Kontron COMh-sdID User manual


User Guide Rev. 1.0

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Table of Contents
1. General Information 1 ....................................................................................................................
1.1 Disclaimer 1 ................................................................................................................................
1.2 Intended Use 2 ...........................................................................................................................
1.3 Terms and Conditions 3 ............................................................................................................
1.4 Customer Support 3 ..................................................................................................................
1.5 Customer Service 3 ...................................................................................................................
1.6 Customer Comments 3 ..............................................................................................................
1.7 Symbols 4 ....................................................................................................................................
1.8 For Your Safety 5 .......................................................................................................................
1.9 High Voltage Safety Instructions 5 .........................................................................................
1.10 Special Handling and Unpacking Instruction 5 ...................................................................
1.11 Lithium Battery Precautions 6 ..............................................................................................
1.12 General Instructions on Usage 6 ...........................................................................................
1.13 Quality and Environmental Management 7 .........................................................................
1.13.1 Disposal and Recycling 7 ......................................................................................................
1.13.2 WEEE Compliance 7 ..............................................................................................................
2. Introduction 8 ..................................................................................................................................
2.1 Product Naming Clarification 8 ...............................................................................................
2.2 Product description 8 ................................................................................................................
2.3 COM-HPC® Documentation 9 ..................................................................................................
2.4 COM-HPC® Server Functionality 9 ..........................................................................................
2.5 COM-HPC® Benefits 9 ...............................................................................................................
3. Product specification 11 .................................................................................................................
3.1 Module Variants 11 ....................................................................................................................
3.1.1 Commercial Grade Modules (0°C to +60°C) 11 ......................................................................
3.1.2 Industrial Temperature Grade Modules (E2, -40°C to +85°C) 11 ............................................
3.2 Accessories 11 ............................................................................................................................
3.2.1 Cooling 11 ...............................................................................................................................
3.2.2 DIMM Memory 12 ....................................................................................................................
3.2.3 Evaluation Carrier 12 ..............................................................................................................
3.3 Functional Specification 12 ......................................................................................................
3.3.1 Technical Data 12 ...................................................................................................................
3.3.2 Block Diagram 13 ....................................................................................................................
3.3.3 Top Side 14 .............................................................................................................................
3.3.4 Bottom Side 15 .......................................................................................................................
3.3.5 Processor (CPU) 15 ..................................................................................................................
3.3.6 System Memory 17 .................................................................................................................
3.3.7 High-Speed Interface Overview 17 ..........................................................................................
3.4 Interfaces 19 ...............................................................................................................................
3.4.1 PCIe 19 ....................................................................................................................................
3.4.2 USB 21 ....................................................................................................................................
3.4.3 SATA 21 ..................................................................................................................................
3.4.4 Ethernet 21 .............................................................................................................................
3.4.5 Graphics Interfaces 24 ............................................................................................................
3.4.6 Audio Interfaces 24 .................................................................................................................
3.4.7 UART 25 ..................................................................................................................................
3.4.8 General Purpose SPI interface 25 ............................................................................................
3.4.9 Boot SPI 25 ..............................................................................................................................

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3.4.10 eSPI 26 ..................................................................................................................................
3.4.11 I2C 27 ....................................................................................................................................
3.4.12 GPIO 27 .................................................................................................................................
3.4.13 SMB 27 ..................................................................................................................................
3.5 Features 28 .................................................................................................................................
3.5.1 ACPI Power States 28 ..............................................................................................................
3.5.2 Embedded Controller - Hardware Monitor 28 ..........................................................................
3.5.3 Trusted Platform Module (TPM) 28 ..........................................................................................
3.5.4 Watchdog 29 ...........................................................................................................................
3.5.5 Real-Time Clock (RTC) 29 ........................................................................................................
3.5.6 NVME 29 .................................................................................................................................
3.5.7 Features on Request 30 ..........................................................................................................
3.6 Electrical Specification 31 ........................................................................................................
3.6.1 Power Supply Specification 31 ................................................................................................
3.6.2 Power Management 32 ...........................................................................................................
3.7 Thermal Management 34 ..........................................................................................................
3.7.1 Heatspreader Plate Assembly 34 ............................................................................................
3.7.2 Active/Passive Cooling Solutions 34 ........................................................................................
3.7.3 Operating with Kontron Heatspreader Plate (HSP) Assembly 34 .............................................
3.7.4 Operating without Kontron Heatspreader Plate (HSP) Assembly 34 .......................................
3.7.5 Temperature Sensors 35 .........................................................................................................
3.7.6 On-Module Fan Connector 35 ..................................................................................................
3.8 Mechanical Specification 37 .....................................................................................................
3.8.1 Module Dimensions 37 ............................................................................................................
3.8.2 Module Height 37 ....................................................................................................................
3.8.3 Heatspreader Plate Assembly Dimension 38 ..........................................................................
3.9 Environmental Specification 39 ...............................................................................................
3.10 Compliance 40 ..........................................................................................................................
3.11 MTBF 41 .....................................................................................................................................
4. COM-HPC Interface Connector 42 .................................................................................................
4.1 Connecting COM-HPC Interface Connector to Carrier Board 42 .........................................
4.2 J1 and J2 signals 43 ...................................................................................................................
4.3 Connector J1 44 ..........................................................................................................................
4.3.1 Pins A1 - A100 / B1 - B100 44 .................................................................................................
4.3.2 Pins C1 - C100 / D1 - D100 45 .................................................................................................
4.4 Connector J2 47 ..........................................................................................................................
4.4.1 Pins E1 - E100 / F1 - F100 47 ..................................................................................................
4.4.2 Pins G1 - G100 / H1 - H100 49 ................................................................................................
5. UEFI BIOS 52 .....................................................................................................................................
5.1 Starting the UEFI BIOS 52 ........................................................................................................
5.2 Navigating the UEFI BIOS 53 ....................................................................................................
5.3 Setup Menus 53 .........................................................................................................................
5.4 Getting Help 53 ..........................................................................................................................
5.5 UEFI Shell 54 ...............................................................................................................................
5.5.1 Entering the UEFI Shell 54 .......................................................................................................
5.5.2 Exiting the UEFI Shell 54 .........................................................................................................
5.6 UEFI Shell Scripting 55 .............................................................................................................
5.6.1 Startup Scripting 55 ................................................................................................................
5.6.2 Create a Startup Script 55 ......................................................................................................
5.6.3 Example of Startup Scripts 55 .................................................................................................
5.7 Firmware Update 55 ..................................................................................................................

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6. Technical Support 56 ......................................................................................................................
6.1 Warranty 56 ................................................................................................................................
6.2 Returning Defective Material 56 .............................................................................................
7. Document Revision 58 ....................................................................................................................

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1. General Information
1.1 Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to
alteration, particularly as a result of the constant upgrading of Kontron products. This document does
not entail any guarantee on the part of Kontron with respect to technical processes described in the
user guide or any product characteristics set out in the user guide. Kontron assumes no responsibility
or liability for the use of the described product(s), conveys no license or title under any patent,
copyright or mask work rights to these products and makes no representations or warranties that
these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this user guide are for illustration purposes only. Kontron
makes no representation or warranty that such application will be suitable for the specified use
without further testing or modification. Kontron expressly informs the user that this user guide only
contains a general description of processes and instructions which may not be applicable in every
individual case. In cases of doubt, please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document
may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any
language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron. Kontron points out that
the information contained in this user guide is constantly being updated in line with the technical
alterations and improvements made by Kontron to the products and thus this user guide only reflects
the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2023 by Kontron Europe GmbH
Kontron Europe GmbH
Gutenbergstraße 2
85737 Ismaning
Germany
www.kontron.com

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1.2 Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR
INTENDED FOR USE OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE
NAVIGATION, CONTROL OR COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER
TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING
APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS
ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE
OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE
PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, “HIGH RISK APPLICATIONS”).
You understand and agree that your use of Kontron devices as a component in High Risk Applications
is entirely at your risk. To minimize the risks associated with your products and applications, you
should provide adequate design and operating safeguards. You are solely responsible for compliance
with all legal, regulatory, safety, and security related requirements concerning your products. You are
responsible to ensure that your systems (and any Kontron hardware or software components
incorporated in your systems) meet all applicable requirements. Unless otherwise stated in the
product documentation, the Kontron device is not provided with error-tolerance capabilities and
cannot therefore be deemed as being engineered, manufactured or setup to be compliant for
implementation or for resale as device in High Risk Applications. All application and safety related
information in this document (including application descriptions, suggested safety measures,
suggested Kontron products, and other materials) is provided for reference only.
Handling and operation of the product is permitted only for trained personnel within a
work place that is access controlled. Follow the “General Safety Instructions” supplied
with the product.
You find the most recent version of the “General Safety Instructions“ online in the
download area of this product in our Customer Section.
This product is not suited for storage or operation in corrosive environments, in particular
under exposure to sulfur and chlorine and their compounds. For information on how to
harden electronics and mechanics against these stress conditions, contact Kontron
Support.

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1.3 Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more
information about warranty compliance and conformity, and the warranty period in your region, visit
https://www.kontron.com/terms-and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and
Purchase Order Terms & Conditions. Visit https://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user
guide or visit our website CONTACT US.
1.4 Customer Support
Find Kontron contacts by visiting: https://www.kontron.com/en/support-and-services.
1.5 Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded
market strengths into a services portfolio allowing companies to break the barriers of traditional
product lifecycles. Proven product expertise coupled with collaborative and highly-experienced
support enables Kontron to provide exceptional peace of mind to build and maintain successful
products. For more details on Kontron’s service offerings such as: enhanced repair services, extended
warranty, Kontron training academy, and more visit https://www.kontron.com/en/support-and-
services.
1.6 Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some
feedback, contact Kontron Support. Detail any errors you find. We will correct the errors or problems
as soon as possible and post the revised user guide on our website.

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1.7 Symbols
The following symbols may be used in this user guide of COMh-sdID
simple Box
Info-Box
Important-Box
Alert-Box
Tip-Box
Help-Box
Todo-Box
Download-Box

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1.8 For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to
ensure its compliance with electrical safety requirements. It was also designed for a long fault-free
life. However, the life expectancy of your product can be drastically reduced by improper treatment
during unpacking and installation. Therefore, in the interest of your own safety and of the correct
operation of your new Kontron product, you are requested to conform with the following guidelines.
1.9 High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power
connector is the product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks.
Serious electrical shock hazards can exist during all installation, repair, and maintenance
operations on this product. Therefore, always unplug the power cable and any other
cables which provide external voltages before performing any work on this product. Earth
ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this
product.
1.10 Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.

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Do not handle this product out of its protective enclosure while it is not used for operational purposes
unless it is otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe
work station is not guaranteed, it is important for the user to be electrically discharged before
touching the product with his/her hands or tools. This is most easily done by touching a metal part of
your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks,
ROM devices, jumper settings etc. If the product contains batteries for RTC or memory backup, ensure
that the product is not placed on conductive surfaces, including anti-static plastics or sponges. They
can cause short circuits and damage the batteries or conductive circuits on the product.
1.11 Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the
battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the
manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
1.12 General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any
way. Changes or modifications to the product, that are not explicitly approved by Kontron and
described in this user guide or received from Kontron Support as a special handling instruction, will
void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and
specific environmental requirements. This also applies to the operational temperature range of the
specific board version that must not be exceeded. If batteries are present, their temperature
restrictions must be taken into account. In performing all necessary installation and application
operations, only follow the instructions supplied by the present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to
store or ship the product, then re-pack it in the same manner as it was delivered. Special care is
necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.

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1.13 Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to
complying with environmental laws, regulations, and other environmentally oriented requirements.
For more information regarding Kontron’s quality and environmental responsibilities, visit
https://www.kontron.com/en/quality-management.
1.13.1 Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where
possible. Many of the components used are capable of being recycled. Final disposal of this product
after its service life must be accomplished in accordance with applicable country, state, or local laws
or regulations.
1.13.2 WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially
when the product become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound
environmental disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive.
You are encouraged to return our products for proper disposal.

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2. Introduction
This user guide describes the COM-HPC® Server Size D Computer-On-Module COMh-sdID made by
Kontron and focuses on describing the module’s special features. Kontron recommends users to study
this user guide before powering on the module.
2.1 Product Naming Clarification
COM-HPC® defines a Computer-On-Module (COM), with all the components necessary for a bootable
host computer, packaged as a super component. The product name for Kontron COM-HPC®
Computer-On-Modules consists of:
Standard short form Type Module size Processor family identifier Available temperature variants
COMh- c=client
s=server
a = Size A (95mm x 120mm)
b = Size B (120mm x 120mm)
c = Size C (160mm x 120mm)
d = Size D (160mm x 160mm)
e = Size E (200mm x 160mm)
ID = IceLake D
AP = AlderLake P
AS = AlderLake S
etc.
(none=) Commercial
Extended (E1)
Industrial (E2)
Screened industrial (E2S)
Table 1: COM-HPC® Product Naming Clarification
2.2 Product description
The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and
24×7 / 10 years reliability allows very robust implementations for harsh environments and extreme
conditions in a small mechanical footprint.
The module accommodates 4x DIMM sockets for a max. of 512GB DDR4 memory at 3200 MT/s. As
storage medium, a soldered NVMe SSD onboard with up to 1 TByte (TLC) storage capacity is
optionally available.
With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting
100Gb Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in
demanding I/O and network structures.
Key features are:
Size D form factor – 160 x 160 mm
Intel Xeon D-2700 (formerly Ice Lake D) Server platform
Up to 20 cores, processor TDP up to 125W
32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
8x LAN Ports for various configurations - up to 100GbE
Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
Optional onboard storage NVMe
Industrial temperature versions
Embedded management controller

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2.3 COM-HPC® Documentation
The COM-HPC® specification defines the COM-HPC® module form factor, pinout and signals. For more
COM-HPC® specification information, visit the PCI Industrial Computer Manufacturers Group
(PICMG®) website.
2.4 COM-HPC® Server Functionality
All Kontron COM-HPC® Server modules are popolated two 400-pin connectors, each has 4 rows called
A to D on connector J1 and row E to H on connector J2. The COM-HPC® Server Computer-on-Module
features the following maximum amount of interfaces according to the PICMG module pinout type.
Interface Server min/max COMh-sdID (E2)
PCIe 0:47 8/48 48
PCIe 48:63 0/16 0
PCIe BMC 1/1 1
NBASE-T 1 1 (1/2.5GBASE-T)
ETH_KR 2/8 8 (various configurations)
USB 2.0 4/8 4
USB 3.2 Gen1 or Gen2 0/2 2 (USB 3.2 Gen1)
USB 3.2 Gen2x2 0/2 2 (USB 3.2 Gen1)
USB 4.0 Support 0/2 0
SATA 0/2 2
UART 1/2 2
eSPI 0/1 1
BOOT_SPI 1/1 1
GP_SPI 1/1 1
SMB 1/1 1
I²C 2/2 2
IPMB 0/1 1
GPIO 12/12 12/12
Table 2: COM-HPC® Server and COMh-sdID functionality
2.5 COM-HPC® Benefits
COM-HPC® defines a Computer-On-Module (COM), with all the components necessary for a bootable
host computer, packaged as a highly integrated computer. All Kontron COM-HPC® modules are very
compact and feature a standardized form factor and a standardized connector layout that carry a
specified set of signals. Each COM module is based on the COM-HPC® specification. This
standardization allows designers to create a single-system carrier board that can accept present and
future COM-HPC® modules. The carrier board designer can optimize exactly how each of these
functions implements physically. Designers can place connectors precisely where needed for the
application, on a carrier board optimally designed to fit a system’s packaging. A single carrier board
design can use a range of COM-HPC® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path
when designing future-proof systems. The modularity of a COM-HPC® solution also ensures against
obsolescence when computer technology evolves. A properly designed COM-HPC® carrier board can
work with several successive generations of COM-HPC® modules. A COM-HPC® carrier board design

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has many advantages of a customized computer-board design and, additionally, delivers better
obsolescence protection, heavily reduced engineering effort, and faster time to market.

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3. Product specification
3.1 Module Variants
3.1.1 Commercial Grade Modules (0°C to +60°C)
Part Number Product Name CPU Use Condition
HSD01-0000-98-2 COMh-sdID D-2798NT D-2798NT Industrial, commercial temperature
HSD01-0000-76-2 COMh-sdID D-2776NT D-2776NT Industrial, commercial temperature
HSD01-0000-53-2 COMh-sdID D-2753NT D-2753NT Industrial, commercial temperature
Table 3: Product Number for Commercial Grade Modules (0°C to +60°C)
3.1.2 Industrial Temperature Grade Modules (E2, -40°C to +85°C)
Part Number Product Name CPU Use Condition
HSD02-0000-96-1 COMh-sdID E2 D-2796TE D-2796TE Industrial, extended temperature
HSD02-0000-75-1 COMh-sdID E2 D-2775TE D-2775TE Industrial, extended temperature
HSD02-0000-52-1 COMh-sdID E2 D-2752TER D-2752TER Industrial, extended temperature
Table 4: Product Number for Industrial Grade Modules (-40°C to +85°C)
3.2 Accessories
Accessories are product specific, COM-HPC® specific or general COMe accessories. For more
information, contact your local Kontron Sales Representative or Kontron Inside Sales.
3.2.1 Cooling
Any LGA115x cooler can be used for the COMh-sdID. In this case please use our HSD01-0000-99-A
COMh-sdID (E2) Adapter and HSD01-0000-99-B COMh-sdID (E2) Backplate for cooler mounting.
Alternatively our standard heat spreader solutions can be used, which are available in a threaded and
non-threaded (through hole) version.
Kontron PN Product Name Description
HSD01-0000-99-0 COMh-sdID (E2) Heat Spreader threaded Standard COM-HPC Heat Spreader for COMh-sdID with threads
HSD01-0000-99-1 COMh-sdID (E2) Heat Spreader through hole Standard COM-HPC Heat Spreader for COMh-sdID through hole
HSD99-0000-99-0 COMh Size D Active Uni Cooler (w/o HSP) Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
HSD99-0000-99-1 COMh Size D Passive Uni Cooler (w/o HSP) Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm)
HSD01-0000-99-A COMh-sdID (E2) Adapter Adapter for a standard LGA115x cooling solution
HSD01-0000-99-B COMh-sdID (E2) Backplate Backplate for a standard LGA115x cooling solution
HSD01-0000-99-C COMh-sdID (E2) Cooler Standard LGA115x cooler, needs in addition HSD01-0000-99-A and
HSD01-0000-99-B
Table 5: Cooling Equipment for COMh-sdID available from Kontron

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3.2.2 DIMM Memory
Kontron provides following RDIMM memory module:
Kontron PN Product Name Size ECC Op. Temperature
97100-1632-SDID DDR4-3200 RDIMM 16GB ECC_SDID 16GB ECC 0°C to +60°C
97100-3232-SDID DDR4-3200 RDIMM 32GB ECC_SDID 32GB ECC 0°C to +60°C
97100-6432-SDID DDR4-3200 RDIMM 64GB ECC_SDID 64GB ECC 0°C to +60°C
97101-1632-SDID DDR4-3200 RDIMM 16GB ECC E2_SDID 16GB ECC -40°C to +85°C
97101-3232-SDID DDR4-3200 RDIMM 32GB ECC E2_SDID 32GB ECC -40°C to +85°C
97101-6432-SDID DDR4-3200 RDIMM 64GB ECC E2_SDID 64GB ECC -40°C to +85°C
Table 6: RDIMM memory modules for COMh-sdID available from Kontron
3.2.3 Evaluation Carrier
Kontron PN Product Name Description
HST01-0000-10-0 COM-HPC Server Carrier 10mm COM-HPC Server Carrier with 10mm Connector Height
Table 7: Evaluation Carrier from Kontron
3.3 Functional Specification
3.3.1 Technical Data
Function Definition
Compliance COM-HPC®/Server, Size D
Dimension
(H X W) 160 mm x 160 mm
Processors Intel Xeon® D-2700 Processor Series
Chipset integrated in SOC
Main Memory 4x DDR4 DIMM sockets for up to 512 GByte LR/RDIMM
Ethernet Controller Intel® I226-LM/IT
Intel® 2x Quad 25GbE LAN integrated in SoC
Ethernet
1x 1/2.5 Gb Ethernet
8x Ethernet ports supporting versatile configurations depending on CPU SKU:
100GbE / 2x 50GbE / 4x 25GbE / 2x 25GbE + 4x 10GbE / 8x 10GbE
Storage 2x SATA 6 Gb/s
Flash On-board NVMe SSD (on request) - up to 1 TByte TLC or 333 GByte pSLC
PCI Express 32x PCIe Gen4 (2 x16, 4 x8, 8 x4)
16x PCIe Gen3 (2 x8, 4 x4, 8 x2)
USB 4x USB 3.0 / USB 2.0
Serial 2x serial interface (RX/TX/CTS/RTS)
Other Features SPI, SMB, Fast I²C, Staged Watchdog, RTC
Special Features Trusted Platform Module (TPM) 2.0
Features on Request NVMe SSD
Power Management ACPI 6.0
Power Supply 12 V ATX and/or Single Supply Power
BIOS AMI UEFI
Operating Systems Linux, Windows 10 IoT Enterprise, Windows Server 2022
Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Industrial temperature: -40 °C to +80 °C operating, -30 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
Table 8: Technical Data

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3.3.2 Block Diagram
Figure 1: COMh-sdID Blockdiagram

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3.3.3 Top Side
Figure 2: COMh-sdID Front Side
Processor1.
4x DDR4 DIMM sockets2.
Fan Connector3.
Optional NVMe4.
Programming connector for embedded controller5.
XDP debug port (not populated on production units)6.

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3.3.4 Bottom Side
Figure 3: COMh-sdID Bottom Side
COM-HPC connectors1.
4 mounting holes - for heatspreader mounting to module backplate (Kontron specific)2.
4 mounting holes - for module mounting to carrier3.
4 mounting holes - for heatspreader to module, module to carrier mounting4.
3.3.5 Processor (CPU)
The COMh-sdID is based on the Intel® Xeon® D-2700 processor family, the next generation System-
on-Chip (SoC) with processor cores built using Intel 10-nanometer process technology. The three
major complexes in this highly-integrated SoC are referred to as CPU, PCH and NAC.
The Central Processing Unit (CPU) complex contains up to 20 next-generation 64-bit processor cores
(code name Ice Lake Server).
The Platform Controller Hub (PCH) of the SoC is architected with a rich set of interconnect
technologies.
The Network Accelerator Complex (NAC) includes technologies for security and packet processing.
The SoC architecture is highly scalable and efficient, providing a unified solution across an array of
products. Product SKUs are targeted for long life supply availability with extended reliability in

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industrial environments.
Topline Specifications are:
Up to 20 processor cores based on architecture code name Ice Lake server:
Each core has L1 (first-level) data and instruction caches:
48 KB data, 64-byte cache line size parity protected
32 KB instruction, 64-byte cache line size parity protected
Mid-Level Cache (MLC) unified instruction/data cache, ECC protected:
1.25 MB of MLC per core (non-inclusive with the LLC)
Last-Level Cache (LLC) unified instruction/data cache, DECTED ECC protected:
2.5 MB of LLC per CHA tile shared by all cores
Four memory channels up to 3200 MT/s:
72-bit wide (64-bit data + 8-bit ECC) operating up to 3200 MT/s memory
Single-rank or dual-rank per DIMM module
ECC and non-ECC support
32 PCI Express lanes, 16 GT/s data rate:
Maximum Root Port width is 16-lanes with support for x8, x4
24 HSIO lanes, 8.0 GT/s data rate:
High-Speed IO lanes with multi-purpose configuration capabilities as PCIe, SATA, USB
Maximum Root Port width is 8-lanes with support for x4, x2
Network Accelerator Complex (NAC) with high performance, programmable, packetprocessing
acceleration technology, including:
Network Interface and Scheduler
Intel® QuickAssist Technology (Intel® QAT v1.8) that performs security and compression
acceleration
CPU STD on request Cores TDP (W) IOTG Temp
min (°C)
DTS max
(°C)
DDR4 1DPC
(M/T) Ethernet mode QAT Base Freq (MHz)
All Core
Turbo
(MHz)
D-2796TE standard 20 118 Yes -40 102 2933 100G No 2,0 2,4
D-2775TE standard 16 100 Yes -40 100 2933 100G No 2,0 2,4
D-2752TER standard 12 77 Yes -40 100 2667 50G No 1,8 2,1
D-2733NT on request 8 80 Yes 0100 2667 50G Yes 2,1 2,6
D-2712T on request 4 65 Yes 0100 2667 50G No 1,9 2,4
D-2786NTE on request 18 118 No -40 100 2933 100G Yes 2,1 2,5
D-2798NX on request 20 126 No 0100 2933 100G Yes 2,1 2,6
D-2796NT on request 20 120 No 0102 2933 100G Yes 2,0 2,5
D-2798NT standard 20 125 No 0100 3200 100G Yes 2,1 2,6
D-2777NX on request 16 116 No 0100 2667 100G Yes 2,2 2,7
D-2776NT standard 16 117 No 0100 2933 100G Yes 2,1 2,6
D-2766NT on request 14 97 No 0100 2667 100G Yes 2,0 2,5
D-2753NT standard 12 87 No 099 2667 100G Yes 2,0 2,5
D-2752NTE on request 12 84 No -40 100 2667 50G Yes 1,9 2,3
D-2757NX on request 12 107 No 0100 2667 50G Yes 2,5 3,0
D-2745NX on request 10 96 No 0100 2667 50G Yes 2,4 2,9
D-2799 on request 20 129 No 0100 3200 No No 2,4 2,6
D-2779 on request 16 126 No 0100 3200 No No 2,5 2,8
D-2738 on request 8 88 No 0100 2933 No No 2,5 3,0
Table 9: CPU Feature Overview
For the D-2700 processor family the Dynamic Temperature Range (DTR) behavior