IEI Technology TANK-XM811 User manual

User Manual
Embedded System with 10th/11th Generation Intel® Core™ Processor,
Two DDR4 Slot, Digital I/O, HDMI, DP, Two Gigabit Ethernet, RS-232/422/485,
RoHS Compliant
TANK-XM811 Series
MODEL:
Rev. 1.00 –July 18, 2022

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TANK-XM811
Revisions
Date
Version
Changes
July 18, 2022
1.00
Initial release

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TANK-XM811
Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.

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Manual Conventions
WARNING
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION
Cautionary messages should be heeded to help reduce the chance of
losing data or damaging the product.
NOTE
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help avoid making mistakes.
HOT SURFACE
This symbol indicates a hot surface that should not be touched without
taking care.

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Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 OVERVIEW.................................................................................................................. 2
1.2 MODEL VARIATIONS ................................................................................................... 3
1.3 FEATURES................................................................................................................... 3
1.4 TECHNICAL SPECIFICATIONS ...................................................................................... 4
1.5 FRONT PANEL............................................................................................................. 6
1.6 REAR PANEL............................................................................................................... 7
1.7 PHYSICAL DIMENSIONS.............................................................................................. 8
2 UNPACKING................................................................................................................. 9
2.1ANTI-STATIC PRECAUTIONS...................................................................................... 10
2.2 UNPACKING PRECAUTIONS....................................................................................... 10
2.3 UNPACKING CHECKLIST............................................................................................11
3 INSTALLATION ......................................................................................................... 16
3.1 INSTALLATION PRECAUTIONS................................................................................... 17
3.2 BACK COVER REMOVAL........................................................................................... 17
3.3 CPU INSTALLATION ................................................................................................. 18
3.4 MEMORY INSTALLATION........................................................................................... 20
3.5 STORAGE INSTALLATION .......................................................................................... 21
3.5.1 M.2 SSD Installation........................................................................................ 21
3.5.2 2.5-inch SSD Installtion................................................................................... 22
3.6 WI-FI MODULE INSTALLATION (OPTIONAL)............................................................. 23
3.7 BACK COVER INSTALLATION.................................................................................... 24
3.8 MOUNTING THE SYSTEM WITH MOUNTING BRACKETS ............................................ 24
3.9 EXTERNAL PERIPHERAL INTERFACE CONNECTORS................................................... 25
3.9.1 AT/ATX Power Mode Selection........................................................................ 26
3.9.2 System Fan Connector..................................................................................... 26
3.9.3 Digital Input / Output Connector..................................................................... 27
3.9.4 HDMI/DP Connector....................................................................................... 28

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3.9.5 LAN Connectors............................................................................................... 28
3.9.6 Power Input, 4-pin Terminal Block.................................................................. 30
3.9.7 Power Input, 4-pin DIN Connector ................................................................. 30
3.9.8 DB-9 RS-232/422/485 Serial Port Connectors................................................ 31
3.9.9 Remote Power Connector ................................................................................ 31
3.10 POWERING ON/OFF THE SYSTEM ........................................................................... 32
3.11 POWER ................................................................................................................... 33
3.12AVAILABLE DRIVERS .............................................................................................. 35
3.12.1 Driver Download........................................................................................... 35
3.13 MAINTENANCE....................................................................................................... 37
3.13.1 Flash Descriptor Security Override Jumper.................................................. 37
4 SYSTEM MOTHERBOARD ..................................................................................... 39
4.1 OVERVIEW................................................................................................................ 40
4.1.1 Layout .............................................................................................................. 40
4.2 INTERNAL PERIPHERAL CONNECTORS...................................................................... 42
4.2.1 Clear CMOS Switch (J_CMOS1)..................................................................... 43
4.2.2 BIOS Programming Connector (JSPI1) .......................................................... 43
4.2.3 EC Programming Connector (EC_SPI1)......................................................... 43
4.2.4 EC Debug Card Connector (DEBUG_SPI1)................................................... 44
4.2.5 System Fan Connector (SYS_FAN1)................................................................ 44
4.2.6 Battery Connector (BAT1) ............................................................................... 44
4.3 EXTERNAL INTERFACE PANEL CONNECTORS ............................................................ 44
4.3.1 LAN Connectors............................................................................................... 45
4.3.2 Power Input Connector, DC Jack (PWR1) ...................................................... 46
4.3.3 Power Input Connector, Terminal Block (PWR2)............................................ 46
A REGULATORY COMPLIANCE.............................................................................. 47
B SAFETY PRECAUTIONS......................................................................................... 52
B.1 SAFETY PRECAUTIONS............................................................................................. 53
B.1.1 General Safety Precautions............................................................................. 53
B.1.2 Anti-static Precautions .................................................................................... 54
B.1.3 Product Disposal............................................................................................. 55
B.2 MAINTENANCE AND CLEANING PRECAUTIONS ........................................................ 55
B.2.1 Maintenance and Cleaning.............................................................................. 56

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B.2.2 Cleaning Tools................................................................................................. 56
C ERROR BEEPCODE ................................................................................................ 57
C.1 PEI BEEP CODES ..................................................................................................... 58
C.2 DXE BEEP CODES ................................................................................................... 58
D HAZARDOUS MATERIALS DISCLOSURE......................................................... 59
D.1 ROHS II DIRECTIVE (2015/863/EU) ....................................................................... 60
D.2 CHINA ROHS........................................................................................................... 61

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List of Figures
Figure 1-1: TANK-XM811 Series....................................................................................................2
Figure 1-2: Front Panel ..................................................................................................................6
Figure 1-3: Rear Panel....................................................................................................................7
Figure 1-4: Physical Dimensions ..................................................................................................8
Figure 3-1: Remove the Cover.....................................................................................................18
Figure 3-2: Motherboard Removal ..............................................................................................18
Figure 3-3: CPU Installation.........................................................................................................19
Figure 3-4: CPU Thermal Pad Installation..................................................................................19
Figure 3-5: Motherboard Installation ..........................................................................................20
Figure 3-6: Memory Installation ..................................................................................................21
Figure 3-7: M.2 Installation...........................................................................................................22
Figure 3-8: HDD Installation ........................................................................................................22
Figure 3-9: Wi-Fi Module and Wi-Fi Antenna Installation.........................................................24
Figure 3-10: Back Cover Installation ..........................................................................................24
Figure 3-11: Mounting Bracket Retention Screws ....................................................................25
Figure 3-12: AT/ATX Power Mode Switch ..................................................................................26
Figure 3-13: SYS_FAN Connector...............................................................................................27
Figure 3-14: DIO Connector.........................................................................................................28
Figure 3-15: HDMI/DP Connection..............................................................................................28
Figure 3-16: LAN Connection......................................................................................................29
Figure 3-17: RJ-45 Ethernet Connector......................................................................................29
Figure 3-18: 4-pin Terminal Block...............................................................................................30
Figure 3-19: Power Input Connector...........................................................................................30
Figure 3-20: DB-9 RS-232/422/485 Serial Port Connector ........................................................31
Figure 3-21: Remote Power Connector......................................................................................32
Figure 3-22: Power Button...........................................................................................................33
Figure 3-23: Power Connectors ..................................................................................................34
Figure 3-24: IEI Resource Download Center..............................................................................35
Figure 3-25 Flash Descriptor Security Override Jumper Location..........................................37
Figure 4-1: System Motherboard (Front)....................................................................................40

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Figure 4-2: System Motherboard (Rear).....................................................................................41
Figure 4-3: Ethernet Connector...................................................................................................45

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List of Tables
Table 1-1: TANK-XM811 Series Model Variations .......................................................................3
Table 1-2: Technical Specifications..............................................................................................5
Table 3-1: Digital I/O Connector Pinouts....................................................................................27
Table 3-2: RJ-45 Ethernet Connector LEDs...............................................................................29
Table 3-3: RS-232 (COM1~COM4) & RS-232/422/485 (COM5~COM6) Connector Pinouts ....31
Table 3-4: Power LED Indicators Description............................................................................34
Table 3-5: Flash Descriptor Security Override Jumper Settings.............................................37
Table 4-1: Peripheral Interface Connectors ...............................................................................42
Table 4-2: Clear CMOS Switch (J_CMOS1)................................................................................43
Table 4-3: BIOS Programming Connector Pinouts (JSPI1)......................................................43
Table 4-4: EC Programming Connector ( EC_SPI1 ).................................................................43
Table 4-5: EC Debug Card Connector (DEBUG_SPI1)..............................................................44
Table 4-6: System Fan Connector (SYS_FAN1) ........................................................................44
Table 4-7: Battery Connector (BAT1)..........................................................................................44
Table 4-8: Rear Panel Connectors..............................................................................................45
Table 4-9: Ethernet Connector Pinouts......................................................................................45
Table 4-10: Connector LEDs........................................................................................................46
Table 4-11: Power Input Connector (PWR1) ..............................................................................46
Table 4-12: Power Input Connector (PWR2) ..............................................................................46

TANK-XM811
Page 1
Chapter
1
1Introduction

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1.1 Overview
Figure 1-1: TANK-XM811 Series
The TANK-XM811 Series is an embedded system for wide range temperature
environments. It is powered by 12th generation Intel® Core™ processor with Intel® Q470
chipset, and has two 260-pin DDR4 SDRAM SO-DIMM slots supporting up to 64GB
memory (8GB preinstalled). The TANK-XM811 Series includes one digital I/O port, one
HDMI, one DP, two GbE LAN, eight USB 3.2 Gen 2, two RS-232/422/485 and four
RS-232 connectors.

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1.2 Model Variations
The model variations of the TANK-XM811 Series are listed below.
Model No.
CPU
TANK-XM811-i5AC-R10
Intel® Core™ i5-12500TE 1.9GHz
(up to 4.3GHz, 6-core, TDP 35W)
TANK-XM811-i7AC-R10
Intel® Core™ i7-12700TE 1.4GHz
(up to 4.6GHz, 12-core, TDP 35W)
TANK-XM811-i9D-R10
Intel® Core™ i9-12900TE 1.1GHz
(up to 4.8GHz, 16-core, TDP35W)
Table 1-1: TANK-XM811 Series Model Variations
1.3 Features
The TANK-XM811 Series features are listed below:
12th Gen. Intel® Core™processor platform with Intel® R680E chipset and
DDR4 memory
Dual independent displays with high resolution support
Rich high-speed I/O interfaces
One 2.5" HDD/SSD SATA 6Gb/s bay
Great flexibility for hardware expansion

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1.4 Technical Specifications
The TANK-XM811 Series technical specifications are listed in Table 1-2
Specifications
Chassis
Color
Black C
Dimensions (WxDxH) (mm)
230.6 x 256.04 x 76.2
System Fan
Fanless
Chassis Construction
Extruded aluminum alloy
Motherboard
CPU
12th Gen. Intel® Core™CPU:
Intel® Core™i9-12900TE 1.1GHz (up to 4.8GHz, 16-core, TDP 35W)
Intel® Core™i7-12700TE 1.4GHz (up to 4.6GHz, 12-core, TDP 35W)
Intel® Core™ i5-12500TE 1.9GHz (up to 4.3GHz, 6-core, TDP 35W)
Chipset
Intel® R680E
System Memory
2 x SO-DIMM DDR4 3200MHz (up to 64GB)
Storage
Hard Drive
1 x 2.5" HDD/SSD SATA 6Gb/s bay
I/O Interfaces
USB 3.2 Gen 2 (10Gb/s)
8
RS-232/422/485
2 x RS-232/422/485
2 x RS232
Ethernet
Two RJ-45
2 x Intel 2.5GbE by Intel® I225 controller
TPM 2.0
Intel PTT
Digital I/O
12-bit (6-in/6-out)
Display
HDMI/DP++
Expansions

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Specifications
M.2
1 x 2280 M key (PCIe x4)
1 x 2230 A-key (USB+PCIe x1, supports vPRO)
Backplane
Optional
Power
Power Input
DC jack: 12 V~28 V DC
Terminal block: 12 V~28 V DC
Power Consumption
12V @ 8.8A (Intel ® Core™ i9-12900TE with 16GB memory)
Remote Power
1 x 2-pin
Reliability
Mounting
Wall mount
Operating Temperature
-20°C ~ 60°C with air flow (CPU TDP 35W & SSD)
-20°C ~ 50°C with air flow (CPU TDP 65W & SSD), 10% ~ 95%
non-condensing
Storage Temperature
-40°C ~ 85°C, 10% ~ 95%, non-condensing
Operating Shock
Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)
Operating Vibration
MIL-STD-810G 514.6C-1 (with SSD)
Weight (Net/Gross)
3.33 kg / 3.7 kg
Safety/EMC
CE/FCC
Watchdog Timer
Programmable 1~255 sec/min
OS
Supported OS
Microsoft Windows 10 IoT Enterprise / Windows 11
Linux
Table 1-2: Technical Specifications

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1.5 Front Panel
The front panel of the TANK-XM811 Series has the following features (Figure 1-2):
Figure 1-2: Front Panel

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1.6 Rear Panel
The rear panel of the TANK-XM811 Series is shown below.
Figure 1-3: Rear Panel

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1.7 Physical Dimensions
The physical dimensions of the TANK-XM811 are shown in 507HFigure 1-4.
Figure 1-4: Physical Dimensions

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Chapter
2
2Unpacking

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2.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during installation may result in
permanent damage to the TANK-XM811 Series and severe injury to
the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the TANK-XM811 Series. Dry climates are especially susceptible to ESD. It is
therefore critical that whenever the TANK-XM811 Series or any other electrical
component is handled, the following anti-static precautions are strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the TANK-XM811 Series, place it
on an antic-static pad. This reduces the possibility of ESD damaging the
TANK-XM811 Series.
2.2 Unpacking Precautions
When the TANK-XM811 Series is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 2.1.
Make sure the packing box is facing upwards so the TANK-XM811 Series
does not fall out of the box.
Make sure all the components shown in Section 2.2 are present.