Lattice Semiconductor iCE40 UltraLite User manual

December 2014
EB96_1.0
iCE40 UltraLite™ Breakout Board
User Guide

2
iCE40 UltraLite Breakout Board
Introduction
Thank you for choosing the Lattice iCE40 UltraLite™ Breakout Board.
This guide describes how to begin using the iCE40 UltraLite Breakout Board, an easy-to-use platform for demon-
strating the high-current LED drive capabilities of the iCE40 UltraLite FPGA. Along with the evaluation board and
accessories, this kit includes the pre-loaded LED Driver Demo that demonstrates driving the RBG LEDs with a
PWM circuit. In addition, most of the device’s I/O balls are accessible via one of the several header locations on the
board, facilitating rapid prototyping of user functions.
The contents of this user’s guide include demo operation, top-level functional descriptions of the various portions of
the evaluation board, descriptions of the on-board connectors, jumpers, a complete set of schematics and the bill of
material for the iCE40 UltraLite Breakout Board.
Note: Static electricity can severely shorten the lifespan of electronic components. Be careful when handling the
iCE40 UltraLite Breakout Board as to not damage it from ESD.
Features
The iCE40 UltraLite Breakout Board includes:
•iCE40 UltraLite Breakout Board – The iCE40 UltraLite Breakout Board features the following on-board compo-
nents and circuits:
— iCE40 UltraLite (iCE40UL1K-CM36A) device in a 36-ball WLCSP package.
— Example of a board using this 0.35-pitch WLCSP package.
— High-current LED output
— Infrared transmit
— iCE40 UltraLite Current Measurements
— Standard USB cable for device programming
— RoHS-compliant packaging and process
•Pre-loaded Demo – The kit includes a pre-loaded demo to control the onboard RGB LED in conjunction with a
software run GUI.
•USB Connector Cable – A mini B USB port provides power, a programming interface and communication for the
software RGB LED GUI to the iCE40 UltraLite SPI port.

3
iCE40 UltraLite Breakout Board
Figure 1 shows the top side of the iCE40 UltraLite Breakout Board indicating the specific features that are designed
on the board.
Figure 1. iCE40 UltraLite Breakout Board (Top Side)
iCE40 UltraLite Device
The board features an iCE40UL1K FPGA with a 1.2 V core supply. The device is packaged in a 36-ball WLCSP. For
a complete description of this device, see DS1050, iCE40 UltraLite Family Data Sheet.
Software Requirements
You should install the following software before you begin developing designs for the board:
• iCEcube2 2014.04 (or higher)
• Diamond Programmer 3.3 (or higher)
These software are available at the Lattice website Design Software & IP page. Make sure you log in to www.lattic-
esemi.com, otherwise these software downloads will not be visible. It is also recommended to download the RGB
LED software GUI which interfaces with the iCE40 UltraLite Breakout Board. This GUI allows you to control the
RGB LED for color, brightness, blinking and breathing. Download the PC or MAC version of the GUI at www.lattic-
esemi.com.
iCE40UL1K-
CM36A (U1)
Barcode LED,
Red (D8) Power LED,
Green (D9)
FTDI USB to
UART/FIFO IC (U7)
Torch LED
(D7)
Infra-Red LED
(D6)
USB Mini-B
Socket (J17)
RGB LED
(U2)

4
iCE40 UltraLite Breakout Board
Demonstration Design Jumpers
Lattice provides the RGB LED Driver Demo design programmed in the board. The RGB LED Driver Demo used in
conjunction with the software GUI illustrates the use of a PWM driver controlling the LEDs on the board. Below is a
description of the control jumpers for each LED.
• The RGB LED (U2) will transition colors
— J3 can be used to probe RGB LED (Default shunted). If you remove J3, the RGB LED will not light up.
• The IR LED (D6) is controlled when a jumper is placed across J4 pins 1-2
• The HP Torch LED (D7) is controlled when a jumper is placed across J4 pins 2-3
• The BARCODE LED (D8) is under FPGA control when a jumper is placed across J5 pins 2-3
— The IRLED FPGA output is 400 mA. This can be combined with 100 mA BARCODE FPGA output for a total
of 500 mA of drive current. This is performed when a jumper is placed across J5 pins 1-2. 
Note: This capability is not supported in the Demonstration Design
Figure 2 shows the default jumper locations.
Figure 2. Default Jumper Locations
J16– Enable
12 MHz clock
J4–Selects
HP LED device
(IR or Torch)
J2– Enable
DONE LED
J15– Program
SPI Flash or
iCE40UL
J3
–RGB
Shunts
J5– Selects
Barcode output
(HP LED or D8)
J14–Isolate
SPI Flash
CSn

5
iCE40 UltraLite Breakout Board
Clock Sources
The board has a single 12 MHz clock source. The 12 MHz clock drives both the FTDI USB interface device, and the
iCE40UL1K device. The iCE40UL1K device can be disconnected from the 12 MHz oscillator using J16. This is nec-
essary, for example, when iCE40 Ultra Lite device ball D2 is mistakenly programmed as an output and prevents the
FTDI USB interface from operating.
Board Power
The board provides the following power features:
•BoardPower
— Board power is derived from the USB connection.
— D9 Green LED indicates Board Power
• iCE40 UltraLite VCC
— Onboard 1.2 V supply
— ICC can be measured across the series resistor R4 (1 Ohm) at test points +1.2 V and VCC
• iCE40 UltraLite VCCIO
— Onboard 3.3 V supply
— ICC0 can be measured across the series resistor R2 (1Ohm) at test points TP4 and VCCIO0
— ICC1 can be measured across the series resistor R3 (1Ohm) at test points TP9 and VCCIO1
— ICC2 can be measured across the series resistor R5 (1Ohm) at test points TP6 and VCCIO2
Board Configuration and Programming
The board allows for programming of the iCE40 UltraLite or the SPI Flash:
• SPI Flash Programming J15 shunt pins 1-3 and 2-4 (Default shunted)
— U5 Micron Technology Inc part number N25Q032A13ESC40F
• iCE40 Ultra Configuration or Programming J15 shunt pins 1-2 and 3-4
— U1 iCE40UL1K-CM36A
• CRESETB can be asserted by pushing SW1
— Can be probed with J1
•DONELEDD2
— Can be probed with J2 (default shunted)
Details of the iCE40 UltraLite Board for use in programming are shown in Figure 3.

6
iCE40 UltraLite Breakout Board
Figure 3. Configuration and Programming Details
CRESETB
Push-Button
U5-Micron
N25Q032A13ESC40F
iCE40UL1K-
CM36A (U1)
USB Mini-B
Socket (J17)
J15–Program
SPI Flash or
iCE40UL
J14–Isolate
SPI Flash
CSn
J1– CRESETB
Probe
D2–DONE
LED (Green)

7
iCE40 UltraLite Breakout Board
Headers and Test Connections
The board features a number of headers and test connections which provide access to the iCE40 Ultra-Lite I/Os,
as shown in Figure 4, Figure 5 and Figure 6 below:
Figure 4. J6 Header ‘A’ Breakouts
Figure 5. J7 Header ‘B’ Breakouts
20 19
GND GND
A2 (RGB0) F5 (CSN)
GND GND
B1 (RGB1) E6 (SCK)
GND F6 (SO)
A1 (RBG2) E5 (SI)
HP3.3 V GND
A6 (IRLED) nc
A5 (BARCODE) nc
+3.3 V nc
21
J6
Header 'A'
J7
Header 'B'
20 19
GND GND
D6 C6
GND F3
C2 F2
A3 E2
B2 C1
B6 D1
A4 E1
B5 F1
+3.3 V +3.3 V
21

8
iCE40 UltraLite Breakout Board
Figure 6. J9 Aardvark and J8 PMOD Connector
12
nc GND
nc nc
FLASH_MISO nc
ICE_SCK FLASH_MOSI
ICE_CSN GND
910
12 11
+3.3 V +3.3 V
GND GND
B2 C1
B6 D1
A4 E1
B5 F1
21
J9
Aardvark
J8
PMOD

9
iCE40 UltraLite Breakout Board
RGB LED Demonstration Design and Software GUI
The iCE40 UltraLite Breakout Board can demonstrate a complete controller for an RGB LED. These are the steps
necessary to run the demonstration.
1. Ensure that the RGB LED GUI is installed.
2. Make sure the jumpers on J15 are both in the horizontal position. This is the default pins 1-3 and 2-4 shorted
together.
Figure 7. SPI Flash Selection (Horizontal) for J15
3. Connect the iCE40 UltraLite breakout board via the USB cable to a PC or MAC.

10
iCE40 UltraLite Breakout Board
4. After the iCE40 UltraLite device has initialized and the RGB LED is illuminated RED, change the J15 jumper
positions to vertical, shorting pins 1-2 and 3-4. This is required to allow the USB port to communicate with the
iCE40 UltraLite device.
Figure 8. iCE Selection (Vertical) for J15
5. Start the RGB GUI on the PC or MAC.
Figure 9. iCE40 UltraLite LED Demonstration Interface
Now you can control the RGB LED on the iCE40 UltraLite Breakout Board. You can set the color, brightness, blink-
ing rate as well as breathing.

11
iCE40 UltraLite Breakout Board
GUI Serial Communication Interface
LED Control via SPI
The Software GUI demonstration program communicates with the iCE40 UltraLite device using a SPI serial com-
munication channel. The SPI interface (mode 0) control link is implemented using a simple write-only protocol (see
Figure 10).
Figure 10. SPI Physical Transaction
SPI Protocol
Data on the MOSI serial line is transmitted MSB first.
Addr[7:0] – Controls which of the 16 bits are updated with REG data.
Note: Unspecified REG bits must be written, but are ignored.
REG[15:0] – Consists of four control fields.
Addr Bits Written Bit Position
0x13 REG[3:0] ------------dddd
0x14 REG[7:4] --------cccc----
0x15 REG[11:8] ----bbbb--------
0x16 REG[15:12] aaaa------------
0x19 REG[15:0] aaaabbbbccccdddd
Field Bit Positions Function
aaaa REG[15:12] RGB Color[3:0]
bbbb REG[11:8] Brightness[3:0]
cccc REG[7:4] Breathe Ramp [3:0]
dddd REG[3:0] Blink Rate [3:0]
ADDR REG [15:8] REG [7:0]
CSn
SCK
MOSI
[7:0]

12
iCE40 UltraLite Breakout Board
Register Definitions
Default setting (hardware, software) is denoted by (*).
RGB Color[3:0] Color Color Code
0000* Red #FF0000
0001 Orange #FF7F00
0010 Yellow #FFFF00
0011 Chartreuse #7FFF00
0100 Green #00FF00
0101 Spring Green #00FF7F
0110 Cyan #00FFFF
0111 Azure #007FFF
1000 Blue #0000FF
1001 Violet #7F00FF
1010 Magenta #FF00FF
1011 Rose #FF007F
1100 —
1101 —
1110 —
1111 White #FFFFFF
Brightness[3:0] Level (%)
0000 6.25(dim)
0001 12.5
0010 18.75
0011 25
0100 31.25
0101 37.5
0110 43.75
0111* 50
1000 56.25
1001 62.5
1010 68.75
1011 75
1100 81.25
1101 87.5
1110 93.75
1111 100 (bright)

13
iCE40 UltraLite Breakout Board
Breathe Ramp [3:0] Factor
0000* .0x (fast)
0001 .063x
0010 .125x
0011 .25x
0100 .5x
0101 1x
0110 2x
0111 4x (slow)
1000 —
1001 —
1010 —
1011 —
1100 —
1101 —
1110 —
1111 —
Blink Rate [3:0] Off Time (s)1
0000 Always On
0001 1/16 (fast)
0010 1/8
0011 1/4
0100 1/2
0101* 1
0110 2
0111 4
1000 Always Off
1001 —
1010 —
1011 —
1100 —
1101 —
1110 —
1111 —
1. By default, the LED "On-Time" is fixed at approximately one second.

14
iCE40 UltraLite Breakout Board
Ordering Information
Description Ordering Part Number
China RoHS Environment-
Friendly Use Period (EFUP)
iCE40 UltraLite Breakout Board ICE40UL1K-B-EVN
Technical Support Assistance
e-mail: [e-mail]
Internet: www.latticesemi.com
Revision History
© 2014 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as
listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of
their respective holders. The specifications and information herein are subject to change without notice.
Date Version Change Summary
December 2014 1.0 Initial release.

15
iCE40 UltraLite Breakout Board
Appendix A. Schematic Diagrams
Figure 11. System Diagram
5
5
4 4
3
3
2
2
1
1
DD
C C B B A A
iCE40UL1LCM36A
P.3
LEDS
P.4
HEADER A
HEADER B & PMOD
AARDVARK CONNECTOR
SPI Flash
USB FTDI
Board Power
BANK 0 - LEDS
BANK 2 - IO
BANK 0 - IO
BANK 1 - SPI / IO
P.9 P. 5
P.5
P.5
P.8 P.7
Date:
Size Schematic Rev
of
Sheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
10
2
System Diagram
ICE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
of
Sheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
10
2
System Diagram
ICE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
of
Sheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
10
2
System Diagram
ICE40-Ultra Lite Breakout Board A

16
iCE40 UltraLite Breakout Board
Figure 12. iCE40 UltraLite
5
5
4
4
3
3
2
2
1
1
D D
C C
B B A A
Done LEDCRESETB Button
Default: Open
DNI
<-----High Speed Signals matched Paths 50 ohms--->
<-----High Speed Signals matched Paths 50 ohms--->
To Breakout Headers
To Breakout Headers
To Signal Connectors
(Not Populated)

Place near U1
To Signal Connectors (Not Populated)
ICE_CDONE
ICE_CRESET_B
AP_DAT3
AP_DAT2
AP_CLK AP_CMD AP_DAT1 AP_DAT0
AP_DAT3
AP_DAT2
AP_CLK
AP_CMD
AP_DAT0
AP_DAT1
ICE_MISO ICE_MOSI
ICE_CRESET_B
SYS_RST
IR_TX
+3.3V
VCCIO1
VCCIO1
VCCIO2
+1.2V
+1.2V
VCCIO1
VCCIO0
VCCIO1
VCCIO2
ICE_MISO[5,6,7]
SD_DAT0 [6]
SD_DAT1 [6] SD_DAT2 [6] SD_CMD [6] SD_DAT3 [6]
AP_DAT3
[6]
AP_DAT2
[6]
AP_CLK[6]
AP_CMD
[6]
AP_DAT1
[6]
AP_DAT0
[6]
IO_B5
[5]
IO_A4[5]
IO_B6[5] IO_B2[5] IO_A3
[5]
IO_C2[5]
IO_F1 [5]
IO_E1 [5]
IO_D1 [5]
IO_C1 [5]
IO_E2 [5]
IO_F2 [5]
BARCODE[4,5,6] ICE_CRESET_B
[6,8]
VCC_ICE [6]
VCCPLL_ICE [6]
VPP_2V5[6]
VCCIO0_ICE [6]
VCCIO2_ICE [6]
IR_TX[4,5,6] LED_BLUE[4,5,6] LED_GREEN
[4,5,6]
LED_RED[4,5,6]
IO_C6[4,5,6] SYS_CLK[6,8] ICE_MOSI[5,6,7] ICE_SCK[5,6,7,8]
ICE_CSN[5,6,7,8]
IO_D6
[5,6,9]
ICE_CDONE[6,8]
IO_F3 [5,6]
SD_CLK [6]
VCCIO1_ICE [6]
Date: Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupp[email protected]
Board Rev
Project
Thursday, August 282014
BA
103
ICE40 Ultra Lite
ICE40-Ultra Lite Breakout Board A
Date: Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupp[email protected]
Board Rev
Project
Thursday, August 282014
BA
103
ICE40 Ultra Lite
ICE40-Ultra Lite Breakout Board A
Date: Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsupp[email protected]
Board Rev
Project
Thursday, August 282014
BA
103
ICE40 Ultra Lite
ICE40-Ultra Lite Breakout Board A
C11
10nF
R13
0
R7
10k
VCCIO2
DNI
1
J1 CRSTB
1 2
J2 CDONE
1 2
R19 2.2k
C10 0.1uF
C59
10nF
TP9
DNI
1
R8
402
C6
1uF
R3 1
R15
0
+1.2V
DNI
1
SW2
SW2
VCC_PLL
DNI
1
R1
1
R22
0
C2
10nF
1.2V
DNI
1
R21
0
C58 10nF
C12 0.1uF
C1
0.1uFC13
1uF
VCC
DNI
1
R20
0
VCCIO1 DNI
1
R6 100
R2
1
R18
0
C8 10nF
TP14
DNI
1
D2
Green
C5 10nF
SW1 CRSTB
R12
0
R17
0
J20
1 2
C7 0.1uF
C9 1uF
TP4
DNI
1
C4 0.1uF
R4
1
R48
2.2k
R16
0
R14
0
C15 10nF
C14
0.1uF
VCCIO0 DNI
1
R5
1
D1
CDBU0520
12
BANK0
BANK1
BANK2
iCE40UL1K-CM36A
U1
IRLED
A6
IOB_10A
D6
IOB_11B_CDONE
D5
CRESET_B
F4 IOT_27A
C2
IOB_0A/TRUE_of_IOB_1B F1
IOB_1B/COMP_of_IOB_0A E1
IOB_3B_GBIN6F2
IOB_5B/COMP_of_IOB_4A C1
IOB_4A/TRUE_of_IOB_5B D1
IOB_7B_GBIN5/COMP_of_IOB_6A F3
IOB_6A/TRUE_of_IOB_7B E2
IOB_14A_SPI_SO
F6
IOB_15B_SPI_SI
E5
IOB_16A_SPI_SCK
E6
IOB_17B_SPI_SS
F5
SPI_VCCIO1
E4
IOB_8A_GBIN4
D2
GND
C3
IOT_18B/COMP_of_IOT_19A
B5
IOT_19A/TRUE_of_IOT_18B
A4
IOT_21A_GBIN1
B6
IOT_22B_GBIN0
C6
IOT_24B/COMP_of_IOT_25A
B2
IOT_25A/TRUE_of_IOT_24B
A3
VCCIO_2 E3
VCCPLL
D4
BARCODE
A5
RGB2
A1
RGB1
B1
RGB0
A2
VCCIO_0
B3
GND
C4
VCC D3
VPP_2V5B4
GND_LED
C5
R11
0
J21
1
2
C3
1uF
R10
0
TP6
DNI
1
R9
10k

17
iCE40 UltraLite Breakout Board
Figure 13. LEDS
5
5
4 4
3
3
2
2
1
1
D D
C C
B B A A
HP LED SELECTION 1-2: IR LED 2-3: HP Torch LED
Note: Trace should be 500 mA size, including to Header A
RGB LED BARCODE
1-2: 500 mA Current on IR_TX 2-3: BARCODE LED 100 mA, IR_TX 400 mA
IR_RX Module - DNI
DNI
IR_TX
IR_TX
VBUS_5V
VCCIO0
+VCC_3.3V +VCC_3.3V
+VCC_3.3V
LED_GREEN
[3,5,6]
LED_RED
[3,5,6]
LED_BLUE[3,5,6]
IR_TX [3,5,6]
BARCODE [3,5,6]
IO_C6 [3,5,6]
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
104
LEDS
ICE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
104
LEDS
ICE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
104
LEDS
ICE40-Ultra Lite Breakout Board A
J4 HEADER 3
1 2 3
R26 100
D8
BAR
APT2012SRCPRV
R23
110 J5
HEADER 3
1 2
3
D6TSAL6200 D7XBDAWT
R27
0
U3
TSMP4138
VDD 3
OUT 1
GND2
J3
R G B
2
4
6
1
3 5
D4 CDBU0520
12
D5 CDBU0520
12
C16 4.7uF
U2
LED TRI-COLOUR_0
SFT722N-S
4
5
61
2 3
R24
62
R25
62
D3 CDBU0520
12

18
iCE40 UltraLite Breakout Board
Figure 14. Headers
5
5
4
4
3
3
2
2
1
1
D D
C C
B B A A
HEADER BHEADER A
MAKE PWR TRACES
CAPABLE OF 1A
MAKE PWR TRACES CAPABLE OF 1A
PMOD Connector Aardvark Connector
IO_B5
IO_A4 IO_B6 IO_B2
IO_F1 IO_E1
IO_D1 IO_C1 ICE_CSN
ICE_SCK
+3.3V
+3.3V+3.3V
+3.3V+3.3V
+VCC_3.3V
LED_BLUE[3,4,6]
LED_GREEN
[3,4,6]
LED_RED[3,4,6]
ICE_MOSI [3,6,7]
ICE_SCK [3,6,7,8]
ICE_CSN[3,6,7,8]
ICE_MISO [3,6,7]
IO_B5[3]
IR_TX
[3,4,6]
BARCODE[3,4,6]
IO_A4[3]
IO_B6[3]
IO_B2[3]
IO_A3[3]
IO_C2[3]
IO_D6[3,6,9]
IO_F1 [3]
IO_E1 [3] IO_D1 [3] IO_C1 [3]
IO_E2 [3]
IO_F2 [3]
IO_F3 [3]
IO_C6 [3,4,6]
FLASH_MOSI [7,8]
FLASH_MISO[7,8]
Date: Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
105
Headers
iCE40-Ultra Lite Breakout Board A
Date: Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
105
Headers
iCE40-Ultra Lite Breakout Board A
Date: Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: techsu[email protected]
Board Rev
Project
Thursday, August 282014
BA
105
Headers
iCE40-Ultra Lite Breakout Board A
J7
Header2x10
DNI
2
4
6
8
10
12
14 16 18
20 19
17 15
13 11 9 7
5
3 1
C19
0.1uF
J6
Header2x10
DNI
2
4
6 8
10
12
14
16 18 20 19
17
15
13 11 9 7 5
3
1
C20 0.1uF
J8 PMOD Connector
DNI
2 4 6
8
10
1
3
5
7
9
11 12
J9
HEADER 5X2
1 3
5 7 9
2
4
6
8 10
C17 0.1uF
C18
0.1uF

19
iCE40 UltraLite Breakout Board
Figure 15. Connectors - DNI
5
5
4
4
3
3
2
2
1
1
DD C C B B A A
<-----High Speed Signals matched Paths 50 ohms--->
Top Layer
<-----High Speed Signals matched Paths 50 ohms--->
Note position of pin#1 in reference board
AP (DRAGON BOARD) 2mm INTERCONNECT
 
ICE_SCK ICE_MISO ICE_CSN ICE_CRESET_B
ICE_MOSI
SYS_CLK
+3.3VVCCIO2
SD_DAT1 [3]
SD_DAT0 [3]
SD_CLK [3] SD_CMD [3]
SD_DAT3 [3]
SD_DAT2 [3]
AP_DAT2[3]
AP_DAT3[3]
AP_CMD[3] AP_CLK[3]
AP_DAT1[3]
AP_DAT0[3]
ICE_SCK[3,5,7,8]
ICE_CRESET_B
[3,8]
ICE_MISO [3,5,7] ICE_CSN[3,5,7,8]
IO_D6[3,5,9]
IR_TX[3,4,5]
VCCIO1_ICE[3]
VCCPLL_ICE[3]
VCCIO0_ICE[3]
VCC_ICE[3]
VCCIO2_ICE[3]
LED_RED[3,4,5]
IO_C6[3,4,5] LED_GREEN[3,4,5]
LED_BLUE[3,4,5]
VPP_2V5[3] IO_F3[3,5] ICE_CDONE
[3,8]
BARCODE[3,4,5]
SYS_CLK [3,8]
ICE_MOSI[3,5,7]
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: [e-mail]
Board Rev
Project
Thursday, August 282014
BA
106
Connectors - DNI
iCE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: [e-mail]
Board Rev
Project
Thursday, August 282014
BA
106
Connectors - DNI
iCE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: [e-mail]
Board Rev
Project
Thursday, August 282014
BA
106
Connectors - DNI
iCE40-Ultra Lite Breakout Board A
R36 0
C22 10nF R84
0R29
10k
R32 10k
J10
AP INTERCONNECT(2mm pitch)
2
4
6
8
10
1 3
5
7 9
C21 0.1uFR34
10k
R30
10k
J11
9 pin FPC connector
1
2 3 4 5 6 7 8
9
MicroSD 114-00841-68
U4
SH4
11
SH3
12
SH2
13
SH1
14
D2 1
CD/D3 2
CMD 3
VCC 4
CLK 5
VSS 6
D0 7 D1 8
CD1
9
CD2
10
R78
0
R380
J13
SMA
A1
Sh1 2
Sh2 3
Sh3
4
Sh4
5
R28 10k
R35 0 R37 0
R33 10k
R31 10k
R39 0
J12
26 pin FPC connector
1
2
3
4 5
6
7 8
9
10
11
12
13
14 15
16
17 18
19
20
21
22
23
24 25
26

20
iCE40 UltraLite Breakout Board
Figure 16. SPI
5
5
4
4
3
3
2
2
1
1
DD C C B B A A
J14: Remove shunt only for Programming iCE. Replace shunt for programming Flash and for normal operation.
For programming Flash - Shunt 1,3 and 2,4 (default)
For programming iCE - Shunt 3,4 and 1,2
FLASH_MISOFLASH_MOSI
VCCIO1
ICE_SCK[3,5,6,8]
ICE_CSN[3,5,6,8]
FLASH_MOSI[3,8]
FLASH_MISO [3,8]
ICE_MOSI[3,5,6]
ICE_MISO [3,5,6]
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: [e-mail]
Board Rev
Project
Thursday, August 282014
BA
107
SPI
iCE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: [e-mail]
Board Rev
Project
Thursday, August 282014
BA
107
SPI
iCE40-Ultra Lite Breakout Board A
Date:
Size Schematic Rev
ofSheet
Title
Lattice Semiconductor Applications
Email: [e-mail]
Board Rev
Project
Thursday, August 282014
BA
107
SPI
iCE40-Ultra Lite Breakout Board A
C24 0.1uF
R40
10k
R42 10k
C23
0.1uF
U5
N25Q032A13ESC40F
CS
1
SDI
5
SCK
6
WP
3
HOLD 7
VCC 8 GND
4
SDO 2
J15
HEADER 2X2
3
4
1 2
R43
10k
R41
10k
J14
1
2