IEI Technology PAC-400AI-C236 User manual

PAC-400AI-C236 Embedded System
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User Manual
MODEL:
PAC-400AI-C236
AI System with Intel®Xeon®E3-1275 v5 CPU,
Intel®C236, DDR4 Memory, Dual GbE, USB 3.2 Gen 1, VGA,
PCIe Mini, PCIe x16, PCIe x4, 250W Power Supply, RoHS
Rev. 1.00 – November 26, 2019

PAC-400AI-C236 Embedded System
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Revision
Date Version Changes
November 26, 2019 1.00 Initial release

PAC-400AI-C236 Embedded System
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.

PAC-400AI-C236 Embedded System
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Manual Conventions
WARNING
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
CAUTION
Cautionary messages should be heeded to help reduce the chance of
losing data or damaging the product.
NOTE
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help avoid making mistakes.
HOT SURFACE
This symbol indicates a hot surface that should not be touched without
taking care.

PAC-400AI-C236 Embedded System
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Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 OVERVIEW.................................................................................................................. 2
1.2 MODEL VARIATIONS ................................................................................................... 2
1.3 FEATURES................................................................................................................... 3
1.4 FRONT PANEL ............................................................................................................. 3
1.5 REAR PANEL............................................................................................................... 4
1.6 TECHNICAL SPECIFICATIONS ...................................................................................... 5
1.7 DIMENSIONS............................................................................................................... 7
2 UNPACKING ................................................................................................................. 8
2.1 ANTI-S TAT I C PRECAUTIONS ........................................................................................ 9
2.2 UNPACKING PRECAUTIONS......................................................................................... 9
2.3 PACKING LIST........................................................................................................... 10
2.4 OPTIONAL ITEMS .......................................................................................................11
3 INSTALLATION ......................................................................................................... 13
3.1 INSTALLATION PRECAUTIONS ................................................................................... 14
3.1.1 High Surface Temperature ............................................................................... 14
3.2 TOP COVER RE M O VA L .............................................................................................. 15
3.3 HDD INSTALLATION................................................................................................. 15
3.4 PCIE MINI CARD INSTALLATION (MS ATA ) .............................................................. 17
3.4.1 Half-size PCIe Mini Card Installation............................................................. 20
3.4.1 PCIe Mini Card Slot Pinouts – Full/Half Size (MSATA1) ............................... 22
3.5 LAN CONNECTION................................................................................................... 23
3.6 MOUNTING THE SYSTEM .......................................................................................... 24
3.7 POWER-ON PROCEDURE........................................................................................... 26
3.7.1 Installation Checklist ....................................................................................... 26
3.7.2 Power-on Procedure ........................................................................................ 26
3.8 AVAILABLE DRIVERS ................................................................................................ 27
3.8.1 Driver Download ............................................................................................. 28
4 TROUBLESHOOTING AND MAINTENANCE ..................................................... 30