Samsung OFFICESERV 7100 User manual

Ed. 00
OfficeServ 7100
Service Manual

COPYRIGHT
This manual is proprietary to SAMSUNG Electronics Co., Ltd. and is protected by copyright.
No information contained herein may be copied, translated, transcribed or duplicated for any commercial
purposes or disclosed to the third partyin any form without the prior written consent of SAMSUNG Electronics
Co., Ltd.
TRADEMARKS
is the trademark of SAMSUNG Electronics Co., Ltd.
Product names mentioned in this manual may be trademarks and/or registered trademarks of their respective
companies.
This manual should be read and used as a guideline for properly installing and operating the product.
This manual may be changed for the system improvement, standardization and other technical reasons without prior
notice.
If you need updated manuals or have any questions concerning the contents of the manuals, contact our Document
Center at the following address or Web site:
Address: Document Center 18th Floor IT Center. Dong-Suwon P.O. Box 105, 416, Maetan-3dong Yeongtong-gu,
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Homepage: http://www.samsungdocs.com
©2006SAMSUNG Electronics Co., Ltd. All rights reserved.

OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. I
INTRODUCTION
Purpose
This document provides an overview of OfficeServ 7100 system and its specifications.
Also, this document describes the configuration and features of each hardware circuit,
troubleshooting for potential problems that may occur while using the system, and the
methods of programming for maintenance.
Audience
This document is intended for engineers who maintain the OfficeServ 7100 system.
Document Content and Organization
This manual is composed of seven Chapters the Abbreviations, which can be summarized
as follows:
CHAPTER 1. System Overview
This chapter describes the major features, configuration, and specifications of the OfficeServ
7100 system..
CHAPTER 2. Circuit Overview
This chapter describes the configuration and characteristics of each module in the OfficeServ
7100 system.
CHAPTER 3. Troubleshooting
This chapter describes potential problems and troubleshooting when using the OfficeServ 1200
system.
CHAPTER 4. Programming for Maintenance
This chapter describes SmartMedia, Complex Programmable Logic Devices(CPLD), and
offline programming to maintain the OfficeServ 7100 system.

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CHAPTER 5. Parts Layout
This chapter provides the parts layout of the OfficeServ 7100 system.
CHAPTER 6. Parts List
This chapter provides the list of all OfficeServ 7100 parts.
CHAPTER 7. Device Parts diagram
This chapter provides the device parts diagrams of the OfficeServ 7100 system and the parts
material list of each device.
ABBREVIATION
Abbreviations introduce acronyms frequently used in this document and their full terms.
Conventions
The following types of paragraphs contain special information that must be carefully read
and thoroughly understood. Such information may or may not be enclosed in a rectangular
box, separating it from the main text, but is always preceded by an icon and/or a bold title.
WARNING
Provides information or instructions that the reader should follow in order to avoid
personal injury or fatality.
CAUTION
Provides information or instructions that the reader should follow in order to avoid
a service failure or damage to the system.
CHECKPOINT
Provides the operator with checkpoints for stable system operation.
NOTE
Indicates additional information as a reference.

OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. III
Reference
OfficeServ 7100 System Manual
The OfficeServ 7100 system manual introduces the OfficeServ 7100 and describes the
necessary information to understand this system such as Hardware organization,
specifications and functions.
OfficeServ 7100 Installation manual
The OfficeServ 7100 installation manual provides the necessary conditions to install this
system and describes how to install, inspect and operate this system.
OfficeServ 7100 Programming manual
The OfficeServ 7100 programming manual describes how to use the Man Machine
Communication(MMC) program that changes system settings by using phones.
Revision History
EDITION DATE OF ISSUE REMARKS
00 11. 2006. Original Draft

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OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. V
SAFETY CONCERNS
For product safety and correct operation, the following information must be given to the
operator/user and shall be read carefully before the installation and operation.
Symbols
Caution
Indication of a general caution
Restriction
Indication for prohibiting an action for a product
Instruction
Indication for commanding a specifically required action

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VI © SAMSUNG Electronics Co., Ltd.
Warning
Caution Before Repairing a Product
Disconnect cables before repairing a product. Failure to do so may cause fire or
an electric shock.
Caution
Caution After Repairing a Product
Metals should not be inserted into a product after repair. Unless foreign substance
is not removed, it may cause fire or broken parts.
Using Standard Parts When Repairing a Product
If non-standard parts are used, the product might not operate properly.
Caution when Assembling
Connect all connectors and screws for assembly after repairing the product to
prevent a gap between the housing and base.
Caution When Using the MMC Card
Only the MMC card provided along with the system should be used. If another
product is used and the system is damaged, Samsung Electronics shall not be
responsible for the consequence and shall not provide after-sales services.
Caution When Connecting a PC to the Target Board
When a PC and the target board are connected, the power should be off. If the
connection is made while the power is supplied, the parallel port or the target
board of PC may be damaged.
WARNING
CAUTION

OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. VII
Caution When Keeping Boards
When dismounting a board, do not pult in the place where metals or conductive
materials exit.
Prohibition of Wearing Metal Accessories
Do not wear metal accessories such as a watch and a ring to avoid the system
from being damaged due to the electric shock when handling the system.
Caution When Using KDB-D/KDB-S
Note that the KDB-D/KDB-S can be used only for a digital phone connected to the
8DLI board. The KDB-D/KDB-S cannot be used for a digital phone connected to the
16DLI board.
Caution When handling Electric Parts
Wear a strap to prevent parts from being damaged due to static electricity when
handling electric parts.

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OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. IX
TABLE OF CONTENTS
INTRODUCTION I
Purpose ...................................................................................................................................................... I
Audience..................................................................................................................................................... I
Document Content and Organization ....................................................................................................... I
Conventions............................................................................................................................................... II
Reference ................................................................................................................................................. III
Revision History ....................................................................................................................................... III
SAFETY CONCERNS V
Symbols .....................................................................................................................................................V
Warning.....................................................................................................................................................VI
Caution......................................................................................................................................................VI
CHAPTER 1. System Overview 1-1
1.1 Major features ...........................................................................................................................1-1
1.2 System Configuration ..............................................................................................................1-5
1.2.1 Organization of Slots................................................................................................................1-6
1.3 System Specification................................................................................................................1-7
1.3.1 System Capacity ......................................................................................................................1-7
1.3.2 Eelectrical Standard .................................................................................................................1-9
1.3.3 Power Specifications..............................................................................................................1-12
1.3.4 Ring and Tone ........................................................................................................................1-13
1.3.5 Available Terminals ................................................................................................................1-14
1.3.6 Equipment Specifications ......................................................................................................1-14
CHAPTER 2. Circuit Overview 2-1
2.1 System Structure......................................................................................................................2-1
2.1.1 Block Diagram..........................................................................................................................2-1
2.1.2 Features of the Communication System between Modules..................................................2-2
2.2 Main Board ................................................................................................................................2-4
2.3 Power Supply Module ..............................................................................................................2-4

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2.4 Control Board ........................................................................................................................... 2-4
2.4.1 MP10 Board............................................................................................................................. 2-4
2.4.2 MP11 Board............................................................................................................................. 2-8
2.5 Universal Board........................................................................................................................ 2-9
2.5.1 UNI Board ................................................................................................................................ 2-9
2.5.2 4TRM Module........................................................................................................................ 2-12
2.5.3 8TRK Module ........................................................................................................................ 2-15
2.5.4 2BRM Module........................................................................................................................ 2-18
2.5.5 TEPRI2 Board ....................................................................................................................... 2-20
2.5.6 4SLM Module ........................................................................................................................ 2-24
2.5.7 16SLI2/16MWSLI Board ....................................................................................................... 2-26
2.5.8 8HYB/8COMBO Board......................................................................................................... 2-29
2.5.9 4DLM Module ........................................................................................................................ 2-31
2.5.10 8DLI Board............................................................................................................................. 2-33
2.5.11 16DLI/16DLI2 Board.............................................................................................................. 2-37
2.5.12 MGI64/MGI16 Board............................................................................................................. 2-41
2.5.13 PLIM Board............................................................................................................................ 2-44
2.5.14 4SWM .................................................................................................................................... 2-47
2.5.15 WBS24 BTS .......................................................................................................................... 2-51
2.5.16 MODEM Board ...................................................................................................................... 2-55
2.6 Terminal................................................................................................................................... 2-57
2.6.1 DPIM ...................................................................................................................................... 2-57
CHAPTER 3. Troubleshooting 3-1
3.1 Diagnosing System Operation................................................................................................ 3-1
3.1.1 Checking Cabinet Power ........................................................................................................ 3-1
3.1.2 Abnormal Battery Backup (1) ................................................................................................. 3-3
3.1.3 Abnormal Battery Backup (2) ................................................................................................. 3-4
3.1.4 Checking MP10/11 Board Operation ..................................................................................... 3-5
3.1.5 Calls are not Connected (Highway) ....................................................................................... 3-6
3.1.6 Calls are not Connected (Switching Clock) ........................................................................... 3-7
3.1.7 Music on Hold (MOH)/Background Music sources (BGM) is Abnormal .............................. 3-8
3.1.8 External Announcement is not Available................................................................................ 3-9
3.2 Motherboard............................................................................................................................ 3-10
3.2.1 Motherboard does not Operate ............................................................................................ 3-10
3.2.2 -54 V Power is not Supplied to Motherboard........................................................................3-11
3.3 Control Board ......................................................................................................................... 3-12
3.3.1 MP10/11 Board...................................................................................................................... 3-12
3.4 Universal Board...................................................................................................................... 3-18

OfficeServ 7100 Service Manual
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3.4.1 4SWM Module........................................................................................................................3-18
3.4.2 UNI Board...............................................................................................................................3-20
3.4.3 4TRM Module.........................................................................................................................3-23
3.4.4 4SLM Module .........................................................................................................................3-25
3.4.5 8TRK Board............................................................................................................................3-26
3.4.6 TEPRI2 Board ........................................................................................................................3-30
3.4.7 8COMBO Board.....................................................................................................................3-37
3.4.8 16SLI2/16MWSLI Board........................................................................................................3-42
3.4.9 MGI64/MGI16 Board .............................................................................................................3-46
3.4.10 PLIM Board.............................................................................................................................3-50
3.5 Option Board (Daughter Board)............................................................................................3-52
3.5.1 MIS Board...............................................................................................................................3-52
3.5.2 MFM Board.............................................................................................................................3-56
3.5.3 RCM Board.............................................................................................................................3-59
CHAPTER 4. Programming for Maintenance 4-1
4.1 Smart Media Programming......................................................................................................4-1
4.1.1 Installation.................................................................................................................................4-1
4.1.2 Performing Functions...............................................................................................................4-3
4.2 CPLD Programming..................................................................................................................4-8
4.2.1 Lattice CPLD Programming ....................................................................................................4-8
4.2.2 Altera EPLD Programming ....................................................................................................4-17
4.3 Offline Programming..............................................................................................................4-20
4.3.1 Preparation .............................................................................................................................4-20
4.3.2 Environment Configuration....................................................................................................4-20
4.3.3 Entering the Offline Test Mode ..............................................................................................4-21
CHAPTER 5. Parts Layout 5-1
5.1 MP10/11 Board ..........................................................................................................................5-2
5.2 4SWM .........................................................................................................................................5-4
5.3 4DLM ..........................................................................................................................................5-5
5.4 4TRM ..........................................................................................................................................5-6
5.5 4SLM...........................................................................................................................................5-7
5.6 2BRM..........................................................................................................................................5-8
5.7 TEPRI2 Board............................................................................................................................5-9
5.8 8COMBO .................................................................................................................................. 5-11
5.9 16DLI2 ......................................................................................................................................5-13

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XII © SAMSUNG Electronics Co., Ltd.
5.10 MGI16/MGI32........................................................................................................................... 5-15
5.11 16SLI2/16MWSLI..................................................................................................................... 5-17
5.12 8TRK Board............................................................................................................................. 5-19
5.13 PLIM Board.............................................................................................................................. 5-21
5.14 Modem..................................................................................................................................... 5-23
CHAPTER 6. Parts List 6-1
6.1 MP10 Board............................................................................................................................... 6-2
6.2 MP11 Board............................................................................................................................. 6-10
6.3 4SWM Module ......................................................................................................................... 6-18
6.4 4TRM Module .......................................................................................................................... 6-22
6.5 4SLM Module .......................................................................................................................... 6-26
6.6 4DLM Module .......................................................................................................................... 6-30
6.7 2BRM Module.......................................................................................................................... 6-32
6.8 8TRK Board............................................................................................................................. 6-35
6.9 TEPRI2 Board.......................................................................................................................... 6-37
6.10 8COMBO Board ...................................................................................................................... 6-43
6.11 16DLI2 Board .......................................................................................................................... 6-49
6.12 MGI64 Board ........................................................................................................................... 6-52
6.13 MGI16 Board ........................................................................................................................... 6-58
6.14 PLIM Board.............................................................................................................................. 6-63
6.15 PLIMD Board........................................................................................................................... 6-68
6.16 MODEM Board ........................................................................................................................ 6-70
6.17 16DLI Board ............................................................................................................................ 6-72
CHAPTER 7. Device Parts Diagram 7-1
ABBREVIATION I
A ~ D ...........................................................................................................................................................I
E ~ K ..........................................................................................................................................................II
L ~ P ..........................................................................................................................................................III
Q ~ V ........................................................................................................................................................ IV
W ~ X ........................................................................................................................................................ V

OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. XIII
LIST OF FIGURES
Figure 1.1 Configuration of the OfficeServ 7100 Cabinet......................................................... 1-5
Figure 1.2 Loop Start C.O. line Signaling ................................................................................. 1-9
Figure 2.1 Physical Structure of the OfficeServ 7100 System ................................................. 2-1
Figure 2.2 Structure of the OfficeServ 7100 System Communication...................................... 2-2
Figure 2.3 MP10/11 Board Block Diagram ............................................................................... 2-5
Figure 2.4 UNI Board Block Diagram ..................................................................................... 2-10
Figure 2.5 Block Diagram of the 4TRM Board........................................................................ 2-12
Figure 2.6 Block Diagram of the DAA Chip ............................................................................ 2-13
Figure 2.7 Block Diagram of the QSLAC Part ........................................................................ 2-14
Figure 2.8 Block Diagram of the 8TRK Board ........................................................................ 2-15
Figure 2.9 Block Diagram of the C.O Line Interface Circuit ................................................... 2-16
Figure 2.10 Block Diagram of the 2BRM Board ..................................................................... 2-18
Figure 2.11 Layout between the 2BRM and UNI Boards ....................................................... 2-19
Figure 2.12 Block Diagram of the TEPRI2 Board................................................................... 2-20
Figure 2.13 Block diagram of the 4SLM Module .................................................................... 2-24
Figure 2.14 Block Diagram of the 16SLI2/16MWSLI Boards ................................................. 2-27
Figure 2.15 8HYB/8COMBO DLI Block Diagram ................................................................... 2-29
Figure 2.16 8HYB/8COMBO SLI Block Diagram.................................................................... 2-30
Figure 2.17 4DLM Block Diagram........................................................................................... 2-31
Figure 2.18 QDASL Block Diagram ........................................................................................ 2-32
Figure 2.19 QDMC Block Diagram ......................................................................................... 2-33
Figure 2.20 Block Diagram of the 8DLI Board........................................................................ 2-34
Figure 2.21 Default Configuration Diagram Between the Digital Phone and System............ 2-36
Figure 2.22 Data Transfer Format Diagram............................................................................ 2-36
Figure 2.23 Block Diagram of the 16DLI Board...................................................................... 2-38
Figure 2.24 Block Diagram of MGI64/MGI16 board ............................................................... 2-41
Figure 2.25 Block Diagram of the PLIM Board ....................................................................... 2-44
Figure 2.26 PoE Strap Option of PLIM Board......................................................................... 2-46
Figure 2.27 4SWM Configuration Diagram............................................................................. 2-47
Figure 2.28 Block Diagram of 4SWM Module ........................................................................ 2-48
Figure 2.29 Block Diagram of WBS24 BTS............................................................................ 2-51
Figure 2.30 Phone System Connection Diagram ................................................................... 2-52
Figure 2.31 Modem Board Block Diagram ............................................................................. 2-55
Figure 2.32 PCM Interface of Modem Board.......................................................................... 2-56
Figure 2.33 Block Diagram of DPIM ....................................................................................... 2-57
Figure 2.34 Block Diagram of Door Phone............................................................................. 2-58

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XIV © SAMSUNG Electronics Co., Ltd.
Figure 2.35 Pin Connection of DPIM ...................................................................................... 2-59
Figure 4.1 Initial Window of the Smart Media Program............................................................ 4-2
Figure 4.2 [Format Menu] Window ........................................................................................... 4-3
Figure 4.3 SMC Format ............................................................................................................ 4-4
Figure 4.4 [Copy Menu] Window .............................................................................................. 4-5
Figure 4.5 [Directory Menu] Window ........................................................................................ 4-6
Figure 4.6 [Copy Menu] Window .............................................................................................. 4-7
Figure 4.7 Connection Diagram of the PC and the Board ....................................................... 4-8
Figure 4.8 Initial Window of the ispVM Program ...................................................................... 4-9
Figure 4.9 [LatticePRO ver 0.1] Window ................................................................................ 4-10
Figure 4.10 [LatticePRO ver 0.1-Chain1] Window ..................................................................4-11
Figure 4.11 [Advanced Processing Options] Window .............................................................4-11
Figure 4.12 Designating the Part Name on the [JTAG Part Properties] Window .................. 4-12
Figure 4.13 Setting the CPLD Part Type ................................................................................ 4-12
Figure 4.14 Designating the Programming Mode and the JEDEC File Path......................... 4-13
Figure 4.15 Program Execution.............................................................................................. 4-14
Figure 4.16 Programming for the MP10/11 Option Board...................................................... 4-15
Figure 4.17 Changing Information of Part1 ............................................................................ 4-16
Figure 4.18 Viewing the Chain File When One Option Board Is Mounted............................. 4-16
Figure 4.19 Initial Window of the Altera MAX+plus II Program .............................................. 4-17
Figure 4.20 Program File Selection ........................................................................................ 4-18
Figure 4.21 Selection of the Data File for Programming ........................................................ 4-18
Figure 4.22 Data File Download ............................................................................................. 4-19
Figure 7.1 OfficeServ 7100 Disassembly Diagram .................................................................. 7-1
Figure 7.2 Front/Rear Panels of the Power Module................................................................. 7-2
LIST OF TABLES
Table 1.1 Rear Panel of the OfficeServ 7100 Cabinet ............................................................. 1-5
Table 1.2 Boards Mountable to Slots ........................................................................................ 1-6
Table 1.3 OfficeServ 7100 System Capacity ............................................................................ 1-7
Table 1.4 C.O. line Capacity ..................................................................................................... 1-8
Table 1.5 Extension Line Capacity............................................................................................ 1-8
Table 1.6 Channels by Slots ..................................................................................................... 1-8
Table 1.7 Electric Characteristics of T1 C.O. line ..................................................................... 1-9
Table 1.8 Electric Characteristics of E1 C.O. line................................................................... 1-10
Table 1.9 Electric Characteristics of BRI C.O. line ................................................................. 1-10

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Table 1.10 Electric Characteristics of PRI C.O. line ............................................................... 1-10
Table 1.11 Electric Characteristics of DLI Line ....................................................................... 1-11
Table 1.12 Electric Characteristics of LAN Interface (10 Base-T).......................................... 1-11
Table 1.13 Electric Characteristics of LAN Interface (100 Base-Tx) ...................................... 1-11
Table 1.14 Specification of the Power Supply Board.............................................................. 1-12
Table 1.15 System Ring Cycle ................................................................................................ 1-13
Table 1.16 System Tone Cycle................................................................................................ 1-13
Table 1.17 Terminals Compatible with the OfficeServ 7100 ................................................... 1-14
Table 2.1 Types of the Universal Board.................................................................................... 2-9
Table 2.2 System Configuration Inter-Working With WBS24 ................................................. 2-53
Table 4.1 CPLD List ................................................................................................................ 4-12
Table 4.2 EPLD List................................................................................................................. 4-19
Table 7.1 Device Parts List........................................................................................................ 7-2

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OfficeServ 7100 Service Manual
© SAMSUNG Electronics Co., Ltd. 1-1
CHAPTER 1. System Overview
This chapter describes an overview of the characteristics and major features of OfficeServ
7100 system, system and slot configurations, and system specifications.
1.1 Major features
The OfficeServ 7100 is the most suitable communication product for mid-small sized offices
using less than 25 subscriber lines and provides voice, data internet function in combination.
The major features of the OfficeServ 7100 system are as follows:
Cutting-edge Digital Switching System
The OfficeServ 7100 uses state-of-the-art technologies such as VoIP or LAN to connect a
variety of multimedia devices at offices where data communication or Internet is used.
In addition, the OfficeServ 7100 is an integrated communications device that can be used
as a phone system or PABX.
Flexible Line Organization
The OfficeServ 7100supports an UNI Card. The UNI card enables to flexibly organize
analog trunk, general phone scriber card, ISDN BRI, Digital Keyset subscriber card, etc.
up to 12 lines depending on user’s environment.
Integrated Communication Environment
The OfficeServ 7100 provides data transfer service via LAN or WAN module as well as voice
call service so that users can make communications conveniently by using wireless or wired
integration platform(e.g., phone, PC, server, wireless phone and peripheral device).
Next Generation Platform
The OfficeServ 7100 provides IP solutions integrating a mail server, Session Initiation
Protocol(SIP) server, and Voice over IP Unified Messaging Service(VoIP UMS) functions
via IP-based Feature server.
The OfficeServ 7100 Feature server operates on the Linux platform and enables to add the
Feature server module continuously.

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High Quality Voice IP Phone
The OfficeServ 7100 separates the priorities of data packet and voice packet from grouping
and ensures the Quality of Service(QoS) for voice calls.
yLayer 2 QoS: Priority Processing(802.1p), VLAN(802.1q)
yLayer 3 QoS: CBQ(Class Based Queuing), RTP Priority Queuing and On-Demand
Bandwidth management for Wide Area Network(WAN)
WAN/LAN Function
The OfficeServ 7100 is equipped with WAN and LAN interface modules, so it enables data
transmission/reception of 10/100 Base-Tx interface in external internet and internal intranet
networks without separate data equipment.
Text-To Speech (TTS) Response Function
The OfficeServ 7100 provides the voice recognition response function to convert text
messages on e-mails into voice messages and let the user listen to the voices over the phone.
Mail Server and Instant Message Processing
The OfficeServ 7100 exchanges instant messages with the e-mail server that integrates or
resends voice messages and e-mails for user’s convenience.
Q-Sig Network Function Support
The OfficeServ 7100 supports the Q-Sig networking function that enables Call Transfer, Do Not
Disturb(DND), Call Completion to Busy Subscriber(CCBS), Call Completion on No Reply
(CCNR) between the OfficeServ 7100 systems or with the iDCS 500 system regardless of the
physical location where the system is installed.
Modularity Applied
Both of the hardware and software of the OfficeServ 7100 are designed in modularity.
So, it provides the scalability to extend C.O. lines or subscriber lines easily while operating
the system or to add various function be installing new software.
Integration of Various Terminals and Additional Devices
The OfficeServ 7100 can connect various terminals and additional devices so that it can
support the integration environment to provides various and efficient services.
Compatibility with the Existing Systems
The OfficeServ 7100 uses MP 10/11 boards to provide the IP UMS, wireless LAN, and complete
media gateway functions. In addition, the cabinet of the OfficeServ 7100 can connect the digital
phones and various IP phones of the existing key phone system without modification and can
interwork with the iDCS 500 system.