Texas Instruments CC3000 User manual

TI CC3000 BoosterPack Evaluation Module
Board
User's Guide
Literature Number: SWRU331A
November 2012–Revised August 2014

Contents
Preface ........................................................................................................................................ 4
Revision History ........................................................................................................................... 5
1 Introduction......................................................................................................................... 6
2 CC3000 BoosterPack EVM Board........................................................................................... 7
2.1 BoosterPack EVM Board Top View ....................................................................................... 7
2.2 CC3000 BoosterPack EVM Board Bottom View......................................................................... 9
2.3 Antenna...................................................................................................................... 10
2.4 Hardware Setup ............................................................................................................ 13
2.5 CC3000 BoosterPack Schematic ........................................................................................ 14
2.6 Bill of Materials (BOM)..................................................................................................... 15
2.6.1 PCB Design Guidelines .......................................................................................... 15
2.6.2 RF Trace ........................................................................................................... 15
2.6.3 Antenna............................................................................................................. 16
2.6.4 Power Trace ....................................................................................................... 17
2.6.5 Ground.............................................................................................................. 17
3 Application Development .................................................................................................... 18
2Contents SWRU331A–November 2012–Revised August 2014
Submit Documentation Feedback
Copyright © 2012–2014, Texas Instruments Incorporated

www.ti.com
List of Figures
2-1. BoosterPack EVM Board (Top View) ..................................................................................... 7
2-2. CC3000 BoosterPack EVM Board (Bottom View)....................................................................... 9
2-3. Antenna Location and RF Trace Routing ............................................................................... 10
2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack EVM Board .............................. 11
2-5. Return Loss From the ACX Antenna and Matching Circuit........................................................... 11
2-6. Antenna Radiation Pattern................................................................................................ 12
2-7. Host PCB Mating Connector Arrangement ............................................................................. 13
2-8. CC3000 BoosterPack Schematics....................................................................................... 14
2-9. Trace Design for PCB Layout ............................................................................................ 15
2-10. Antenna Layout Guidelines ............................................................................................... 16
2-11. Power Trace ................................................................................................................ 17
2-12. Ground Routing for the CC3000 BoosterPack EVM Board........................................................... 17
3-1. MSP-EXP430G2 Test Platform and CC3000 BoosterPack EVM Board............................................ 18
List of Tables
2-1. Key Parts of CC3000 BoosterPack EVM Board Top View............................................................. 7
2-2. J2 Configuration of the CC3000 EVM Board............................................................................. 8
2-3. Header J11 of the CC3000 BoosterPack EVM Board Top View...................................................... 8
2-4. Header J12 of the CC3000 BoosterPack EVM Board Top View...................................................... 8
2-5. Header J9 of the CC3000 BoosterPack EVM Board (Bottom View).................................................. 9
2-6. Header J10 of the CC3000 BoosterPack EVM Board (Bottom View)............................................... 10
2-7. LaunchPad to BoosterPack Pin Comparison........................................................................... 13
2-8. PCB Stack-Up Data........................................................................................................ 15
2-9. Trace Design Measurement Values ..................................................................................... 16
3
SWRU331A–November 2012–Revised August 2014 List of Figures
Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated

Preface
SWRU331A–November 2012–Revised August 2014
Read This First
About This Manual
This user guide describes how to use the TI CC3000 BoosterPack evaluation module (EVM) board to
evaluate the performance of the TI CC3000 module.
Related Documentation From Texas Instruments
•TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor Data Sheet (SWRS126)
•CC3000 wiki
If You Need Assistance
The primary sources of CC3000 information are the device-specific data sheets and user’s guides. For the
most up-to-date version of the user’s guide and data sheets, see the CC3000 module product page.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required
to take whatever measures may be required to correct this interference.
SimpleLink is a trademark of Texas Instruments.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
4Read This First SWRU331A–November 2012–Revised August 2014
Submit Documentation Feedback
Copyright © 2012–2014, Texas Instruments Incorporated

www.ti.com Revision History
Revision History
Changes from Original (November 2012) to A Revision ................................................................................................ Page
• Changed wiki title in Related Documentation From Texas Instruments ........................................................... 4
• Changed link name in If You Need Assistance ....................................................................................... 4
• Changed wiki title in Table 2-2 .......................................................................................................... 8
• Changed typo in Table 2-6: name for pin 7 changed from WL_SPI_CLK, pin type changed from input, and description
changed from clock input............................................................................................................... 10
• Changed wiki title in Chapter 3 ........................................................................................................ 18
• Changed link name in Chapter 3 ...................................................................................................... 18
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
5
SWRU331A–November 2012–Revised August 2014 Revision History
Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated

Chapter 1
SWRU331A–November 2012–Revised August 2014
Introduction
This user's guide describes how to use the TI CC3000 BoosterPack EVM board to evaluate the
performance and functionality of the TI CC3000 module. The TI CC3000 module is a self-contained Wi-Fi®
solution that enables Internet connectivity for a wide variety of embedded applications. This document
details the key parts and features of the CC3000 BoosterPack EVM board along with the different options
available for the user and includes layout guidelines to assist in PCB development.
6Introduction SWRU331A–November 2012–Revised August 2014
Submit Documentation Feedback
Copyright © 2012–2014, Texas Instruments Incorporated

SWRU331-001
Chapter 2
SWRU331A–November 2012–Revised August 2014
CC3000 BoosterPack EVM Board
2.1 BoosterPack EVM Board Top View
Figure 2-1 shows the top view of the CC3000 BoosterPack EVM board.
Figure 2-1. BoosterPack EVM Board (Top View)
Table 2-1 describes the key parts and jumpers mounted on top of the CC3000 BoosterPack EVM board.
Table 2-1. Key Parts of CC3000 BoosterPack EVM Board Top View
Part Name Description
CC3000MOD Core module for performance evaluation. For more information, see the CC3000 module
datasheet (SWRS126).
Antenna Can be used for radiated testing by reworking the capacitor to correct pads
J1 U.FL RF connector used for conductive power tests
J2 Used to swap between test mode and operation mode. When pins 2 and 3 are shorted, J2 runs in
operation mode. When pins 1 and 2 are shorted, J2 runs in test mode.
J11 Through-hole test points (for more information, see Table 2-3)
J12 Through-hole test points (for more information, see Table 2-4)
J13 Used to switch between external power and power from the motherboard. Can be used for power
measurements. Connect pins 1 and 2 for power from the LaunchPad flash programmer and
debugging tool. Connect pins 2 and 3 for external power.
J14 DC jack for external power supply. If power is not supplied from the motherboard, ensure that
external power is applied.
7
SWRU331A–November 2012–Revised August 2014 CC3000 BoosterPack EVM Board
Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated

BoosterPack EVM Board Top View www.ti.com
Table 2-2 describes the J2 configuration of the CC3000 EVM board.
Table 2-2. J2 Configuration of the CC3000 EVM Board
Mode Description
Test mode: CC3000 radio Connect pins 1 and 2. Test mode is used with the CC3000 radio tool to operate, test, and
tool(1) calibrate the CC3000 chipset designs during development. This tool uses the RS232/UART pins
to run radio frequency (RF) RX and TX tests on the CC3000 module. For more information, see
the CC3000 wiki.
Functional mode: Normal mode Connect pins 2 and 3. Normal mode is for regular functionality between the host platform and the
CC3000 module.
(1) For more information about test software for the PC, see the CC3000 wiki.
Table 2-3 describes the signals on J11.
Table 2-3. Header J11 of the CC3000 BoosterPack EVM Board Top View
Pin Pin Name Pin Type Descriptions
1 Reserved – Reserved
2 Reserved – Reserved
3 WL_RS232_TX Output RS232 transmit output; used for radio tool serial interface
in test mode. Leave floating in functional mode.
4 WL_RS232_RX Input RS232 receive output; used for radio tool serial interface
in test mode. Leave floating in functional mode.
Table 2-4 describes the signals on J12.
Table 2-4. Header J12 of the CC3000 BoosterPack EVM Board Top View
Pin Pin Name Pin Type Descriptions
1 GND – Ground
2 SCL_CC3000 Output I2C clock signal output from the CC3000 module. This pin
is connected to SCL_EEPROM through a 0-Ωresistor
and is not used by end users.
3 SCL__EEPROM Input I2C clock signal input from EEPROM inside the CC3000
module. This pin is connected to SCL_CC3000 using a
0-Ωresistor and is not used by end users.
4 SDA_CC3000 Input and output I2C data signal from the CC3000 module. This pin is
connected to SDA_EEPROM using a 0-Ωresistor and is
not used by end users.
5 SDA_EEPROM Input and output I2C data signal from EEPROM inside the CC3000
module. This pin is connected to SDA_CC3000 using a
0-Ωresistor and is not used by end users.
8CC3000 BoosterPack EVM Board SWRU331A–November 2012–Revised August 2014
Submit Documentation Feedback
Copyright © 2012–2014, Texas Instruments Incorporated

SWRU331-002
www.ti.com CC3000 BoosterPack EVM Board Bottom View
2.2 CC3000 BoosterPack EVM Board Bottom View
The two BoosterPack mating connectors (J9 and J10) connect to the host platform and mount to the
bottom of the BoosterPack EVM board, as shown in Figure 2-2.
Figure 2-2. CC3000 BoosterPack EVM Board (Bottom View)
Table 2-5 describes the signals on J9.
Table 2-5. Header J9 of the CC3000 BoosterPack EVM Board (Bottom View)
Pin Pin Name Pin Type Descriptions
1 VBAT_IN Power In Battery voltage input to module. For the MSP430 host
platform, VIO_HOST = VBAT_IN. For other platforms
that have different voltage levels from the battery
voltages, R14 can be removed.
2 VBAT_SW_EN Input Active-high enables signal from the host device
3 Reserved – Reserved
4 Reserved – Reserved
5 Reserved – Reserved
6 Reserved – Reserved
7 WL_SPI_CLK Input Host interface SPI clock input
8 Reserved – Reserved
9 Reserved – Reserved
10 Reserved – Reserved
9
SWRU331A–November 2012–Revised August 2014 CC3000 BoosterPack EVM Board
Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated

SWRU331-003
AT8010-E2R9HAA
Z
XY
Antenna www.ti.com
Table 2-6 describes the signals on J10.
Table 2-6. Header J10 of the CC3000 BoosterPack EVM Board (Bottom View)
Pin Pin Name Pin Type Descriptions
1 GND – Ground
2 WL_SPI_IRQ Output Host interface SPI interrupt request
3 WL_SPI_CS Input Host interface SPI chip select
4 Reserved – Reserved
5 Reserved – Reserved
6 WL_SPI_DIN Input Host interface SPI data input
7 WL_SPI_DOUT Output Host interface SPI data output
8 Reserved – Reserved
9 Reserved – Reserved
10 Reserved – Reserved
2.3 Antenna
The ACX ceramic mounts on the BoosterPack EVM board with a specific layout and matching circuit for
the radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX
ceramic antenna on the BoosterPack EVM board and the RF trace routing from the CC3000 module to the
antenna.
Figure 2-3. Antenna Location and RF Trace Routing
10 CC3000 BoosterPack EVM Board SWRU331A–November 2012–Revised August 2014
Submit Documentation Feedback
Copyright © 2012–2014, Texas Instruments Incorporated