Intel E2160 - Cpu Pentium Dual-Core 1.80Ghz Fsb800Mhz 1M Lga775... Guide

Order Number: 315279 - 003US
Intel®CoreTM 2 Duo E6400, E4300,
and Intel®Pentium®Dual-Core
E2160 Processor
Thermal Design Guide
October 2007

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
TDG October 2007
2Order Number: 315279 - 003US
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Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
October 2007 TDG
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Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
Contents
1.0 Introduction..............................................................................................................7
1.1 Document Goals and Scope ..................................................................................7
1.1.1 Importance of Thermal Management...........................................................7
1.1.2 Document Goals.......................................................................................7
1.1.3 Document Scope......................................................................................7
1.2 References .........................................................................................................9
1.3 Definition of Terms..............................................................................................9
2.0 Processor Thermal/Mechanical Information ............................................................11
2.1 Mechanical Requirements ................................................................................... 11
2.1.1 Processor Package..................................................................................11
2.1.2 Heatsink Attach .....................................................................................12
2.2 Thermal Requirements.......................................................................................14
2.2.1 Processor Case Temperature....................................................................14
2.2.2 Thermal Profile ......................................................................................15
2.2.3 TCONTROL .................................................................................................16
2.3 Heatsink Design Considerations...........................................................................17
2.3.1 Heatsink Size.........................................................................................17
2.3.2 Heatsink Mass........................................................................................ 18
2.3.3 Package IHS Flatness..............................................................................18
2.3.4 Thermal Interface Material.......................................................................18
2.4 System Thermal Solution Considerations..............................................................19
2.4.1 Chassis Thermal Design Capabilities..........................................................19
2.4.2 Improving Chassis Thermal Performance ...................................................19
2.4.3 Summary..............................................................................................19
2.5 System Integration Considerations ......................................................................20
3.0 Thermal Metrology ..................................................................................................21
3.1 Characterizing Cooling Performance Requirements.................................................21
3.1.1 Example................................................................................................22
3.2 Processor Thermal Solution Performance Assessment.............................................23
3.3 Local Ambient Temperature Measurement Guidelines.............................................23
3.4 Processor Case Temperature Measurement Guidelines............................................25
4.0 Thermal Management Logic and Thermal Monitor Feature.......................................26
4.1 Processor Power Dissipation................................................................................26
4.2 Thermal Monitor Implementation.........................................................................26
4.2.1 PROCHOT# Signal.................................................................................. 27
4.2.2 Thermal Control Circuit ...........................................................................27
4.2.3 Thermal Monitor 2.................................................................................. 28
4.2.4 Operation and Configuration ....................................................................29
4.2.5 On-Demand Mode ..................................................................................30
4.2.6 System Considerations............................................................................30
4.2.7 Operating System and Application Software Considerations..........................31
4.2.8 THERMTRIP# Signal ...............................................................................31
4.2.9 Cooling System Failure Warning...............................................................31
4.2.10 Digital Thermal Sensor............................................................................31
4.2.11 Platform Environmental Control Interface (PECI) ........................................32
5.0 Intel® Reference Thermal Solution..........................................................................33
5.1 Thermal Solution Requirements...........................................................................33
5.2 PICMG 1.3 Form Factor......................................................................................34
5.3 ATX/BTX form factors ........................................................................................ 36

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor—
Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
TDG October 2007
4Order Number: 315279 - 003US
5.4 Altitude ............................................................................................................36
5.5 Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design..........37
6.0 Intel® Quiet System Technology (Intel® QST).........................................................38
6.1 Intel®QST Algorithm .........................................................................................38
6.1.1 Output Weighting Matrix..........................................................................39
6.1.2 Proportional-Integral-Derivative (PID) .......................................................39
6.2 Board and System Implementation of Intel® QST..................................................41
6.3 Intel®QST Configuration and Tuning....................................................................43
6.4 Fan Hub Thermistor and Intel®QST.....................................................................43
A LGA775 Socket Heatsink Loading.............................................................................44
A.1 LGA775 Socket Heatsink Considerations ...............................................................44
A.2 Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design....44
A.3 Heatsink Selection Guidelines..............................................................................49
B Thermal Interface Management ...............................................................................50
B.1 Bond Line Management ......................................................................................50
B.2 Interface Material Area.......................................................................................50
B.3 Interface Material Performance............................................................................50
C Case Temperature Reference Metrology...................................................................51
C.1 Objective and Scope ..........................................................................................51
D Mechanical Drawings ...............................................................................................53
E Intel® Enabled Reference Solution Information.......................................................56

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
October 2007 TDG
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Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
Figures
1 Package IHS Load Areas ...........................................................................................11
2 Processor Case Temperature Measurement Location .....................................................15
3 Example Thermal Profile ...........................................................................................16
4 Processor Thermal Characterization Parameter Relationships .........................................22
5 Locations for Measuring Local Ambient Temperature, Active Heatsink..............................24
6 Locations for Measuring Local Ambient Temperature, Passive Heatsink............................25
7 Concept for Clocks under Thermal Monitor Control........................................................28
8 Thermal Monitor 2 Frequency and Voltage Ordering......................................................29
9T
CONTROL for Digital Thermal Sensor .............................................................................32
10 Thermal Characterization Parameters for Various Operating Conditions ...........................34
11 PICMG 1.3 Copper Heatsink.......................................................................................35
12 PICMG 1.3 Heatsink Performance ...............................................................................36
13 Intel® QST Overview ...............................................................................................39
14 PID Controller Fundamentals .....................................................................................40
15 Intel® QST Platform Requirements.............................................................................41
16 Example Acoustic Fan Speed Control Implementation....................................................42
17 Digital Thermal Sensor and Thermistor ......................................................................43
18 Board Deflection Definition........................................................................................46
19 Example: Defining Heatsink Preload Meeting Board Deflection Limit................................ 48
20 PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components, Primary Side ........................................................................................54
21 PICMG 1.3 Motherboard Keep-out, Secondary Side.......................................................55
Tables
1 Referenced Documents...............................................................................................9
2 Terms Used...............................................................................................................9
3 Thermal Characterization Parameter at various TLA's.....................................................33
4 Board Deflection Configuration Definitions ................................................................... 45
5 Intel Reference Component PICMG 1.3 Thermal Solution Providers .................................56

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor—
Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
TDG October 2007
6Order Number: 315279 - 003US
Revision History
Date Revision Description
October 2007 003 Updated to include the Intel® Pentium® Dual-Core E2160 processor
March 2007 002 Updated to include the Intel® E4300 processor
September 2006 001 Initial release

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
October 2007 TDG
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Introduction—Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160
Processor
1.0 Introduction
1.1 Document Goals and Scope
1.1.1 Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within their functional temperature range.
Within this range, a component is expected to meet its specified performance level.
Operation outside the functional temperature range can degrade system performance,
cause logic errors or cause component and/or system damage. Temperatures
exceeding the maximum operating limit of a component may result in irreversible
changes in the operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and
component thermal characteristics. The system level thermal constraints consist of the
local ambient air temperature and airflow over the processor as well as the physical
constraints at and above the processor. The processor temperature depends on the
component power dissipation, the processor package thermal characteristics and the
processor thermal solution.
All of these parameters are affected by the continued push of technology to increase
processor performance levels and packaging density (more transistors). As operating
frequencies increase and packaging size decreases, the power density increases while
the thermal solution space and airflow typically become more constrained or remains
the same within the system. The result is an increased importance on system design to
ensure that thermal design requirements are met for each component, including the
processor, in the system.
1.1.2 Document Goals
Depending on the type of system and the chassis characteristics, new system and
component designs may be required to provide adequate cooling for the processor. The
goal of this document is to provide an understanding of these thermal characteristics
and discuss guidelines for meeting the thermal requirements imposed on single
processor systems using the Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®
Dual-Core E2160 Processor.
The concepts given in this document are applicable to any system form factor. Specific
examples used will be the Intel enabled reference solution for PICMG 1.3 server
systems. Please refer to the applicable ATX and BTX form factor reference documents
and thermal design guidelines to design a thermal solution for those form factors.
1.1.3 Document Scope
In this document, when a reference is made to "the processor", it is intended that this
includes all the processors described and supported in this document. If needed for
clarity, the specific processor will be listed.

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor—
Introduction
Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
TDG October 2007
8Order Number: 315279 - 003US
This design guide supports the following processors:
•Intel
®CoreTM 2 Duo E6400 Processor for Embedded Applications
•Intel
®CoreTM 2 Duo E4300 Processor for Embedded Applications
• Intel® Pentium® Dual-Core E2160 Processor for Embedded Applications
In this document, when a reference is made to "the datasheet", the reader should refer
to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop
Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core
Processor E2000 Sequence Datasheet. For more information on a specific processor,
reference the specific processor datasheet.
Section 2.0 of this document discusses package thermal mechanical requirements to
design a thermal solution for the processor in the context of personal computer
applications.
Section 2.0 discusses the thermal solution considerations and metrology
recommendations to validate a processor thermal solution.
Section 4.0 addresses the benefits of the processor's integrated thermal management
logic for thermal design.
Section 5.0 gives information on the Intel reference thermal solution for the processor.
Section 6.0 discusses the implementation of Intel Quiet System Technology (Intel®
QST).
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
October 2007 TDG
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Introduction—Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160
Processor
1.2 References
Material and concepts available in the documents listed in Table 1 may be beneficial
when reading this document.
1.3 Definition of Terms
Table 1. Referenced Documents
Document Comment
Intel® Core™2 Duo Desktop Processor, Intel® Pentium® Dual-Core
Processor, and Intel® Pentium® 4 Processor 6x1 Sequence
Thermal and Mechanical Design Guidelines
http://developer.intel.com/
design/processor/designex/
313685.htm
LGA775 Socket Mechanical Design Guide http://developer.intel.com/ design/Pentium4/guides/
302666.htm
Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo
Desktop Processor E6000 Sequence Datasheet http://www.intel.com/design/ processor/datashts/313278.htm
Intel® Pentium® Dual-Core Processor E2000 Sequence Datasheet http://www.intel.com/design/
processor/datashts/316981.htm
Intel® Core™2 Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines http://www.intel.com/design/ processor/designex/317804.htm
Intel® Pentium® 4 Processor on 90 nm Process in the 775-Land LGA
Package Thermal and Mechanical Design Guidelines
http://developer.intel.com/
design/Pentium4/guides/
302553.htm
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
Performance ATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Performance microATX Desktop System Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/
Table 2. Terms Used (Sheet 1 of 2)
Term Description
TAThe measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet for
an active heatsink. Also referred to as TLA.
TCThe case temperature of the processor, measured at the geometric center of the topside of
the IHS.
TEThe ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets. Also referred to as TEXT.
TSHeatsink temperature measured on the underside of the heatsink base, at a location
corresponding to TC.
TC-MAX The maximum case temperature as specified in a component specification.
ΨCA Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (TC- TA) / Total Package Power.
Note: Heat source must be specified for Ψmeasurements.
ΨCS
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (TC- TS) / Total Package Power. Also
referred to as ΨTIM.
Note: Heat source must be specified for Ψ measurements.

Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor—
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Intel®CoreTM 2 Duo E6400, E4300, and Intel®Pentium®Dual-Core E2160 Processor
TDG October 2007
10 Order Number: 315279 - 003US
§ §
ΨSA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS- TA) / Total Package Power.
Note: Heat source must be specified for Ψmeasurements.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of
the heat from the processor case to the heatsink.
PMAX The maximum power dissipated by a semiconductor component.
TDP Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
IHS Integrated Heat Spreader: a thermally conductive lid integrated into a processor package
to improve heat transfer to a thermal solution through heat spreading.
LGA775 Socket The surface mount socket designed to accept the processors in the 775-Land LGA
package.
ACPI Advanced Configuration and Power Interface.
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
Thermal Monitor A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
TCC Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by lowering effective processor frequency when the die temperature has exceeded its
operating limits.
TDIODE Temperature reported from the on-die thermal diode.
FSC Fan Speed Control: Thermal solution that includes a variable fan speed which is driven by a PWM signal and uses the on-die thermal diode as a reference to change the duty cycle of
the PWM signal.
TCONTROL TCONTROL is the specification limit for use with the on-die thermal diode.
PWM Pulse width modulation is a method of controlling a variable speed fan. The enabled 4 wire fans use the PWM duty cycle percent from the fan speed controller to modulate the fan
speed.
Health Monitor
Component Any standalone or integrated component that is capable of reading the processor temperature and providing the PWM signal to the 4 pin fan header.
TMA Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution.
Table 2. Terms Used (Sheet 2 of 2)
Term Description