Kontron microETXexpress-OH User manual

If it’s embedded, it’s Kontron.
microETXexpress®-OH Computer-on-Module (COM)
Version 0.65

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» Table of Contents «
1User Information ............................................................................. 1
1.1About This Document................................................................................................................. 1
1.2Copyright Notice ....................................................................................................................... 1
1.3Trademarks .............................................................................................................................. 1
1.4Standards................................................................................................................................ 1
1.5Warranty ................................................................................................................................. 1
1.6Technical Support ..................................................................................................................... 2
2Introduction................................................................................... 3
2.1The microETXexpress®-OH COM.................................................................................................... 3
2.2Naming Clarifications................................................................................................................. 3
2.3Understanding the COM Functionality ........................................................................................... 4
2.4COM Express® Documentation ..................................................................................................... 5
2.5COM Express® COM Benefits ........................................................................................................ 5
3Specifications ................................................................................. 7
3.1Functional Specification............................................................................................................. 7
3.2Functional Block Diagram ........................................................................................................... 9
3.3Mechanical Specifications........................................................................................................... 9
3.4Electrical Specifications ........................................................................................................... 10
3.4.1Supply Voltage ...................................................................................................................... 10
3.4.2Supply Current (Windows XP SP3).............................................................................................. 10
3.5Environmental Specifications .................................................................................................... 10
3.5.1Temperature ......................................................................................................................... 10
3.6MTBF .................................................................................................................................... 11
4COM Connectors............................................................................. 12
4.1Pin-Outs................................................................................................................................ 13
4.1.1Connectors X1A and X1B: microETXexpress® Interface .................................................................. 13

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4.1.2Connector J1 – Fan................................................................................................................. 28
4.1.3Connectors J2 and J3 – SO-DIMM DDR3 Memory Sockets................................................................ 28
4.1.4Connector J5 –JTAG................................................................................................................ 28
4.1.5PCI Express Interface .............................................................................................................. 29
4.1.6USB Interface........................................................................................................................ 29
4.1.7SATA Interface ...................................................................................................................... 30
4.1.8Audio Interface ..................................................................................................................... 30
4.1.9Graphics Interface.................................................................................................................. 30
4.1.10Ethernet Interface ................................................................................................................. 31
4.1.11SPI Bus Interface ................................................................................................................... 31
4.1.12LPC Bus Interface................................................................................................................... 31
4.1.13Power Control Interface .......................................................................................................... 32
4.1.14Miscellaneous Circuits............................................................................................................. 33
5Special Features ............................................................................ 35
5.1Parallel Processing .................................................................................................................. 35
5.2Watchdog .............................................................................................................................. 35
5.3General Purpose Input and Output (GPIO) .................................................................................... 35
5.4Fast I2C ................................................................................................................................. 35
5.5ACPI Suspend Modes and Resume Events ..................................................................................... 35
6Design Considerations .................................................................... 37
6.1Thermal Management .............................................................................................................. 37
6.2Heat Spreader Dimensions ........................................................................................................ 37
6.3Onboard Fan Connector ............................................................................................................ 37
6.3.1Fan Connector Electrical Characteristics ..................................................................................... 38
7System Resources .......................................................................... 39
7.1Interrupt Request (IRQ) Lines.................................................................................................... 39
7.2Memory Area.......................................................................................................................... 41
7.3I/O Address Map ..................................................................................................................... 41
7.4Peripheral Component Interconnect (PCI) Devices......................................................................... 41
7.5System Management Bus (SMBus) .............................................................................................. 41
7.6K-Station Resources ................................................................................................................ 41

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8BIOS Operation ............................................................................. 43
8.1Determining the BIOS Version ................................................................................................... 43
8.2Setup Guide ........................................................................................................................... 43
8.2.1Start AMIBIOS®8 Setup Utility .................................................................................................. 43
8.3BIOS Setup ............................................................................................................................ 45
8.3.1Main Menu............................................................................................................................ 45
8.3.2Advanced Settings Menu ......................................................................................................... 45
8.3.3PCIPnP Settings..................................................................................................................... 45
8.3.4Boot Settings........................................................................................................................ 45
8.3.5Hard Disk Drives .................................................................................................................... 45
8.3.6Security Settings ................................................................................................................... 45
8.3.7Chipset Settings .................................................................................................................... 45
8.3.8Exit Options.......................................................................................................................... 45
9Appendix B: Architecture Information................................................ 46
9.1Buses.................................................................................................................................... 46
9.1.1ISA, Standard PS/2 – Connectors .............................................................................................. 46
9.1.2PCI/104 ............................................................................................................................... 46
9.2General PC Architecture............................................................................................................ 46
9.3Ports .................................................................................................................................... 47
9.3.1RS-232 Serial ........................................................................................................................ 47
9.3.2Serial ATA............................................................................................................................. 47
9.3.3USB..................................................................................................................................... 47
9.4Programming ......................................................................................................................... 47
10Appendix C: Document Revision History.............................................. 48

Kontron microETXexpress-OH User’s Guide
1
1User Information
1.1 About This Document
This document provides information about products from Kontron and/or its subsidiaries. No warranty of suitability,
purpose, or fitness is implied. While every attempt has been made to ensure that the information in this document is
accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights
of third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2011 Kontron
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language or computer language, in any form or by any means (electronic, mechanical,
photocopying, recording, or otherwise), without the express written permission of Kontron.
1.3 Trademarks
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron. Kontron is a trademark or registered trademark of Kontron AG.
The following components used on this board are trademarked as follows:
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corporation.
» Microsoft is a registered trademark of Microsoft Corporation.
» Intel is a registered trademark of Intel Corporation.
» COM Express is a trademark of PICMG.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners and
indicated with an “*”.
1.4 Standards
Kontron is certified to ISO 9000 standards.
1.5 Warranty
This Kontron product is warranted against defects in material and workmanship for the warranty period from the date
of shipment. During the warranty period, Kontron will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.

Kontron microETXexpress-OH User’s Guide
2
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron will not be responsible for any defects or damages to other products not supplied by Kontron that are caused
by a faulty Kontron product.
1.6 Technical Support
Technicians and engineers from Kontron and/or its subsidiaries are available for technical support. We are committed
to making our product easy to use and will help you use our products in your systems.
Please consult our website at http://www.kontron.com/support for the latest product documentation, utilities,
drivers and support contacts. Consult our customer section for the latest BIOS downloads, Product Change
Notifications and additional tools and software. You can also always contact your board supplier for technical support.

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2Introduction
2.1 The microETXexpress®-OH COM
The Kontron microETXexpress®-OH Computer-on-Module (COM) complies with the newly updated Rev. 2.0 COM
Express® specification that provides for a compact form factor (95 x 95 mm) a new COM Express® Type 6 connector
definition. The microETXexpress®-OH COM design enables the development of graphics-intensive applications based
on the Advanced Micro Devices (AMD) G-series Advanced Processing Unit (APU) and the AMD Fusion Controller Hub
(FCH) using the secure development path of an established, future-proof industry standard, the COM Express®
compact form factor, pin-out Type 6.
The Kontron microETXexpress®-OH module processor has an integrated memory controller for up to 8Gbytes of single
channel DDR3 memory. The integrated DirectX®11-capable graphics processing unit (GPU) within the FCH supports
display interfaces with a maximum resolution of 2560 x 1600 VGA and 18-bit single-channel LVDS. With six PCI
Express lanes for flexible configurations, the microETXexpress®-OH COM is ideal for multi-interface designs and
brings the added benefit of low power consumption. These special features make this 95 x 95 mm Computer-on-
Module a key solution for applications such asmultimedia content delivery, outdoor digital signage, infotainment
kiosks, POS/POI devices, panel PCs, and professional gaming systems that require high-level graphics performance
and support for the latest APIs like DirectX 11, and where low thermal power design is also an advantage.
All modules in the Kontron microETXexpress® family are compliant with the COM Express® standard, compact form
factor and follow either the Type 2 or Type 6 pin-out definition. These modules also take advantage of the new
Kontron Embedded Application Programming Interface (Kontron EAPI), which is cross-platform middleware that is
both form factor and operating system independent. This ensures easy interchangeability as well as design scalability
and future migration paths.
The microETXexpress®-OH COM is a complete PC with standard interfaces such as USB, Gigabit Ethernet, SATA 2.0 as
well as additional options like high-definition audio (HDA) and ACPI, I2C. The microETXexpress®-OH COM also
supports the MARS and K-STATION Kontron tools.
2.2 Naming Clarifications
The COM Express® standard defines a Computer-On-Module, or COM, with all the components necessary for a bootable
host computer, packaged as a super-component. The interfaces provide a smooth transition path from legacy parallel
interfaces such as IDE or parallel ATA (PATA) to Low Voltage Differential Signaling (LVDS) interfaces including the PCI
bus, PCI Express*, and Serial ATA (SATA).
» ETXexpress® modules are Kontron COM Express® modules in the basic form factor (125mm x 95mm) that follow
pin-out types 2 or 6.
» microETXexpress® modules are Kontron COM Express® modules in the compact form factor (95mm x 95mm) that
follow pin-out types 2 or 6.

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» nanoETXexpress® modules are Kontron COM Express® compatible modules in an ultra-small form factor that
follow pin-out types 1 or 10 (55mm x 84mm)
NOTE: The Kontron microETXexpress®-OH module takes advantage of new features introduced in the PICMG COM
COM.0 R2.0 COM Express® Specification.
2.3 Understanding the COM Functionality
All Kontron microETXexpress® and ETXexpress® modules contain two connectors (X1A and X1B), each with two rows.
The primary connector rows are Row A and Row B (connector X1A). The secondary connector rows are Row C and Row D
(connector X1B). The microETXexpress-OH COM uses the PICMG COM Express® pin-out Type 6 definition, which is a
new addition to the PICMG COM Express standard and documented in Revision 2.0 of the PICMG specification. The Type
6 pin-out is based on Type 2 and also supports new features on the secondary connector (rows C and D). The key
changes are:
» The PCI interface is no longer supported and the pins are used instead for digital display interfaces (DDI) and two
additional PCI Express lanes
» The IDE (PATA) parallel interface is no longer supported and the pins are used instead for additional transmit and
receive pairs for four USB 3.0 ports.
» Three dedicated DDI ports have been added. Ports 1, 2, and 3 can be configured individually for Display Port (DP),
HDMI, or DVI and port 1 can also be used for SDV0.
» SDVO is no longer supported.
» Two optional two-wire RS232 serial ports have been added using pins formerly assigned to 12V signals.
The primary connector (Row A and Row B) on the microETXexpress®-OH COM features the following functionality:
» Analog VGA graphics
» LVDS 18-bit single channel
» Gigabit Ethernet LAN
» Serial ATA (SATA)
» PCI Express*
» SPI Bus
» USB 2.0 and USB 3.0
» LPC (Low Pin Count) bus
» Watchdog timer (WDT)
» GPIO
» I2C
» Intel® High Definition Audio (HDA)
The secondary connector (Row C and Row D) supports the following buses and I/O:
» SDVO/DP/DVI/HDMI
» DP/DVI/HDMI
» PCI Express

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5
NOTE: For full descriptions of the COM Express Type 6 pin-outs, refer to the PICMG documentation that can be obtained
from the the PICMG website.
2.4 COM Express® Documentation
This product manual serves as one of three principal references for this COM Express® module design. It documents
the specifications and features of the microETXexpress®-OH COM. The other two references, which are available from
your Kontron support representative or from PICMG, include:
» The PICMG COM Express® Specification, R2.0, which defines the COM Express® module form factors, pin-outs, and
signals. This document can be obtained by filling out the order form on the PIGMG website at
http://www.picmg.com .
» The PICMG COM Express® Design Guide, which serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules. This guide is on the PICMG website
at http://www.picmg.com.
2.5 COM Express® COM Benefits
Compact form factor (95 x 95 mm) Computer-on-Module Express (COM Express) modules are very compact, highly
integrated computers that use either the Type 2 or Type 6 COM Express® connector pin-outs. All microETXexpress®
modules feature a standardized form factor and a standardized connector layout for a specified set of signals, as
defined in the PICMG COM Express® specification (PICMG COM.0.R2). This standardization lets designers create a
single-system baseboard that can accept present and future microETXexpress modules.
Kontron microETXexpress® modules include common personal computer (PC) peripheral functions such as:
» Graphics
» USB ports
» Ethernet
» Audio
» SATA hard disk drive format
Baseboard designers can optimize exactly how each of these functions is implemented physically for the intended
application by placing connectors precisely where they are needed on a baseboard that is designed for an optimal fit
in the system packaging.
A peripheral PCIe bus can be implemented directly on the application-specific baseboard rather than on mechanically
unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one plug-in
super-component simplifies packaging, eliminates cabling, and significantly reduces system-level total cost of
ownership.
A single baseboard design can use a range of COM Express modules. This flexibility enables product differentiation at
various price/performance points, and the design of future-proof systems with a built-in upgrade path. The

Kontron microETXexpress-OH User’s Guide
6
modularity of a COM Express solution also ensures against obsolescence as computer technology evolves. A properly
designed COM Express baseboard can work with several successive generations of COM Express modules.
A COM Express baseboard design has many of the advantages of a custom, computer-board design, but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

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3Specifications
3.1 Functional Specification
Processor: AMD G-Series Fusion Advanced Processing Unit (APU)
» CPU: AMD T44R with 1.2 GHz single-core APU (9W)
AMD T52R with 1.5 GHz single-core APU (18W)
AMD T40N with 1.0 Ghz dual-core APU (9W)
AMD T56N with 1.6 GHz dual-core APU (18W)
» Cores: Up to 2 cores
» Bus Speed: Up to 2x1.66 GHz
» Cache: TBD
» Memory Controller: Up to 8GB (2x4GB)single channel, two non-ECC DDR3 S0DIMMs (1066 MHz or with the
T56N CPU only, 1333 MHz)
» Video Controller: DirectX®11-capable graphics and parallel processing engine
Universal Video Decoder (UVD) 3.0 (the dedicated highdefinition video acceleration block
in the APU)
» Graphics Processing: General purpose graphics processing unit (GPGPU)
AMD Radeon HD6310 with support for DirectX® 11, OpenCL 1.0, and OpenGL 3.2 and 2.1
» Instruction Set: Kontron Embedded Application Programming Interface (Kontron EAPI)
» Package: 19mm x 19mm
» Thermal Spec: Operation: 0° to +60°C
Storage: -30° to +85°
Chipset: AMD Fusion Controller Hub (FCH)
A50M I/O Controller Hub
» Speed: TBD
» USB: 8xUSB 2.0 channels
2xUSB 3.0 channels as a build option
» Audio: 3 channelsHigh Definition Audio
» PCI Express: PCI Express 1.0 or 2.0
Six PCIe general purpose lanes
2xExpressCard
» Storage 4xSATA
» Ethernet Intel® 82574 GbE Controller
» Suspend Modes Core Sleep States: S0, S3, S4, S5eco
» TDP: TBD
» Package: TBD

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8
Display Interfaces
» Features: 2 Digital Display Interfaces 0 and 1 (as defined by COM Express Rev. 2 Type 6)
Dual independent display pipes - two active display interfaces allowed
Display Port – resolution to 2560 x 1200 x 60 Hz
HDMI/DVI - resolution to 1920 x 1200 x 60 Hz
Single channel (18 bit) LVDS channel A (as defined by COM Express Rev. 2 Type 6)
(Pin shared (multiplexed) with (TBD) DDI)
Analog VGA, with max resolution TBD (on COM Express A-B connector)
Storage
» SATA: 4xSATA TBD ports supporting up to 6.0 Gbps transfer rate
Onboard Devices:
» Ethernet: Intel® 82574 GbE Controller
» Ethernet Features: S0 or S5 power, under BIOS control, supporting WakeOnLAN, PXE Lanboot (TBD),
» TPM: TBD
» Watchdog Timer: SIO implementation
BIOS enables and configures watchdog in the CPLD (TBD).
Watchdog has the option to generate NMI after the delay has expired.
» Power Management: BIOS enables ACPI power management revision 3.0 in the CPLD for supported OS.
Additional Interfaces:
» LPC bus: Yes, to COM Express A-B connector
» SMBus: Yes, to COM Express A-B connector
» I2C: Yes, the I2C bus can be implemented using an FCH SMBus port or via the SIO hardware.
(COM Express Rev 2.0 specifies that the I2C bus shall be active in S5)
» GPIO: Yes, 8xGPIO, 4 GPI and 4 GPO (inputs are interrupt-capable)
» SPI Yes, to COM Express A-B connector, SPI bus includes carrier board SPI device support
» K-Station: Yes
» Bootlogo: TBD
» MARS: Supported for smart battery management
» HWM: Temperature Monitoring for CPU and Board Temperature (Nuvoton NCT5577D SIO hardware
monitor)
» Passive Cooling: TBD
» ACPI: ACPI 3.0
» Suspend Modes: S0, S3, S5/WOL enabled, S5/WOL disabled, S5eco (S4 not supported in the FCH)
» Input Voltage: Single supply support with wide range power supply input, 4.75V – 18V
5.0V supply is the optional standby power rail.

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9
3.2 Functional Block Diagram
Figure 1 is t he microETXexpress®-OH COM block diagram
Figure 1: microETXexpress®-OH COM Block Diagram
To be supplied in a later version
3.3 Mechanical Specifications
Module Dimensions
» 95 mm x 95 mm ±0.2 mm (3.47 in. x 3.47 in)
Height on Top
» Approximately TBD mm maximum (without the PCB)
» Height varies depending on whether the optional cooling solution (either a passive heat sink or a heat spreader
plate) is installed
Height on Bottom
» Approximately TBD mm maximum (without the PCB)
Figure 2 is the microETXexpress®-OH COM mechanical drawing
Figure 2: microETXexpress®-OH COM Mechanical Drawing
To be supplied in a later version
All dimensions are shown in millimeters. The COM Express® specification says that these holes should be ± 0.25mm
[±0.010"], unless otherwise noted. The tolerances for placement of the COM Express connector with respect to the
peg holes (dimensions [16.50, 6.00]) should be ± 0.10mm [±0.004"]. The mounting holes shown in the drawing use
6mm diameter pads and 2.7mm plated holes for use with 2.5mm hardware. The pads are tied to the PCB ground plane.
Gray circles represent the mechanical mounting holes. Black circles represent the mounting holes required by the
PICMG COM Express® standard.

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3.4 Electrical Specifications
3.4.1 Supply Voltage
ATC Power
» 4.75V to +18V main power is on the COM Express VCC_12V pins and 4.75V to 5.25V standby power is on the
VCC_5V_SBY. RTC power is provided on the VCC_RTC pins. VCC_12V may or may not collapse in suspend states S3,
S4, and S5.
Single Power Supply
» 4.75V to +18V main power is on the COM Express VCC_12V pins and standby power if needed is also provided on
the VCC-12V pins. The VCC_5V_SBY pins may be floating or may be tied to a 5V source on the carrier board. RTC
power is provided on the VCC_RTC pins.
Power Supply Risetime
» TBD
3.4.2 Supply Current (Windows XP SP3)
The testing performed to capture the supply current data used tested modules mounted on a Kontron evaluation
board with a mouse and keyboard connected. The power consumption tests were executed in Windows XP (with SP3)
using a tool to stress the CPU at 100 % load. The power measurement values were captured after 15 minutes of full
load or a stable CPU core temperature of 90°C. To ensure a stable die temperature, a corresponding heat sink was
used to hold the temperature under the critical trip point. The modules were tested using the maximum CPU
frequency. For more detailed information, refer to the “Power Consumption” diagrams on the EMD Customer section of
the Kontron website.
Tables to be supplied in a later version
NOTE: It is difficult to test for all possible applications on the market. There may be an application that draws more
power from the CPU than the values measured in the table above. Take this into consideration if you are at
the limit of the thermal specification, in which case you should consider improving your thermal solution.
3.5 Environmental Specifications
3.5.1 Temperature
Operating: (with Kontron heat spreader plate assembly):
» Ambient temperature: 0 to TBD°C

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» Maximum heat sink temperature: 0 to 70°C* (without a fan on the 9W APU SKUs)
» Non-operating: TBD°C
NOTES: *1) The maximum operating temperature with the heat spreader plate installed is the maximum measurable
temperature on any spot on the heat spreader surface. You must maintain the temperature according to the
specification above.
Operating (without Kontron heat spreader plate assembly):
» Maximum operating temperature: TBD°C
» Non operating: TBD°C
NOTE: **The maximum operating temperature is the maximum measurable temperature on any spot on the module
surface. You must maintain the temperature according to the specification above.
Humidity
» Operating: TBD% (non-condensing)at 40°C
» Non operating: TBD (non-condensing) at 40°C
3.6 MTBF
TBD

Kontron microETXexpress-OH User’s Guide
12
4COM Connectors
The pin-outs for microETXexpress® interface connectors X1A (primary connector, rows A and B) and X1B (secondary
connector, rows C and D) are documented for convenient reference. See the PICMG COM Express® Specification on the
PICMG website and COM Express® Design Guide on the Kontron website for detailed, design-level information.
Figure 3: COM Interface Connector Locations
To be supplied in a later version
Table 1: General Signal Description Key
Type Description
I/O-3,3 Bi-directional 3,3 V IO-Signal
I/O-5
T
Bi-dir. 3,3V I/O (5V Tolerance)
I/O-5 Bi-directional 5V I/O-Signal
I-3,3 3.3V Input
I/OD Bi-directional Input/Output Open Drain
I-5
T
3.3V Input (5V Tolerance)
OA Output Analog
OD Output Open Drain
O-1,8 1.8V Output
O-3,3 3.3V Output
O-5 5V Output
DP-I/O Differential Pair Input/Output
DP-I Differential Pair Input
DP-O Differential Pair Output
PU Pull-Up Resistor
PD Pull-Down Resistor
PWR Power Connection
nc Not connected, Signal not available
NOTE: To protect external power lines of peripheral devices, make sure that the wires have the right diameter to
withstand the maximum available current and the enclosure of the peripheral device fulfils the fire-
protection requirements in IEC/EN60950

Kontron microETXexpress-OH User’s Guide
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4.1 Pin-Outs
4.1.1 Connectors X1A and X1B: microETXexpress® Interface
Table 2: Connector X1A - Row A
Pin Signa
l
Description Type Termination Commen
t
A1 GND (Fixed) Power Ground PWR --
A2 GBE0_MDI3- Ethernet Receive Data- DP-I Intel® 82577 -
A3 GBE0_MDI3+ Ethernet Receive Data+ DP-I Intel® 82577 -
A4 GBE0_LINK100# Ethernet Speed LED
100Mbps
O-3.3 Intel® 82577 -
A5 GBE0_LINK1000# Ethernet Speed LED
1000Mbps
O-3.3 Intel® 82577 -
A6 GBE0_MDI2- Ethernet Receive Data- DP-I Intel® 82577 -
A7 GBE0_MDI2+ Ethernet Receive Data+ DP-I Intel® 82577 -
A8 GBE0_LINK# LAN Link LED OD Intel® 82577 -
A9 GBE0_MDI1- Ethernet Receive Data- DP-I Intel® 82577 -
A10 GBE0_MDI1+ Ethernet Receive Data+ DP-I Intel® 82577 -
A11 GND (Fixed) Power Ground PWR --
A12 GBE0_MDI0- Ethernet Transmit Data- DP-O Intel® 82577 -
A13 GBE0_MDI0+ Ethernet Transmit Data+ DP-O Intel® 82577 -
A14 GBE0_CTREF LAN Reference Voltage O-3.3 is on a power rail
controlled
-
A15 SUS_S3# Indicates Suspend to RAM
state
O-3.3 CPLD I/O CPLD I/O
A16 SATA0_TX+ SATA 0 Transmit Data+ DP-O -
A17 SATA0_TX- SATA 0 Transmit Data- DP-O -
A18 SUS_S4# Indicates Suspend to Disk
state
O-3.3 CPLD I/O CPLD I/O
A19 SATA0_RX+ SATA 0 Receive Data+ DP-I
A20 SATA0_RX- SATA 0 Receive Data- DP-I -
A21 GND (Fixed) Power Ground PWR -
A22 SATA2_TX+ SATA 2 Transmit Data- DP-O
A23 SATA2_TX- SATA 2 Transmit Data+ DP-O
A24 SUS_S5# Indicates Soft Off state O-3.3 CPLD I/O CPLD I/O
A25 SATA2_RX+ SATA 2 Receive Data+ Not connected nc nc
A26 SATA2_RX- SATA 2 Receive Data- Not connected nc nc
A27 BATLOW# Indicates low external
battery
I-3.3 CPLD I/O
A28 (S)ATA_ACT# SATA, IDE, SD Activity
Indicator
O-3.3 Buffered outpu
t
A29 AC/HDA_SYNC HD Audio Sync O-3.3
A30 AC/HDA_RST# HD Audio Reset O-3.3
A31 GND Fixed) Power Ground PWR --
A32 AC/HDA_BITCLK HD Audio Clock O-3.3

Kontron microETXexpress-OH User’s Guide
14
Pin Signa
l
Description Type Termination Commen
t
A33 AC/HDA_SDOUT HD Audio Data O-3.3
A34 BIOS_DIS0# Disable Module BIOS
Enables boot from a BIOS
on Baseboard
I-3.3
A35 THRMTRIP# CPU thermal shutdown
indicator
O-3.3
A36 USB6- USB Data- Port #6 DP-I/O -
A37 USB6+ USB Data+ Port #6 DP-I/O -
A38 USB_6_7_OC# USB Overcurrent Pair 6/7 I-3.3
A39 USB4- USB Data- Port #4 DP-I/O
A40 USB4+ USB Data+ Port #4 DP-I/O -
A41 GND (Fixed) Power Ground PWR --
A42 USB2- USB Data- Port #2
A43 USB2+ USB Data+ Port #2 DP-I/O
A44 USB_2_3_OC# USB Overcurrent Pair 2/3 I-3.3
A45 USB0- USB Data- Port #0 DP-I/O
A46 USB0+ USB Data+ Port #0 DP-I/O
A47 VCC_RTC RTC Power Supply +3V PWR --
A48 EXCD0_PERST# PCIe Express Card 0 Rese
t
O-3.3
A49 EXCD0_CPPE# PCIe Express Card 0
Request
I-3.3
A50 LPC_SERIRQ LPC Serial Interrupt
Request
IO-3.3
A51 GND (Fixed) Power Ground PWR --
A52 PCIE_TX5+ PCIe 5 Transmit Data+ DP-O
A53 PCIE_TX5- PCIe 5 Transmit Data- DP-O
A54 GPI0 General Purpose Input 0 I-3.3
A55 PCIE_TX4+ PCIe 4 Transmit Data+ DP-O
A56 PCIE_TX4- PCIe 4 Transmit Data- DP-O
A57 GND (Fixed) Power Ground PWR --
A58 PCIE_TX3+ PCIe 3 Transmit Data+ DP-O
A59 PCIE_TX3- PCIe 3 Transmit Data- DP-O
A60 GND (Fixed) Power Ground PWR --
A61 PCIE_TX2+ PCIe 2 Transmit Data+ DP-O
A62 PCIE_TX2- PCIe 2 Transmit Data- DP-O
A63 GPI1 General Purpose Input 1 I-3.3
A64 PCIE_TX1+ PCIe 1 Transmit Data+ DP-O
A65 PCIE_TX1- PCIe 1 Transmit Data- DP-O
A66 GND (Fixed) Power Ground PWR --
A67 GPI2 General Purpose Input 2 I-3.3
A68 PCIE_TX0+ PCIe lane #0 Transmit+ DP-O
A69 PCIE_TX0- PCIe lane #0 Transmi
t
-DP-O
A70 GND (Fixed) Power Ground PWR --
A71 LVDS_A0+ LVDS Channel A (positive) DP-O

Kontron microETXexpress-OH User’s Guide
15
Pin Signa
l
Description Type Termination Commen
t
A72 LVDS_A0- LVDS Channel A
(negative)
DP-O -
A73 LVDS_A1+ LVDS Channel A (positive) DP-O -
A74 LVDS_A1- LVDS Channel A
(negative)
DP-O
A75 LVDS_A2+ LVDS Channel A (positive) DP-O
A76 LVDS_A2- LVDS Channel A
(negative)
DP-O
A77 LVDS_VDD_EN LVDS Panel Power
Controller
O-3.3
A78 LVDS_A3+ LVDS Channel A (positive) DP-O
A79 LVDS_A3- LVDS Channel A
(negative)
DP-O
A80 GND (Fixed) Power Ground PWR --
A81 LVDS_A_CK+ LVDS Channel A Clock+ DP-O
A82 LVDS_A_CK- LVDS Channel A Clock- DP-O
A83 LVDS_I2C_CK LVDS I2C Clock IO-3.3
A84 LVDS_I2C_DAT LVDS I2C Data IO-3.3
A85 GPI3 General Purpose Input 3 I-3.3
A86 RSVD Reserved Not connected nc nc
A87 RSVD Reserved Not connected Nc nc
A88 PCIE0_CK_REF+ PCIe Clock (positive) DP-O
A89 PCIE0_CK_REF- PCIe Clock (negative) DP-O
A90 GND (Fixed) Power Ground PWR --
A91 SPI_Power Power for of
f
-board SPI
flash
O-3.3
A92 SPI_MISO SPI Master In Slave Out
data line
I-3.3
A93 GPO0 General Purpose Output 0 O-3.3
A94 SPI_CLK SPI clock line for of
f
-
board SPI
O-3.3
A95 SPI_MOSI SPI Master Out Slave In
data line
O-3.3 -
A96 TPM_PP Trusted Platform Module
Physical Presence pin
I-3.3
A97 TYPE10# Not connected for
T
y
pe 6
module
Not connected nc nc
A98 SER0_TX Gen. Purpose Serial Port 0
Transmit
Not connected nc nc
A99 SER0_RX Gen. Purpose Serial Port 0
Receive
Not connected nc nc
A100 GND (Fixed) Power Ground PWR --
A101 SER1_TX Gen. Purpose Serial Port 1
Transmit
Not connected nc nc
A102 SER1_RX Gen. Purpose Serial Port 1
Receive
Not connected nc nc
A103 LID# LID Button I/OP-3.3