Lanner LEC-7230 User manual

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Embedded &
Industrial Computing
Hardware Platforms for Embedded and Industrial Computing
LEC-7230
V1.2
User's Manual
Release date: 2016/10/31

Overview
Icon Descriptions
The icons are used in the manual to serve as an
indication of interest topics or important messages.
Below is a description of these icons:
NOTE: This check mark indicates
that there is a note of interest and is
something that you should pay special
attention to while using the product.
WARNING: This exclamation point
indicates that there is a caution or
warning and it is something that could
damage your property or product.
Online Resources
The listed websites are links to the on-line product
information and technical support.
Resource Website
Lanner http://www.lannerinc.com
Product Resources http://www.lannerinc.com/
download-center/
RMA http://eRMA.lannerinc.com
Copyright and Trademarks
This document is copyrighted, © 2014. All rights are
reserved. The original manufacturer reserves the right to
make improvements to the products described in this
manual at any time without notice.
No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual
is intended to be accurate and reliable. However, the
original manufacturer assumes no responsibility for its
use, nor for any infringements upon the rights of third
parties that may result from such use.
Acknowledgement
Intel, Pentium and Celeron are registered trademarks of
Intel Corp.
Microsoft Windows and MS-DOS are registered
trademarks of Microsoft Corp.
All other product names or trademarks are properties of
their respective owners.
Compliances and Certification
CE Certication
This product has passed the CE test for environmental
specifications. Test conditions for passing included
the equipment being operated within an industrial
enclosure. In order to protect the product from being
damaged by ESD (Electrostatic Discharge) and EMI
leakage, we strongly recommend the use of CE-
compliant industrial enclosure products.
FCC Class A Certication
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference when the equipment is operated in a
commercial environment. This equipment generates,
uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction
manual, may cause harmful interference to radio
communications. Operation of this equipment in a
residential area is likely to cause harmful interference
in which case the user will be required to correct the
interference at his own expense.
Revision History
Version Date Descriptions
1.0 2014/05/12 Ocial release
1.1 2016/09/01 -Modify the Appendices for new
Lanner GPIO driver installation
-Add the Hardware Installation
chapter
1.2 2016/10/31 Modied memory specications

EMC Notice
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case users will be required
to correct the interference at their own expense.
Safety Guidelines
Follow these guidelines to ensure general safety:
• Keep the chassis area clear and dust-free before,
during and after installation.
• Do not wear loose clothing or jewelry that could get
caught in the chassis. Fasten your tie or scarf and roll
up your sleeves.
• Wear safety glasses/goggles if you are working
under any conditions that might be hazardous to
your eyes.
• Do not perform any action that creates a potential
hazard to people or makes the equipment unsafe.
• Disconnect all power by turning off the power and
unplugging the power cord before installing or
removing a chassis or working near power supplies
• Do not work alone if potentially hazardous
conditions exist.
• Never assume that power is disconnected from a
circuit; always check the circuit.
LITHIUM BATTERY CAUTION:
Risk of explosion could occur if battery is replaced by an
incorrect type. Please dispose of used batteries according
to the recycling instructions of your country.
• Installation only by a trained electrician or only by an
electrically trained person who knows all the applied
or related installation and device specifications..
• Do not carry the handle of power supplies when
moving to other place.
• The machine can only be used in a fixed location
such as labs or computer facilities.
Operating Safety
• Electrical equipment generates heat. Ambient air
temperature may not be adequate to cool equipment to
acceptable operating temperatures without adequate
circulation. Be sure that the room in which you choose to
operate your system has adequate air circulation.
• Ensure that the chassis cover is secure. The chassis design
allows cooling air to circulate effectively. An open chassis
permits air leaks, which may interrupt and redirect the flow
of cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and
impair electrical circuitry. ESD damage occurs when electronic
components are improperly handled and can result in complete
or intermittent failures. Be sure to follow ESD-prevention
procedures when removing and replacing components to avoid
these problems.
• Wear an ESD-preventive wrist strap, ensuring that it makes
good skin contact. If no wrist strap is available, ground
yourself by touching the metal part of the chassis.
• Periodically check the resistance value of the antistatic
strap, which should be between 1 and 10 megohms
(Mohms).
Rack Mounting Installation Environment Precaution
1. Elevated Operating Ambient - If installed in a closed
or multi-unit rack assembly, the operating ambient
temperature of the rack environment may be greater than
room ambient. Therefore, consideration should be given
to installing the equipment in an environment compatible
with the maximum ambient temperature (Tma) specified
by the manufacturer.
2. Reduced Air Flow - Installation of the equipment in a rack
should be such that the amount of air flow required for
safe operation of the equipment is not compromised.
Mechanical Loading - Mounting of the equipment in the
rack should be such that a hazardous condition is not
created due to uneven mechanical loading.
3. Mechanical Loading - Mounting of the equipment in the
rack should be such that a hazardous condition is not
achieved due to uneven mechanical loading.
4. Circuit Overloading - Consideration should be given to
the connection of the equipment to the supply circuit and
the effect that overloading of the circuits might have on
over-current protection and supply wiring. Appropriate
consideration of equipment nameplate ratings should be
used when addressing this concern.
5. Reliable Earthing - Reliable earthing of rack-mounted
equipment should be maintained. Particular attention
should be given to supply connections other than direct
connections to the branch circuit (e.g. use of power strips).”

Table of Contents
Chapter 1: Introduction 5
System Specifications 5
Package Contents 6
Standard Accessories 6
Optional Power Cords 6
Optional Mounting Kit 6
Optional Accessories 6
Chapter 2: System Components 7
System Drawing 7
Block Diagram 8
Front Components 9
Rear Components 10
Chapter 3: Motherboard Layout 11
Connectors and Jumpers List 13
Jumper and Connectors 14
Chapter 4: Hardware Setup 18
Preparing the Hardware Installation 18
Installing the System Memory 18
Installing the Wireless Module 19
Installing the 3G SIM Card 19
Installing the Disk Drive 19
Installing CompactFlash Card 20
Appendix A: Programming Watchdog Timer 21
Appendix B: Digital Input/Output Control on the GPIO port 22
Appendix C: Terms and Conditions 24

Chapter 1:
Introduction
Thank you for choosing the LEC-7230. The LEC-7230
features Intel Celeron J1900/N2930/E3825/E3845
processor. The system supports dual LAN as well as HDMI
and VGA connectors for high demand of networking and
multimedia applications. In addition, its fanless design
reduces maintenance effort and attributes its longevity.
The following highlight the features of the LEC-7230
system:
•Dual HDMI and VGA video output powered by Intel®
HD Graphics
•Dual 10/100/1000 Mbps LAN ports
•3 x USB ports (1 x USB 3.0 port and 2 x USB 2.0 port)
•Digital I/O connector
•Support 2.5" SATA HDD/SSD storage
•2 x RS-232/422/485 serial COM ports supporting
hardware control via DB9 connectors
•Power-on switch through the Phoenix connector for
distant power-on/off control
•Audio input and output through Mic-in and Line-out
jack
•Fanless design
•Integrated SIM card reader
•Dustproof
•Wide operating temperature from -20-55°C
System Specifications
Processor Options Intel® Celeron® J1900/N2930/
E3825/E3845 CPU
BIOS AMI SPI Flash BIOS
System
Memory
1 x SO-DIMM socket for up to
1066/1333 8GB DDR3L SDRAM
for Intel Celeron J1900/N2930/
E3845 CPU
1 x SO-DIMM socket for up to
1066/1333 4GB DDR3L SDRAM
for Intel Celeron E3825
USB 1 x USB 3.0 port
2 x USB 2.0 Type-A ports
Super I/O 1x LPC Super I/O Fintek F81865F
Expansion Bus Mini-PCIe x 1, with SIM card
reader
DIO 2 x DI or 2 x DO with +5V TTL
Level
OS Support Microsoft Embedded Windows 8
Storage HDD/SSD Support 1 x 2.5” HDD/SSD drive bay
CF 1 x CompactFlash card slot
Networking
LAN 2 x 10/100/1000Mbps,
Autosensing,RJ-45
Controller Intel i210 x 2
Display
Graphics Controller Intel®Integrated Graphics Media
Accelerator
Display Interface VGA x 1 (1600x1200@60 24bpp),
HDMI x1 (1920x1080)
Audio
Codec Audio Codec ALC-886 HD Audio,
Low Power Audio
Output
1x green phone-jack connector for
audio line-out
1x pink phone-jack connector for
audio mic-in
LEDs Power, HDD active, 3G active (if 3G
mini-card inserted)
Physical
Characteristics
Housing Aluminum
Dimensions (WxHxD) 198.0 x 144.8 x 48.0, unit: mm
Mounting Options Rack, VESA, DIN-rail and Wall
mount
Environment
Operating Temperature
-20~55°C (PCBA needs thermal
solution on heat-sink or cased
design;)
Ambient Relative Humid-
ity (non-condensing) 5 to 95% (non-condensing)
Power Input Voltage +12 V +/- 5% DC
Connector DC jack with lock
Standard and
Regulation
EMC CE/FCC
Green Product RoHs
Reliability
Alter tool Built-in buzzer and RTC (real-time
clock) with battery lithium backup
Automatic Reboot Trigger
Watchdog Timer 256 level time
interval system reset, software
programmable

Package Contents
Your package contains the following items:
•LEC-7230 Fanless Embedded System
•Power adapter (P/N: 0P0W060122002)
•Drivers and User’s Manual CD : S09OADA64H110
•2-pin Terminal Block (P/N: 04AW20023Z101)
•6-pin Terminal Block (P/N: 04AW20061Z101)
Standard Accessories
Optional Power Cords
Optional Mounting Kit
Optional Accessories
0P0W060122002 AC Power Adapter 60W 12V/5A, 2.5mm DC Jack with
lock
080W1N0002001 SATA SSD/HDD cable w/ power
080W240318306 US Power Cord
080W240318305 Schuko (EU) Power Cord
080W240318301 UK Power Cord
080W240318307 China Power Cord
080W240318309 Japan Power Cord
098W000004000 Wall Mount
098W000009000 VESA Mount
098W000006000 Rack Mount
098W000007000 DIN Rail Mount
0TAW000026000 Wi-Fi module WPEA-152GN(BT) 802.11b/g/n Mini PCIe
module
080W1Q0001501 Antenna Internal Wi-Fi Antenna Cable
0TZW000000039 Antenna SMA Antenna, male jack / female plug
080W0Q0000501 Antenna Internal Antenna cable for 3G//GPS
module
0TZW000000072 Antenna 3G Module External Antenna

Chapter 2:
System Components
System Drawing
Mechanical dimensions of the LEC-7230
Unit: mm

Block Diagram

Component Description
F1 Reset Reset switch
F2 MIC IN/LINE OUT Connect the audio devices to these ports. The
Microphone and line out port are provided by
Realtek ALC 886-GR.
F3 USB 3.0 Port An USB 3.0 type A connector.
F4 Four USB 2.0 Ports Double-stacked USB 2.0 type A connectors
Two additional USB 2.0 ports by LEK-IOA11. add-
on board
F5 Two 10/100/1000Mbps LAN ports Two RJ-45 (network) jacks with LED indicators are
as described below.
LINK/ACT (Yellow)
• On/Flashing: The port is linking and active in
data transmission.
• Off: The port is not linking.
SPEED (Green/Yellow)
• Yellow: The connection speed is 1000Mbps.
• Green: The connection speed is 100Mbps
• Off: The connection speed is 10Mbps.
F6 HDD (Yellow)
3G Status (Green) and
Power LED (Green)
HDD
• Blinking: data access activities
• Off: no data access activities
3G Status
• Blinking: 3G transmission activities
• On: 3G expansion card exists
• Off: no 3G expansion card present
Power
• On: The computer is on.
• Off: The computer is off .
F7 Power-on Switch A power-on switch through the Phoenix
contact for distant power-on/off control
F8 Power Button with dual LED ATX Power-on button with LEDs: Standby
mode in Red; Power-on mode in Green
Front Components
SPEED
LINK/ACT
F3
F1 F2 F5
F6
F4 F7
F8

Rear Components
R1 R2
Component Description
R1 HDMI The HDMI (High-Denition Multimedia Interface).
This port can support up to 1920x1080 resolution.
R2 VGA Port The displays can support VGA up to 1600x1200
resolution.
R3 DIO Digital Input/Output Connector 2 DI and DO
connections
R4 COM The serial port consists of a 9-pin, RS232/422/485
configured with automatic hardware flow control
D-SUB connector that allows the connection of a
serial peripheral. To switch among RS232/422/485,
use the BIOS menu.
R5 Power Adapter Socket DC-in 12V. Only use the power adapter supplied
with the LEC-7230-CT1 System
R3
R4
R5
WARNING: Improper installation can cause injury or property damage.
For proper and safe operation use in eld site with AC Power, please follow these
instructions:
1. Securely plugged and locked the DC-Jack to the machine
2. Connect the AC adapter power cord into a standard 110v/220v AC outlet

Chapter 3:
Motherboard Layout


Connectors and Jumpers List
The tables below list the function of each of the board
jumpers and connectors by labels shown in the above
section. The next section in this chapter gives pin
definitions and instructions on setting jumpers.
Table 3.1 Connector List for LEB-7230 Board
Labels Function Notes
COM1/COM2 RS232 Serial Ports COM1 and COM2
HDMI1 High-Denition Multimedia Interface Port
JCMOS1 Clear CMOS Jumper
JKBMS1 PS/2 Keyboard & Mouse Connector
JLPC1 Low-pin Count Interface
JRI1/2 COM1/COM2 Pin 9 Signal Selection
JSPI1 SPI ROM Interface (for debug use only)
MPCIE1 Mini-PCIe Connectors (with SIM1)
SATA1 Serial-ATA Connector (SATA1)
SATAPWR1 SATA HDD Power Connector
SIM1 SIM Card Reader
USB1 USB 2.0 Type A Dual Port
USB2 USB 3.0 Type A Port
VGA1 VGA Connector
CF1 CompactFlash Connector
DIO1 Digital Input/Output
PSBTN2 Power Button with Phoenix Connector
JCOM1/2 RS232 Pin Headers

Select COM1/COM2 Pin 9 Function (JRI1/JRI2): The
pin 9 of COM1 and COM2 can be altered by JRI1 and JRI2
respectively according to the following jumper settings.
Default
+5V
+12V
Jumper Setting
Function
SW1/SW4
RI# (default) 1-2
+5V 3-4
+12V 5-6
Jumper and Connectors
RS-232/422/485 Serial Port (COM1 and COM2): It is
an RS-232/422/485 port with automatic hardware flow
control through a D-SUB9 connector.
Note: To switch among RS-232, 422, 485
communication protocols, use the BIOS menu.
Pin No. Signal
RS-232
1 Data Carrier Detect ( DCD # )
2 Receive Data ( RXD )
3 Transmit Data ( TXD )
4 Data Terminal Ready ( DTR # )
5 Ground ( GND )
6 Data Set Ready ( DSR # )
7 Request To Send ( RTS # )
8 Clear To Send ( CTS # )
9 Ring Indicator ( RI # )
JRI1: COM1 JRI2: COM2
6789
12345
5
3
1
6
4
2
1 3 5
2 4 6
2 4 6
5
3
1
6
4
2
5
3
1
6
4
2
2 4 6
1 3 5
Pin No. Signal
RS-422
1 TXD-
2 TXD+
3 RXD+
4 RXD-
5 GND
Pin No. Signal
RS-485
1 DATA-
2 DATA+
3
4
5 GND

Clear CMOS jumper (JCMOS1): It is for clearing the
CMOS settings.
VGA (VGA1)
Pin Signal Pin Signal Pin Signal
1 Red Color
Signal
6 GND 11 NC
2 Green Color
Signal
7 GND 12 DDC DATA
3 Blue Color
Signal
8 GND 13 HSYNC
4 Reserved 9 +5V 14 VSYNC
5 GND 10 GND 15 DDC CLK
HDMI Connector (HDMI1): High-Definition Multimedia
Interface Connector
Pin Signal Pin Signal
1 DATA2+ 2 GND
3 DATA2- 4 DATA1+
5 GND 6 DATA1-
7 DATA0+ 8 GND
9 DATA0- 10 CLK+
11 GND 12 CLK-
13 N.C 14 N.C
15 DDC CLK 16 DDC DAT
17 GND 18 HDMI_VCC
19 HPD
Serial-ATA Connector (SATA1): It is for connecting a 2.5’’
harddisk to serve as your system’s storage. It can support
SATA II which features Data transfer rates up to 3.0 Gb/s
(300 MB/s).
4-pin Serial-ATA Power Connector (SATAPWR1): It is
for connecting the SATA power cord.
Dual USB 2.0 Port (USB1):
USB 3.0 Port (USB2)
Pin No. Signal
1-2 Normal (Default)
2-3 Clear CMOS
1
2
3
Pin No. Signal
1 12V
2 GND
3 GND
4 +5V
1 2 3 4 5
11 12 13 14 15
19 1
18 2
Pin No. Signal
1 GND
2 TX0_P
3 TX0_N
4 GND
5 RX0_N
6 RX0_P
7 GND
SATA1
7
6
5
4
3
2
1
Pin No. Signal
1 +5V
2 DATA-
3 DATA+
4 GND
5 SSRX-
6 SSRX+
7 GND
8 SSTX-
9 SSTX+
1 2 3 4
5 6 7 8
1 2 3 4

PS/2 Keyboard and Mouse Connector (JKBMS1)
Pin NO. Description Pin NO. Description
1 VCC 2 MSCLK
3 MSDATA 4 KEY
5 KBDATA 6 KEY
7 GND 8 KBCLK
SIM Card Reader (SIM1)
Pin NO. Signal Pin NO. Signal
C1 UIM_PWR C5 GND
C2 UIM_RST# C6 UIM_VPP
C3 UIM_CLK C7 UIM_DATA
Mini PCI Express Connector (for 3G card with PCI Express 1X
and USB 2.0 signals and a SIM card reader, MPCIE1):
PIN Signal PIN Signal
1 WAKE# 2 +3.3Vaux
3 COEX1 4 GND
5 COEX2 6 +1.5V
7 CLKREQ# 8 UIM_PWR
9 GND 10 UIM_DATA
11 REFCLK- 12 UIM_CLK
13 REFCLK+ 14 UIM_RESET
15 GND 16 UIM_VPP
Key
17 RSVD 18 GND
19 RSVD 20 W_DISABLE#
21 GND 22 PERST#
23 PERn0 24 +3.3Vaux
25 PERp0 26 GND
27 GND 28 +1.5V
29 GND 30 SMB_CLK
31 PETn0 32 SMB_DATA
33 PETp0 34 GND
35 GND 36 USB_D-
37 GND 38 USB_D+
39 +3.3Vaux 40 GND
41 +3.3Vaux 42 LED_WWAN#
43 GND 44 LED_WLAN#
45 RSVD 46 LED_WPAN#
47 RSVD 48 +1.5V
49 RSVD 50 GND
51 RSVD 52 +3.3Vaux
2
4
6
8
1
3
5
7
C1
C3
C5
C7

Digital Input/Output Connector (DIO1)
CompactFlash (CF1)
SIM Card Reader (SIM1)

Chapter 4:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from
the server. The power switch button does not
completely shut off system power. Portions of
the power supply and some internal circuitry
remain active until power is removed.
1. Unpower the LEC-7230 and remove the power cord.
2. Turn the device upside down.
3. Unscrew the 4 rubber feet from the bottom cover.
4. Open the cover.
Installing the System Memory
The motherboard supports DDR3L memory to meet the
higher bandwidth requirements of the latest operating
system and Internet applications. It comes with one Low-
Voltage Double Data Rate Three (DDR3L) Small Outline
Dual Inline Memory Module (SO-DIMM) socket.
1. Align the memory module’s key with the SO-DIMM
socket’s notch.
2. Install the SO-DIMM.
Note:
The system can support memory of DDR3L SO-
DIMM up to 4/8 GB depending on the CPU SKU.

Installing the Wireless Module
1. Align the wireless module’s key with the Mini-PCIe
slot notch.
2. Insert the wireless module into the connector
diagonally.
3. Fix the wireless module with the screws.
Installing the 3G SIM Card
1. Unlock the SIM card reader first by sliding it outward.
2. Flip the SIM card reader diagonally.
3. Put the SIM card into the reader. The angled corner of
the SIM ensures that the card fits only the correct way
in the reader. Make sure the ICs will be in contact with
the SIM card reader.
4. Close the tray. You should feel a click when the SIM
card is locked securely in the SIM card reader.
Note: To remove the SIM card, push
the card outward to unlock it.
Installing the Disk Drive
The system can accommodate one Serial-ATA disk drive.
Follow these steps to install a hard disk into the system:
1. Align the mounting holes of the HDD/SSD and
that on the LEC-7230 systems as illustrated in the
following picture. Fix the hard disk on the system by
attaching the screws through the back cover from the
outside.
2. Plug the Serial-ATA cable to the disk.
3. Connect the Serial-ATA power and data disk cables to
the Serial-ATA power and disk connectors on the main
board respectively.

Installing CompactFlash Card
LEC-7230 provides one CompactFlash slot. Follow the
procedures below for installing a CompactFlash card.
1. Align CompactFlash card and the card slot with the
arrow pointing toward the connector.
2. Push the card to insert into the connector.
Notes about installing Windows 7 on CF Card
1. Press DEL to entry BIOS, the default setting of SATA
mode is “AHCI Mode”
2. Since we are installing Windows 7 operating system on
a CompactFlash card, which is ATA-based, please change
the “SATA Mode” from “AHCI Mode” to “IDE Mode”.
(BIOS -> Advanced -> IDE Conguration -> SATA Mode).
3. When the conguration is done, select “Save & Exit”
setup screen.
4. Press <Enter> on “Save Changes and Exit”. The pop-up
message will ask “Save conguration & exit” and choose
“Yes”. The system will reboot itself afterwards and the
setup is completed.
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