St Eval-fda903u-sa User manual

Introduction

This document describes how to use the evaluation board in order to check FDA903U device performance; for any other

information and deeper details please refer to the FDA903U datasheet.

Evaluation board for FDA903U power amplifier

UM2635

User manual

UM2635 - Rev 1 - September 2019

For further information contact your local STMicroelectronics sales office.

www.st.com

1Purpose

The purpose of this document is to describe the FDA903U Stand Alone Demo Module for Slug Up package.

Table 1. Board summary

Order Code Device supported

EVAL-FDA903U-SA FDA903U

It contains the module description, the schematic, the bill of materials and the board layout of the following

module:

6038-492.19

In the following chapters it will be referred as 492 module.

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Purpose

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2Warning

This evaluation board/kit is intended for the following uses:

• Engineering development

• Demonstrations

• Evaluation purposes only

and is not considered by ST Microelectronics (ST) to be a finished end-product fit for general consumer use.

The people who handle the product(s) must have electronics training and observe good engineering standard

practices.

As such, the goods being provided are not intended to be complete in terms of required design-, marketing-,

and/or manufacturing-related protective considerations, including product safety and environmental measures

typically found in end products that incorporate such semiconductor components or circuit boards.

This evaluation board/kit does not fall within the purpose of the European Union directives regarding

electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore

may not meet the technical requirements of these directives or other related directives.

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Warning

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3Module description

This board is a 1x45W class D amplifier based on the ST FDA903U and is intended to demonstrate the device’s

capabilities.

Figure 1. 6038-492.19 - top view

Figure 2. 6038-492.19 with Coilcraft XAL4040 - bottom view

Note: The output LC filter in this module can be assembled with different values and kind of coils and capacitors. By

default it is assembled for a 14.4V application with ferrite coils that are a good compromise considering

performances, price and availability that allow to drive 4 ohm.

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Module description

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3.1 HW Configuration and Control SW

3.1.1 Connectors and connections

The 492 module embeds a Stand Alone connection which is different from the previous power amplifiers boards

developed.

Based on that:

•The Voltage Supply to the power amplifier can be provided through J3 connector (Vbat 3.3–18V, GND) with

the chance to use the sense technique close to the device through the VCC/GND test points;

•The Feedback default configuration including the output L-C low-pass filter, allowing superior frequency

response linearity and lower distortion. Furthermore, there is also the chance to use the FDA903U as

traditional class D amplifiers with the feedback directly connected to the PWM output (before L-C filter

stage). Both working modes can be selected mounting or not the following resistors:

Table 2. Working mode selection

R5, R6 R7, R8

Traditional feedback 0 Ω DO NOT MOUNT

Feedback after the demodulation filter DO NOT MOUNT 0 Ω

•The Device State and Address Selection of the power amplifier can be set through the ENABLE pins ENx

( x = 1, 2, 3, 4) on J10 connector. With an open connection the ENx is set to high logical value and through a

jumper it is possible to pull down (to GND) the ENx desired thus setting the low logical value. In this way it is

possible to select different I2C addresses (up to 8) or to configure the device in 4 different legacy modes

according to the Data Sheet table;

•The HW Mute of the power amplifier can be set through the MUTE pin on J10 connector. With an open

connection the MUTE pin is set to high value (the amplifier is in play state) and through a jumper it is

possible to pull down (to GND) the MUTE pin thus setting the low value and put in mute state the amplifier;

•The Output Channel of the power amplifier can be monitored/analyzed through the J1 connector (CH+/

CH-);

3.1.2 How to manage the I2C

3.1.2.1 I2C HW & SW control

For the programmability of a “Stand Alone module” in terms of I2C settings, there is the J10 connector on 424

stand alone module (I2C SCL, I2C SDA, GND).

GUI is available and it is running on a Windows PC if the user adopts ST interface board (description available in

the dedicated user manual)

For the GUI description, please refer to its own manuals.

There are other possibilities to control the device in terms of I2C settings (e.g. FTDI, etc) but the SW control

needs to be implemented by the final user.

3.1.2.2 I2S HW & SW control

The I2S signals (I2S SCL, I2S WS, I2S SDA1) of 492 “Stand Alone module” can be provided through the J10

connector with different HW configurations:

1. Directly from Audio Precision instruments:

a. PSIA controller (AP 2700 series)

b. Digital Serial Transmitter (APx5xx series)

2. ST interface board (description available in the dedicated user manual)

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HW Configuration and Control SW

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4Schematic, BOM and layouts

4.1 Schematic

Figure 3. Schematic

GND_DIG

GND_PWR

GND_SHLD

GND_ANA

EN4

I2S_SDA1

I2C_SCL

I2S_SCL

I2S_WS

I2S_TEST

CD/DIAG

I2C_SDA

DVdd

EN3

EN2

EN1

AVdd

VCC

DGSVR

D1V8SVR

MUTE

4.7nF

4.7uF

10nF

SVR

A5VSVR

AGSVR

10R

3.3uF

330pF

1uF

R2 10R

GND_PWR

10uHL2

XAL6060-103ME

OUT1- CH1-

R8 0R

R6 0R

FB1-

10R

3.3uF

330pF

1uF

R1 10R

GND_PWR

10uHL1

XAL6060-103ME

OUT1+CH1+

R7 0R

R5 0R FB1+

TAB 1

GNDM 2

VCCM 3

OUTM 4

OUTM 5

FBM 6

NC 7

DGND 8

DVDD 9

ENABLE 1 10

ENABLE 2 11

ENABLE 3 12

ENABLE 4 13

THSENS 14

CDDIAG 15

NC 16

D1V8SVR 17

DGSVR 18

I2CDATA

I2CCLK

I2STEST

I2SDATA

I2SCLK

I2SWS

AGND

AVDD

AGSVR

A5VSVR

SVR

HWMUTE

FBP

OUTP

GNDP

VCCP

FDA903

SLUG UP

PowerSSO-36

(exposed pad)

TP2

GND

TP1

THS

Heatsink

C20

1uF

C19

100nF

VCC

TP4

C27

1uF

C28

100nF

C22

33nF

C23

33pF

R10

PRG18BB470MB1RB

MMSZ4684T1

EN1

EN2

EN3

R13 10K

R12 10K

C18

100pF

R15 10K

R11 10K

3V3

R14 10K

STD DONGLE CONNECTOR

CH1+

CH1-

SPEAKERS CONNECTOR

EN4

C21

470uF

POWER STAGE

Q1 STS10P4LLF6

R17

22K

R16

22K

C26

1uF

4.7uH

SM6T36CAY

C24

4.7uF

C25

4.7uF

C14

100pF

C15

10nF

C17

100pF

C16

10nF

VCC

3V3

TP3

GND

TP6

I2S_SCL

I2S_WS

I2S_SDA1

I2S_SDA2

11 12

13 14

15 16

17 18

19 20

21 22

23 24

25 26

27 28

29 30

31 32

33 34

35 36

37 38

39 40

20x2 p2.54mm M Horiz.

CD/DIAG

I2C_SCL

Vbatt

I2C_SDA

Vbatt

AVdd

BLM2

BLM18BD102SN1

DVdd

I2S_TEST

MMBZ5244B

MUTE

Vbatt

GND

TP5

C13

4.7uF

C11

100pF

C12

10nF

BLM1

BLM18BA220SN1

C10

100pF

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

J11

8x2 p2.54mm M Horiz.

I2S_SCL

I2S_WS

I2S_SDA1

I2S_SDA2

I2C_SCL

I2C_SDA

1 2

3 4

5 6

7 8

9 10

11 12

13 14

15 16

J12

8x2 p2.54mm F Horiz.

I2S_SCL

I2S_WS

I2S_SDA1

I2C_SCL

I2C_SDA

I2S_SDA2

BUSES EXP CONNECTORS

CLOSE TO VDD PINS

CLOSE TO VCC PINS

4.2 Bill of materials

Table 3. Bill of materials

Quantity Designator Description VALUE

RATED

TOLERANCE PACKAGE

V I P F

1 U1 FDA903U - Fully digital class D

amplifier 1ch PSSOP36

1 R9 SMD Resistor 1 K 1% 0805

2 R7, R8 SMD Resistor 0 R 1% 0603

2 R5, R6 SMD Resistor 0 R 1% 0603

2 R16, R17 SMD Resistor 22 K 1% 0603

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Schematic, BOM and layouts

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Quantity Designator Description VALUE

RATED

TOLERANCE PACKAGE

V I P F

5R11, R12, R13, R14,

R15 SMD Resistor 10 K 1% 0603

1 R10 SMD PTC Thermistor 47 R 20% 0603

4 R1, R2, R3, R4 SMD Resistor 10 R 0.5 W 1% 1210

1 Q1 P-Channel MOSFET 40 V 10 A SOIC

1 L3 Inductor 4.7 µH 11 A 20%

2 L1, L2 Inductor 10 µH 7.6 A

2 J2, J3 Terminal Block 2position

p5.08mm

1 J12 Header, 8-Pin, Dual row, Female,

TH, Right Angle

1 J11 Header, 8-Pin, Dual row, Right

Angle

1 J1 Header Male, Dual row, SMD,

Horiz.

1 H1 Heatsink

4 F1, F2, F3, F4 FIDUCIAL

1 D3 Bidirectional 36V Transil 36 V 600 W DO-214AA

1 D2 14V Zener Diode 14 V 0.225 W 5% SOT-23

1 D1 3.3V Zener Diode 3.3 V 0.5 W 5% SOD-23

4 C9, C12, C15, C16 SMD MLCC X7R Capacitor 10 nF 50 V 10% 0603

2 C8, C13 SMD MLCC X7R Capacitor 4.7 µF 25 V 10% 0805

1 C7 SMD MLCC C0G/NP0 Capacitor 4.7 nF 50 V 5% 0603

5C5, C6, C20, C26,

C27 SMD MLCC X7R Capacitor 1 µF 50 V 10% 0805

2 C3, C4 SMD MLCC X7R Capacitor 3.3 µF 50 V 20% 1210

2 C24, C25 SMD MLCC X7R Capacitor 4.7 µF 100 V 10% 2020

1 C23 SMD MLCC C0G/NP0 Capacitor 33 pF 50 V 5% 0603

1 C22 SMD MLCC X7R Capacitor 33 nF 50 V 10% 0603

1 C21 Alluminium Polarized Capacitor

SMD 470 µF 50 V

2 C19, C28 SMD MLCC X7R Capacitor 100 nF 50 V 10% 0603

5C10, C11, C14, C17,

C18 SMD MLCC C0G/NP0 Capacitor 100 pF 50 V 5% 0603

2 C1, C2 SMD MLCC C0G/NP0 Capacitor 330 pF 50 V 5% 0603

1 BLM2 SMD EMI SUppression Filter 0.2 A 100 MHz 0603

1 BLM1 SMD EMI SUppression Filter 0.5 A 100 MHz 0603

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Bill of materials

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4.3 PCB layouts

All the useful circuitry/components for the FDA903U, in terms of PCB space occupation, are highlighted by the

black rectangle while outside there are the power supply stage and connectors (Vbat, Out, Signal Controls I2C,

I2S, Enables, Mute, CDDIAG).

Figure 4. 6038-492.19 - FDA903U – Top layer and silkscreen

Figure 5. 6038-492.19 - FDA903U – Inner1 layer

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PCB layouts

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Figure 6. 6038-492.19 - FDA903U – Inner2 layer

Figure 7. 6038-492.19 - FDA903U – Bottom layer and silkscreen

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PCB layouts

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Revision history

Table 4. Document revision history

Date Version Changes

17-Sep-2019 1 Initial release.

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Contents

1Purpose ...........................................................................2

2Warning ...........................................................................3

3Module description ................................................................4

3.1 HW Configuration and Control SW ................................................4

3.1.1 Connectors and connections................................................5

3.1.2 How to manage the I2C....................................................5

4Schematic, BOM and layouts ......................................................6

4.1 Schematic ....................................................................6

4.2 Bill of materials ................................................................6

4.3 PCB layouts ...................................................................8

Revision history .......................................................................10

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Contents

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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

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Table of contents