 kbps/UL: 236.8 kbps
WCDMA CS: UL 64 kbps/DL 64 kbps
WCDMA PS: UL 384 kbps/DL 384 kbps
HSPA+: UL 5.76 Mbps/DL 21.6 Mbps
Applications USIM PBM (Phone Book Management)
Certification
Information
European Conformity (CE)
Federal Communications Commission (FCC)
Globe Certification Forum (GCF)
PCS Type Certification Review Board (PTCRB)
The certifications of different type of MU739 module are different because of sale markets. To
get the details, please refer to ‘Chapter 7’.
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Overall Description
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11
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU739 module. The application
block diagram and major functional units of the MU739 module contain the following
parts:
Baseband controller
Power manager
Multi-chip package (MCP) memory
Radio frequency (RF) transceiver
RF interface
RF PA
Figure 2-1 Circuit block diagram of the MU739 module
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Overall Description
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12
2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MU739 module
USB Interface The USB interface supports USB 2.0 high speed standard.
USIM Interface The USIM interface provides the interface for a USIM card.
The USIM card can be inserted into the host side.
Power Supply DC 3.8V is recommended.
Audio Interface The module supports one I2S interface.
RF Pad RF antenna interface
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU739
module, including:
LGA Interface
Power Interface
Signal Control Interface
USB Interface
USIM Card Interface
Audio Interface
IPC Interface
General Purpose I/O Interface
JTAG Interface
RF Antenna Interface
Reserved Interface
NC Interfaces
3.2 LGA Interface
The MU739 module uses a 114-pin LGA as its external interface. For details about the
module and dimensions of the LGA, see “6.2 Dimensions and Interfaces”.
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Hardware Guide
Description of the Application Interfaces
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Figure 3-1 shows the sequence of pins on the 114-pin signal interface of the MU739
module.
Figure 3-1 Bottom view of sequence of LGA interface pins
Table 3-1 shows the definitions of pins on the 114-pin signal interface of the MU739
module.
7877 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
114 113 112 111 110 109
108 107 106 105 104 103
102 101 100 99 98 97
96 95 94 93 92 91
90 89 88 87 86 85
84 83 82 81 80 79
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
76
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
GPIO pads
Power pads
USIM pads
GND pads
USB pads
Control pads RF pads
JTAG pads
Audio pads
HSIC pads
MIPI pads
NC pads
Reserved pads
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Description of the Application Interfaces
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Table 3-1 Definitions of pins on the LGA interface
PIN
No.
Pin Name I/
O
Description DC Characteristics (V)
Normal MUX Min Typical Max
1 NC - No connect - - -
2 JTAG_TDO O JTAG Serial Data Out -0.3 1.8 2.1
3 NC - No connect - - -
4 NC - No connect - - -
5 NC - No connect - - -
6 GPIO1 I/O
General I/O pins. The
function of these pins has
not been defined. Optional
-0.3 1.8 2.1
7 NC - No connect - - -
8 JTAG_TRST_N O JTAG Reset/Module enable -0.3 1.8 2.1
9 RESOUT_N O Reset output -0.3 1.8 2.1
10 JTAG_TMS I JTAG State machine
control signal -0.3 1.8 2.1
11 JTAG_TDI I JTAG Serial Data Input -0.3 1.8 2.1
12 JTAG_TCK I JTAG clock input -0.3 1.8 2.1
13 ON1 I Turn on the module, high
active -0.3 1.8 2.1
14 HSIC_HOST_ACTIVE I
HSIC Host Active;
Inactive: the host controller
is switched off;
Active: the host controller is
switched on. Used to
synchronize enumeration.
-0.3 1.8 2.1
15 HSIC_SLAVE_WAKE
UP I
HSIC Slave Wakeup, used
by MU739 in L0 to indicate
that link can be switched to
L2 because MU739 has no
data to transfer.
-0.3 1.8 2.1
16 GPIO2 I/O
General I/O pins. The
function of these pins has
not been defined. Optional
-0.3 1.8 2.1
17 SLEEP_STATUS O
Indicates the sleep status of
MU739
H: MU739 is awake,
L: MU739 is in sleep
-0.3 1.8 2.1
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Description of the Application Interfaces
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PIN
No.
Pin Name I/
O
Description DC Characteristics (V)
Normal MUX Min Typical Max
18 Reserved - Reserve - - -
19 Reserved - Reserve - - -
20 SIM_VCC P power supply for USIM card - 1.8/2.9
21 HSIC_USB_STRB I/O Inter-connect USB Strobe -0.3 1.2 1.5
22 HSIC_USB_DATA I/O Inter-connect USB Data -0.3 1.2 1.5
23 USB_ DP I/O High-speed USB D+ - - -
24 USB_ DM I/O High-speed USB D- - - -
25 SIM_RST I USIM Reset 0 1.8/2.9 2.1/
3.3
26 MIPI_HSI_RX_DATA I MIPI HS Receive Data -0.54 1.8 2.1
27 SIM_CLK O USIM Clock 0 1.8/2.9 2.1/
3.3
28 MIPI_HSI_RX_FLG I MIPI HS Receive Flag -0.54 1.8 2.1
29 SIM_DATA I/O USIM Data Input / Output 0 1.8/2.9 2.1/
3.3
30 MIPI_HSI_RX_RDY O MIPI HS Receive Ready -0.54 1.8 2.1
31 PWRDWN_N I
Put the complete system
(baseband, PMU and RF)
into an initial state
- 1.8 -
32 USB_VBUS P Power supply for USB - 3.3/5 -
33 MIPI_HSI_TX_RDY I MIPI HS Transmit Ready -0.54 1.8 2.1
34 MIPI_HSI_TX_WAKE I MIPI HS Transmit Wake -0.54 1.8 2.1
35 MIPI_HSI_TX_FLG O MIPI HS Transmit Flag -0.54 1.8 2.1
36 MIPI_HSI_TX_DATA O MIPI HS Transmit Data -0.54 1.8 2.1
37 MIPI_HSI_RX_WAKE I MIPI HS Receive Wake -0.54 1.8 2.1
38 VCC_EXT1 P 1.8 V power output 1.7 1.8 1.9
39 W_DISABLE_N I Airplane mode -0.3 1.8 2.1
40 VCC_IN P 1.8 V power input - 1.8 -
41 HSIC_HOST_WAKEU
P O
Used by MU739 to resume
link from L2 or L3 to L0
when data is available on
MU739.
-0.3 1.8 2.1
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Description of the Application Interfaces
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PIN
No.
Pin Name I/
O
Description DC Characteristics (V)
Normal MUX Min Typical Max
42 WAKEUP_IN I
H: AP wakeup MU739.
L: AP set MU739 to sleep
mode.
-0.3 1.8 2.1
43 WAKEUP_OUT O Module to wake up the AP -0.3 1.8 2.1
44 HSIC_SUSPEND_RE
QUEST O
Used by CP in L0 to
indicate that link can be
switched to L2 because CP
has no data to transfer.
-0.3 1.8 2.1
45 LED_STATUS O Pin for network status LED -0.3 1.8 2.1
46 LED_MODE O Pin for network mode LED -0.3 1.8 2.1
47 Reserved - Reserve - - -
48 ON2_N I Turn on the module, low
active -0.3 1.8 2.1
49 VBAT_PMU P
Battery supply, power
supply for Baseband and
Transceiver
3.3 3.8 4.2
50 Reserved - Reserve - - -
51 VBAT_PA P Battery supply, power
supply for PA 3.3 3.8 4.2
52 VBAT_PA P Battery supply, power
supply for PA 3.3 3.8 4.2
53 RESIN_N I Baseband reset -0.3 1.8 2.1
54 I2S_CLK1 O Serial clock -0.3 1.8 2.1
55 I2S_CLK0 PCM_
CLK O Serial clock /PCM clock -0.3 1.8 2.1
56 I2S_RX PCM_
DIN I Serial receive data /PCM
Data Input -0.3 1.8 2.1
57 I2S_TX PCM_
DOUT O Serial transmit data /PCM
data output -0.3 1.8 2.1
58 I2S_WA0 PCM_
SYNC O Word alignment select
/PCM interface sync -0.3 1.8 2.1
59 I2S_WA1 O Word alignment select -0.3 1.8 2.1
60 NC - No connect - - -
61 NC - No connect - - -
62 GND - Ground - 0 -
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HUAWEI MU739 HSPA+ LGA Module
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Description of the Application Interfaces
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PIN
No.
Pin Name I/
O
Description DC Characteristics (V)
Normal MUX Min Typical Max
63 GND - Ground - 0 -
64 GND - Ground - 0 -
65 MAIN_ANT - Main antenna - - -
66 GND - Ground - 0 -
67 GND - Ground - 0 -
68 GND - Ground - 0 -
69 NC - No connect - - -
70 GND - Ground - 0 -
71 GND - Ground - 0 -
72 AUX_ANT - Diversity antenna - - -
73 GND - Ground - 0 -
74 GND - Ground - 0 -
75 NC - No connect - - -
76 NC - No connect - - -
77 NC - No connect - - -
78 NC - No connect - - -
79 GND - Ground - 0 -
80 GND - Ground - 0 -
81 GND - Ground - 0 -
82 GND - Ground - 0 -
83 GND - Ground - 0 -
84 GND - Ground - 0 -
85 GND - Ground - 0 -
86 GND - Ground - 0 -
87 GND - Ground - 0 -
88 GND - Ground - 0 -
89 GND - Ground - 0 -
90 GND - Ground - 0 -
91 GND - Ground - 0 -
92 GND - Ground - 0 -
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HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Description of the Application Interfaces
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PIN
No.
Pin Name I/
O
Description DC Characteristics (V)
Normal MUX Min Typical Max
93 GND - Ground - 0 -
94 GND - Ground - 0 -
95 GND - Ground - 0 -
96 GND - Ground - 0 -
97 GND - Ground - 0 -
98 GND - Ground - 0 -
99 GND - Ground - 0 -
100 GND - Ground - 0 -
101 GND - Ground - 0 -
102 GND - Ground - 0 -
103 GND - Ground - 0 -
104 GND - Ground - 0 -
105 GND - Ground - 0 -
106 GND - Ground - 0 -
107 GND - Ground - 0 -
108 GND - Ground - 0 -
109 GND - Ground - 0 -
110 GND - Ground - 0 -
111 GND - Ground - 0 -
112 GND - Ground - 0 -
113 GND - Ground - 0 -
114 GND - Ground - 0 -
Pindicates power pins; Iindicates pins for digital signal input; Oindicates pins for digital
signal output.
The NC (No Connect) pins are internally connected to the module. Therefore, these pins
should not be used, otherwise they may cause problems. Please contact us for more details
about this information.
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Description of the Application Interfaces
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3.3 Power Interface
3.3.1 Overview
The power supply part of the MU739 module contains:
VBAT PIN for the power supply
SIM_VCC PIN for USIM card power output
USB_VBUS PIN for USB power supply
VCC_EXT1 PIN for 1.8 V power output
VCC _IN PIN for 41~46 PIN voltage supply
Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
Pin No. Signal
Name
I/O Description DC Characteristics (V)
Min Typical Max
49 VBAT_PMU P Battery supply,
power supply for
Baseband and
Transceiver
3.3 3.8 4.2
51, 52 VBAT_PA P Battery supply,
power supply for PA
3.3 3.8 4.2
20 SIM_VCC P Power supply for
USIM card
- 1.8/2.9 -
32 USB_VBUS P Power supply for
USB
- 3.3/5 -
38 VCC_EXT1 P 1.8 V power output 1.7 1.8 1.9
40 VCC _IN P 1.8 V power input - 1.8 -
62~64,
66~68,70,
71, 73,74,
79~114
GND - Ground - 0 -
3.3.2 VBAT Interface
When the MU739 module works normally, power is supplied through the VBAT_PMU
and VBAT_PA pins and the voltage ranges from 3.3 V to 4.2 V (typical value is 3.8 V).
The 114-pin LGA module provides one VBAT_PMU pin, two VBAT_PA pins and
forty-six GND pins. To ensure that the MU739 module works normally, all the pins
must be connected.
When the MU739 module is used for different applications, special attention should be
paid to the design of the power supply. When the MU739 module transmits at the
maximum power, the transient peak current may reach 2.0 A. In this case, the
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