Sony DR-BT50 - Stereo Bluetooth Headset User manual

DR-BT50
US Model
Canadian Model
AEP Model
UK Model
E Model
SERVICE MANUAL
WIRELESS STEREO HEADSET
SPECIFICATIONS
Ver. 1.0 2007.02
General
Communication System
Bluetooth Specification version 2.0
Output
Bluetooth Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (30 ft) *1
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS
Compatible Bluetooth Profiles*2
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HSP (Headset Profile)
HFP (Hands-free Profile)
Supported Codecs*3
SBC*4, MP3
Transmission range (A2DP)
20 - 20,000 Hz (sampling frequency 44.1 kHz)
Supplied accessory
AC power adaptor (1)
Carrying porch (1)
Operating instruction (1)
*1 The actual range will vary depending on factors such as obstacles
between devices, magnetic fields around a microwave oven, static
electricity, reception sensitivity, aerial’s performance, operating
system,
*2 Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
*3 Codec: Audio signal compression and conversion format
*4 Subband Codec
Headset
Power source
DC 3.7 V: Built-in lithium-ion
rechargeable battery
Mass
Approx. 180 g (6.4 oz)
Rated power consumption
3.0 W
Receiver
Type
Closed type, dynamic
Driver unit
40 mm dome type
Reproduction frequency range
10 – 25,000 Hz
Microphone
Type
Omni directional, electret condenser
Effective frequency range
100 – 4,000 Hz
Design and specifications are subject to change without notice.
Sony Corporation
Personal Audio Division
Published by SonyTechno Create Corporation
9-887-600-01
2007B02-1
© 2007.02

DR-BT50
2
TABLE OF CONTENTS
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
1. GENERAL........................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ························································ 4
2-2. Housing (R) Assy ························································· 4
2-3. Battery Holder ······························································ 5
2-4. Main Board ·································································· 5
2-5. Jack Board···································································· 6
2-6. Switch Board································································ 6
2-7. Mic Board ···································································· 6
3. DIAGRAMS
3-1. Block Diagram ····························································· 9
3-2. Printed Wiring Boards – Main Board – ····················· 10
3-3. Printed Wiring Boards
– Jack, Mic and Switch Board – ····························· 11
3-4. Schematic Diagram ···················································· 12
3-5. IC Pinfunction Description ········································13
4. EXPLODEDVIEWS
4-1. Housing (L) Section ···················································· 14
4-2. Housing (R) Section ···················································· 15
5. ELECTRICAL PARTS LIST........................................ 16
•IC101 (CXN1450-2ABL), IC401 (WM8711LGEF/R) and
IC451 (uPD78F0500FC(S)-AA3-A) on MAIN board cannot
be replaced individually.
Replace it with “MAIN BOARD, COMPLETE”.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

DR-BT50
3
SECTION 1
GENERAL
Location and Function of Part
s
This section is extracted
from instruction manual.
POWER button
Multi function button
Controls various call functions.
Indicator (blue)
Indicates the communication
status of the unit.
Indicator (red)
Indicates the power status of
the unit.
Microphone
DC IN 3 V jack
RESET button
Push this button when the unit
does not operate properly.
Pairing information is not
deleted by this operation.
VOL (volume) – button
VOL (volume) +*button
Jog switch
Controls various functions when
listening to music.
+/– buttons
Jump to previous/succeeding
groups when listening to music.
Slider
(right) indication
Right ( ) unit
Ear pad
Left ( ) unit
(left) indication
Headband
* This button has a tactile dot.
(RIGHT)
(RIGHT)
(LEFT)
(LEFT)

4
DR-BT50 SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. HOUSING (R) ASSY
2-2. HOUSING (R) ASSY
(Page 4)
2-3. BATTERY HOLDER
(Page 5)
2-4. MAIN BOARD
(Page 5)
2-5. JACK BOARD
(Page 6)
2-6. SWITCH BOARD
(Page 6)
2-7. MIC BOARD
(Page 6)
SET
1 ear pa
d
5 Remove the solder at 5 places.
2 two screws
(B2.6)
3 screw
(B2.6)
4 plate (R),
front sub assy
6 headband assy
7 housing (R) assy
RED
RED
NAT
Marking(+ side) WHT
BLK
driver (R)
to driver (L)
to MAIN board
Note : Plus terminal is marking
with felt tip pen.
(The position uncertainty)

5
DR-BT50
2-3. BATTERY HOLDER
2-4. MAIN BOARD
1 screw
(B2.6)
4 button panel
2 screw
(B2.6)
3 claw
5 battery holder
6 Remove the solder at 2 places.
NAT
MAIN board
RED
2 CNP451
1 connector
(CN201)
4 two claws
3 Remove the solder at 2 places.
6 Remove the solder at 3 places.
5 MAIN board
BLK
side A
side B
RED
YEL
BLK
GRY

6
DR-BT50
2-5. JACK BOARD
1 CNP202
3 claw
2 Remove the solder at 2 places.
4 claw
5 JACK board
RED BLK
35mm
9mm
Note :When exchange the FFC
(Flexible Flat cable)
conductor side Reinforce
board
SWITCH board
CN202
MAIN board
CN451
2-6. SWITCH BOARD
1 claw
2 claw
3 SWITCH board
4 Remove the solder at 3 places
YEL
GRY
BLK
2-7. MIC BOARD
1 two screw
s
2 MIC board

7
DR-BT50
SECTION 3
DIAGRAMS
For schematic diagrams.
Note:
•All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4 W or less unless otherwise
specified.
•%: indicates tolerance.
•C: panel designation.
•A: B+ Line.
•Power voltage are dc 3.7 V and fed with regulated dc
power supply from battery terminal.
•Voltages are dc with respect to ground under tolerances.
no mark : STANDBY
(): AC ADAPTOR IN
•Voltagesaretakenwitha VOM (Input impedance 10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Signal path.
F: AUDIO
NOTE FOR PRINTEDWIRING BOARDS AND SCHEMATIC DIAGRAMS.
Caution:
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
Pattern face side: Partson thepattern facesideseen from
(Side B) the pattern face are indicated.
For printed wiring boards.
Note:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•a: Through hole.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•IC101 (CXN1450-2ABL), IC401 (WM8711LGEF/R) and IC451
(uPD78F0500FC(S)-AA3-A) on MAIN board cannot be replaced
individually.
Replace it with “MAIN BOARD, COMPLETE”.
•The voltage of IC101 and IC451 cannot be measured.
•MAIN board is four-layer pritnted board. However, the patterns of
layer 2 and 3 have not been included in this diagrams.
IC203 XC6219B282MR
1VIN
VSS 2
CE 3
VOUT
5
4NC
R1
R2
-
+
ON/OFF
CONTROL
EACH
CIRCUIT
CURRENT
LIMIT
VOLTAGE
REFERENCE
• IC Block Diagram

8
DR-BT50
OUT
BAT
VCC
ISET
IN
VCC VCC
VCC
STAT2
VSS
9
10
8
7
6
2
3
5
1
4
I(DETECT)
ENABLE
V(ISET)
VI(BAT)
VI(BAT)
VI(BAT)
VI(BAT)
V(RCH)
V(PRECHG)
V(TAPER)
V(TERM)
VSET
VI(BAT)
VI(SET)
VI(SET)
V(SLP)
VO(REG)
VO(REG)
VO(REG)
VSET
CHG ENABLE
CHG ENABLE
CHG ENABLE I(FAULT)
ENABLE
I(DETECT) ENABLE
I(FAULT) ENABLE
DEGLITCH
DEGLITCH
DEGLITCH
DEGLITCH
RECHARGE
PRECHARGE
TAPER
TERM
STAT1
REFERENCE
AND BIAS
THERMAL
SHUTDOWN
CHARGE
CONTROL,
TIMER,
AND
DISPLAY
LOGIC
PG
PG
TS
IC261 BQ24010ADRCR
IC251 XC9103D093MR
1FB
VDD VDD
VDD
2
CE 3
EXT
5
4 GND
–
+
–
+
VREF WITH
SOFT START,
CE
PWM/PFM
CONTROLER
RAMP WAVE
GENERATOR,
OSC
BAFFER,
DRIVER
PWM
COMPARATOR
ERROR AMP
CURRENT
RIPPLE DETECT
AND FB
PHASE
COMPENSATION

99
DR-BT50
DR-BT50
•Signal path
F: AUDIO
3-1. BLOCK DIAGRAM
D103
(BLUE)
INDICATOR
41
28
10
5
4
1
+1.8V DC-DC CONVERTER
RF_IN/OUT
MIC301
(MIC)
ANT101
ANTENNA
SPEAKER
(L-CH)
47 A_IN_L_P/MIC_P
PI0_10
RESET-1 4 1
SP302
48 A_IN_L_N/MIC_N
S204
(MULTI FUNCTION)
F3
C4
LED DRIVER
Q102 D102
(RED)
39
PCM_OUT
13
PCM_SYNC 12
PCM_CLK
38
PIO_11
6
AIO_01
5
AIO_03
37
PIO_09
SPEAKER
(R-CH)
SP301
32
PIO_02
31
PIO_04
19
RESET-2 18
S205 VOL
S209
VOL
+2V
REW
S201 FF
D1
D2
D3
C1
(JOG SW)
PIO_07
29
PIO_06
+BATTERY
(+3.7V)
RECHAGEABLE
BATTERY
(LI-ION)
3.7V
PIO_05 CHARGE ON/OFF
30
RECEIVER/TRASMITTER,
MIC AMP,AF AMP,
BLUETOOTH CONTROL
RESET
B3
A5
B1
B2
POWER
+B SWITCH
Q201,202
RESET
VDD
2
EXT
DC-DC CONVERTOR
5
J251
DC IN 3V
3
CE
S101
D201
IC151
+1.8V
+1.5V
(MIC)
IC201
IC202
5
3
1
+1.5V REG.
FB
1
Q251
L251
L201
BT301
+4.5V
IC251
IC101
SUB CONTROL
IC451
SWICHING
STAT1
BATT
91
2
7
3
OUT
10
PG
IN
OUT
LX
CE
VOUT
VIN
VIN
+2.8V
IC203
5
3
1
+2.8V REG.
CE
VOUT VIN
+2V
IC204
5
3
1
+2V REG.
CE
VOUT VIN
VOUT VIN
VCC
8
TS
PI0_03
PI0_01
PI0_00
34
33
35
D1
D3
D2
PI0_08
36
C1
S207
A2
A3
E6
S208 -
-
+
+
INR
1
6
5
1
SD
2
INL
O-I
4
REFI
O-L
10
O-R
13
8
BCLK
7
DACLRC
9
DACDAT
27
SCLK
28
XTI/MCLK
1
SDIN
LHPOUT
14
RHPOUT
RESET
S206
+
-
+1.5V
(MIC)
IC401
AUDIO DAC IC420
POWER AMP
IC261
LI-ION BATTERY
CHARGER

DR-BT50
1010
DR-BT50
3-2. PRINTED WIRING BOARD – MAIN BOARD – : Uses unleaded solder.
Ref. No. Location
D102 D-1
D103 C-1
D201 D-2
D250 E-2
IC101 B-2
IC151 C-2
IC201 D-2
IC202 B-5
IC203 C-2
IC204 C-6
IC251 D-6
IC261 D-2
IC401 B-1
IC420 C-1
IC451 C-5
Q102 C-1
Q201 C-2
Q202 C-2
Q251 D-2
• Semiconductor
Location
23 4 5 6 7
A
1
B
C
D
E
17
2115
8
14
28
22
1
5
10
15
15
106
16
1
1
1
3
G
D
SA
K
4
1
5
10
6
2
1
5
D
GE
S
3
45
E
B
B
C
C
2
43
20 25 27
30
35
40
42455052
(RED)
(BLK)
1
13
54
1
34
18
5
1
34
5
(RED)
(BLK)
(NAT)
(WHT)
FB201
S209
IC420
C431
C432
C205
C428
C415
C254
C263
C123
R263
R261 R262
C262
C261
R264
Q251
R251
R252
R253
C256
IC401
D102
IC201
R120
R121
C252
C152
S101
POWER
D201
C209
JC406
C403
C105
R151
C151
IC151
CN201
IC101
C117
L102
JC401
R125
C104
C106
C101
JC402
JC404
R203
D103
R204
C119
C118
R126
C120
L103
C121
C414
C203
Q102
C202
C201
Q201
Q202
R201
R202
C204
IC203
C208
C255
L201
ANT101
C207
D250
R134
C418
JC408
JC409
IC261
R135
R421
R408
C214
C215
R103
R115
R114
R110
R128
R129
R139
R137
JC138
R265
C264
JC131
R136
R205
R206
R407
R423
R422
FB423
FB421
C429
VDR422
L251
C421
FB202
BT301
RECHARGEABLE
BATTERY
(LI-ION)
3.7V
C450
C408
C417
C424
TP261 (RED)
(NAT)
TP262
TP269 TP2701
TAP472
FB405
C133
C130
R111
R133
C112
C108
C211
C212
R107
R127
IC202
C253
C109
C224
R452
R112
C111
R109
C425
R101
FB424
C103
C210
FB402
C405
C402
R108
C266
IC204
IC251
R152
L421
C217
R113
R131
R132
VDR201
C456
C223
C462
R217
JC407
C461
R105
C466
R118
C113
C107
R102
C459
JC106
IC451
C463
C465
R473
C457
R468
R462
R461
R457
R458
R467
R460
R470
R465
R454
R456
R455
R469
C458
R471
R464
R472
R453
R451
C464
JC403
C467
C468
R463
C460
CN451
L423
L422
C483
R459
TP257
TP260
TP1051
TP107
TP108 TP106
TP120
TP100
TP468
TP466
TP473
TP471 TP470
TP467
TP121 TP463
TP2581
TP925
TP112
TP109
TP115
TP103
TP210
TP206
TP104
TP101
TP207
TP253
TP254
TP255
TP203
TP204
TP210
TP212
TP213
TP469
TP461 TP474
TP205
TP256
TP462
TP451
TP452
TP453
TAP462
TAP451
TAP452
TAP453
TAP471
TAP461
C430
TP111 TP110
MAIN BOARD (SIDE A)MAIN BOARD (SIDE B)
1
2
MULTI
FUNCTION
A
MIC BOARD
(Page 11)
D
JACK BOARD
(Page 11)
B
JACK BOARD
(Page 11)
11
(11)
1-872-502-
11
(11)
1-872-502-
(BLK)
(GRY)
(YEL)
1
2
3
C
SWITCH
BOARD
(Page 11)
SP301
R-CH
SP302
L-CH

1111
DR-BT50
DR-BT50
3-3. PRINTED WIRING BOARD – JACK, MIC AND SWITCH BOARDS
–: Uses unleaded solder.
23 4 5 6 7
A
1
B
C
D
E
MIC
(RED)
(BLK)
1
8
FF
REW
S201
(JOG SW)
S204
VOL+
CN202
R210
JC202
R218
R216
R215
TP209 TP208 TP211
R212
R214
R213
R211
S207
R209
R208
TP113 TP114
C122
MIC301
S208
11
(11)
1-872-503-
11
(11)
1-872-503-
11
(11)
1-872-504-
11
(11)
1-872-504-
11
(11)
1-872-505-
(BLK)
3
(GRY)
2
(YEL)
1
CMAIN BOARD
(Page 10)
SWITCH BOARD
(SIDE A)
SWITCH BOARD
(SIDE B)
JACK BOARD (SIDE B)
JACK BOARD (SIDE A)
MIC BOARD
(NAT)
(RED)
2
1
AMAIN BOARD
(Page 10)
DMAIN BOARD
(Page 10)
B
MAIN BOARD
(Page 10)
S205
VOL
-
S206
RESET
J251
DC IN 3V

DR-BT50
1212
DR-BT50
3-4. SCHEMATIC DIAGRAM •See page 7, 8 for IC Block Diagrams. • See page 13 for IC Pin Function Description.
0
0
0
2.8
(0)
0.5(0)
0(4)
3.9(4.1)
1.3
(4.1)
3.9
(0)
3.9(0) 0
0
(0)
3.9
(0)
3.9
(0)
2.8
(0)
1.8
1.8(0)
(0)
1.5
1.7(1.9)
1.7(0)
00
0
0
0
0
0
0
0
2.8(0)
0.6(0)
0.5(0)
0
2.8
(0)
0
0
0
0
1.8(0)
1.8(0)
0.8(0)
(0)
2
(0)
2
0
2(0)
(0)
2.8
2.8
(0)
0
(4.4)
0
(1.6)
(4.1)
3.9
3.9(4.1)
0(2.2)
1.8 (0)
0(0.9)
0
(4.4)
0
(3.2)
0(1.5)
0
(3.2) 0
(4.4) 0
(0.9)
TP101
TP102
TP103
TP104 TP105
TP107
TP108
D201
R262
R120
R126
C101
C253
C255
C103
C118
C119
ANT101
TP113
TP114
CN201
R102
C256
R253 R252
TP251
TP252
TP253
TP207
TP106
R203
Q102
IC101
IC201
L103
TP258
IC261
TP115
C212
TP110
TP109
TP111
TP112
R251
C123
C261
R101
TP305
TP306
TP307
TP308
TP309
TP310
TP311
TP312
R206
D103
D102
IC151
Q251
R129
R131
R132
R133
R134
R135
R139
R103
TP203
TP261 TP262
TP263
TP264
TP269
TP270
C211
JC131
JC138
JC404
JC407
JC408
JC409
D250
R128
R215
R216
R107
C108
C107
R108
C109
R109
C111
R111
C112
R112
R451
R452
TP451
TP452
TP453
R454
R455
R456
R457
R458
R459
R460
TP461
TP462
JC202 R218
TP211
TP208
TP209
TP210
TP212
TP213 R461
R113
TP473
TP466
R473
TP468
TP469
TAP451
TAP452
TAP453
TAP461
R217
R211
R213
R210
IC251
JC106
R136
R137
TP474
TP467
TP470
TP471
C415
C252
C105
IC401
TAP471
TAP472
IC203
L102
R118
S204
S205
S206
C113
C133
C130
C431
C432
FB424
IC202
IC420
R407
R408
R422
C201
C217
TP204
R212
R214
FB201
FB202
IC451
uPD78F0500FC
SP301
SP302
S101
S208
S209
CN451
VDR201
VDR421
VDR422
C430
R105
R110
R114
R115
C254
CN202
S207
R121
L251
10uH
FB421
FB423
IC204
C450
Q201
C151
JC402
C414 R421
C425
B301
C202
C209
C203 R204
TP205
Q202
R202
R205 R201
C205
C204
L201
10uH
C210
C208
C207
TP206
C215 C214
R151
C152
R152
C104
C106
R125
C120 C121 C122 MIC301
C117
R127
C421
R423
C429
C428
C424
L422
L421
L423
C408
JC403
C405
FB405
C418
C417
C402
C403
JC406
JC401
FB402
C224
C223
C468
R471
C464
C467
C465
C466
R472
R453
R462
R467
R465 C456 C463
C462
C461
C460
C459
C458
C457
R469
R463
R464
R470
R468
R208
R209
J251
TP254
C264
C263
C262
R265
R261
C266
R264
R263
C483
S201
SPI_CSB
SPI_MISO
SPI_CLK
SPI_MOSI URAT_TX
URAT_CTS
URAT_RTS
RB715W
10k
470
0
0.01
0.1
0.1
0.1
0.047
10V
0.047
10V
MIC
GND
2P
150k 0.5%
68p
56k 0.5% 220k 0.5%
DC 3.0V
GND
DC 4.5V
GND
URAT_RX
100k
RN1704-TE85R
CXN1450
XC9226A186MR
15nH
BQ24010ADRCR
RESET
1
RX
(RED)
RX
(NAT)
RX
(NAT)
RX
(GRN)
0
0.01
0.47 C
220k 0.5%
47k
CL-191S-PB168
CL-191S-PP193
XC6109N16ANR
QS5U17
1k
1k
1k
1k
1k
1k
1k
1k
CON + (RED)
0.1
0
0
0
0
0
0
CRS08-TE85R
1k
1k
1k
220k
0.01
0.01
220k
0.01
220k
0.01
220k
0.01
220k
1k
1k
1k
1k 1k
1k
1k1k
1k
01k
1k
47k
10k
1k
1k
1k
1k
XC9103D093MR
0
1k
1k
6.3V
10uH
100 6.3V
0.01
IC WM8711LGEFL/R
XC6219B282MR
4.7nH
0
0.01
100p
100p
1
1
0
TK63115SCL-G
NCP2809BDMR2G
22k
22k
22k
22
10V
100p
CON -
1k
1k
FBMH1608HM221-T
FBMH1608HM221-T
FFC8P
BBA080-T
BBA080-T
BBA080-T
100p
100
1k
1k
1k
47 10V
FFC8P
150
NP04SB
XC6213B202MR
0.1
RTF015P02TL
0.01
0
0.01 0
100p
0.1
0.01
0.01 470k
POWER_HOLD
2SC4617TL-Q
47k
1k 100k
4.7
10V
0.1
1
0.1
10
6.3V
1.8V
11
10k
0.01
100
0.1
0.1
2.2k
15pF 10.001
0.5pF
2.2k
1
22k
100p
100p
22
6.3V
0mH
0mH
0mH
0mH
10
6.3V
0
0.01
0
0.1
0.1
1
1
0
0
0
1
1
1
1k
1
1
1
0.01
47k
1k
100k
100k
100k 0.01 0.01
0.01
0.01
0.01
0.01
0.01
0.01
100k
100k
100k
100k
100k
1k
1k
GND
0.1
0.001
1
2.2k
0.5%
10k
0.1
10k
0.5%
330
0.5%
0.1
BATTERY
HP L_P
BATTERY
CHARGE ON/OFF
HP R_P
1.5V
1.8V
2.8V
PIO_07
PIO_06
HP GND
HP GND
1
C4
B2
A5
A2
A3
A5
B3
B2
B1
C4
D1
D2
D3
D3
D1
D2
F3
A3
A2
F3
C1
C1
B3
B1
RECHARGEABLE
BATTERY
(LI-ION)
(3.7V)
+B SWITCH
+B SWITCH
3.9(0)
3.9
(0)
1.8 (0)
POWER
IC201
+1.8 REG
+1.5 REG
IC202
1.8 (0) +2.8 REG
IC203
IC151
RESET
MIC
(RED)
(BLUE)
LED DRIVE
BLUETOOTH CONTROL
MIC AMP, AF AMP,
RECEIVER/TRANSMITTER,
IC101
IC B/D
IC420
POWER AMP
(NAT)
(RED)
R-CH
(RED)
(GRN)
L-CH
IC401
AUDIO DAC
IC204
+2V REG
IC451
SUB CONTROL
MULTI
FUNCTION
DC IN 3V
RESET
SWITCHING
IC B/D
IC251
DC-DC CONVERTOR
IC B/D
IC261
LI-ION BATTERY CHARGER
VOL+
VOL-
JOG SW
>
.
MAIN BOARD
JACK BOARD
SWITCH
BOARD
MIC BOARD

13
DR-BT50
3-5. IC PIN FUNCTION DESCRIPTION
IC401WM8711LGEFL/R (AUDIO DAC) (MAIN BOARD)
Pin No. Pin Name I/O Description
1XTI/MCLK I Master clock input
2XTO - Not used (Open)
3DCVDD - Power supply (+2V)
4DGND - Ground
5DBVDD - Power supply (+2V)
6CLKOUT - Not used (Open)
7BCLK O Digital audio bit clock signal output
8DACDAT I Digital audio data input
9DACLRC I Sample rate left/right clock input
10 - - Not used (Open)
11 --Not used (Open)
12 HPVDD - Power supply (+2.8V)
13 LHPOUT O L-CH audio signal output
14 RHPOUT O R-CH audio signal output
15 HPGND - Ground
16 LOUT - Not used (Open)
17 ROUT - Not used (Open)
18 AVDD - Power supply (+2.8V)
19 AGND - Ground
20 VMID - Mid-rail reference decoupling terminal
21 - - Not used (Open)
22 - - Not used (Open)
23 RLINEIN I R-CH line signal input (Not used)
24 LLINEIN I L-CH line signal input (Not used)
25 MODE I Mode control input (Pull down)
26 CSB I MPU Chip select input (Pull down)
27 SDIN I MPU Data input
28 SCLK I MPU Clock signal input

14
DR-BT50
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
SECTION 4
EXPLODEDVIEWS
NOTE:
•-XX, -X mean standardized parts, so they may
have some differences from the original one.
•Items marked “*” are not stocked since they
are seldom required for routine service. Some
delayshouldbeanticipatedwhen ordering these
items.
•Themechanical parts with no reference number
in the exploded views are not supplied.
•Abbreviation
CND: Canadian model
KR: Korean model
1A-1231-804-A HOUSING (L) ASSY
21-542-593-12 DRIVER (040F020)
3X-2177-241-1 PLATE (L), FRONT SUB ASSY
43-253-143-01 SCREW (B2.6), (+) P TAPPING
52-688-747-01 PAD, EAR
62-685-615-11 HANGER (R)
72-685-617-11 RETAINER, SLIDER
8X-2178-106-1 HEADBAND ASSY
92-888-576-11 CAP, SLIDER
10 3-703-358-05 PIN, PARALLEL (DIA. 2X16)
11 2-892-991-11 LID (R), HANGER
12 3-254-058-11 SCREW
13 2-685-616-11 LID (L), HANGER
14 2-685-614-11 HANGER (L)
4-1. HOUSING (L) SECTION
housing (R) section
1
2
3
4
4
5
6
7
89
9
10
11 12
13
14
7
10

15
DR-BT50
4-2. HOUSING (R) SECTION
51 2-688-747-01 PAD, EAR
52 3-253-143-01 SCREW (B2.6), (+) P TAPPING
53 X-2177-242-1 PLATE (R), FRONT SUB ASSY
54 1-542-593-12 DRIVER (040F020)
55 2-898-054-01 KNOB, JOG
56 A-1231-895-A JACK BOARD, COMPLETE
57 1-833-877-11 FLEXIBLE FLAT CABLE
58 A-1231-894-A SWITCH BOARD, COMPLETE
59 2-898-057-01 HOLDER, BATTERY
60 X-2178-104-1 LITHIUM ION BATTERY SUB ASSY (AEP, UK, E, KR)
60 X-2178-114-1 LITHIUM ION BATTERY SUB ASSY (US, CND)
61 A-1231-813-A MAIN BOARD, COMPLETE
62 2-898-053-01 BUTTON, VOLUME
63 2-898-060-01 PANEL, BUTTON
64 2-898-933-01 CUSHION, MIC
65 3-254-082-11 SCREW
66 A-1231-897-A MIC BOARD, COMPLETE
67 2-898-059-01 HOLDER, MIC
68 2-898-062-01 BUTTON, FOLDER
69 2-898-058-01 LIGHT GUIDE
70 2-898-055-01 BUTTON, MULTIFUNCTION
71 2-898-052-01 BUTTON, POWER
72 2-898-056-01 RING, BUTTON
73 A-1231-806-A HOUSING (R) ASSY
74 3-198-111-01 SHEET, COIL
MIC301 1-542-708-21 ELECTRET CONDENSER MICROPHONE
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
51
52
52
53
54
55
56
57
52
58
59
52
60
61
74
62 63
64
65
66
67
MIC301
68
69
70
71
72
73

16
DR-BT50 SECTION 5
ELECTRICAL PARTS LIST
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
NOTE:
•Due to standardization, replacements in the
parts list may be different from the parts
specifiedin the diagrams or the components
used on the set.
•-XX, -X mean standardized parts, so they
may have some difference from the original
one.
•Itemsmarked “*” are not stocked sincethey
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•CAPACITORS:
uF: µF
•RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable
•COILS
uH: µH
•SEMICONDUCTORS
In each case, u: µ, for example:
uA...: µA... , uPA... , µPA... ,
uPB... , µPB... , uPC... , µPC... ,
uPD..., µPD...
•Abbreviation
CND: Canadian model
KR: Korean model
JACK
A-1231-895-A JACK BOARD, COMPLETE
*********************
< CONNECTOR >
CN202 1-817-549-51 CONNECTOR, FPC 8P
< JACK >
J251 1-820-573-11 JACK, DC (DC IN 3V)
< JUMPER RESISTOR >
JC202 1-218-990-11 SHORT CHIP 0
< RESISTOR >
R210 1-218-953-11 RES-CHIP 1K 5% 1/16W
R212 1-218-953-11 RES-CHIP 1K 5% 1/16W
R213 1-218-953-11 RES-CHIP 1K 5% 1/16W
R214 1-218-953-11 RES-CHIP 1K 5% 1/16W
R215 1-218-953-11 RES-CHIP 1K 5% 1/16W
R216 1-218-953-11 RES-CHIP 1K 5% 1/16W
R218 1-218-953-11 RES-CHIP 1K 5% 1/16W
< SWITCH >
S201 1-786-923-11 LEVER (SLIDE TYPE) SWITCH (JOG SW)
S204 1-786-722-21 SWITCH, TACTILE (VOL +)
S205 1-786-722-21 SWITCH, TACTILE (VOL -)
S206 1-786-722-21 SWITCH, TACTILE (RESET)
************************************************************
A-1231-813-A MAIN BOARD, COMPLETE
*********************
< ANTENNA >
ANT101 1-754-380-11 HELICAL ANTENNA
< CAPACITOR >
C101 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C103 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C104 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C105 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C106 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C107 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C108 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C109 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C111 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C112 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C113 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C117 1-164-839-11 CERAMIC CHIP 0.5PF 0.25PF 50V
C118 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C119 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C120 1-164-854-11 CERAMIC CHIP 15PF 5% 50V
C121 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C123 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C130 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C133 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C151 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C152 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C201 1-165-897-11 TANTAL. CHIP 22uF 20% 10V
C202 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C203 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C204 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C205 1-135-210-11 TANTAL. CHIP 4.7uF 20% 10V
C207 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C208 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C209 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C210 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C211 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C212 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C214 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C215 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C217 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C223 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C224 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C252 1-128-964-91 TANTAL. CHIP 100uF 20% 6.3V
C253 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C254 1-137-934-91 TANTAL. CHIP 47uF 20% 10V
C255 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C256 1-164-870-11 CERAMIC CHIP 68PF 5% 50V
C261 1-112-324-91 CERAMIC CHIP 0.47uF 20% 10V
C262 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C263 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C264 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C266 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C402 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C403 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C405 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C408 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
When indicating parts by reference
number, please include the board
name.
The components identified by
mark 0or dotted line with mark
0are critical for safety.
Replace only with part number
specified.
Les composants identifiés par une
marque 0sont critiques pour la
sécurité.
Ne les remplacer que par une
piéce portant le numéro spécifié.
MAIN

17
DR-BT50
Ref. No. Part No. Description Remarks
IC451 (Not supplied) IC uPD78F0500FC (S) -AA3-A
< JUMPER RESISTOR >
JC106 1-218-990-11 SHORT CHIP 0
JC131 1-218-990-11 SHORT CHIP 0
JC138 1-218-990-11 SHORT CHIP 0
JC401 1-218-990-11 SHORT CHIP 0
JC402 1-218-990-11 SHORT CHIP 0
JC403 1-218-990-11 SHORT CHIP 0
JC404 1-218-990-11 SHORT CHIP 0
JC406 1-218-990-11 SHORT CHIP 0
JC407 1-218-990-11 SHORT CHIP 0
JC408 1-218-990-11 SHORT CHIP 0
JC409 1-218-990-11 SHORT CHIP 0
< COIL >
L102 1-456-367-11 INDUCTOR 4.7nH
L103 1-414-842-21 INDUCTOR 15nH
L201 1-481-168-11 INDUCTOR 10uH
L251 1-456-136-21 INDUCTOR 10uH
L421 1-469-084-21 FERRITE 0mH
L422 1-400-050-11 INDUCTOR, FERRITE BEAD
L423 1-469-084-21 FERRITE 0mH
< TRANSISTOR >
Q102 6-550-974-01 TRANSISTOR RN1704 (TE85R.F)
Q201 6-551-067-01 TRANSISTOR RTF015P02TL
Q202 8-729-927-99 TRANSISTOR 2SC4617R
Q251 6-551-556-01 TRANSISTOR QS5U17TR
< RESISTOR >
R101 1-208-943-11 METAL CHIP 220K 0.5% 1/16W
R102 1-208-939-11 METAL CHIP 150K 0.5% 1/16W
R103 1-218-953-11 RES-CHIP 1K 5% 1/16W
R105 1-218-941-81 RES-CHIP 100 5% 1/16W
R107 1-218-981-11 RES-CHIP 220K 5% 1/16W
R108 1-218-981-11 RES-CHIP 220K 5% 1/16W
R109 1-218-981-11 RES-CHIP 220K 5% 1/16W
R110 1-218-953-11 RES-CHIP 1K 5% 1/16W
R111 1-218-981-11 RES-CHIP 220K 5% 1/16W
R112 1-218-981-11 RES-CHIP 220K 5% 1/16W
R113 1-218-973-11 RES-CHIP 47K 5% 1/16W
R114 1-218-953-11 RES-CHIP 1K 5% 1/16W
R115 1-218-953-11 RES-CHIP 1K 5% 1/16W
R118 1-218-990-11 SHORT CHIP 0
R120 1-218-949-11 RES-CHIP 470 5% 1/16W
R121 1-218-943-11 RES-CHIP 150 5% 1/16W
R125 1-218-957-11 RES-CHIP 2.2K 5% 1/16W
R126 1-218-990-11 SHORT CHIP 0
R127 1-218-957-11 RES-CHIP 2.2K 5% 1/16W
R128 1-218-953-11 RES-CHIP 1K 5% 1/16W
R129 1-218-953-11 RES-CHIP 1K 5% 1/16W
R131 1-218-953-11 RES-CHIP 1K 5% 1/16W
R132 1-218-953-11 RES-CHIP 1K 5% 1/16W
R133 1-218-953-11 RES-CHIP 1K 5% 1/16W
R134 1-218-953-11 RES-CHIP 1K 5% 1/16W
R135 1-218-953-11 RES-CHIP 1K 5% 1/16W
C414 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C415 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C417 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C418 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C421 1-100-352-91 CERAMIC CHIP 1uF 20% 16V
C424 1-119-750-11 TANTAL. CHIP 22uF 20% 6.3V
C425 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C428 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C429 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C430 1-164-874-11 CERAMIC CHIP 100PF 5% 50V
C431 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C432 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C450 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C456 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C457 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C458 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C459 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C460 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C461 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C462 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C463 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C464 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C465 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C466 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C467 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C468 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C483 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
< CONNECTOR >
CN201 1-770-619-11 PIN, CONNECTOR 2P
CN451 1-817-549-51 CONNECTOR, FPC 8P
< DIODE >
D102 6-501-537-01 DIODE CL-191S-PP193-D-T (RED)
D103 6-501-538-01 DIODE CL-191S-PB168-D-T (BLUE)
D201 8-719-082-45 DIODE RB715W-TL
D250 6-500-453-01 DIODE CRS08-TE85R
< FERRITE BEAD >
FB201 1-400-050-11 INDUCTOR, FERRITE BEAD
FB202 1-400-050-11 INDUCTOR, FERRITE BEAD
FB402 1-218-990-11 SHORT CHIP 0
FB405 1-218-990-11 SHORT CHIP 0
FB421 1-469-084-21 FERRITE 0mH
FB423 1-469-084-21 FERRITE 0mH
FB424 1-218-990-11 SHORT CHIP 0
< IC >
IC101 (Not supplied) IC CXN1450-2ABL
IC151 6-709-935-01 IC XC6109N16ANR
IC201 6-709-718-01 IC XC9226A186MR
IC202 6-710-808-01 IC TK63115SCL-G@GT
IC203 6-708-696-01 IC XC6219B282MR
IC204 6-711-118-01 IC XC6213B202MR
IC251 6-709-933-01 IC XC9103D093MR
IC261 6-704-354-02 IC BQ24010ADRCR
IC401 (Not supplied) IC WM8711LGEFL/R
IC420 6-709-817-01 IC NCP2809BDMR2G
MAIN
•IC101(CXN1450-2ABL), IC401 (WM8711LGEF/R)and IC451 (uPD78F0500FC(S)-AA3-A)
on MAIN board cannot be replaced individually.
Replace it with “MAIN BOARD, COMPLETE”.

18
DR-BT50
Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks
R136 1-218-953-11 RES-CHIP 1K 5% 1/16W
R137 1-218-953-11 RES-CHIP 1K 5% 1/16W
R139 1-218-953-11 RES-CHIP 1K 5% 1/16W
R151 1-218-965-11 RES-CHIP 10K 5% 1/16W
R152 1-218-941-81 RES-CHIP 100 5% 1/16W
R201 1-218-977-11 RES-CHIP 100K 5% 1/16W
R202 1-218-973-11 RES-CHIP 47K 5% 1/16W
R203 1-218-977-11 RES-CHIP 100K 5% 1/16W
R204 1-218-985-11 RES-CHIP 470K 5% 1/16W
R205 1-218-953-11 RES-CHIP 1K 5% 1/16W
R206 1-218-973-11 RES-CHIP 47K 5% 1/16W
R217 1-218-953-11 RES-CHIP 1K 5% 1/16W
R251 1-218-990-11 SHORT CHIP 0
R252 1-208-943-11 METAL CHIP 220K 0.5% 1/16W
R253 1-218-974-11 METAL CHIP 56K 0.5% 1/16W
R261 1-218-965-11 RES-CHIP 10K 5% 1/16W
R262 1-218-965-11 RES-CHIP 10K 5% 1/16W
R263 1-208-671-11 METAL CHIP 330 0.5% 1/16W
R264 1-208-911-11 METAL CHIP 10K 0.5% 1/16W
R265 1-208-691-11 METAL CHIP 2.2K 0.5% 1/16W
R407 1-218-969-11 RES-CHIP 22K 5% 1/16W
R408 1-218-969-11 RES-CHIP 22K 5% 1/16W
R421 1-218-990-11 SHORT CHIP 0
R422 1-218-969-11 RES-CHIP 22K 5% 1/16W
R423 1-218-969-11 RES-CHIP 22K 5% 1/16W
R451 1-218-953-11 RES-CHIP 1K 5% 1/16W
R452 1-218-953-11 RES-CHIP 1K 5% 1/16W
R453 1-218-953-11 RES-CHIP 1K 5% 1/16W
R454 1-218-953-11 RES-CHIP 1K 5% 1/16W
R455 1-218-953-11 RES-CHIP 1K 5% 1/16W
R456 1-218-953-11 RES-CHIP 1K 5% 1/16W
R457 1-218-953-11 RES-CHIP 1K 5% 1/16W
R458 1-218-953-11 RES-CHIP 1K 5% 1/16W
R459 1-218-953-11 RES-CHIP 1K 5% 1/16W
R460 1-218-953-11 RES-CHIP 1K 5% 1/16W
R461 1-218-953-11 RES-CHIP 1K 5% 1/16W
R462 1-218-977-11 RES-CHIP 100K 5% 1/16W
R463 1-218-977-11 RES-CHIP 100K 5% 1/16W
R464 1-218-977-11 RES-CHIP 100K 5% 1/16W
R465 1-218-977-11 RES-CHIP 100K 5% 1/16W
R467 1-218-977-11 RES-CHIP 100K 5% 1/16W
R468 1-218-977-11 RES-CHIP 100K 5% 1/16W
R469 1-218-977-11 RES-CHIP 100K 5% 1/16W
R470 1-218-977-11 RES-CHIP 100K 5% 1/16W
R471 1-218-953-11 RES-CHIP 1K 5% 1/16W
R472 1-218-973-11 RES-CHIP 47K 5% 1/16W
R473 1-218-965-11 RES-CHIP 10K 5% 1/16W
< SWITCH >
S101 1-771-844-21 SWITCH, TACTILE (SMD) (POWER)
S209 1-771-844-21 SWITCH, TACTILE (SMD) (MULTI FUNCTION)
< VARISTOR >
VDR201 1-802-081-11 VARISTOR (SMD)
VDR421 1-802-081-11 VARISTOR (SMD)
VDR422 1-802-081-11 VARISTOR (SMD)
************************************************************
A-1231-897-A MIC BOARD, COMPLETE
********************
< CAPACITOR >
C122 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
************************************************************
A-1231-894-A SWITCH BOARD, COMPLETE
***********************
< RESISTOR >
R208 1-218-953-11 RES-CHIP 1K 5% 1/16W
R209 1-218-953-11 RES-CHIP 1K 5% 1/16W
R211 1-218-953-11 RES-CHIP 1K 5% 1/16W
< SWITCH >
S207 1-771-844-21 SWITCH, TACTILE (SMD) ( +)
S208 1-771-844-21 SWITCH, TACTILE (SMD) ( –)
************************************************************
MISCELLANEOUS
**************
21-542-593-12 DRIVER (040F020)
54 1-542-593-12 DRIVER (040F020)
60 X-2178-104-1 LITHIUM ION BATTERY SUB ASSY
(AEP, UK, E. KR)
60 X-2178-114-1 LITHIUM ION BATTERY SUB ASSY (US, CND)
MIC301 1-542-708-21 ELECTRET CONDENSER MICROPHONE
************************************************************
ACCESSORIES
************
01-478-846-12 ADAPTOR, AC (AC-ES3010K2) (US, CND)
01-478-847-11 ADAPTOR, AC (AC-ES3010K2) (KR)
01-478-848-13 ADAPTOR, AC (AC-ES3010K2) (AEP, E)
01-478-849-12 ADAPTOR, AC (AC-ES3010K2) (UK)
2-888-579-01 POUCH, CARRYING
3-095-523-11 MANUAL, INSTRUCTION (ENGLISH) (AEP, UK)
3-095-523-21 MANUAL, INSTRUCTION
(FRENCH, SPANISH, GERMAN) (AEP)
3-095-523-31 MANUAL, INSTRUCTION (ITALIAN, DUTCH,
PORTUGUESE, RUSSIAN) (AEP)
3-095-523-41 MANUAL, INSTRUCTION (DANISH, FINNISH,
NORWEGIAN, SWEDISH) (AEP)
3-095-523-51 MANUAL, INSTRUCTION (ENGLISH, SPANISH)
(US)
3-095-523-61 MANUAL, INSTRUCTION (ENGLISH, FRENCH)
(CND)
3-095-523-71 MANUAL, INSTRUCTION (ENGLISH) (E, KR)
3-095-523-81 MANUAL, INSTRUCTION (KOREAN) (KR)
SWITCHMICMAIN

19
DR-BT50
MEMO

DR-BT50
REVISION HISTORY
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Ver. Date Description of Revision
1.0 2007.02 New