Kontron COMe-bID7 User manual

USER GUIDE
COMe-bID7
User Guide Rev. 1.2
Doc. ID: 1069-1349

COMe-bID7 User Guide Rev. 1.2
This page has been intentionally left blank

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 3
 COME-BID7 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2023 by Kontron Europe GmbH
Kontron Europe GmbH
Gutenbergstraße 2
85737 Ismaning
Germany
www.kontron.com

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 4
Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE
FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICATION SYSTEMS FOR
AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING APPLICATIONS,
WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE
PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR
SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled. Please follow the “General Safety Instructions” supplied with
the system.
You find the most recent version of the “General Safety Instructions“ online in the download
area of this product.
This product is not suited for storage or operation in corrosive environments, in particular
under exposure to sulfur and chlorine and their compounds. For information on how to
harden electronics and mechanics against these stress conditions, contact Kontron Support.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 5
Revision History
Revision Brief Description of Changes Date of Issue Author
1.0 Release 2023-January-24 ih
1.1 Added chapter 3.12 2023-February-08 ih
1.2 New Kontron logo 2023-March-29 ih
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: https://www.kontron.com/support-and-services.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit https://www.kontron.com/de/support-and-services/
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 6
Symbols
The following symbols may be used in this manual
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products. Failure to observe the precautions indicated and/or prescribed
by the law may endanger your life/health and/or result in damage to your material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive to
static electricity. Care must therefore be taken during all handling operations and inspections
of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 7
For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 8
Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 9
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 10
Table of Contents
Disclaimer .............................................................................................................................................................................................................3
Intended Use....................................................................................................................................................................................................... 4
Revision History..................................................................................................................................................................................................5
Terms and Conditions.......................................................................................................................................................................................5
Customer Support..............................................................................................................................................................................................5
Customer Service ...............................................................................................................................................................................................5
Customer Comments ........................................................................................................................................................................................5
Symbols .................................................................................................................................................................................................................6
For Your Safety....................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance...............................................................................................................................................................................................9
Table of Contents .............................................................................................................................................................................................10
List of Tables......................................................................................................................................................................................................12
List of Figures ....................................................................................................................................................................................................13
1/ Introduction..........................................................................................................................................................................................14
1.1. Product Description...................................................................................................................................................................................14
1.2. Product Naming Clarification ................................................................................................................................................................14
1.3. Understanding COM Express® Functionality...................................................................................................................................15
1.4. COM Express® Documentation.............................................................................................................................................................15
1.5. COM Express® Benefits...........................................................................................................................................................................15
2/ Product Specification ........................................................................................................................................................................16
2.1. Module Definition......................................................................................................................................................................................16
2.2. Commercial Grade Modules..................................................................................................................................................................16
2.3. Industrial Grade Modules ......................................................................................................................................................................17
2.4. Product Views............................................................................................................................................................................................17
3/ Functional Specification...................................................................................................................................................................19
3.1. Block Diagram COMe-bID7.....................................................................................................................................................................19
3.2. Processors.................................................................................................................................................................................................20
3.3. COM Express Compliance......................................................................................................................................................................21
3.3.1. COM.0 Rev 3.1: default configuration: .............................................................................................................................................21
3.3.2. COM.0 Rev 3.0: available on request (legacy mode)............................................................................................................... 22
3.4. Memory.......................................................................................................................................................................................................22
3.5. PCI Express 4.0 .........................................................................................................................................................................................23
3.6. HSIO Usage ................................................................................................................................................................................................23
3.7. USB ...............................................................................................................................................................................................................25
3.8. SATA.............................................................................................................................................................................................................26
3.9. Ethernet – 1G / 2.5GBASE-T LAN ........................................................................................................................................................26
3.10. Ethernet – 4x 10GBASE-KR.................................................................................................................................................................26
3.10.1. Overview of currently supported LAN Interfaces on COMe-bID7....................................................................................... 27
3.11. UART ...........................................................................................................................................................................................................29
3.12. Additional Features...............................................................................................................................................................................29
3.13. Evaluation platforms for COMe-bID7 – Compatibility Matrix.................................................................................................30
4/ Features and Interfaces...................................................................................................................................................................31

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 11
4.1. ACPI Suspend Modes and Resume Events .......................................................................................................................................31
4.2. Real Time Clock (RTC).............................................................................................................................................................................31
4.3. NVMe Storage (Option) ..........................................................................................................................................................................31
4.4. Hardware Monitor (HWM) ....................................................................................................................................................................31
4.5. Trusted Platform Module (TPM).........................................................................................................................................................31
4.6. Onboard Fan Connector ........................................................................................................................................................................32
4.7. Watchdog Timer (WDT) Dual Stage ..................................................................................................................................................32
4.8. Watchdog Timer Signal.........................................................................................................................................................................32
4.9. Hyper-Threading .....................................................................................................................................................................................32
4.10. Fast I2C .....................................................................................................................................................................................................33
4.11. LPC...............................................................................................................................................................................................................33
4.12. Serial Peripheral Interface (SPI) ....................................................................................................................................................... 33
4.12.1. SPI Boot .................................................................................................................................................................................................. 33
4.12.2. SPI Flash Update.................................................................................................................................................................................34
4.13. System Management Bus (SMB)......................................................................................................................................................34
4.14. GPIO............................................................................................................................................................................................................35
4.15. NS-CI ..........................................................................................................................................................................................................35
5/ Accessories..........................................................................................................................................................................................36
5.1. Product Specific Accessories................................................................................................................................................................36
5.2. General Accessories ............................................................................................................................................................................... 37
6/ Electrical Specification ....................................................................................................................................................................38
6.1. Supply Voltage ..........................................................................................................................................................................................38
6.2. Power Supply Rise Time........................................................................................................................................................................38
6.3. Supply Voltage Ripple............................................................................................................................................................................38
6.4. Power Consumption...............................................................................................................................................................................38
6.5. ATX Mode ...................................................................................................................................................................................................39
6.6. Single Supply Mode ................................................................................................................................................................................39
7/ Power Control.....................................................................................................................................................................................40
7.1. Power Supply.............................................................................................................................................................................................40
7.2. Power Supply Control Settings ...........................................................................................................................................................40
8/ Standards and Certification ............................................................................................................................................................41
8.1. MTBF ............................................................................................................................................................................................................42
9/ Mechanical Specification ................................................................................................................................................................43
9.1. Dimensions.................................................................................................................................................................................................43
9.1.1. Height ........................................................................................................................................................................................................44
9.1.2. Module Height with Four SODIMM Memory Sockets................................................................................................................44
9.2. Thermal Management, Heatspreader and Cooling Solutions..................................................................................................46
9.2.1. Heatspreader Dimensions.................................................................................................................................................................47
10/ COMe Connector Pin-out List ........................................................................................................................................................48
11/ UEFI BIOS .............................................................................................................................................................................................. 67
11.1. Starting the UEFI BIOS............................................................................................................................................................................ 67
11.2. Setup Menus ............................................................................................................................................................................................69
11.3. Main Menu ................................................................................................................................................................................................70
11.4. Advanced Setup Menu...........................................................................................................................................................................71
11.5. Platform Configuration.........................................................................................................................................................................83
11.6. Socket Configuration.............................................................................................................................................................................84
11.7. Security Setup Menu..............................................................................................................................................................................85
11.7.1. Remember the Password..................................................................................................................................................................86
11.8. Boot Setup Menu ....................................................................................................................................................................................87
11.9. Save and Exit............................................................................................................................................................................................88

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 12
11.10.1. Basic Operation of the UEFI Shell.................................................................................................................................................89
11.11. UEFI Shell Scripting...............................................................................................................................................................................90
11.11.1. Startup Scripting .................................................................................................................................................................................90
11.11.2. Create a Startup Script.....................................................................................................................................................................90
11.12. Example of Startup Scripts................................................................................................................................................................90
11.12.1. Execute Shell Script on other Harddrive ....................................................................................................................................90
12/ Technical Support ..............................................................................................................................................................................91
12.1. Warranty ....................................................................................................................................................................................................91
12.2. Returning Defective Merchandise....................................................................................................................................................92
Appendix: Terminology..................................................................................................................................................................................93
About Kontron .................................................................................................................................................................................................. 95
List of Tables
Table 1: Pin Assignment of Type 7 and COMe-bID7...............................................................................................................................15
Table 2: Commercial Grade Modules (0°C to 60°C operating)...........................................................................................................16
Table 3: Industrial Grade Modules by Design (E2, -40°C up to 85°C Operating).........................................................................17
Table 4: Intel® Processor D-1700 Product Family Specifications ...................................................................................................20
Table 5: COM Express Compliance..............................................................................................................................................................21
Table 6: Memory Features ...........................................................................................................................................................................22
Table 7: SoC – PCI Express Gen. 4.0........................................................................................................................................................... 23
Table 8: SoC – HSIO Usage: PCI Express Gen 3.0, SATA, USB, onboard I/O ..................................................................................24
Table 9: BIOS versions ................................................................................................................................................................................... 25
Table 10: Supported USB Features ............................................................................................................................................................ 25
Table 11: General, Special Kontron and Optional Features ................................................................................................................29
Table 12: Onboard Fan Connector .............................................................................................................................................................. 32
Table 13: Dual Staged Watchdog Timer- Time-Out Events............................................................................................................... 32
Table 14: I2C Bus Port Address ...................................................................................................................................................................33
Table 15: SPI Boot Pin Configuration ......................................................................................................................................................... 33
Table 16: Supported SPI Boot Flash...........................................................................................................................................................34
Table 17: SMBus Address.............................................................................................................................................................................. 35
Table 18: Product Specific Accessories List............................................................................................................................................36
Table 19: Cooler and Heatspreader ...........................................................................................................................................................36
Table 20: General Accessories List............................................................................................................................................................ 37
Table 21: Memory Modules .......................................................................................................................................................................... 37
Table 22: COM Express® Connector Electrical Specifications..........................................................................................................38
Table 23: ATX Mode ........................................................................................................................................................................................39
Table 24: Single Supply Mode.....................................................................................................................................................................39
Table 25: Power Supply Control Settings................................................................................................................................................40
Table 26: Standards and Certification Compliance...............................................................................................................................41
Table 27: Pin-out List A..................................................................................................................................................................................49
Table 28: Pin-out List B ................................................................................................................................................................................. 53
Table 29: Pin-out List C...................................................................................................................................................................................57
Table 30: Pin-out List D..................................................................................................................................................................................61
Table 31: Summary – COM.0 REV3.0 vs REV3.1......................................................................................................................................66
Table 32: Navigation Hot Keys Available in the Legend Bar..............................................................................................................68
Table 33: Main Setup Menu Sub-screens................................................................................................................................................ 70
Table 34: Advanced Setup menu Sub-screens and Functions......................................................................................................... 72
Table 35: Platform Configuration Sub-screens and Functions........................................................................................................83
Table 36: Socket Configuration Sub-screens and Functions............................................................................................................84
Table 37: Security Setup Menu Functions...............................................................................................................................................85
Table 38: Boot Setup Menu Functions .....................................................................................................................................................87
Table 39: Save and Exit Menu Functions .................................................................................................................................................88

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 13
List of Figures
Figure 1: Top View of COMe-bID7 ................................................................................................................................................................17
Figure 2: Bottom View of COMe-bID7 ........................................................................................................................................................18
Figure 3: Block Diagram COMe-bID7 ..........................................................................................................................................................19
Figure 4: MTBF De-rating Values (Reliability report: COMe-bID7 E2 D-1747NTE EV) ..............................................................42
Figure 5: Module Dimensions ......................................................................................................................................................................43
Figure 6: Module Height ................................................................................................................................................................................44
Figure 7: Module Top and Bottom SODIMM Assembly (Option)......................................................................................................45
Figure 8: Heatspreader 68009-0000-99-0 Dimensions ...................................................................................................................47
Figure 9: Heatspreader 68009-0000-99-1 Dimensions ....................................................................................................................47
Figure 10: COMe Connector with 220 pins...............................................................................................................................................48
Figure 11: COMe Connector Pinout .............................................................................................................................................................48
Figure 12: Setup Menu Selection Bar.........................................................................................................................................................69
Figure 13: Main Setup Menu......................................................................................................................................................................... 70
Figure 14: Advanced Setup Menu ................................................................................................................................................................71
Figure 15: Platform ConfigurationMenu...................................................................................................................................................83
Figure 16: Socket ConfigurationMenu.......................................................................................................................................................84
Figure 17: Security Setup Menu...................................................................................................................................................................85
Figure 18: Boot Setup Menu .........................................................................................................................................................................87
Figure 19: Save and Exit Setup Menu ........................................................................................................................................................88

COMe-bID7 User Guide Rev. 1.2
www.kontron.com
// 14
1/ Introduction
1.1. Product Description
Kontron's Computer-on-Module COMe-bID7 is a COM Express® BASIC TYPE 7 form-factor with Intel®’s Xeon® D-
1700 processor family. The Intel® Xeon ® D-1700 Generation increases efficiency and performance per watt ratio,
which is a result of the innovative 10nm technology and has up to 10 cores for control, micro server, storage and
communication applications in Internet of Things (IoT) and embedded environment. The COMe-bID7 is also
designed for industrial temperature environment.
Intel® Xeon® Processor D-1700 System on Chip (SoC), member of the Intel® Xeon® Processor family
DDR4 memory technology up to 128 GByte ECC with 4x SODIMM sockets
High-speed connectivity 16x PCIe Gen4 + 16x PCIe Gen3
Quad 10 GbE interfaces
1.2. Product Naming Clarification
COM Express® defines a Computer-on-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product name for Kontron COM Express® Computer-On-Modules
consists of:
Industry standard short form
COMe-
Module form factor
b=basic (125mm x 95mm)
c=compact (95mm x 95mm)
m=mini (84mm x 55mm)
Intel’s processor code name
ID = Ice Lake-D
Pinout type
7 = Type 7
Available temperature variants
Commercial
E2 = Industrial
Processor Identifier
Chipset identifier (if chipset assembled)
Storage
NVMe (if assembled)

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 15
1.3. Understanding COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called
Row A & B on primary connector and Row C & D on secondary connector. The COM Express® Computer-On-Module
(COM) features the following maximum amount of interfaces according to the PCI Industrial Computer Manufacturers
Group (PICMG) module Pin-out type.
Table 1: Pin Assignment of Type 7 and COMe-bID7
Feature Type 7 Standard COMe-bID7 Pinout
NBASE-T LAN 1x 10GBit max. 1x 2.5GBit max
10GBASE-KR LAN Ports 4x 4x
NC-SI 1x 1x
PCI Express 32x 16x PCIe Gen3
16x PCIe Gen4
Serial ATA 2x 2x
USB 4x USB 3.2 (USB 2.0) 4x USB 3.1 Gen1 respect. USB 3.0 (USB 2.0)
Serial Ports 2x 2x
eSPI/LPC 1x 1x
External SPI 1x 1x
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x
1.4. COM Express® Documentation
The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This
specification is available at the PICMG® website by filling out the order form.
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and
feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each
COM is based on the COM Express® specification. This standardization allows designers to create a single-system
baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 16
2/ Product Specification
2.1. Module Definition
The COM Express® basic sized Computer-on-Module COMe-bID7 follows pin-out Type 7 and is compatible to the
PICMG specification COM.0 Rev 3.1.
The COMe-bID7 can also be offered compliant to COM-Express Spec Rev 3.0 on request.
The COMe-bID7 is available in different variants to cover the individual demands in performance, price and power.
2.2. Commercial Grade Modules
The following is a list of modules for commercial temperature range.
Table 2: Commercial Grade Modules (0°C to 60°C operating)
Product Number Product Name Description
68008-0000-49-2 COMe-bID7 D-1749NT COM Express® basic pin-out type 7 COM.0 R3.1 with
Intel®D-1749NT, 90 W, 10 core, 3.0 GHz, 4x 10GBASE-
KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM
socket
68008-0000-35-1 COMe-bID7 D-1735TR COM Express® basic pin-out type 7 COM.0 R3.1 with
Intel® D-1735TR, 59 W, 8 core, 2.2 GHz, 4x 10GBASE-KR,
4x 10GBASE-KR, 16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4
SO-DIMM socket
68008-0000-12-1 COMe-bID7 D-1712TR COM Express® COM.0 R3.1 basic pin-out type 7 with
Intel® D-1712TR, 40 W, 4 core, 2.0 GHz, 4x 10GBASE-KR,
16x PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM
socket

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 17
2.3. Industrial Grade Modules
Industrial temperature grade modules are available based on their design. Please contact your local sales or support
for further details.
Table 3: Industrial Grade Modules by Design (E2, -40°C up to 85°C Operating)
Product Number Product Name Description
68009-0000-46-1 COMe-bID7 E2 D-1746TER COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®
D-1746TER, 67/56 W, 10 core, 2.0 GHz, 4x 10GBASE-KR, 16x
PCIe Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket,
industrial temperature
68009-0000-32-1 COMe-bID7 E2 D-1732TE COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®
D-1732TE, 52 W, 8 core, 1.9 GHz, 4x 10GBASE-KR, 16x PCIe
Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial
temperature
68009-0000-15-1 COMe-bID7 E2 D-1715TER COM Express® basic pin-out type 7 COM.0 R3.1 with Intel®
D-1715TER, 50 W, 4 core, 2.4 GHz, 4x 10GBASE-KR, 16x PCIe
Gen4, 16x PCIe Gen3, 2x DDR4 SO-DIMM socket, industrial
temperature
2.4. Product Views
Figure 1: Top View of COMe-bID7
1. Fan Connector
2. Processor
3. 2x DDR4 SODIMM sockets
4. Optional NVMe
2
3
1
4

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 18
Figure 2: Bottom View of COMe-bID7
5. XDP debug port (not populated on production units)
6. Optional 2x DDR4 SODIMM sockets
7. 2x COMe connectors
7
5
6

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 19
3/ Functional Specification
3.1. Block Diagram COMe-bID7
Figure 3: Block Diagram COMe-bID7

COMe-bID7 User Guide Rev. 1.2
www.kontron.com // 20
3.2. Processors
The Intel® Xeon® processor D-1700 processor family with 45 mm x 45 mm package size (FCBGA) is the next
generation System-on-Chip (SoC) with processor cores built using Intel 10-nanometer process technology. The three
major complexes in this highly-integrated SoC are the CPU, PCH and NAC. The Central Processing Unit (CPU) complex
contains up to 10 next-generation 64-bit processor cores.
The Platform Controller Hub (PCH) of the SoC is architected with a rich set of interconnect technologies.
The Network Accelerator Complex (NAC) includes technologies for security and packet processing.
The SoC architecture is highly scalable and efficient, providing a unified solution across an array of products. The
processor SKUs are targeted for long life supply availability with extended reliability in communications
environments.
Table 4: Intel® Processor D-1700 Product Family Specifications
Intel®
Process
or
D-1749
NT
D-1747
NTE
D-1746
TER
D-1735
TR
D-1732
TE
D-1734
NT
D-1715
TER
D-1718T D-1712
TR
# of
Cores
10 10 10 8 8 8 4 4 4
# of
Threads
20 20 20 16 16 16 8 8 8
Base
Freq.
(GHz)
3.0 2.5 2.0 2.2 1.9 2.0 2.4 2.6 2.0
Turbo
Fre-
quency
(GHz)
3.5 3.5 3.1 3.4 3.0 3.1 3.5 3.5 3.1
Thermal
Design
Power
(TDP)
(W)
90 80 67 59 52 50 50 46 40
Instruct.
Set
64 Bit 64 Bit 64 Bit 64 Bit 64 Bit 64 Bit 64 Bit 64 Bit 64 Bit
Cache
(MB)
15 15 15 15 15 15 10 10 10
Memory
Type
DDR4-
2667
DDR4-
2933
DDR4-
2667
DDR4-
2933
DDR4-
2667
DDR4-
2400
DDR4-
2667
DDR4-
2933
DDR4-
2400
Max
Memory
Size
(GB)
128 128 128 128 128 128 128 128 128
ECC
Memory
Yes Yes Yes Yes Yes Yes Yes Yes Yes