Kontron microETXexpress-DC User manual

microETXexpress®-DC
Document Revision 1.14
If it's embedded it's Kontron

» Table of Contents «
1User Information.................................................................................................6
1.1 About This Document............................................................................................6
1.2 Co yright Notice.................................................................................................. 6
1.3 Trademarks......................................................................................................... 6
1.4 Standards...........................................................................................................6
1.5 Warranty............................................................................................................7
1.6 Technical Su ort................................................................................................7
2Introduction.......................................................................................................8
2.1 Product Descri tion..............................................................................................8
2.2 Naming clarification.............................................................................................8
2.3 Understanding COM Ex ress® Functionality...............................................................8
2.4 COM Ex ress® Documentation................................................................................9
2.5 COM Ex ress® Benefits..........................................................................................9
3Product S ecification..........................................................................................10
3.1 Modules & Accessories.........................................................................................10
3.2 Functional S ecification......................................................................................11
3.3 Block Diagram................................................................................................... 16
3.4 Electrical S ecification........................................................................................17
3.4.1 Su ly Voltage...................................................................................................17
3.4.2 Power Su ly Rise Time........................................................................................17
3.4.3 Su ly Voltage Ri le..........................................................................................17
3.4.4 Power Consum tion............................................................................................17
3.5 Environmental S ecification.................................................................................18
3.5.1 Tem erature......................................................................................................18
3.5.2 Humidity.......................................................................................................... 18
3.6 Standards and Certifications.................................................................................19
3.7 MTBF............................................................................................................... 21
3.8 Mechanical S ecification.....................................................................................22
3.9 Thermal Management..........................................................................................23
3.10 Heats reader.....................................................................................................23
3.11 Onboard Fan Connector........................................................................................24
3.11.1 Electrical Characteristics......................................................................................25
4Features and Interfaces.......................................................................................26
www.kontron.com

4.1 S5 Eco Mode......................................................................................................26
4.2 Power Control....................................................................................................27
4.3 LPC.................................................................................................................. 28
4.4 LPC boot...........................................................................................................28
4.5 JIDA16 and JIDA32.............................................................................................29
4.6 K-Station 1.......................................................................................................29
4.7 JIDA32, EAPI and PLD Driver.................................................................................30
4.8 K-Station 2.......................................................................................................30
4.9 K-Station & API Ressources for JIDA32....................................................................31
4.9.1 I2C.................................................................................................................. 31
4.9.2 Storage............................................................................................................ 31
4.9.3 GPIO................................................................................................................ 31
4.9.4 Hardware Monitor...............................................................................................31
4.10 API Ressources for Board Driver.............................................................................32
4.10.1 I2C..................................................................................................................32
4.10.2 Storage............................................................................................................32
4.10.3 GPIO................................................................................................................ 32
4.10.4 Onboard Hardware Monitor...................................................................................32
4.10.5 SIO Winbond 83627DHGP.....................................................................................32
4.10.6 SIO Winbond 83627HG.........................................................................................33
4.11 GPIO - General Pur ose In ut and Out ut................................................................34
4.12 Dual Staged Watchdog Timer.................................................................................35
4.13 Flash Backu Feature.......................................................................................... 36
4.14 S eedste Technology.........................................................................................38
4.15 C-States........................................................................................................... 39
4.16 Hy er Threading.................................................................................................40
4.17 ACPI Sus end Modes and Resume Events..................................................................41
5System Ressources..............................................................................................42
5.1 Interru t Request (IRQ) Lines...............................................................................42
5.1.1 In 8259 PIC Mode...............................................................................................42
5.1.2 In APIC mode..................................................................................................... 42
5.2 Direct Memory Access (DMA) Channels....................................................................43
5.3 Memory Area..................................................................................................... 43
5.4 I/O Address Ma .................................................................................................43
5.5 External Inter-IC (I2C) Bus...................................................................................43
5.6 System Management (SM) Bus...............................................................................43
5.7 JILI I2C Bus...................................................................................................... 44
4

6Connectors.......................................................................................................45
6.1 Connector Location.............................................................................................45
6.2 Pinout List........................................................................................................ 46
6.2.1 General Signal Descri tion...................................................................................46
6.2.2 Connector X1A Row A...........................................................................................47
6.2.3 Connector X1A Row B..........................................................................................49
6.2.4 Connector X1B Row C...........................................................................................51
6.2.5 Connector X1B Row D..........................................................................................53
7BIOS O eration..................................................................................................55
7.1 Determining the BIOS Version...............................................................................55
7.2 Setu Guide......................................................................................................55
7.2.1 Start AMI® BIOS Setu Utility...............................................................................55
7.3 BIOS Setu ........................................................................................................57
7.3.1 Main Menu........................................................................................................57
7.3.2 Module Info.......................................................................................................57
7.3.3 Advanced Menu..................................................................................................60
7.3.4 PCIPnP Menu..................................................................................................... 80
7.3.5 Boot................................................................................................................ 81
7.3.6 Security........................................................................................................... 82
7.3.7 Chi set............................................................................................................83
7.3.8 Exit Menu......................................................................................................... 88
5

1 User Information
1.1 About This Document
This document rovides information about roducts from Kontron Embedded Modules GmbH and/or its subsidiaries. No
warranty of suitability, ur ose, or fitness is im lied. While every attem t has been made to ensure that the information
in this document is accurate, the information contained within is su lied “as-is” and is subject to change without notice.
For the circuits, descri tions and tables indicated, Kontron assumes no res onsibility as far as atents or other rights of
third arties are concerned.
1.2 Copyright Notice
Co yright © 2003-2011 Kontron Embedded Modules GmbH
All rights reserved. No art of this document may be re roduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or com uter language, in any form or by any means (electronic, mechanical, hotoco ying,
recording, or otherwise), without the ex ress written ermission of Kontron Embedded Modules GmbH.
DIMM-PC®, PISA®, ETX®, ETXex ress®, microETXex ress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of com onents used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Cor .
» Microsoft is a registered trademark of Microsoft Cor .
» Intel is a registered trademark of Intel Cor .
» All other roducts and trademarks mentioned in this manual are trademarks of their res ective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
6

1.5 arranty
This Kontron Embedded Modules GmbH roduct is warranted against defects in material and workmanshi for the
warranty eriod from the date of shi ment. During the warranty eriod, Kontron Embedded Modules GmbH will at its
discretion decide to re air or re lace defective roducts.
Within the warranty eriod, the re air of roducts is free of charge as long as warranty conditions are observed.
The warranty does not a ly to defects resulting from im ro er or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, o eration outside of the roduct’s environmental s ecifications or im ro er
installation or maintenance.
Kontron Embedded Modules GmbH will not be res onsible for any defects or damages to other roducts not su lied by
Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH roduct.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available for technical
su ort. We are committed to making our roduct easy to use and will hel you use our roducts in your systems.
Please consult our Web site at htt ://www.kontron.com/su ort for the latest roduct documentation, utilities, drivers
and su ort contacts. Consult our customer section htt ://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications and additional tools and software. In any case you can always contact your
board su lier for technical su ort.
7

2 Introduction
2.1 Product Description
The microETXex ress®-DC brings latest 45nm erformance generations of Intel® Atom™ N270 rocessor with 1.6 GHz and
the Intel® 945GSE and ICH7M chi set to a com act 95 x 95 mm module, which is fully com atible to the new COMex ress
„com act“ form factor. Kontron’s new high-efficient ower-off state S5 Eco enables ACPI features and lowest ower-
consum tion in soft-off state – less than 1 mA. Com ared to the regular S5 state this means a reduction by at least factor
200! Battery u time therefore goes u dramatically. Like all Kontron microETXex ress® modules, it is fully com atible to
the COM Ex ress™ Pin-out Ty e 2. Therefore, u grading existing carrier boards originally designed for COM Ex ress™ basic
gets easy and minimizes redesign efforts.
2.2 Naming clarification
COM Ex ress® defines a Com uter-On-Module, or COM, with all com onents necessary for a bootable host com uter,
ackaged as a su er com onent. Interfaces will rovide a smooth transition ath from legacy arallel interfaces to LVDS
(Low Voltage Differential Signaling) interfaces. These include the PCI bus and arallel ATA as well as PCI Ex ress and
Serial ATA.
» ETXex ress® modules are Kontron's COM Ex ress® modules in basic form factor (125mm x 95mm)
» microETXex ress® modules are Kontron's COM Ex ress® modules in com act form factor (95mm x 95mm)
» nanoETXex ress modules are Kontron's COM Ex ress® modules in mini form factor (55mm x 84mm)
2.3 Understanding COM Express® Functionality
All Kontron microETXex ress® and ETXex ress® modules contain two connectors; each of it has two rows. The rimary
connector has two rows called Row A and Row B. The secondary connector has two rows called Row C and Row D. On
nanoETXex ress® modules only the rimary connector Row A and Row B is used.
The rimary connector (Row A and Row B) feature the following legacy-free functionality:
» Ethernet
» Serial ATA (SATA)
» USB 2.0
» LVDS/VGA and dual dis lay video
» High Definition Audio (Azalia)
» LPC (low in count) Bus
» PCIex ress
8

2.4 COM Express® Documentation
This roduct manual serves as one of three rinci al references for a COM Ex ress® design. It documents the
s ecifications and features of microETXex ress®-DC. The other two references, which are available from your Kontron
Su ort or from PICMG®, include:
» The COM Ex ress® S ecification defines the COM Ex ress® module form factor, in-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The COM Ex ress® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of COM Ex ress® modules.
Some of the information contained within this roduct manual a lies only to certain
roduct revisions (CE: xxx). If certain information a lies to s ecific roduct revisions (CE:
xxx) it will be stated. Please check the roduct revision of your module to see if this
information is a licable.
2.5 COM Express® Benefits
COM Ex ress® modules are very com act, highly integrated com uters. All Kontron COM Ex ress® modules, like
nanoETXex ress, microETXex ress® and ETXex ress®, feature a standardized form factor and a standardized connector
layout that carry a s ecified set of signals. Each COM is based on the COM Ex ress® s ecification. This standardization
allows designers to create a single-system baseboard that can acce t resent and future COM Ex ress® modules.
COM Ex ress® modules include common ersonal com uter (PC) eri heral functions such as:
» Gra hics
» USB orts
» Ethernet
» Sound
» SATA
The baseboard designer can o timize exactly how each of these functions im lements hysically. Designers can lace
connectors recisely where needed for the a lication on a baseboard designed to o timally fit a system’s ackaging.
A PCI bus can be im lemented directly on the baseboard rather than on mechanically unwieldy ex ansion cards. The
ability to build a system on a single baseboard using the com uter as one lug-in com onent sim lifies ackaging,
eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of ETXex ress®, microETXex ress® and nanoETXex ress modules. This
flexibility can differentiate roducts at various rice/ erformance oints, or to design future roof systems that have a
built-in u grade ath. The modularity of a COM Ex ress® solution also ensures against obsolescence as com uter
technology evolves. A ro erly designed COM Ex ress® baseboard can work with several successive generations of COM
Ex ress® modules.
A COM Ex ress® baseboard design has many advantages of a custom, com uter-board design but delivers better
obsolescence rotection, greatly reduced engineering effort, and faster time to market.
9

Product Specification
3.1 Modules & Accessories
The COM Ex ress® com act sized Com uter-on-Module microETXex ress®-DC (UNP1) follows in-out Ty e 2 and is
com atible to PICMG s ecification COM.0 Rev 1.0. The microETXex ress®-DC based on Intel's Navy Pear latform is
available in different variants:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor Chipset and Features
36005-0000-16-2 uETXe-DC N270 1.6GHz Intel® Atom™ N270 DDR2, 945GSE
36005-0040-16-2 uETXe-DC N270 4GB SSD Intel® Atom™ N270 DDR2, 945GSE, 4GB onboard SSD
Extended temperature modules (-25°C to +75°C operating)
Product Number Product Name Processor Chipset and Features
36005-0000-16-2EXT uETXe-DC N270 1.6GHz E1 Intel® Atom™ N270 DDR2, 945GSE
36005-0040-16-2EXT uETXe-DC N270 4GB SSD E1 Intel® Atom™ N270 DDR2, 945GSE, 4GB onboard SSD
Accessories
Product Number Product Name
38102-0000-00-1 COM Ex ress® miniBaseboard Ty e 2
38104-0000-00-0 COM Ex ress® Eval Ty e 2
97011-5120-08-0 DDR2-800 SODIMM / 512MB
97011-1024-08-0 DDR2-800 SODIMM / 1GB
97011-2048-08-0 DDR2-800 SODIMM / 2GB
97011-5120-08-2 DDR2-800 SODIMM / 512MB E2 (industrial tem erature)
97011-1024-08-2 DDR2-800 SODIMM / 1GB E2 (industrial tem erature)
97011-2048-08-2 DDR2-800 SODIMM / 2GB E2 (industrial tem erature)
36005-0000-99-0 microETXex ress®-DC, Heats reader, threaded
36005-0000-99-1 microETXex ress®-DC, Heats reader, through hole
36005-0000-99-0C01 microETXex ress®-DC, Active Cooling Solution, threaded
36005-0000-99-0CO2 microETXex ress®-DC, Passive Cooling Solution, threaded
36005-0000-99-1CO2 microETXex ress®-DC, Passive Cooling Solution, through hole
96007-0000-00-2 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
96079-0000-00-0 KAB-HSP, Cable ada tor to connect FAN to module
10

3.2 Functional Specification
Processor
The 45nm Intel® ATOM™ (Diamondville) CPU with 22x22mm ackage size (PBGA437 socket) su orts:
» Intel® Hy er-Threading Technology (HTT)
» Enhanced Intel S eedSte ® Technology (EIST)
» Thermal Monitoring Technologies
» Idle States (C-States)
» Execute Disable Bit
CPU specifications
» Intel® ATOM™
» Codename: Diamondville
» L2-Cache: 512kB
» FSB: 533MHz
» Instruction set: 32bit
Memory
Sockets 1 x DDR2 SO-DIMM
Memory Type DDR2-400/533
Maximum Size 2GB
Technology Single Channel
Chipset
The Intel® 945GSE Chi set (Codename Calistoga) combined with the Intel® 82801GBM (ICH7M) Southbridge su orts:
» PCI Ex ress Revision 1.0
» USB 2.0
» Integrated Gra hics with dual dis lay
11

Graphics Core
The integrated Intel® GMA950 (Gen3.5) su orts:
Graphics Core Render Clock 166MHz
Execution Units / Pixel Pipelines 4
Max Graphics Memory 256MB
GFX Memory Bandwidth (GB/s) 10.7
GFX Memory Technology DVMT 3.0
API (DirectX/OpenGL) 9.0c / 1.4
Shader Model 2.0
Hardware accelerated Video -
Independent/Simultaneous Displays 2
Display Port -
HDCP support -
SDVO available via ADD2 (DDI1)
Monitor output
CRT max Resolution QXGA (2048x1536)
TV out: YES
LVDS
LVDS Bits/Pixel 1x18, 2x18
LVDS Bits/Pixel with dithering -
LVDS max Resolution: UXGA (1600x1200)
PWM Backlight Control: YES
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 SDVOB
Digital Display Interface DDI2 -
Digital Display Interface DDI -
12

Storage
onboard SSD 512MB/2GB/4GB IDE SSD o tional
SD Card support -
IDE Interface 1 x PATA 100
Serial-ATA 2 x SATA 1.5Gb/s
SATA AHCI NCQ, HotPlug, Staggered S inu
SATA RAID -
Onboard SSD
The 4GB onboard flash drive su orts:
» u to PIO Mode 6
» u to multi word DMA Mode 4
» u to ultra DMA-6
» Build in ECC (Error Correction Code)
» Dynamic Wear Leveling
» Ex anded Data Protection
Flash Drive specifications
Module HW Revision up to CE 2.4.0 CE 2.4.1 and newer
Flash Size 4GB industrial 4GB industrial
Flash Part No. SST85LD1004T-60-RI Greenliant GLS85LP1004P-S-I-FTE
NAND Type SLC NAND SLC NAND
Host write Cycles 100M 70M
Flash Erase Cycles 100k 70k
Temperature Range [°C] -40 to 85 -40 to 85
Sustained Read Speed 20 MB/s 50 MB/s
Sustained Write Speed 20 MB/s 20 MB/s
ATA Modes PIO6, MWDMA4, UDMA4 PIO6, MWDMA4, UDMA6
Total Bytes 4,096,253,952 4,068,384,768
Cylinders/Heads/Sectors 7937/16/63 7883/16/63
Variants with onboard SSD flash do not su ort external IDE due to the missing signals
PDIAG# and DASP# master/slave ca abalities over the COMex ress connector
13

Connectivity
USB 8x USB 2.0
USB Client -
PCI PCI Rev 2.3 (33MHz/3.3V)
PCI External Masters 4
PCI Express 3x PCIe x1
Max PCI Express 4x PCIe x1 without LAN
PCI Express x2/x4 configuration NO
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® 82574L (Hartwell)
Ethernet
The Intel® 82574L (Hartwell) ethernet su orts:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Audio AC97 / HD Audio
Onboard Hardware Monitor ON Semi ADT7475
Trusted Platform Module Infineon TPM 1.2 SLB9635TT
Miscellaneous -
Kontron Features
External I2C Bus Fast I2C, MultiMaster ca able
M.A.R.S. support YES
Embedded API JIDA16 / JIDA32 / PICMG EAPI
JIDA 2 Applications / K-Station YES
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Power Features
Singly Supply Support YES
Supply Voltage 8.5V - 18V
ACPI ACPI 2.0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Graphic States D0, D3
Misc Power Management DPST 2.3
Power Consumption and Performance
Full Load Power Consumption 10W
Kontron Performance Index 1714
Kontron Performance/Watt 172
Detailed Power Consum tion measurements in all states and bechmarks for CPU, Gra hics
and Memory erformance are available in A lication Note KEMAP054 at EMD Customer
Section.
14

Supported Operating Systems
The microETXex ress®-DC currently su orts:
» Microsoft Windows CE 6.0
» Microsoft Windows XP embedded
» Microsoft Windows XP x86
» Microsoft Windows 7 x86
» Microsoft Windows Embedded Standard 7 x86 (WES7)
» Linux
» WindRiver VxWorks 6.6 - 6.8
15

3.3 Block Diagram
16

3.4 Electrical Specification
3.4.1 Supply Voltage
Following su ly voltage is s ecified at the COM Ex ress® connector for commercial grade and industrial grade modules:
nominal Voltage: 8.5V - 18V
5V_Stb: 5V DC +/- 5%
Following su ly voltage is s ecified at the COM Ex ress® connector for extended tem erature modules:
nominal Voltage: 12V DC +/- 5%
5V_Stb: 5V DC +/- 5%
5V Standby voltage is not mandatory for o eration
3.4.2 Power Supply Rise Time
» The in ut voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ram of each DC in ut voltage from 10% to 90% of its final set- oint
following the ATX s ecification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV eak to eak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power Consum tion of the different microETXex ress®-DC modules is 10W (100% CPU load; 90°C CPU
tem erature). Further details with measurements and TDP values of the single variants can be found in our customer
section. Information there is available after registration.
17

3.5 Environmental Specification
3.5.1 Temperature
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) -25°C to +75°C -30°C to +85°C
Industrial grade (E2) -40°C to +85°C -40°C to +85°C
See available module variants in cha ter Product S ecification
With Kontron Embedded Modules GmbH heatspreader plate assembly
The o erating tem erature defines two requirements:
» the maximum ambient tem erature with ambient being the air surrounding the module.
» the maximum measurable tem erature on any s ot on the heats reader's surface
Without Kontron Embedded Modules GmbH heatspreader plate assembly
The o erating tem erature is the maximum measurable tem erature on any s ot on the module's surface.
3.5.2 Humidity
» O erating: 10% to 90% (non condensing)
» Non o erating: 5% to 95% (non condensing)
18

3.6 Standards and Certifications
RoHS
The microETXexpress®-DC
is com liant to the directive 2002/95/EC on the restriction of the use of certain hazardous substances (RoHS) in electrical
and electronic equi ment.
CE marking
The microETXexpress®-DC
is CE marked according to Low Voltage Directive 2006/95/EC – Test standard EN60950
Component Recognition UL 60950-1
The COM Express® compact form factor Com uter-on-Modules are Recognized by Underwriters Laboratories Inc.
Re resentative sam les of this com onent have been evaluated by UL and meet a licable UL requirements.
UL Listings:
» NWGQ2.E304278
» NWGQ8.E304278
WEEE Directive
WEEE Directive 2002/96/EC is not a licable for Com uter-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Com uter-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or su ort for further details.
19

Shock & Vibration
The COM Express® compact form factor Com uter-on-Modules successfully assed shock and vibration tests according to
» IEC/EN 60068-2-6 (Non o erating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, 2g)
» IEC/EN 60068-2-27 (Non o erating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the microETXexpress®-DC follows the requirements for electromagnetic
com atibility standards
» EN55022
» EN55011
» EN55024
» FCC15
20