Kontron KTQ77/Flex User manual

If it’s embedded, it’s Kontron
KTQ77/Flex Users Guide
KTD-N0848-B

KTQ77/Flex Users Guide
KTD-N0848-B Page 2
Document revision history.
Revision
Date
By
Comment
B
Jan. 8th 2014
MLA
Added BIOS features: Force Boot Setup and PC Speaker/Beep.
A Aug. 22nd 2013 MLA
Minor bugs. Removed 5V tolerance for some GPIO’s. J11 and
J30 descriptions corrected. 3.3V now 5% tolerance. CPU List
updated. BIOS part added. System Resources tables corrected.
RAM list updated. Block diagram improved.
0
Jun. 29th 2012
MLA
Preliminary version
Copyright Notice:
Copyright 2011, KONTRON Technology A/S, ALL RIGHTS RESERVED.
No part of this document may be reproduced or transmitted in any form or by any means, electronically
or mechanically, for any purpose, without the express written permission of KONTRON Technology A/S.
Trademark Acknowledgement:
Brand and product names are trademarks or registered trademarks of their respective owners.
Disclaimer:
KONTRON Technology A/S reserves the right to make changes, without notice, to any product,
including circuits and/or software described or contained in this manual in order to improve design
and/or performance.
Specifications listed in this manual are subject to change without notice. KONTRON Technology
assumes no responsibility or liability for the use of the described product(s), conveys no license or title
under any patent, copyright, or mask work rights to these products, and makes no representations or
warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified. Applications that are described in this manual are for illustration purposes only.
KONTRON Technology A/S makes no representation or warranty that such application will be suitable
for the specified use without further testing or modification.
Life Support Policy
KONTRON Technology’s PRODUCTS ARE NOT FOR USE AS CRITICAL COMPONENTS IN LIFE
SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF THE GENERAL
MANAGER OF KONTRON Technology A/S.
As used herein:
Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
body, or (b) support or sustain life and whose failure to perform, when properly used in accordance with
instructions for use provided in the labelling, can be reasonably expected to result in significant injury to
the user.
A critical component is any component of a life support device or system whose failure to perform can
be reasonably expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness.
Document details

KTQ77/Flex Users Guide
KTD-N0848-B Page 3
KONTRON Technology Technical Support & Services
If you have questions about installing or using your KONTRON Technology Product, check this User’s
Manual first – you will find answers to most questions here. To obtain support, please contact your local
Distributor or Field Application Engineer (FAE).
Before Contacting Support: Please be prepared to provide as much information as possible:
•CPU Board
1. Type.
2. Part Number (find PN on label)
3. Serial Number if available (find SN on label)
•Configuration
1. CPU Type, Clock speed
2. DRAM Type and Size.
3. BIOS Revision (Find the Version Info in the BIOS Setup).
4. BIOS Settings different than Default Settings (Refer to the BIOS Setup Section).
•System
1. O/S Make and Version.
2. Driver Version numbers (Graphics, Network, and Audio).
3. Attached Hardware: Harddisks, CD-rom, LCD Panels etc.
Warranty
KONTRON Technology warrants its products to be free from defects in material and workmanship
during the warranty period. If a product proves to be defective in material or workmanship during the
warranty period, KONTRON Technology will, at its sole option, repair or replace the product with a
similar product.
Replacement Product or parts may include remanufactured or refurbished parts or components.
The warranty does not cover:
1. Damage, deterioration or malfunction resulting from:
A. Accident, misuse, neglect, fire, water, lightning, or other acts of nature, unauthorized product
modification, or failure to follow instructions supplied with the product.
B. Repair or attempted repair by anyone not authorized by KONTRON Technology.
C. Causes external to the product, such as electric power fluctuations or failure.
D. Normal wear and tear.
E. Any other causes which does not relate to a product defect.
2. Removal, installation, and set-up service charges.
Exclusion of damages:
KONTRON TECHNOLOGY LIABILITY IS LIMITED TO THE COST OF REPAIR OR REPLACEMENT
OF THE PRODUCT. KONTRON TECHNOLOGY SHALL NOT BE LIABLE FOR:
1. DAMAGE TO OTHER PROPERTY CAUSED BY ANY DEFECTS IN THE PRODUCT,
DAMAGES BASED UPON INCONVENIENCE, LOSS OF USE OF THE PRODUCT, LOSS OF
TIME, LOSS OF PROFITS, LOSS OF BUSINESS OPPORTUNITY, LOSS OF GOODWILL,
INTERFERENCE WITH BUSINESS RELATIONSHIPS, OR OTHER COMMERCIAL LOSS,
EVEN IF ADVISED OF THEIR POSSIBILITY OF SUCH DAMAGES.
2. ANY OTHER DAMAGES, WHETHER INCIDENTAL, CONSEQUENTIAL OR OTHERWISE.
3. ANY CLAIM AGAINST THE CUSTOMER BY ANY OTHER PARTY.
Document details

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Contents
Introduction ..............................................................................................8
1Installation procedure .........................................................................9
1.1 Installing the board .......................................................................................................................... 9
1.2 Requirement according to IEC60950 ................................................................................................. 10
2System Specification..........................................................................11
2.1 Component main data ..................................................................................................................... 11
2.2 System overview ............................................................................................................................. 15
2.3 Processor Support Table .................................................................................................................. 17
2.4 System Memory support................................................................................................................... 20
2.5 KTQ77 Graphics Subsystem............................................................................................................... 21
2.5.1 Intel® HD Graphics 4000/2500....................................................................................................... 21
2.6 Power Consumption ........................................................................................................................ 22
3Connector Locations ..........................................................................25
3.1 KTQ77/Flex – frontside .................................................................................................................... 25
3.2 KTQ77/Flex - backside ..................................................................................................................... 26
4Connector Definitions ........................................................................27
5IO-Area Connectors............................................................................28
5.1 Display connectors (IO Area)............................................................................................................ 28
5.1.1 Analogue VGA (VGA) ...................................................................................................................... 28
5.1.2 DP Connectors (DP0/DP1)............................................................................................................... 29
5.2 Ethernet Connectors (IO Area).......................................................................................................... 30
5.3 USB Connectors (IO Area) ................................................................................................................ 31
5.3.1 USB Connector 0/1 (USB0/1) ......................................................................................................... 32
5.3.2 USB Connector 2/3 (USB2/3) ......................................................................................................... 33
5.3.3 USB Connector 4/5 (USB4/5) ......................................................................................................... 33
5.4 Audio Connector (IO Area) ............................................................................................................... 34
5.5 COM1 Connector (IO Area) ............................................................................................................... 35
6Internal Connectors...........................................................................36

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6.1 Power Connector (ATX/BTXPWR) ....................................................................................................... 36
6.2 Fan Connectors (FAN_CPU) (J28) and (FAN_SYS) (J29).......................................................................37
6.3 PS/2 Keyboard and Mouse connector (KBDMSE) (J15)......................................................................... 38
6.4 Display connectors (Internal)........................................................................................................... 39
6.4.1 LVDS Flat Panel Connector (LVDS) (J39) (optionally).........................................................................39
6.5 SATA (Serial ATA) Disk interface (J22 – J27) ...................................................................................... 40
6.6 USB Connectors (USB)..................................................................................................................... 41
6.6.1 USB Connector 6/7 ........................................................................................................................ 41
6.6.2 USB Connector 8/9 (USB8/9) (J18).................................................................................................41
6.6.3 USB Connector 10/11 (USB10/11) (J17).......................................................................................... 42
6.6.4 USB Connector 12/13 (USB12/13) (J16).......................................................................................... 42
6.7 Serial COM2 – COM4 Ports (J19, J20, J21).......................................................................................... 43
6.8 Audio Connectors............................................................................................................................ 44
6.8.1 CDROM Audio Input (CDROM) (J44) .................................................................................................44
6.8.2 Line2 and Mic2.............................................................................................................................. 44
6.8.1 Audio Header Connector (AUDIO_HEAD) (J47) ................................................................................. 45
6.9 Front Panel Connector (FRONTPNL) (J36) .......................................................................................... 46
6.10 Feature Connector (FEATURE) (J30) .................................................................................................. 47
6.11 ”Load Default BIOS Settings” Jumper (J11) .......................................................................................49
6.12 ClrRTC (J12) ................................................................................................................................... 49
6.13 SPI Recover Jumper (J41)................................................................................................................ 50
6.14 SPI Connector (SPI) (J40)................................................................................................................ 51
6.15 XDP-CPU (Debug Port for CPU) (J14) .................................................................................................52
6.16 XDP-PCH (Debug Port for Chipset) (J13) ............................................................................................ 53
7Slot Connectors (PCIe, mSATA, miniPCIe, PCI) .......................................54
7.1 PCIe Connectors.............................................................................................................................. 54
7.1.1 PCI-Express x16 Connector (PCIe x16).............................................................................................. 54
7.1.2 mSATA (J43) ................................................................................................................................. 56
7.1.3 miniPCI-Express mPCIe (J42).......................................................................................................... 57
7.1.4 PCI-Express x4 Connector (PCIe x4) (J33) ........................................................................................ 58
7.2 PCI Slot Connectors ........................................................................................................................ 59
7.2.1 Signal Description – PCI Slot Connector ........................................................................................... 60
7.2.2 KTQ77 PCI IRQ & INT routing ........................................................................................................... 61
8On-board - & mating connector types ...................................................62
9System Resources..............................................................................63

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9.1 Memory Map................................................................................................................................... 63
9.2 PCI Devices .................................................................................................................................... 64
9.3 Interrupt Usage.............................................................................................................................. 65
9.4 IO Map........................................................................................................................................... 66
10 BIOS................................................................................................67
10.1 Main.............................................................................................................................................. 67
10.2 Advanced....................................................................................................................................... 68
10.2.1 Advanced -PCI Subsystem Settings ................................................................................................ 69
10.2.2 Advanced -APCI Settings ............................................................................................................. 74
10.2.3 Advanced -Trusted Computing ...................................................................................................... 75
10.2.4 Advanced -CPU Configuration ....................................................................................................... 76
10.2.5 Advanced -SATA Configuration...................................................................................................... 78
10.2.6 Advanced -Intel ® Rapid Start Technology ..................................................................................... 82
10.2.7 Advanced -Intel TXT (LT) Configuration.......................................................................................... 83
10.2.8 Advanced -Intel ® Anti-Theft Technology Configuration .................................................................. 84
10.2.9 Advanced -AMT Configuration ....................................................................................................... 85
10.2.10 Advanced -Acoustic Management Configuration .............................................................................87
10.2.11 Advanced -USB Configuration....................................................................................................... 88
10.2.12 Advanced -SMART Settings ........................................................................................................... 90
10.2.13 Advanced -Super IO Configuration................................................................................................. 91
10.2.14 Advanced -Voltage Monitor .......................................................................................................... 96
10.2.15 Advanced -Hardware Health Configuration..................................................................................... 97
10.2.16 Advanced -LAN Configuration ....................................................................................................... 99
10.2.17 Advanced -Delay Startup ............................................................................................................ 101
10.2.18 Advanced -Serial Port Console Redirection ................................................................................... 102
10.2.19 Advanced -CPU PPM Configuration............................................................................................... 106
10.3 Chipset ........................................................................................................................................ 107
10.3.1 PCH-IO Configuration................................................................................................................... 108
10.3.2 System Agent (SA) Configuration .................................................................................................. 114
10.4 Boot............................................................................................................................................ 132
10.4.1 CSM16 parameters ....................................................................................................................... 134
10.4.2 Force Boot Setup ......................................................................................................................... 135
10.4.3 CSM parameters........................................................................................................................... 136
10.5 Security ....................................................................................................................................... 137
10.5.1 HDD Security Configuration .......................................................................................................... 138
10.6 Save & Exit................................................................................................................................... 139
11 AMI BIOS Beep Codes .......................................................................140

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12 OS Setup ........................................................................................141

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Introduction
This manual describes the KTQ77/Flex board made by KONTRON Technology A/S. The board will also
be denoted KTQ77 in this manual.
The KTQ77 board is based on the Q77 chipset, support 2nd and 3rd generation Intel® i7 -, i5 -, i3 2Core
and 4Core processors and also Pentium and Celeron processors. See “Processor Support Table for
more specific details.
Use of this Users Guide implies a basic knowledge of PC-AT hard- and software. This manual is
focused on describing the KTQ77 board’s special features and is not intended to be a standard PC-AT
textbook.
New users are recommended to study the short installation procedure stated in the following chapter
before switching-on the power.
Note. LPT and LVDS are optionally for future variants.
All configuration and setup of the CPU board is either done automatically or manually by the user via
the BIOS setup menus. Only exception is the “Load Default BIOS Settings” Jumper.
Introduction

KTQ77/Flex Users Guide
KTD-N0848-B Page 9
Warning: Turn off PSU (Power Supply Unit) completely (no mains power connected to the
PSU) or leave the Power Connectors unconnected while configuring the board. Otherwise
components (DRAM, LAN cards etc.) might get damaged. Make sure PSU has 3.3V monitoring
watchdog (standard ATX PSU feature), running the board without 3.3V will damage the board
within minutes.
!
!
Warning: When mounting the board to chassis etc. please notice that the board contains
components on both sides of the PCB which can easily be damaged if board is handled
without reasonable care. A damaged component can result in malfunction or no function at all.
1 Installation procedure
1.1 Installing the board
To get the board running, follow these steps. If the board shipped from KONTRON has already
components like DRAM, CPU and cooler mounted, then relevant steps below, can be skipped.
1. Turn off the PSU (Power Supply Unit)
2. Insert the DRAM(s) (UDIMM 240pin)
Be careful to push it in the slot(s) before locking the tabs. For a list of approved DRAM contact your
Distributor or FAE. See also chapter “System Memory Support”.
3. Install the processor
The CPU is keyed and will only mount in the CPU socket in one way. Use finger to open/ close the
CPU socket. Refer to supported processor overview for details.
4. Cooler Installation
Use heat paste or adhesive pads between CPU and cooler and connect the Fan electrically to the
FAN_CPU connector.
5. Connecting Interfaces
Insert all external cables for hard disk, keyboard etc. A monitor must be connected in order to be
able change CMOS settings.
6. Connect and turn on PSU
Connect PSU to the board by the ATX/BTXPWR and the 4-pin ATX+12V connectors.
7. Power Button
The PWRBTN_IN must be toggled to start the Power supply; this is done by shorting pins 16
(PWRBTN_IN) and pin 18 (GND) on the FRONTPNL connector (see Connector description). A
“normally open” switch can be connected via the FRONTPNL connector.
8. BIOS Setup
Enter the BIOS setup by pressing the <Del> key during boot up.
Enter Exit Menu and Load Optimal Defaults.
Refer to the “BIOS Configuration / Setup“ section of this manual for details on BIOS setup.
9. Mounting the board to chassis
When fixing the Motherboard on a chassis it is recommended using screws with integrated washer and
having diameter of ~7mm.
Note: Do not use washers with teeth, as they can damage the PCB and may cause short circuits.
Installation procedure
Note: To clear all CMOS settings, including Password protection, move the Clear CMOS jumper in the
Clear CMOS position (with or without power) for ~10 sec. This will Load Failsafe Defaults and make sure
Secure CMOS is disabled.

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1.2 Requirement according to IEC60950
Users of KTQ77 family boards should take care when designing chassis interface connectors in order to
fulfil the IEC60950 standard:
Lithium Battery precautions:
CAUTION!
Danger of explosion if battery is incorrectly
replaced.
Replace only with same or equivalent type
recommended by manufacturer.
Dispose of used batteries according
to the manufacturer’s instructions.
VORSICHT!
Explosionsgefahr bei unsachgemäßem
Austausch der Batterie.
Ersatz nur durch den selben oder einen vom
Hersteller empfohlenen gleichwertigen Typ.
Entsorgung gebrauchter Batterien nach
Angaben des Herstellers.
ADVARSEL!
Lithiumbatteri – Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende
type anbefalt av apparatfabrikanten.
Brukte batterier kasseres i henhold til
fabrikantens
instruksjoner.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent
typ som rekommenderas av apparattillverkaren.
Kassera använt batteri enligt fabrikantens
instruktion.
VAROITUS
Paristo voi räjähtää, jos se on virheellisesti
asennettu.
Vaihda paristo ainoastaan laltevalmistajan
suosittelemaan
tyyppiin. Hävitä käytetty paristo valmistajan
ohjeiden
mukaisesti.
When an interface/connector has a VCC (or other power) pin, which is directly connected to a power
plane like the VCC plane:
To protect the external power lines of the peripheral devices, the customer has to take care about:
•That the wires have suitable rating to withstand the maximum available power.
•That the enclosure of the peripheral device fulfils the fire protecting requirements of IEC60950.
Installation procedure

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2 System Specification
2.1 Component main data
The table below summarizes the features of the KTQ77/Flex embedded motherboard.
Form factor
KTQ77/Flex: Flex-ATX (190,5 mm by 228,6 mm)
Processor
Support the following Intel® Core™ processors via Socket H2 (LGA1155), ZIF Socket
•Intel® Core™ i7, 2nd and 3rd Generation
•Intel® Core™ i5, 2nd and 3rd Generation
•Intel® Core™ i3, 2nd and 3rd Generation
•1333/1600MHz system bus and 3/6/8MB internal cache.
•Up to 95W (Thermal Guideline)
•PCIe x16 (PEG) Gen3.0
Memory
•4x DDR3 UDIMM 240pin socket
•Support single and dual ranks DDR3 1066/1333/1600MT/s
(PC3-8500/PC3-10600/PC3-12800)
•Support system memory from 1GB and up to 4x 8GB
Note: Less than 4GB displayed in System Properties using 32bit OS
(Shared Video Memory/PCI resources is subtracted)
•ECC not supported
Chipset
Intel Q77 PCH (Platform Controller Hub)
•Intel ® VT-d (Virtualisation Technology for Directed I/O)
•Intel ® TXT (Trusted Execution Technology)
•Intel ® vPRO
•Intel ® AMT (Active Management Technology) version 8.0
•Intel ® AT (Anti-Theft Technology)
•Intel ® HD Audio Technology
•Intel ® RST (Rapid Storage Technology)
•Intel ® RRT (Rapid Recover Technology)
•SATA (Serial ATA) 6Gb/s and 3Gb/s.
•USB 4x rev. 3.0/2.0 + 10x rev. 2.0
•PCIe x4 (in x16 slot) Gen2.0
•ACPI 3.0b compliant
•Triple Display support (Triple Graphic Pipes)
•Blue-ray HD video playback
Security
•Intel® Integrated TPM 1.2 support
Management
•Intel® AMT (Active Management Technology) 8.0
Audio
Audio, 7.1 Channel High Definition Audio Codec using the VIA 1708B codec
•Line-out
•Line-in
•Surround output: SIDE, LFE, CEN, BACK and FRONT
•Microphone: MIC1 and MIC2
•CDROM in
•SPDIF (electrical Interface only)
•On-board speaker (Electromagnetic Sound Generator like Hycom HY-05LF)
System Specification

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Video
Intel ® HD Graphics 4000 or
Intel ® HD Graphics 3000 or
Intel ® HD Graphics 2500 or
Intel ® HD Graphics 2000 or
Intel ® HD Graphics, depending on actual CPU.
Analogue VGA and digital display ports (2x DP) via the Mobile Intel ® Q77 Chipset.
•VGA (analogue panel)
•2x DP (DisplayPort), comply with DisplayPort 1.2 specification.
•LVDS panel support (optional) up to 24 bit, 2 pixels/clock and 1920x1200.
•HDMI panel support via DP to HDMI Adapter Converter.
•Second VGA panel support via DP to VGA Adapter Converter
•Second DVI panel support via DP to DVI Adapter Converter
•Triple independent pipes for Mirror and/or independent display support
I/O Control
Via ITE IT8516E Embedded Controller and Winbond W83627DHG I/O Controller
(both via LPC Bus interface)
Peripheral
interfaces
•2x USB 2.0 ports on I/O area
•4x USB 3.0 ports on I/O area
•8x USB 2.0 ports on internal pinrows
•4x Serial ports (RS232) on internal pinrows
•2x Serial ATA-600 IDE interfaces (blue)
•4x Serial ATA-300 IDE interfaces (black)
•1x Serial ATA-300 IDE interfaces (white), shared with mSATA
•RAID 0/1/5/10 support
•mSATA via mSATA connector, shared with SATA (white)
•PS/2 keyboard and mouse ports via pinrow
LAN
Support
•1x 10/100/1000Mbits/s LAN (ETHER1) using Intel® Lewisville 82579LM Gigabit
PHY connected to Q77 supporting AMT 8.0
•2x 10/100/1000Mbits/s LAN (ETHER2/ETHER3)using Intel® Hartwell 82574L PCI
Express controllers
•PXE Netboot supported.
•Wake On LAN (WOL) supported
Expansion
Capabilities
•2x PCI slot(s) (PCI Local Bus Specification Revision 3.0, 33MHz)
•PCI-Express slots:
o1 slot PCIe x16 Gen3.0
o1 slot PCIe x4 (in a x16 slot) Gen2 (EFT samples support only PCIe x1)
o1 slot miniPCI-Express
•SMBus, compatible with ACCES BUS and I2C BUS, (via Feature connector)
•SPI bus routed to SPI connector
•DDC Bus routed to DP connector when DP Adapters are connected
•5 x digital input, (via Feature connector)
•13 x GPIOs (General Purpose I/Os), (via Feature connector)
•DAC, ADC, PWM and TIMER (Multiplexed), (via Feature connector)
•WAKE UP / Interrupt Inputs (Multiplexed), (via Feature connector)
•3 Wire Bus for GPIO Expansion (up to 152 GPIOs), (via Feature connector)
•8 bit Timer output, (via Feature connector)
System Specification

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Hardware
Monitor
Subsystem
•Smart Fan control system, support Thermal® and Speed® cruise for FAN_CPU
•CPU die temperature input (Precision +/- 3ºC)
•Voltage monitoring
•Intrusion (Case Open) detect input, (via Feature connector)
•Sleep S4/S5# Indication, (via Feature connector)
•System Powergood Signal, (via Feature connector)
Power
Supply Unit
ATX/BTX (w. ATX+12V) PSU for full PCI/PCIe load.
Battery
Exchangeable 3.0V Lithium battery for on-board Real Time Clock and CMOS RAM.
Manufacturer Panasonic / Part-number CR-2032L/BN, CR2032N/BN or CR-2032L/BE.
Approximate 5 years retention.
Current draw is 5,7µA when PSU is disconnected and 0 µA in S0 – S5.
CAUTION: Danger of explosion if the battery is incorrectly replaced. Replace
only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
BIOS
•Kontron Technology / AMI BIOS (EFI core version)
•Support for ACPI 3.0 ( Advanced Configuration and Power Interface), Plug & Play
oSuspend (S1 mode)
oSuspend To Ram (S3 mode)
oSuspend To Disk (S4 mode)
•“Always On” BIOS power setting
•RAID Support (RAID modes 0,1, 5 and 10)
Operating
Systems
Support
•WinXP (32b *)
•Windows 7 (32b + 64b *)
•WES7 (32b * + 64b *)
•Linux Fedora *
•Linux Ubuntu * (RAID problem)
•VxWorks BSP, WES7 BSP, Kontron Linux BSP (not ready yet)
*= Out Of The Box installation test only
System Specification

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Environmental
Conditions
Operating:
0°C – 60°C operating temperature (forced cooling). It is the customer’s
responsibility to provide sufficient airflow around each of the components to keep
them within allowed temperature range.
10% - 90% relative humidity (non-condensing)
Storage:
-20°C – 70°C; lower limit of storage temperature is defined by specification
restriction of on-board CR2032 battery. Board with battery has been verified for
storage temperature down to -40°C by Kontron.
5% - 95% relative humidity (non-condensing)
Electro Static Discharge (ESD) / Radiated Emissions (EMI):
All Peripheral interfaces intended for connection to external equipment are ESD/
EMI protected.
EN 61000-4-2:2000 ESD Immunity
EN55022:1998 class B Generic Emission Standard.
Safety:
IEC 60950-1: 2005, 2nd Edition
UL 60950-1
CSA C22.2 No. 60950-1
Product Category: Information Technology Equipment Including Electrical
Business Equipment
Product Category CCN: NWGQ2, NWGQ8
File number: E194252
Theoretical MTBF:
216227 / 100903 hours @ 40ºC / 60ºC for the KTQ77/Flex
Restriction of Hazardous Substances (RoHS):
All boards in the KTQ77 family are RoHS compliant.
Capacitor utilization:
No Tantalum capacitors on board
Only Japanese brand Solid capacitors rated for 100 ºC used on board
System Specification

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2.2 System overview
The block diagram below shows the architecture and main components of the KTQ77. The key
component on the board is the Intel®Q77 (Panther Point) Express Chipset.
More detailed block diagram on next page.
System Specification

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System Specification
Dual Channel DDR3
1067/1333/1600
4 x DIMM
Q77 PCH
PCIe x16 Graphics
Ivy Bridge or
Sandy Bridge
LGA1155
2x DisplayPort
VGA
PCIe x4 Slot
Intel 82574L 10/100/GBe
14x USB
(4x Gen 3.0 / 2.0)
6x SATA
SDVO to LVDS (option)
VIA Codec
SPI
SPI
TPM
Intel Lewisville PHY
Intel 82574L 10/100/GBe
mSATA
PCIe Mini Card
IO controller
W83627DHG-P(T)
IO controller
ITE8516
PCI slot
PCI slot
COM3/4
COM1/2
FAN CPU/SYS
FEATURE

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2.3 Processor Support Table
The KTQ77 is designed to support the following LGA1155 processors (up to 95W power consumption):
2nd and 3rd generation Intel® Core™ i7 processor
2nd and 3rd generation Intel® Core™ i5 processor
2nd and 3rd generation Intel® Core™ i3 processor
Pentium and Celeron
In the following list you will find all CPU’s supported by the chipset in according to Intel.
Embedded CPU’s are indicated by green text, successfully tested CPU’s are indicated by highlighted
text, successfully tested embedded CPU’s are indicated by green and highlighted text and failed
CPU’s are indicated by red text.
Some processors in the list are distributed from Kontron, those CPU’s are marked by an * (asterisk).
However please notice that this marking is only guide line and maybe not fully updated.
Processor
Brand
Clock
[GHz]
Turbo
[GHz]
Cores /
Threads
Bus
[MHz]
Cache
[MB]
CPU
Number
sSpec
no.
Step
TG
[W/ºC]
Note
3.5
3.9
4 / 8
1333/1600
8
3770K
SR0PL
E1
77/67.4
HDG4000
I7 3rd Gen.
3.4
3.9
4 / 8
1333/1600
8
3770
SR0PK
E1
77/67.4
HDG4000
(Ivy Bridge)
3.1
3.9
4 / 8
1333/1600
8
3770S
SR0PN
E1
65/69.1
HDG4000
2.5
3.7
4 / 8
1333/1600
8
3770T
SR0PQ
E1
45/69.8
HDG4000
3.5
3.9
4 / 8
1066/1333
8
2700K
SR0DG
D2
95/72.6
HDG3000
I7 2nd Gen.
3.4
3.8
4 / 8
1066/1333
8
2600
SR00B
D2
95/72.6
HDG2000
(Sandy Bridge)
3.4
3.8
4 / 8
1066/1333
8
2600K
SR00C
D2
95/72.6
HDG3000
2.8
3.8
4 / 8
1066/1333
8
2600S
SR00E
D2
65/69.1
HDG2000
3.4
3.8
4 / 4
1333/1600
6
3570
SR0T7
N0
77/67.4
HDG2500
I5 3rd Gen.
3.4
3.8
4 / 4
1333/1600
6
3570K
SR0PM
E1
77/67.4
HDG4000
(Ivy Bridge)
3.3
3.7
4 / 4
1333/1600
6
3550
SR0P0
E1
77/67.4
HDG2500
3.2
3.6
4 / 4
1333/1600
6
3470
SR0T8
N0
77/67.4
HDG2500
3.1
3.8
4 / 4
1333/1600
6
3570S
SR0T9
N0
65/69.1
HDG2500
3.1
3.5
4 / 4
1333/1600
6
3450
SR0PF
E1
77/67.4
HDG2500
3.1
3.3
4 / 4
1333/1600
6
3350P
SR0WS
E1
69/67.4
-
3.0
3.7
4 / 4
1333/1600
6
3550S
SR0P3
E1
65/69.1
HDG2500
3.0
3.2
4 / 4
1333/1600
6
3330
SR0RQ
E1
77/67.4
HDG2500
2.9
3.6
4 / 4
1333/1600
6
3475S
SR0PP
E1
65/69.1
HDG4000
2.9
3.6
4 / 4
1333/1600
6
3470S
SR0TA
N0
65/69.1
HDG2500
2.9
3.6
2 / 4
1333/1600
3
3470T
SR0RJ
L1
35/65.0
HDG2500 *
2.8
3.5
4 / 4
1333/1600
6
3450S
SR0P2
E1
65/69.1
HDG2500
2.7
3.5
4 / 4
1333/1600
6
3330S
SR0RR
E1
65/
HDG2500
2.3
3.2
4 / 4
1333/1600
6
3570T
SR0P1
E1
45/69.8
HDG2500
3.3
3.7
4 / 4
1066/1333
6
2550K
SR0QH
D2
95/72.6
-
I5 2nd Gen.
3.3
3.7
4 / 4
1066/1333
6
2500K
SR008
D2
95/72.6
HDG3000
(Sandy Bridge)
3.3
3.7
4 / 4
1066/1333
6
2500
SR00T
D2
95/72.6
HDG2000
3.2
3.5
4 / 4
1066/1333
6
2450P
SR0G1
D2
95/72.6
-
3.1
3.4
4 / 4
1066/1333
6
2380P
SR0G2
D2
95/72.6
-
3.1
3.4
4 / 4
1066/1333
6
2400
SR00Q
D2
95/72.6
HDG2000
3.0
3.3
4 / 4
1066/1333
6
2320
SR02L
D2
95/72.6
HDG2000
2.9
3.2
4 / 4
1066/1333
6
2310
SR02K
D2
95/72.6
HDG2000
2.8
3.1
4 / 4
1066/1333
6
2300
SR00D
D2
95/72.6
HDG2000
2.7
3.7
4 / 4
1066/1333
6
2500S
SR009
D2
65/69.1
HDG2000
2.7
3.5
2 / 4
1066/1333
3
2390T
SR065
Q0
35/65.0
HDG2000
2.5
3.3
4 / 4
1066/1333
6
2405S
SR0BB
D2
65/69.1
HDG3000
2.5
3.3
4 / 4
1066/1333
6
2400S
SR00S
D2
65/69.1
HDG2000
2.3
3.3
4 / 4
1066/1333
6
2500T
SR00A
D2
45/69.8
HDG2000
System Specification

KTQ77/Flex Users Guide
KTD-N0848-B Page 18
Processor
Brand
Clock
[GHz]
Turbo
[GHz]
Cores /
Threads
Bus
[MHz]
Cache
[MB]
CPU
Number
sSpec
no.
Step
TG
[W/ºC]
Note
3.5
-
2 / 4
1333/1600
3
3250
SR0YX
P0
55/65.3
HDG2500
I3 3rd Gen.
3.4
-
2 / 4
1333/1600
3
3245
SR0YL
L1
55/65.3
HDG4000
(Ivy Bridge)
3.4
-
2 / 4
1333/1600
3
3240
SR0RH
L1
55/65.3
HDG2500
3.3
-
2 / 4
1333/1600
3
3225
SR0RF
L1
55/65.3
HDG4000
(No vPRO)
3.3
-
2 / 4
1333/1600
3
3220
SR0RG
L1
55/65.3
HDG2500
3.2
-
2 / 4
1333/1600
3
3210
SR0YY
P0
55/65.3
HDG2500
3.0
-
2 / 4
1333/1600
3
3250T
SR0YW
P0
35/65.0
HDG2500
2.9
-
2 / 4
1333/1600
3
3240T
SR0RK
L1
35/65.0
HDG2500
2.8
-
2 / 4
1333/1600
3
3220T
SR0RE
L1
35/65.3
HDG2500
3.4
-
2 / 4
1066/1333
3
2130
SR05W
Q0
65/69.1
HDG2000
I3 2nd Gen.
3.3
-
2 / 4
1066/1333
3
2125
SR0AY
J1
65/69.1
HDG3000
(Sandy Bridge)
3.3
-
2 / 4
1066/1333
3
2120
SR05Y
Q0
65/69.1
HDG2000
3.1
-
2 / 4
1066/1333
3
2105
SR0BA
J1
65/69.1
HDG3000
(No vPRO)
3.1
-
2 / 4
1066/1333
3
2100
SR05C
Q0
65/69.1
HDG2000
3.1
-
2 / 4
1066/1333
3
2102
SR05D
Q0
65/69.1
HDG2000
2.6
-
2 / 4
1066/1333
3
2120T
SR060
Q0
35/65.0
HDG2000
2.5
-
2 / 4
1066/1333
3
2100T
SR05Z
Q0
35/65.0
HDG2000
3.1
-
2 / 2
1066/1333
3
G870
SR057
Q0
65/69.1
HDG
3.0
-
2 / 2
1066/1333
3
G860
SR058
Q0
65/69.1
HDG
Pentium
2.9
-
2 / 2
1066/1333
3
G850
SR05Q
Q0
65/69.1
HDG
2.9
-
2 / 2
1066
3
G645
SR0RS
Q0
65/69.1
HDG
2.8
-
2 / 2
1066/1333
3
G840
SR05P
Q0
65/69.1
HDG
2.8
-
2 / 2
1066
3
G640
SR059
Q0
65/69.1
HDG
2.7
-
2 / 2
1066
3
G632
SR05N
Q0
65/69.1
HDG
2.7
-
2 / 2
1066
3
G630
SR05S
Q0
65/69.1
HDG
2.8
-
2 / 2
1066/1333
3
G860T
SR0MF
Q0
35/65.0
HDG
2.6
-
2 / 2
1066
3
G620
SR05R
Q0
65/69.1
HDG
2.6
-
2 / 2
1066
3
G622
-
-
65/69.1
HDG
2.5
-
2 / 2
1066
3
G645T
SR0S0
Q0
35/65.0
HDG
2.4
-
2 / 2
1066
3
G640T
SR066
Q0
35/65.0
HDG
2.2
-
2 / 2
1066
3
G620T
SR05T
Q0
35/65.0
HDG
2.3
-
2 / 2
1066
3
G630T
SR05U
Q0
35/65.0
HDG
2.7
-
2 / 2
1333
2
G1620
SR10L
P0
55
HDG *
2.7
-
2 / 2
1066
2
G555
SR0RZ
Q0
65/69.1
HDG
2.6
-
2 / 2
1333
2
G1610
SR10K
P0
55
HDG *
2.6
-
2 / 2
1066
2
G550
SR061
Q0
65/69.1
HDG
2.5
-
2 / 2
1066
2
G540
SR05J
Q0
65/69.1
HDG
Celeron
2.4
-
2 / 2
1066
2
G530
SR05H
Q0
65/69.1
HDG
2.3
-
2 / 2
1333
2
G1610T
SR10M
P0
35/
HDG *
2.2
-
2 / 2
1066
2
G550T
SR05V
Q0
35/65.0
HDG
2.1
-
2 / 2
1066
2
G540T
SR05L
Q0
35/65.0
HDG
2.0
-
2 / 2
1066
2
G530T
SR05K
Q0
35/65.0
HDG
2.0
-
1 / 2
1066/1333
1.5
G470
SR0S7
Q0
35/65.5
HDG
1.8
-
1 / 2
1066
1.5
G460
SR0GR
Q0
35/65.5
HDG
1.6
-
1 / 1
1066
1
G440
SR0BY
Q0
35/65.5
HDG
(*) ECC not supported on KTQ77.
Not all CPUs, even of same type, support all functions ex. i7 3770K, i7 2600K, i5 3570K, 3450, 3450S,
3350P, 3330S, 3330 and i5 2500K, 2300,2310, 2320, 2380P, 2450P, 2550K doesn’t support vPro while
all other i7 and i5 does.
Intel® Turbo Boost Technology 2.0 is supported by i5 and i7, as indicated in above list of processors,
and is enabling overclocking of all cores, when operated within the limits of thermal design power,
temperature and current.
System Specification

KTQ77/Flex Users Guide
KTD-N0848-B Page 19
!
Warning: Make sure sufficient airflow is always present around the components located below
the cooler. Different coolers are available on the market and some is not generating any airflow
or is blocking the airflow around these components, causing reduced lifetime.
Sufficient cooling must be applied to the CPU in order to remove the effect as listed in above table
(Thermal Guideline). The sufficient cooling is also depending on the maximum (worst-case) ambient
operating temperature and the actual load of processor.
It is recommended to use a cooler like the Kontron
PN 1046-6305 “KTQ77 Cooler”.
The design of this cooler makes sure airflow is
always present around the components below the
cooler. Even if Fan is set to be off, it is still running
a minimum RPM (Rotation Per Minute).
Air sucked in to the cooler
Air blown out of the cooler
Components below the cooler
Note: The temperature of the air blown out of the cooler must be less than 70
º
C maximum in order not
to overheat components near the CPU. However most CPU’s requires maximum 67.4ºC, so in order not
to violate the CPU specification the temperature of the air should be maximum ~65ºC.
System Specification

KTQ77/Flex Users Guide
KTD-N0848-B Page 20
2.4 System Memory support
The KTQ77/FLEX has four DDR3 UDIMM sockets. The sockets support the following memory features:
•4x DDR3 1.5V UDIMM 240-pin
•Dual-channel with 2 UDIMM per channel
•Single/dual rank unbuffered 1333/1600MT/s (PC3-10600/PC3-12800)
The supported 2nd Generation Core i5 support 1066/1333 MT/s
From 1GB and up to 4x 8GB.
Note: Less than 4GB displayed in System Properties using 32bit OS
(Shared Video Memory/PCI resources is subtracted)
•SPD timings supported
•ECC not supported
The installed DDR3 DIMM should support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read and configure the memory controller for optimal performance. If non-SPD memory is
used, the BIOS will attempt to configure the memory settings, but performance and reliability may be
impacted.
Memory Operating Frequencies
Regardless of the DIMM type used, the memory frequency will either be equal to or less than the
processor system bus frequency. For example, if DDR3 1600 memory is used with a 1333 MHz system
bus frequency processor, the memory clock will operate at 666 MHz. The table below lists the resulting
operating memory frequencies based on the combination of DIMMs and processors.
DIMM Type
Module
name
Memory
Data
transfers
[Mill/s]
Processor
system bus
frequency
[MHz]
Resulting
memory clock
frequency
[MHz]
Peak transfer
rate
[MB/s]
DDR3 1066
PC3-8500
1066
1066 / 1333
533
8533
DDR3 1333
PC3-10600
1333
1333/1600
666
10666
DDR3 1600
PC3-12800
1600
1333
666
10666
DDR3 1600
PC3-12800
1600
1600
800
12800
Notes: Kontron offers the following memory modules:
1054-2766 1GB DDR3 1066
1031-9872 1GB DDR3 1333
1054-3706 1GB DDR3 1600
1054-2768 2GB DDR3 1066
1054-3702 2GB DDR3 1333
1054-3707 2GB DDR3 1600
1054-3700 4GB DDR3 1066
1054-3703 4GB DDR3 1333
1054-3708 4GB DDR3 1600
1054-3704 8GB DDR3 1333
1052-5601 8GB DDR3 1600
In order to support Intel ® AMT (Management Engine) SLOT A0 must always be populated. In case of
using more than a single DIMM it is recommended to populate A0 + B0 first.
DDR3 (SLOT B1)
DDR3 (SLOT B0)
DDR3 (SLOT A1)
DDR3 (SLOT A0)
System Specification