Texas Instruments TMAG5170D User manual

User’s Guide
TMAG5170DEVM
ABSTRACT
This user’s guide describes the characteristics, operation, and use of the TMAG5170D evaluation module
(EVM). This EVM is designed to evaluate the performance of the TMAG5170D. Throughout this document,
the terms evaluation board, evaluation module, and EVM are synonymous with the TMAG5170DEVM. This
document includes a schematic, reference printed circuit board (PCB) layouts, and a complete bill of materials
(BOM).
Table of Contents
1 Overview..................................................................................................................................................................................2
1.1 Kit Contents........................................................................................................................................................................2
1.2 Related Documentation From Texas Instruments.............................................................................................................. 2
2 Hardware................................................................................................................................................................................. 3
2.1 Features............................................................................................................................................................................. 3
3 Operation.................................................................................................................................................................................3
3.1 Quick Start Setup............................................................................................................................................................... 3
3.2 EVM Operation...................................................................................................................................................................4
4 Schematics, PCB Layout, and Bill of Materials................................................................................................................. 12
4.1 Schematics.......................................................................................................................................................................13
4.2 PCB Layout...................................................................................................................................................................... 15
4.3 Bill of Materials.................................................................................................................................................................17
Trademarks
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All trademarks are the property of their respective owners.
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1 Overview
The TMAG5170D is a dual-die, 3-axis linear Hall-effect sensor. This device integrates three independent Hall
sensors in X, Y, and Z axes on each die. A precision analog signal-chain along with integrated 12-bit ADC
digitizes the measured analog magnetic field values. The device can be configured further to select one of three
magnetic field ranges that suits the magnet strength and component placements during system calibration.
Table 1-1. TMAG5170D Device Summary
PRODUCT SENSITIVITY RANGE OPTIONS
TMAG5170DA2 ±75 mT, ±150 mT, ±300 mT
TMAG5170DA1 is not yet available and is not currently installed on the EVM.
1.1 Kit Contents
Table 1-2 lists the contents of the EVM kit. Contact the nearest Texas Instruments Product Information Center if
any component is missing.
Table 1-2. Kit Contents
ITEM QUANTITY
TMAG5170DEVM 1
3D-printed Rotate & Push module 1
Handheld magnet 1
1.2 Related Documentation From Texas Instruments
This user's guide is available from the TI website under literature number SBAU420. Any letter appended to the
literature number corresponds to the document revision that is current at the time of the writing of this document.
Newer revisions are available from www.ti.com or the Texas Instruments' Literature Response Center at (800)
477-8924 or the Product Information Center at [phone]. When ordering, identify the document by both
title and literature number. Table 1-3 lists documentation related to the EVM. Click the links in Table 1-3 for
further information. The device name links to the product web folder on www.ti.com. The literature number links
to the document PDF.
Table 1-3. Related Documentation
DOCUMENT TITLE
DOCUMENT LITERATURE
NUMBER
TMAG5170D-Q1 data sheet SLYS052
TI-SCB user's guide SLAU839
TMAG5170 EVM Quick Start Video —
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2 Hardware
The EVM is an easy-to-use platform for evaluating the main features and performance of the TMAG5170D.
The EVM includes a graphical user interface (GUI) used to read and write registers, as well as view and save
measurement results. Also included is a 3D-printed Rotate & Push module to test the common functions of angle
measurement and push button with a single device.
The EVM is intended to provide basic functional evaluation of the devices. The layout is not intended to be a
model for the target circuit, nor is the model laid out for electromagnetic compatibility (EMC) testing. The EVM
has both sensitivity variations of the TMAG5170D installed, and may be broken into two separate boards as
needed. The EVM is intended to interface with the TI-SCB, but may be used as a stand-alone device if desired.
2.1 Features
• Snap-apart PCB for TMAG5170DA2 sensitivity evaluation
• GUI support to read and write device registers, as well as view and save measurement results
• 3D-printed Rotate & Push module
• Micro-USB connector for power supply
3 Operation
3.1 Quick Start Setup
To set up and use the EVM, follow these steps:
1. Download and install the PAMB Windows® USB driver: http://www.ti.com/lit/zip/sbac253
2. Attach the EVM to the Sensor Control Board (TI-SCB) (see Figure 3-1).
3. Connect the EVM to a PC using a USB cable.
a. Insert the micro USB cable into the TI-SCB Controller onboard USB receptacle J2.
b. Plug the other end of the USB cable into a PC.
4. Access the GUI from the following link in either a Firefox™ or Google Chrome™ browser:
a. TMAG5170DEVM GUI: https://dev.ti.com/gallery/search/TMAG5170D
5. Configure the device through the register map settings:
a. Click Write Config to Both
b. Set OPERATING_MODE within the DEVICE_CONFIG register to "Active Measure Mode" (0b101)
c. Set MAG_CH_EN within the SENSOR_CONFIG register to "XYZ" (0b0111)
6. Navigate to the Plots panel and click Collect Data
7. Apply a magnetic field to the sensor by doing one of the following:
a. Wave the included handheld magnet around the sensor.
b. Use the Rotate & Push module by attaching it to the EVM (see Figure 3-10). For more details on how to
use this module, see Section 3.2.2.
8. Observe the outputs in the GUI. See Section 3.2.1.3 for more information on GUI setup and operation.
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3.2 EVM Operation
To use the EVM with the included TI-SCB Controller, connect the EVM as shown in Figure 3-1.
Figure 3-1. EVM on TI-SCB Controller
It is optional to snap apart the TMAG5170DEVM to separate the TMAG5170DA1 and TMAG5170DA2 halves. To
snap apart the PCB, flex the PCB at the indicated boundary shown in Figure 3-2.
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Figure 3-2. TMAG5170DEVM Snap Apart Edge
3.2.1 Setup
3.2.1.1 Driver Installation
Download and install the PAMB Windows USB driver: http://www.ti.com/lit/zip/sbac253. This is a one-time step
per computer. Unzip the folder and run the .exe file with administrator privileges.
3.2.1.2 Firmware
The GUI can load firmware onto the TI-SCB as described in Section 3.2.1.3.1. Firmware updates will be pushed
through the GUI (requires driver installation). Downloaded offline GUIs may check for GUI/Firmware updates
depending on the version.
3.2.1.2.1 Firmware Debug
If the firmware gets corrupted or must be manually reinstalled for any reason, follow these steps to reinstall the
firmware. This is demonstrated in the TMAG5170 EVM Quick Start Video:
1. Configure the MCU on the TI-SCB Controller to Device Firmware Update (DFU) Mode.
a. It is possible that the MCU has already entered DFU mode. If so, the GUI will notify you and try to
update the firmware to the latest version after the GUI is connected to the PC.
b. DFU mode can be entered manually through one of the following methods while the TI-SCB Controller is
powered on:
• Through software:
– Send the command 'bsl' on the TI-SCB's USB Serial (COM) port.
• Though the hardware:
– Ensure TI-SCB is connected to the PC through a USB
– Short the two test points near PK1 and PK2 of the header pins (see Figure 3-3) with a pair of
tweezers (or wire) while pressing the RESET button.
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Figure 3-3. Test Points Used to Enter DFU Mode Manually
c. LEDs D1 and D2 will be off if successful
2. With the MCU in DFU mode, upload the firmware through the GUI:
• Open the File menu and select Program Device
• The firmware update will initiate
• After the GUI re-initializes, the TI-SCB should automatically connect
If the firmware programming was unsuccessful, TI recommends to repeat the above steps with a different
USB port connection on the machine.
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3.2.1.3 GUI Setup and Usage
Access the GUI from the following link in either a Firefox or Google Chrome browser:
• TMAG5170DEVM GUI: https://dev.ti.com/gallery/search/TMAG5170D
3.2.1.3.1 Initial Setup
To set up the GUI the first time, follow these steps:
1. Make sure that the above mentioned driver was installed successfully to ensure that everything works
properly and that the GUI can update the EVM firmware, if necessary.
2. With the EVM/TI-SCB Controller unit plugged to the PC, go to the GUI link:
3. To launch the GUI from the web browser, click the GUI Composer application to open the GUI Composer
window (see Figure 3-4).
Figure 3-4. GUI Composer Application Window
a. For first-time GUI Composer setup, follow the prompts to download the TI Cloud Agent and browser
extension (see Figure 3-5). These prompts will appear after you close the README.md dialog.
Figure 3-5. TI Cloud Agent
4. Optionally, click the icon in the GUI Composer window to download the GUI for offline use (see Figure
3-4).
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3.2.1.3.2 GUI Operation
To operate the GUI, follow these steps:
1. Connect to and launch the GUI as described in Section 3.2.1.3.1.
2. With the EVM connected to the GUI, close the README.md file page. The text near the bottom-left hand
corner of the GUI should read Hardware Connected (see Figure 3-6).
Figure 3-6. Hardware Connected
a. If Hardware Connected does not show in the bottom-left hand corner of the GUI, check different
hardware COM ports under Options → Serial Port (see Figure 3-7).
Figure 3-7. Change Serial Port
b. If the hardware still does not connect, make sure you are using the correct GUI/EVM combination.
3. Click the Registers icon shown in Figure 3-8 (also available on the left-side menu) to view the register
map, change device settings, and enable automatic register read. Each die within the TMAG5170D may
be configured independently using the device select, or both sensors can be configured under the same
register settings (if desired). For questions about a register or register bit field, select the icon. For more
questions about registers, check the data sheet.
Figure 3-8. Registers Page Icon
4. Click the Plots icon to view and save graphical data from the results registers (see Figure 3-9). This is also
available on the left-side menu.
Figure 3-9. Plots Page Icon
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3.2.2 Rotate and Push Demonstration
To use the rotate and push demonstration, follow these steps:
1. Attach the Rotate & Push module to the EVM as shown in Figure 3-10.
Figure 3-10. Rotate & Push Module on EVM
2. In the GUI register page:
a. At this time the Rotate & Push GUI will only show results for the device selected on the register map
page.
b. Make sure that the DEVICE_CONFIG → OPERATING_MODE says (TRIGGER_MODE Active).
c. Make sure that SYSTEM_CONFIG → TRIGGER_MODE is set to the default value.
d. Under the SENSOR_CONFIG register:
i. Make sure both the X and Y channels are enabled (MAG_CH_EN).
ii. Set X_RANGE and Y_RANGE to ±100 mT for A1 versions, and ±133 mT for A2 versions.
iii. Optional: Set ANGLE_EN to X-Y angle calculation.
e. At the top of the register map, set Auto Read to As fast as possible.
3. Go to the Rotate & Push tab inside the Plots page (see Figure 3-11).
Figure 3-11. Rotate & Push GUI Page
4. If the push button LEDs are not triggering at every angle or trigger when they are not supposed to, calibrate
the module by doing the following:
a. With the settings set to run the demo, slowly rotate the module 360° and use the Plots page to record
the absolute value of the minimum and maximum magnetic field measurements (in mT) for both the X
and Y channels.
b. Adjust the Push threshold calibration value found in the Rotate & Push tab to be about 3 mT to 5 mT
larger than the maximum value recorded above.
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3.2.2.1 Optimizing Device Angle Matching
Each 3D Hall-effect sensor is fabricated on a die and the package assembly has these dies stacked vertically for
a minimal offset in the XY plane. Device tolerances for sensitivity gain and offset should be canceled out:
1. Capture the data for one full rotation on both devices with averaging set to 32x for minimal input referred
noise. Set the device to calculate angle using the desired axes.
2. Correct the gain for one axis on each device:
a. Find the maximum and minimum data points for each axis used in the angle measurement
b. If the maximum of either channel is more than 2x the maximum of the other, it will be necessary to
attenuate the channel with the larger input. Otherwise, TI recommends to amplify the output of the
smaller input
c. GAIN_VALUE in the MAG_GAIN_CONFIG register (0h11) is used to select the sensitivity gain
adjustment for the desired axis.
i. Gain is calculated from an 11-bit value / 1024. (For a value ranging from 0-2)
ii. Select the axis to amplify/attenuate using GAIN_SELECTION
iii. Set gain value based on the ratio of:
1. (Max Ch A - Min Ch A)/(Max Ch B - Min Ch B).
2. Where Channel A and B are selected based on step 2b.
3. Repeat step 1 to verify the amplitude matching and to start the calculation of the offset correction
a. For each axis, calculate the offset using:
i. Output Offset = (Maximum Value + Minimum Value) /2
b. Set OFFSET_SELECTION in MAG_OFFSET_CONFIG (0h12) to 0b11 to enable offset correction on
both axes
c. Set OFFSET_VALUE1 and OFFSET_VALUE2 using a 7-bit 2's compliment value to correct output offset
based on maximum and minimum peak data in step 3a.
After correction sensitivity and offset errors of the device, the sensors may still experience some measurement
error due to mechanical rotations of the package relative to the rotating magnet. The most straightforward
alignment method is achieved by placing the sensor on-axis to the rotating magnet.
Figure 3-12. Sensor Alignments for Angle Measurements
In an ideal on-axis placement, the X and Y axis data will observe a decrease in magnitude only, with no impact
to observed angle linearity. As the package is mechanically offset, peak input data for X and Y axes will vary, and
the severity of amplitude correction needed will become more significant. Additionally, package rotations may
cause angle offset relative to the position of the magnet or phase error between the observed X and Y axis input.
This happens as each sensing element detects the field which is orthogonal to the sensing element and the
sensor is no longer orthogonal to the rotating magnet. As a result, each sensing element detects a portion of the
vector component from either of the other two axes. This error may vary based on the installation of either the
magnet or sensor within the system. Often, end-of-line calibration for each sensor is required after full system
assembly to achieve the best results. For more information, refer to the Texas Instruments Achieving Highest
System Angle Sensing Accuracy application note.
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3.2.3 Direct EVM Serial Communication
If desired, you can directly communicate with the TI-SCB without the use of the GUI through the USB serial
(COM) port. Simply send the desired command string over the serial port and receive the results. This is useful
for interfacing the EVM with custom setups, scripts, and GUIs. To read and write registers, use the following
format:
• Select device format: setdevice CMD
– Where CMD is a two bit command transmitted as an integer value (0-3).
• 00 = read/write from device 1
• 01 = read/write from device 2
• 10 = Write to both devices; read from device 1
• 11 = Write to both devices; read from device 2
– A valid set command to write both devices and read from device 1 is:
• Setdevice 0x02
– On the EVM, the SDI and SDO lines are shared, and CS controlled using this command. The MCU may
send the same write command to each device using two consecutive writes, but read data is logged by the
MCU individually.
• Read register format: rreg ADR
– Where ADR is the address in hex, and rreg is always lower case
– Register addresses can be in upper or lower case, and do not need to be led by '0x'. The 0 padding
register addresses is also optional. For example, to read register address 0xA, some valid commands
include:
• rreg a
• rreg 0A
• rreg 0x0A
– When '0x' is used, the 'x' must be lower case.
– For the above example, the EVM would return the results in JSON format
{"acknowledge":"rreg 0x0A"}
{"register":{"address":10,:"value":65488}}
{"evm_state":"idle"}
• Write register format: wreg ADR VAL
– where ADR and VAL are in hex, and wreg is always lower case
– Register addresses and values can be in upper or lower case, and do not need to be led by '0x'. The 0
padding register addresses and values is also optional. For example, to write register address 0x1 with the
value 0x01c0, some valid commands include:
• wreg 1 1c0
• wreg 01 0x1c0
• wreg 0x01 0x01C0
– When '0x' is used, the 'x' must be lower case.
– For the above example, the EVM would return the results in JSON format:
{"acknowledge":"wreg 0x01 0x01C0"}
{"console":"Writing 0x1c0 to SENSOR_CONFIG register"}
{"evm_state":"idle"}
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4 Schematics, PCB Layout, and Bill of Materials
Note
Board layouts are not to scale. These figures are intended to show how the board is laid out. The
figures are not intended to be used for manufacturing EVM PCBs.
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4.1 Schematics
Figure 4-1 and Figure 4-2 show the schematic of the EVM. Figure 4-1 shows the circuitry for the EVM, and Figure 4-2 shows the mechanical components
included with the EVM.
3.3V_1
GND_1
1
3
5
7
9
11
J3A
NRPN062PARN-RC
2
4
6
8
10
12
J3B
NRPN062PARN-RC
3.3 V
PD2
PN5
PN4 PP1
PP0
PQ3
PQ2
PQ0
PQ15.0 V
GND
CSA_1
SCLK_1
SDIA_1
SDOA_1
GND_1
6.3V
0.1uF
C1
GND_1
GND_1
6.3V
0.1uF
C2
GND_1
10.0k
R7
10.0k
R8
1 3
2 4
G
R
D2
HSMF-C165
1 3
2 4
G
R
D1
HSMF-C165
GND_1
GND_1
5V_1
VCCA_1
VCCA_1
VCCB_1
TI-SCB Connector
VCCA_1
VCCB_1
VCCB_1
SCLKA_1
SCLKB_1
ALERTB_1
SDIA_1
SDOA_1
SDIA_1
SDOA_1
VCC1
9
SDO1 7
SCK1 5
SDI1 6
TEST1 11
ALERT1 12
CS1 8
GND1 10
TMAG5170DA1EPWRQ1
U1A
VCC2
16 ALERT2 14
CS2 1
SCK2 3
SDI2 4
SDO2 2
TEST2 13
GND2 15
TMAG5170DA1EPWRQ1
U1B
3.3V_1
3.3V_1
SCLK_1
SCLK_1
CSB_1
CSA_1
150
R5
215
R6
ALERTA_1
215
R4
150
R3
ALERTA_1
ALERTB_1
16V
1uF
C3
16V
1uF
C5
1
2
J2
961102-6804-AR
4
1
2
3
J1
TSW-104-07-G-S
CSB_1
SCLKB_1
SDIB_1
SDOB_1
Dual Sensor
Alert LED Indicators
Redundant 3.3V
SPI Bus 2 Connection
CSB_1
SDOB_1
SDIB_1
3.3V_2
GND_2
1
3
5
7
9
11
J6A
NRPN062PARN-RC
2
4
6
8
10
12
J6B
NRPN062PARN-RC
3.3 V
PD2
PN5
PN4 PP1
PP0
PQ3
PQ2
PQ0
PQ15.0 V
GND
CSA_2
SCLK_2
SDIA_2
SDOA_2
GND_2
6.3V
0.1uF
C6
GND_2
GND_2
6.3V
0.1uF
C7
GND_2
10.0k
R26
10.0k
R27
1 3
2 4
G
R
D4
HSMF-C165
1 3
2 4
G
R
D3
HSMF-C165
GND_2
GND_2
5V_2
VCCA_2
VCCA_2
VCCB_2
TI-SCB Connector
VCCA_2
VCCB_2
VCCB_2
SCLKA_2
SCLKB_2
ALERTB_2
SDIA_2
SDOA_2
SDIA_2
SDOA_2
3.3V_2
3.3V_2
5V_2
SCLK_2
SCLK_2
CSB_2
CSA_2
150
R24
215
R25
ALERTA_2
215
R23
150
R22
ALERTA_2
ALERTB_2
16V
1uF
C8
16V
1uF
C10
1
2
J5
961102-6804-AR
4
1
2
3
J4
TSW-104-07-G-S
CSB_2
SCLKB_2
SDIB_2
SDOB_2
Dual Sensor
Alert LED Indicators
Redundant 3.3V
SPI Bus 2 Connection
CSB_2
SDOB_2
SDIB_2
TMAG5170DA1 TMAG5170DA2
VCC1
9
SDO1 7
SCK1 5
SDI1 6
TEST1 11
ALERT1 12
CS1 8
GND1 10
TMAG5170DA2EPWRQ1
U3A
VCC2
16 ALERT2 14
CS2 1
SCK2 3
SDI2 4
SDO2 2
TEST2 13
GND2 15
TMAG5170DA2EPWRQ1
U3B
3.3V_1B VCCB_1 3.3V_2B VCCB_2
5V_1
GND_2 GND_2GND_2GND_1 GND_1 GND_1
TP1 TP2
OUT 1
NR/FB 2
GND 3
EN
4
NC
5
IN
6
PAD 7
TPS73733DRVR
U4
OUT 1
NR/FB 2
GND 3
EN
4
NC
5
IN
6
PAD 7
TPS73733DRVR
U2
33.0
R15
33.0
R16
33.0
R17
33.0
R18
33.0
R34
33.0
R35
33.0
R36
33.0
R37
33.0
R14 33.0 R33
0
R1
0
R2
0
R12
0
R9
0
R10
0
R11 0
R13
0
R20
0
R21
0
R19
0
R31
0
R28
0
R29
0
R30 0
R32
0
R38
10000pF
16V
C4
10000pF
16V
C9
Figure 4-1. TMAG5170DEVM Schematic
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LOGO
PCB
Texas Instruments
FID2FID1 FID3
SENS107
A
PCB Number:
PCB Rev: CE Mark LOGO
PCB
WEEE logo
LOGO
PCB
Texas Instruments CE Mark
LOGO
PCB
WEEE logo
Figure 4-2. Hardware Schematic
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4.2 PCB Layout
Figure 4-3 through Figure 4-6 show the PCB layers of the EVM.
Figure 4-3. Top View
Figure 4-4. Top Layer
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Figure 4-5. Bottom View
Figure 4-6. Bottom Layer
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4.3 Bill of Materials
Table 4-1 provides the parts list for the EVM.
Table 4-1. Bill of Materials
DESIGNATOR QUANTITY VALUE DESCRIPTION PACKAGE
REFERENCE PART NUMBER MANUFACTURER
!PCB1 1 Printed Circuit Board SENS107 Any
C1, C2, C6, C7 4 0.1uF CAP, CERM, 0.1 uF, 6.3 V, +/- 10%, X5R,
0201 0201 GRM033R60J104KE19D MuRata
C3, C5, C8, C10 4 1uF CAP, CERM, 1 uF, 16 V, +/- 10%, X5R, 0402 0402 EMK105BJ105KVHF Taiyo Yuden
C4, C9 2 10nF 10000 pF ±20% 16V Ceramic Capacitor X5R
01005 (0402 Metric) 010005 CM02X5R103M16AH AVX
D1, D2, D3, D4 4 Rg LED, Rg, SMD 1.6x0.8mm HSMF-C165 Avago
J3, J6 2 HDR12 NRPN062PARN-RC Sullins Connector
Solutions
R1, R2, R9, R10, R11, R12, R13,
R20, R21, R28, R29, R30, R31,
R32
14 0 RES, 0, 5%, 0.1 W, 0603 0603 RC0603JR-070RL Yageo
R3, R5, R22, R24 4 150 RES, 150, 5%, 0.05 W, 0201 0201 RC0201JR-07150RL Yageo America
R4, R6, R23, R25 4 215 RES, 215, 1%, 0.05 W, 0201 0201 RC0201FR-07215RL Yageo America
R7, R8, R26, R27 4 10.0k RES, 10.0 k, 1%, 0.1 W, 0402 0402 ERJ-2RKF1002X Panasonic
R14, R15, R16, R17, R18, R33,
R34, R35, R36, R37 10 33.0 RES, 33.0, 1%, 0.05 W, 0201 0201 RC0201FR-0733RL Yageo America
U1 0 Dual-Die High-Precision 3D Linear Hall-Effect
Sensor With SPI TSSOP16 TMAG5170DA1EPWRQ1 Texas Instruments
U2, U4 2
Single Output LDO, 1A, Adj. (1.2 to 5.0V),
Reverse Current Protection, DRV0006A
(WSON-6)
DRV0006A TPS73733DRVR Texas Instruments
U3 1 Dual-Die High-Precision 3D Linear Hall-Effect
Sensor With SPI TSSOP16 TMAG5170DA2EPWRQ1 Texas Instruments
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or
mount. N/A N/A N/A
J1, J4 0 Header, 100mil, 4x1, Gold, TH 4x1 Header TSW-104-07-G-S Samtec
J2, J5 0 Header, 2.54mm, 2x1, Gold, TH Header, 2.54mm, 2x1,
TH 961102-6804-AR 3M
R19, R38 0 0 RES, 0, 5%, 0.1 W, 0603 0603 RC0603JR-070RL Yageo
www.ti.com Schematics, PCB Layout, and Bill of Materials
SBAU420 – MARCH 2023
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TMAG5170DEVM 17
Copyright © 2023 Texas Instruments Incorporated

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
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set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
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User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
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2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

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3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-delivered-in-japan.html
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-for-power-line-communication.html
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.