Lanner LEC-2290E User manual

LEC-2290E User Manual
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LEC-2290E
User Manual
Version: 1.0
Date of Release: 2021-11-16
Embedded Computing Platform

LEC-2290E User Manual
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The icons are used in the manual to serve as an indication of interest topics or important messages. Below is a
description of these icons:
Note: This mark indicates that there is a note of interest and is something that you should pay special
attention to while using the product.
Warning: This mark indicates that there is a caution or warning and it is something that could
damage your property or product.
The listed websites are links to the on-line product information and technical support.
Resources
URL
Lanner
http://www.lannerinc.com
Product Resource
http://www.lannerinc.com/download-center
RMA
http://eRMA.lannerinc.com
This document is copyrighted © 2021. All rights are reserved. The original manufacturer reserves the right to
make improvements to the products described in this manual at any time without notice.
No part of this manual may be reproduced, copied, translated or transmitted in any form or by any means
without the prior written permission of the original manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original manufacturer assumes no responsibility for its use,
nor for any infringements upon the rights of third parties that may result from such use.
Your feedback is valuable to us, as it will help us continue to provide you with more accurate and relevant
documentation. To provide any feedback, comments or to report an error, please email to
[email protected]m. Thank you for your time.

LEC-2290E User Manual
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Taiwan Corporate Headquarters
Lanner Electronics Inc.
7F, No.173, Sec.2, Datong Rd.
Xizhi District, New Taipei City 22184,
Taiwan
立端科技股份有限公司
221 新北市汐止區
大同路二段 173 號7樓
T: [phone]
F: [phone]
E: [email protected]m
China
Beijing L&S Lancom Platform Tech. Co., Ltd.
Guodong LOFT 9 Layer No. 9 Huinan Road,
Huilongguan Town, Changping District, Beijing
102208 China
T: [phone]
F: [phone]
E: [e-mail]
USA
Lanner Electronics Inc.
47790 Westinghouse Drive
Fremont, CA 94539
T: [phone]
F: [phone]
E: [e-mail]
Canada
Lanner Electronics Canada Ltd
3160A Orlando Drive
Mississauga, ON
L4V 1R5 Canada
T: [phone]
F: [phone]
E: [e-mail]
Europe
Lanner Europe B.V.
Wilhelmina van Pruisenweg 104
2595 AN The Hague
The Netherlands
T: [phone]
E: [e-mail]

LEC-2290E User Manual
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Intel® and Intel® Atom® are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other
countries.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to
Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference
in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the equipment
off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Note
1. An unshielded-type power cord is required in order to meet FCC emission limits and also to prevent interference
to the nearby radio and television reception. It is essential that only the supplied power cord be used.
2. Use only shielded cables to connect I/O devices to this equipment.
3. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
Important
1. Operations in the 5.15-5.25GHz band are restricted to indoor usage only.
2. This device meets all the other requirements specified in Part 15E, Section 15.407 of the FCC Rules.

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Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during and after installation.
Do not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie or scarf and roll up your sleeves.
Wear safety glasses if you are working under any conditions that might be hazardous to your eyes.
Do not perform any action that creates a potential hazard to people or makes the equipment unsafe.
Disconnect all power by turning off the power and unplugging the power cord before installing or removing a chassis or
working near power supplies
Do not work alone if potentially hazardous conditions exist.
Never assume that power is disconnected from a circuit; always check the circuit.
Suivez ces consignes pour assurer la sécuritégénérale :
Laissez la zone du châssis propre et sans poussière pendant et après l’installation.
Ne portez pas de vêtements amples ou de bijoux qui pourraient être pris dans le châssis. Attachez votre cravate ou
écharpe et remontez vos manches.
Portez des lunettes de sécurité pour protéger vos yeux.
N’effectuez aucune action qui pourrait créer un danger pour d’autres ou rendre l’équipement dangereux.
Coupez complètement l’alimentation en éteignant l’alimentation et en débranchant le cordon d’alimentation avant
d’installer ou de retirer un châssis ou de travailler à proximité de sources d’alimentation.
Ne travaillez pas seul si des conditions dangereuses sont présentes.
Ne considérez jamais que l’alimentation est coupée d’un circuit, vérifiez toujours le circuit. Cet appareil génère, utilise et
émet une énergie radiofréquence et, s’il n’est pas installé et utilisé conformément aux instructions des fournisseurs de
composants sans fil, il risque de provoquer des interférences dans les communications radio.
There is risk of Explosion if Battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions.
Installation only by a skilled person who knows all Installation and Device Specifications which are to be applied.
Do not carry the handle of power supplies when moving to another place.
Please conform to your local laws and regulations regarding safe disposal of lithium BATTERY.
Disposal of a battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.
Leaving a battery in an extremely high temperature surrounding environment can result in an explosion or the leakage
of flammable liquid or gas.
A battery subjected to extremely low air pressure that may result in an explosion or the leakage of flammable liquid or
gas.
Risque d’explosion si la pile est remplacée par une autre d’un mauvais type.
Jetez les piles usagées conformément aux instructions.
L’installation doit être effectuée par un électricien formé ou une personne formée à l’électricité connaissant toutes les
spécifications d’installation et d’appareil du produit.
Ne transportez pas l’unité en la tenant par le câble d’alimentation lorsque vous déplacez l’appareil.
Electrical equipment generates heat. Ambient air temperature may not be adequate to cool equipment to acceptable
operating temperatures without adequate circulation. Be sure that the room in which you choose to operate your system
has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design allows cooling air to circulate effectively. An open chassis
permits air leaks, which may interrupt and redirect the flow of cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs when electronic
components are improperly handled and can result in complete or intermittent failures. Be sure to follow ESD-prevention

LEC-2290E User Manual
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procedures when removing and replacing components to avoid these problems.
Wear an ESD-preventive wrist strap, ensuring that it makes good skin contact. If no wrist strap is available, ground
yourself by touching the metal part of the chassis.
Periodically check the resistance value of the antistatic strap, which should be between 1 and 10 megohms (Mohms).
L’équipement électrique génère de la chaleur. La température ambiante peut ne pas être adéquate pour refroidir
l’équipement à une température de fonctionnement acceptable sans circulation adaptée. Vérifiez que votre site propose
une circulation d’air adéquate.
Vérifiez que le couvercle du châssis est bien fixé. La conception du châssis permet à l’air de refroidissement de bien
circuler. Un châssis ouvert laisse l’air s’échapper, ce qui peut interrompre et rediriger le flux d’air frais destiné aux
composants internes.
Les décharges électrostatiques (ESD) peuvent endommager l’équipement et gêner les circuits électriques. Des dégâts
d’ESD surviennent lorsque des composants électroniques sont mal manipulés et peuvent causer des pannes totales ou
intermittentes. Suivez les procédures de prévention d’ESD lors du retrait et du remplacement de composants.
Portez un bracelet anti-ESD et veillez à ce qu’il soit bien au contact de la peau. Si aucun bracelet n’est disponible, reliez
votre corps à la terre en touchant la partie métallique du châssis.
Vérifiez régulièrement la valeur de résistance du bracelet antistatique, qui doit être comprise entre 1 et 10 mégohms
(Mohms).
Mounting Installation Precaution
Environment:
Do not install and/or operate this unit in any place that flammable objects are stored or used in.
If installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack environment may be
greater than room ambient. Therefore, consideration should be given to installing the equipment in an environment
compatible with the maximum ambient temperature (Tma) specified by the manufacturer.
Installation of the equipment (especially in a rack) should consider the ventilation of the system’s intake (for taking chilled
air) and exhaust (for emitting hot air) openings so that the amount of airflow required for safe operation of the equipment
is not compromised.
To avoid a hazardous load condition, be sure the mechanical loading is even when mounting.
Consideration should be given to the connection of the equipment to the supply circuit and the effect that overloading
of the circuits might have on over-current protection and supply wiring. Appropriate consideration of equipment
nameplate ratings should be used when addressing this concern.
Reliable earthing should be maintained. Particular attention should be given to supply connections other than direct
connections to the branch circuit (e.g., use of power strips).
Installation & Operation:
The installation of this product must be performed by trained specialists; otherwise, a non-specialist might create the
risk of the system’s falling to the ground or other damages.
Lanner Electronics Inc. shall not be held liable for any losses resulting from insufficient strength for supporting the system
or use of inappropriate installation components.

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Before turning on the device, ground the grounding cable of the equipment. Proper grounding (grounding) is very
important to protect the equipment against the harmful effects of external noise and to reduce the risk of electrocution in
the event of a lightning strike. To uninstall the equipment, disconnect the ground wire after turning off the power. A
ground wire is required and the part connecting the conductor must be greater than 4 mm2 or 10 AWG.
Avant d’allumer l’appareil, reliez le câble de mise à la terre de l’équipement à la terre.
Une bonne mise àla terre (connexion àla terre) est très importante pour protéger l’équipement contre les effets néfastes
du bruit externe et réduire les risques d’électrocution en cas de foudre.
Pour désinstaller l’équipement, débranchez le câble de mise à la terre après avoir éteint l’appareil.
Un câble de mise àla terre est requis et la zone reliant les sections du conducteur doit faire plus de 4 mm2 ou 10 AWG.
Loosen the screw of the earthing point.
Connect the grounding cable to the ground.
The protection device for the power source must provide 30 A current.
This protection device must be connected to the power source before power.
The cable hould 16 AWG
Desserrez la vis du terminal de mise àla terre.
Branchez le câble de mise à la terre àla terre.
L’appareil de protection pour la source d’alimentation doit fournir 30 A de
courant.
Cet appareil de protection doit être branché à la source d’alimentation avant
l’alimentation.
Le câble doit 16 AWG
This product is intended to be supplied by a Listed Power Adapter or DC power source, rated 12-24Vdc, 17.5-8A minimum,
Tma = 70°C, and the altitude of operation = 5000m.
This equipment must be grounded.
Cet équipement doit être mis àla terre.
Suitable for installation in Information Technology Rooms in accordance with Article 645 of the National Electrical Code
and NFPA 75.
Peut être installé dans des salles de matériel de traitement de l'information conformément à l'article 645 du National
Electrical Code et àla NFPA 75.
The machine can only be used in a restricted access location and has installation instructions by a skilled person.
Les matériels sont destinés àêtre installés dans des EMPLACEMENTS À ACCÈS RESTREINT.
This equipment is for INDOOR USE ONLY

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Package Content.................................................................................................................................9
Ordering Information .........................................................................................................................9
Optional Accessories..........................................................................................................................9
System Specifications.......................................................................................................................10
Motherboard Information................................................................................................................14
Internal Jumpers and Connector......................................................................................................17
Open the Chassis..............................................................................................................................32
Installing the Disk Drive....................................................................................................................33
Installing 4G Module ........................................................................................................................34
Installing Memory Card....................................................................................................................35
Installing System Memory................................................................................................................36
Installing Graphic Card (Optional)....................................................................................................37
Install IPMI BMC Card (Optional) .....................................................................................................42
Wall Mounting..................................................................................................................................44
Main Page.........................................................................................................................................47
Advanced Page.................................................................................................................................48
Chipset..............................................................................................................................................78
Security.............................................................................................................................................91
Boot Menu........................................................................................................................................94
Save and Exit Menu..........................................................................................................................95
Command Line Configuration ..........................................................................................................97
NVIDIA EGX Installation Guide .......................................................................................................100

LEC-2290E User Manual
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The LEC-2290E, an intelligent edge computing box PC, powered by the 8th generation Intel® CoreTM i7 CPU
(codenamed Coffee Lake) and features up to 32GB DDR4 memory, 4x PoE for camera connections and
PCIe/Mini-PCIe slots for GPU cards. LEC-2290E comes with support of Intel® Distribution of OpenVINO™
Toolkit and Movidius inferencing engine to realize high-performance intelligent edge computing applications
like compute-intensive video analytics. The systems computing capacity can be expanded by GPUs for video
processing and together with the powerful CPU to execute computer vision algorithms.
Intel® CoreTM i7-8700
2x DDR4 2133/2400 SO-DIMM, Max 32GB (Max 16GB + 16GB)
2x RJ45 Gbe LAN, 4x PoE, 4x USB 3.0, 6x COM Ports, 8x DI & 8x DO
2x Removable HDD/SSD External Slot w/ RAID, 1x mSATA
1x PCIe*16, 1x PCIe*4, 1x Mini-PCIe (PCIe + USB2.0) w/ Nano-SIM, x B Key M.2 (PCIe + USB3.0) w/ Nano-SIM
Your package contains the following items:
1x LEC-2290E System Unit
4x Rubber Foot
2x 4-pin Terminal Block, 1x 2-pin Terminal Block, 1x 20-pin Terminal Block
SKU No.
Description
LEC-2290E
Intelligent Edge Computing Box PC with Intel® CoreTM i7-8700
Model No.
Description
IAC-AST2500I
IPMI BMC Card
0TAW000234000
EG25GGB-MiniPCIe-S Quectel IoT/M2M-optimized LTE Cat 4
0TAW000165000
WPEQ-261ACN(BT) Sparklan WI-FI Card 2T2R Wi-Fi+Bluetooth 4.1 Combo
090W000791100
Extending Bracket for half-size mini-card in full-size miniPCIe
0TAW000222000
EM7455 Sierra LTE M.2 Card (Americas and EMEA), CAT 6
0TAW000147000
EM7430 Sierra LTE M.2 Card (Asia Pacific), CAT 6
0TAW000223000
EM7511 Sierra LTE M.2 Card (AT&T for the FirstNet), CAT 12
PSF7184-001
4G Module PGN-300 LTE KIT
PSF7877-001
4G Module PGN-600 LTE KIT
098W000004000
Wall mount Kit (with screws)
098W000006000
Rack mount Kit (with screws)

LEC-2290E User Manual
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Processor System
CPU
Intel® Core™ i7-8700 (Codenamed Coffee Lake)
Frequency
3.2 GHz
Core Number
6 cores
Chipset
C246
Fanless
N/A
Memory
Technology
DDR4 2133/2400 SO-DIMM
Max. Capacity
Up to 32 GB
Socket
2x 260-pin SO-DIMM
Graphic
Processor
Intel® UHD Graphics 630
HDMI
2
Audio
Codec
TSI 92HD73C HD code
Interface
1x for MIC-in, 1x for Line-out
Ethernet
Controller
6x Intel i210iT Ethernet controller
Speed
10/100/1000 Mbps
PoE
4x IEEE 802.3af / IEEE 802.3at (Total PoE Budget of 60W)
Interface
RJ45
Storage
HDD/SSD
2x Removable HDD/SSD External Slot with RAID
mSATA
1x mSATA
I/O
COM
6x D-sub 9, support RS232/422/485
Ethernet
6x RJ45 GbE Ethernet ports
USB
4x USB 3.0 Type A
Audio
1x Mic-in, 1x Line-out
Remote Power Switch
1x 2-pin Remote Power Switch
LED
Power-on status: power on→green, power off →LED off
1x Storage access status: connect→green, disconnect→LED off
1x 3G/LTE access status: programmable LED
1x Wifi access status: programmable LED
LAN LED: 1G→amber, 100MB→green, active→blinking
Button
1x Reset Button, 1x Power-on button
(Red-stand by, Green-Operating)
Display
1x DP max. 4096x2304@60Hz; 2 x HDMI max. 4096x2304@24Hz
Digital I/O
1x Terminal Block Isolation, 8x DI (12V), 8x DO (Sink mode,
12V@100mA)
PoE
4x PoE supporting IEEE802.3af (15.5W),
Single port supporting IEEE802.3at (25.5W),
Max power output of 4x port PoE: 60W
Power Input
1x 4Pin Terminal block (Pin define: -/+/+/-) for 9~30V DC input
(normal 12VDC & 24VDC)
Antenna
4x SMA-type Antenna Hole
Expansion Interface
PCIe
1x PCIe x16 Slot,
1x PCIe x4 Slot,
1x mini-PCIe (PCIe + USB2.0) with Nano-SIM,
1x B key M.2 (PCIe + USB3.0) with Nano-SIM
Watchdog Timer
1-255 Level Time Interval System Reset, Software Programmable
Power
Type
ATX
Connector
1x 4pin terminal block
Supply Voltage
DC 9~30V (-/+/+/-)
Power Consumption (Idle)
29.5W@ +12VDC-IN
Power Consumption (Full Load)
121.6W@ +12VDC-IN

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Environment
Operating Temperature
0°C~40°C
Storage Temperature
-40°C ~70°C
Relative Humidity
10%~90% Non-condensing
Vibration
IEC 60068-2-64, 0.5Grms, random 5~500Hz, 40 mins/axis
Mechanical
Dimension (W x H x D)
275 x115 x 225mm
Weight
6.2 kg
Mounting
Wallmount
OS Support
Microsoft Windows
Windows 10 IoT 64-bit series
Linux
Kernel 3.12 or Above,
Ubuntu 18.10 64bit or Above,
Cent OS 7 or Above,
Fedora 30 64bit or Above
Certification
EMC
FCC/CE Class A (To be acquire by early March 2022)
Safety
UL62368/CB 62368 & 60950 (To be acquire by early March 2022)

LEC-2290E User Manual
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No.
Description
F1
COM Port
3x DB9 Male Connector for RS232/422/485
F2
GbE Port
2x RJ45 port with LED indicators
F3
USB 3.0 Port
4x USB 3.0 Type A
F4
Audio Jack
3.5mm Line-out and Line-in Jack
F5
Remote Switch
1 x 2pin remote power switch
F6
System Status LED
Indicator
F7
Power Button
Power On/Off button with LED Indicator
F8
Reset Button
For software reset
F9
PoE Port
4x PoE Port with LED indicators. Any single port supports IEEE 802.3at 25.4W
under total PoE power budget at 60W.
F10
Storage Bay
2x HDD/SSD Disk Bays (9.5mm height each max.)
F11
DC Input
1x 4 pin terminal block (pin define: -/+/+/-) for 12V DC input (max. 200W)
HDD1
HDD2
PoE1
F5
F6
F9
F2
F1
F4
F3
PoE2
PoE3
PoE4
F7
F11
HDD Status
System Power
Status
WLAN Connection Status
WWAN Connection Status
F8
F10

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No.
Description
R1
DIO
1x 20 pin terminal block 8 DI (12V) & 8 DO (12V,100mA) Isolation
R2
Display Port
1x Display Port
R3
HDMI Port
2x HDMI Port
R4
COM Port
3x DB9 Male Connector for RS232/422/485
R5
DC Input
1x 4-pin terminal block for DC 9~36V system power source
R6
Module Slot
(Antenna Port)
Removable PGN Module Slot supporting Dual SIM and 2x Antenna
Hole with dust cover
R7
PCIE Slot
1x PCIe *16 Slot
R1
R2
R3
R4
R5
R6
R7

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The block diagram indicates how data flows among components on the motherboard. Please refer to the
following figure for your motherboard’s layout design.

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Storage
Expansion
DDR4
DDR4
CPU
M.2
DIMM1
DIMM2
MSATA1
MPCIE1
JNGFF1

LEC-2290E User Manual
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IPMI
BMX
Card
PCIe

LEC-2290E User Manual
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PIN
DESCRIPTION
PIN
DESCRIPTION
1
WAKE#
2
+3.3V
3
RSVD
4
GND
5
RSVD
6
+1.5V
7
CLKREQ#
8
UIM_PWR
9
GND
10
UIM_DATA
11
REFCLK-
12
UIM_CLK
13
REFCLK+
14
UIM_RESET
15
GND
16
UIM_VPP
KEY B
17
RSVD
18
GND
19
RSVD
20
W_DISABLE#
21
GND
22
PERST#
23
PERn0
24
+3.3V
25
PERp0
26
GND
27
GND
28
+1.5V
29
GND
30
SMB_CLK
31
PETn0
32
SMB_DATA
33
PETp0
34
GND
35
GND
36
USB_D+
37
GND
38
USB_D-
39
+3.3V
40
GND
41
+3.3V
42
LED_WWAN#
43
GND
44
LED_WLAN#
45
RSVD
46
LED_WPAN#
47
RSVD
48
+1.5V
49
RSVD
50
GND
51
RSVD
52
+3.3V
57
GND
56
NC
59
ANTCTL0
58
NC
61
ANTCTL1
60
COEX3
63
ANTCTL2
62
COEX2
65
ANTCTL3
64
COEX1
67
PEDET
66
SIM_DET
69
PEDET/CONFIG1
68
SUSCLK
71
GND
70
3V3_AUX
73
GND
72
3V3_AUX
75
CONFIG2
74
3V3_AUX
PIN
DESCRIPTION
PIN
DESCRIPTION
1
CONFIG3
2
3V3_AUX
3
GND
4
3V3_AUX
5
GND
6
CARD PWROFF
7
USB D+
8
W_DIS
9
USB D-
10
DAS/DSS#
11
GND
KEY B
MPCIE

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PIN
DESCRIPTION
PIN
DESCRIPTION
B1
12V
A1
PRSNT1#
B2
12V
A2
12V
B3
12V
A3
12V
B4
GND
A4
GND
B5
SMCLK
A5
JTAG2
B6
SMDAT
A6
JTAG3
B7
GND
A7
JTAG4
B8
3.3V
A8
JTAG5
B9
JTAG1
A9
3.3V
B10
3.3VAUX
A10
3.3V
B11
WAKE#
A11
PERST#
KEY B
B12
RSVD
A12
GND
B13
GND
A13
REFCLKA+
21
CONFIG0
20
AUDIO_0
23
NC
22
AUDIO_1
25
NC
24
AUDIO_2
27
GND
26
AUDIO_3
29
PERn1/USB3RX-
28
UIM_RFU
31
PERp1/USB3RX+
30
UIM_RESET
33
GND
32
UIM_CLK
35
PETn1/USB3TX-
24
UIM_DATA
37
PETp1/USB3TX+
36
UIM_PWR
39
GND
38
DEVSLP
41
PETn0/SATA_B+
40
GNSS0
43
PETp0/SATA_B-
42
GNSS1
45
GND
44
GNSS2
47
PERn0/SATA_A-
46
GNSS3
49
PERp0/SATA_A+
48
GNSS4
51
GND
50
PRESET#
53
REFCLK-
52
CLKREQ#
55
REFCLK+
54
WALE#
57
GND
56
NC
59
ANTCTL0
58
NC
61
ANTCTL1
60
COEX3
63
ANTCTL2
62
COEX2
65
ANTCTL3
64
COEX1
67
PEDET
66
SIM_DET
69
PEDET/CONFIG1
68
SUSCLK
71
GND
70
3V3_AUX
73
GND
72
3V3_AUX
75
CONFIG2
74
3V3_AUX

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B14
HSOP0
A14
REFCLKA-
B15
HSON0
A15
GND
B16
GND
A16
HSIP0
B17
PRSNT2#
A17
HSIN0
B18
GND
A18
GND
B19
HSOP1
A19
RSVD
B20
HSON1
A20
GND
B21
GND
A21
HSIP1
B22
GND
A22
HSIN1
B23
HSOP2
A23
GND
B24
HSON2
A24
GND
B25
GND
A25
HSIP2
B26
GND
A26
HSIN2
B27
HSOP3
A27
GND
B28
HSON3
A28
GND
B29
GND
A29
HSIP3
B30
RSVD
A30
HSIN3
B31
PRSNT2#
A31
GND
B32
GND
A32
RSVD(REFCLKB+)
B33
HSOP4
A33
RSVD(REFCLKB-)
B34
HSON4
A34
GND
B35
GND
A35
HSIP4
B36
GND
A36
HSIN4
B37
HSOP5
A37
GND
B38
HSON5
A38
GND
B39
GND
A39
HSIP5
B40
GND
A40
HSIN5
B41
HSOP6
A41
GND
B42
HSON6
A42
GND
B43
GND
A43
HSIP6
B44
GND
A44
HSIN6
B45
HSOP7
A45
GND
B46
HSON7
A46
GND
B47
GND
A47
HSIP7
B48
PRSNT2#
A48
HSIN7
B49
GND
A49
GND
B50
HSOP8
A50
RSVD

LEC-2290E User Manual
20
B51
HSON8
A51
GND
B52
GND
A52
HSIP8
B53
GND
A53
HSIN8
B54
HSOP9
A54
GND
B55
HSON9
A55
GND
B56
GND
A56
HSIP9
B57
GND
A57
HSIN9
B58
HSOP10
A58
GND
B59
HSON10
A59
GND
B60
GND
A60
HSIP10
B61
GND
A61
HSIN10
B62
HSOP11
A62
GND
B63
HSON11
A63
GND
B64
GND
A64
HSIP11
B65
GND
A65
HSIN11
B66
HSOP12
A66
GND
B67
HSON12
A67
GND
B68
GND
A68
HSIP12
B69
GND
A69
HSIN12
B70
HSOP13
A70
GND
B71
HSON13
A71
GND
B72
GND
A72
HSIP13
B73
GND
A73
HSIN13
B74
HSOP14
A74
GND
B75
HSON14
A75
GND
B76
GND
A76
HSIP14
B77
GND
A77
HSIN14
B78
HSOP15
A78
GND
B79
HSON15
A79
GND
B80
GND
A80
HSIP15
B81
PRSNT2#
A81
HSIN15
B82
RSVD(CARD_DET#)
A82
GND