Texas Instruments BQ24296M User manual

User's Guide
SLUUB62A–August 2014–Revised March 2015
bq24296M and bq24298 EVM (PWR655) User’s Guide
This user's guide describes the characteristics, operation, and use of the PWR655 bq24296MEVM and
bq24298EVM (EVM). This document details the equipment required, equipment setup, testing procedures,
schematics, PCB assembly and layout drawings, and bill of materials (BOM).
Contents
1 Introduction ................................................................................................................... 2
1.1 EVM Features....................................................................................................... 2
1.2 I/O Descriptions..................................................................................................... 2
2 Test Summary................................................................................................................ 4
2.1 Equipment ........................................................................................................... 4
2.2 Equipment Setup.................................................................................................... 5
2.3 Test Procedure...................................................................................................... 7
3 PCB Layout Guideline ..................................................................................................... 10
4 Board Layout, Schematic, and Bill of Materials ........................................................................ 11
4.1 Board Layout....................................................................................................... 11
4.2 Schematics......................................................................................................... 15
4.3 Bill of Materials .................................................................................................... 17
List of Figures
1 Connections of the EV2300 or EV2400 Kit............................................................................... 5
2 Original Test Setup for PWR655 .......................................................................................... 5
3 Main Window of the bq24296M Evaluation Software................................................................... 6
4 Main Window of the bq24298 Evaluation Software ..................................................................... 6
5 CHG Mode Ripple and Duty Cycle: VBUS = 5 V, VBAT = 3.7 V .......................................................... 8
6 Boost Mode Ripple and Duty Cycle: VBAT = 3.7 V ....................................................................... 9
7 PWR655 EVM Top Layer ................................................................................................. 11
8 PWR655 EVM Second Layer............................................................................................. 12
9 PWR655 EVM Third Layer................................................................................................ 13
10 PWR655 EVM Bottom Layer ............................................................................................. 14
11 bq24296M Schematic...................................................................................................... 15
12 bq24298 Schematic........................................................................................................ 16
List of Tables
1 Device Data Sheets ......................................................................................................... 2
2 EVM Connections............................................................................................................ 2
3 Jumper Connections ........................................................................................................ 3
4 Recommended Operating Conditions..................................................................................... 3
5 Device ID JEITA Settings................................................................................................... 9
6 bq24296M Bill of Materials................................................................................................ 17
7 bq24298 Bill of Materials.................................................................................................. 19
1
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Introduction www.ti.com
1 Introduction
1.1 EVM Features
For detailed features and operation, refer to Table 1 for a list of devices and their data sheets.
Table 1. Device Data Sheets
Device Document
bq24296M SLUSBU3
bq24298 SLUSC59
The bq24296M and bq24298 evaluation modules (EVM) are complete charger modules for evaluating an
I2C-controlled single NVDC-1 charge using the bq24296M and bq24298 devices.
This EVM doesn’t include the USB-to-GPIO interface board. To evaluate the EVM, a USB-to-GPIO
interface board must be ordered separately.
1.2 I/O Descriptions
Table 2 lists the jumper connections available on this EVM.
Table 2. EVM Connections
Jack Description
J1–VBUS Input: positive terminal
J1–GND Input: negative terminal (ground terminal)
J2–PMID PMID pin connection/Power bank output
J2–GND Ground/Power bank output negative terminal
J3–SYS Connected to system
J3–GND Ground
J4–BAT+ Connected to battery pack
J4–GND Ground
J6–INT INT pin connection
J6– OTG OTG pin connection
J6–CE CE pin connection
J6–GND Ground
J7 USB-to-GPIO connector (USB interface adapter connector – EV2300 or EV2400)
J8 External TS1 pin connection
J8 Ground
J9 External TS2 pin connection
J9 Ground
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www.ti.com Introduction
Table 3 lists the controls and key parameter settings for this EVM.
Table 3. Jumper Connections
Jack Description Factory Setting
JP1 For bq24296M and bq24298 input current setting: bq24296M and bq24298:
spacePSEL LOW: Adaptor input Short PSEL to LOW
spacePSEL HIGH: USB input
JP2 D-/PG pin selection bq24296M and bq24298:
Short D–/PG to PG
JP3 TS2 or QON selector bq24296M and bq24298:
Select QON Installed
JP4 TS2 pin setting Not installed
JP5 D+/D– connections for bq24296M input current limit setting Not installed
JP6 USB current limit selection pin during buck mode and PSEL is high (JP1- Not installed
High)/Enable pin during boost mode.
In buck mode: OTG = High, IIN limit = 500 mA; OTG = Low, IIN limit = 100 mA.
The boost mode is activated when the REG01[5:4] = 10 and OTG pin is HIGH.
JP7 CE pin setting: pull low to enable the charge Not Installed:
(GUI also can pull CE low)
JP8 STAT, PG, CE, INT, OTG pin internal pull-up source (VSYS) jumper bq24296M and bq24298:
Installed
JP9 TS1 Resistor Divider pull-up source (REGN) bq24296M and bq24298:
Installed
JP10 Internal 10 kΩfrom TS1 to ground bq24296M and bq24298:
Short TS2 and TS2-I
JP11 TS2 Connection Not Installed
Table 4 lists the recommended operating conditions for this EVM.
Table 4. Recommended Operating Conditions
Symbol Description MIN TYP MAX Unit
Supply voltage, VIN Input voltage from AC adapter 3.9 5 6.2 VDC
Battery voltage, VBAT Voltage applied at VBAT terminal 0 3.7 4.4 V
IBAT Fast charging current 3 A
Discharging current through internal MOSFET 5.5 A
Supply current, IAC Maximum input current from AC adapter input 0 3 A
Output current, ISYS Output current (SYS) 0 3.5 A
Operating junction 0 125 °C
temperature range, TJ
3
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Test Summary www.ti.com
2 Test Summary
Section 2.1 through Section 2.3 explains the equipment,equipment setup, and test procedure.
2.1 Equipment
2.1.1 Power Supplies
Power supply #1 (PS #1): a power supply capable of supplying 5 V at 1 A is required. While this part can
handle larger voltage and current, it is not necessary for this procedure.
2.1.2 Load #1 (4-Quadrant Supply, Constant Voltage < 4.5 V)
A 0–20 V/0–5 A, > 30-W system, DC electronic load and setting as constant voltage load mode.
or:
Kepco load: BOP 20–5M, DC 0 to ±20 V, 0 to ±5 A (or higher).
or:
Real single-cell battery.
2.1.3 Load #2 – Use with Boost Mode
PMID to GND load, 10 Ω, 5 W or greater.
2.1.4 Meters
Six Fluke 75 multimeters, (equivalent or better).
or:
Four equivalent voltage meters and two equivalent current meters.
The current meters must be capable of measuring 5 A+ current.
2.1.5 Computer
A computer with at least one USB port and a USB cable. The Battery Management Studio (bqStudio)
(SLUC525) must be properly installed.
2.1.6 USB-to-GPIO Communication Kit (EV2300 or EV2400 - USB Interface Adapter)
2.1.7 Software
Download the bqStudio software and double-click on the file. Follow the installation steps. The software
supports the Microsoft®Windows®XP and Windows 7 operating systems.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
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www.ti.com Test Summary
2.2 Equipment Setup
Use the following steps to setup the equipment:
Step 1. Set PS #1 for 5-V DC, 1-A current limit and then turn off the supply.
Step 2. Connect the output of PS #1 in series with a current meter (multimeter) to J1 (VBUS and GND).
Step 3. Connect a voltage meter across J1 (VBUS) and J1 (GND).
Step 4. Turn on the Load, set to constant voltage mode and output to 2.5 V. Turn off (disable) Load.
Connect Load in series with a current meter (multimeter), ground side, to J4 (BAT+ and
GND) as shown in Figure 2.
Step 5. Connect a voltage meter across J4 (BAT+ and GND).
Step 6. Connect the USB interface adapt to the computer and connect SDA, SCL, and GND to
TP12(SDA), TP13(SCL), and TP8 (AGND) on the EVM, respectively. Figure 1 shows the
connections.
Figure 1. Connections of the EV2300 or EV2400 Kit
Step 7. Figure 2 illustrates the shunt installation.
Figure 2. Original Test Setup for PWR655
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Test Summary www.ti.com
8. Turn on the computer. Launch the evaluation software. The main windows of the bq24296M and
bq24298 software are shown in Figure 3 and Figure 4, respectively.
Figure 3. Main Window of the bq24296M Evaluation Software
Figure 4. Main Window of the bq24298 Evaluation Software
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www.ti.com Test Summary
2.3 Test Procedure
2.3.1 Current Settings
1. Make sure equipment setup steps are followed.
ILIM Setting: Set the potentiometer to its lowest value for max input current by connecting an
ohmmeter between point TP9 and ground. Turn the screw on the potentiometer counterclockwise until
the resistance drops to its lowest point (this should be in the range of 125 Ωto 175 Ω, the value of R7)
2. Launch the GUI software, if not already done
3. Turn on PS #1
Measure →V (J3(SYS), J3(GND)) = 4.10 ±300 mV
2.3.2 Charge Voltage and Current Regulation of VIN and Device ID Verification
Follow steps 1–7 and verify the outputs and IC for the EVM:
Step 1. Software setup (all of Step 1 is done in the GUI)
(a) Device address: bq24296M and bq24298
(b) Click the Read button
(c) Select Disabled for I2C Watchdog Timer Limit
(d) Set Input Voltage Limit to 4.2 V
(e) Set Input Current Limit to 500 mA
(f) Set Charge Voltage Limit to 4.208 V
(g) Set Fast Charge Current, ICHG to 512 mA
(h) Set Pre-Charge Current to 256 mA
(i) Deselect Enable Termination (see the following images)
(j)
7
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Test Summary www.ti.com
Click the Read button twice
Observe →Everything normal at FAULT box
Observe →D3 (STAT) is on
Observe →D4 (PG) is on
Step 2. Enable Load #1 from Section 2.2, step 4. Measure the voltage across J3 and J4 as follows:
Measure →V(J3(SYS), J3(GND)) = 3.65 V ±300 mV
Measure →V(J4(BAT), J4(GND)) = 2.5 V ±200 mV
Step 3. Increase the constant voltage load to 3.7 VDC
Measure →V(J3(SYS), J3(GND)) = 3.75 V ±200 mV
Measure →IBAT = 500 mA ±200 mA
Measure →V(J4(BAT), J4(GND)) = 3.7 V ±200 mV
Step 4. In the software, set Fast Charge Current, ICHG to 1024 mA
Measure →IIN = 500 mA ±200 mA
Step 5. Verify scope measurements (See Figure 5 – 500 ns/div)
C1 (AC coupled 20 mV/div): Vac_PMID (TP2 to GND) – Ripple excluding high frequency
spikes < 10 mV
C2 (5 V/div): Vdc_SW (TP1) – Frequency between 1.25 MHz and 1.5 MHz, duty cycle
between 73% and 81%
C3 (AC coupled, 20 mV/div): Vac_VSYS (TP4 to GND) – Excluding high frequency spikes <
15 mV
Figure 5. CHG Mode Ripple and Duty Cycle: VBUS =5V,VBAT = 3.7 V
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www.ti.com Test Summary
6. Switch to Boost mode
(a) Turn off and disconnect PS #1
(b) If the constant voltage load connected from BAT+ to GND is not a four-quadrant supply
(sources current), remove the load and use the power source disconnected in step one,
set to 3.7 V and 2-A current limit and connect between BAT+ and GND
(c) Apply 10 Ω(5 W or greater) across J2 (PMID(+) to GND(–)
(d) Uncheck the OTG Low box in the GUI
(e) Check the Enable OTG option in the GUI
(f) Verify VPMID to GND on J2 is between 4.9 V and 5.3 V
(g) Verify scope measurement (see Figure 6):
C1 (AC coupled 20 mV/div): Vac_PMID (TP2 to GND) – Ripple excluding high frequency
spikes
C2 (5 V/div): Vdc_SW (TP1) – Frequency between 1.2 MHz and 1.7 MHz, duty cycle
between 67% and 74%
Figure 6. Boost Mode Ripple and Duty Cycle: VBAT = 3.7 V
spacer
Step 6. Verify Device ID JEITA shown in software matches Table 5.
Table 5. Device ID JEITA Settings
Assembly Number EVM Part Number Device ID JEITA
PWR655-001 bq24296EVM-655 bq24296M Disabled
PWR655-002 bq24298EVM-655 bq24298 Disabled
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PCB Layout Guideline www.ti.com
3 PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the
components minimizing high-frequency current path loop is important to prevent electrical and magnetic
field radiation and high-frequency resonant problems. This PCB layout priority list must be followed in the
order presented for proper layout:
1. Place the input capacitor as close as possible to the PMID and GND pin connections and use the
shortest possible copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this
trace to lower electrical and magnetic field radiation but make the trace wide enough to carry the
charging current. Do not use multiple layers in parallel for this connection. Minimize parasitic
capacitance from this area to any other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a
short copper trace connection or GND plane.
4. Route analog ground separately from power ground. Connect analog ground and connect power
ground separately. Connect analog ground and power ground together using power pad as the single
ground connection point or use a 0-Ωresistor to tie analog ground to power ground.
5. Use a single ground connection to tie the charger power ground to the charger analog ground just
beneath the IC. Use ground copper pour but avoid power pins to reduce inductive and capacitive noise
coupling.
6. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
7. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB
ground. Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground
plane on the other layers.
8. The via size and number should be enough for a given current path.
See the EVM design for the recommended component placement with trace and via locations. For the
QFN information, refer to Quad Flatpack No-Lead Logic Packages (SCBA017) and QFN/SON PCB
Attachment (SLUA271).
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www.ti.com Board Layout, Schematic, and Bill of Materials
4 Board Layout, Schematic, and Bill of Materials
This section contains the board layouts,schematics, and BOMs.
4.1 Board Layout
Figure 7 through Figure 10 illustrate the board layouts for this EVM.
Figure 7. PWR655 EVM Top Layer
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Figure 8. PWR655 EVM Second Layer
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Figure 9. PWR655 EVM Third Layer
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Figure 10. PWR655 EVM Bottom Layer
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PGND
VBUS
VBUS
GND
PMID
GND
System
GND
Battery
GND
Vbus: 3.9V to 6.2V
2.2µF
C9
DNP
1
2
J3
VBUS 1
D- 2
D+ 3
ID 4
GND 5
6 7 8
11 10 9
J5
1
2
J2
1
2
J1
1000pF
C8
DNP
1
2 3 4 5
TP1
PGNDPGND
PMID
0
R13
10.0k
R14
10.0k
R15
10.0k
R5
0.047µF
C4
AGND
REGN
1000pF
C10
DNP
1000pF
C17
DNP
PGND
PGND
SYS
PGND
1
2
J4
1000pF
C20
DNP
BAT
PGND
1 2
3 4
5 6
7 8
9 10
J7
D+/PSEL
D-/PG
1
2
JP6
1
2
3
JP2
STAT
SCL
SDA
1 2
JP8
PULL-UP
PULL-UP
INT
OTG
CE
AGND
10.0k
R6
DNP
PULL-UP
10.0k
R7
1
2
JP7
AGND
768
R18
ILIM
TS1
Green
D3
Green
D4
2.21k
R21
2.21k
R22
PULL-UP
STAT PG
AGND
D-
PG
10µF
C13
DNP
200
R8
30.1k
R3
5.23k
R2
VBUS
1
2JP5
D-
D+/PSEL
4
1
2
3
J6
INT
OTG
CE
200
R9
200
R10
200
R11
200
R12
OTG CE
D+/PSEL
SDASCL
1 2
JP9
REGN
1
2
J8
10.0k
R23
1
2
JP10
AGND
1
2
J9
1
2
3
JP4
30.1k
R25
DNP
5.23k
R24
DNP
REGN
10.0k
R26
DNP
1
2
JP11
AGND
TS1
GND
TS2
GND
TS1
TS2
TS2-1
TP2
TP3
TP10
TP4
TP5
D-/PG
ILIM
OTG
TP14
TP18
REGN
STAT
CE
TP19
TP11
TP15
SCLSDA
D+/PSEL
TS1
TP12
TP16
TP20
INT
TP13
TP17
TP9
10µF
C12
DNP
10µF
C11
DNP
TP6
PGND
TP8
AGND
TP7
AGND
REGN
SYS
1
2
3
JP3
QON
TS2
QON/TS2
QON
TS2
S1
KSR221GLFS
1µF
C22
100k
R20
AGND
PG
D-
0.1µF
C14
DNP
1µF
C18
DNP
1
2
3
JP1
D+/PSEL
AGND
REGN
PSEL
HI
LOW
TEST POINTS
10.0k
R4
QON/TS2
NT1
Net-Tie
PGND
PGND
PGND
PGND
50k
R19
VBUS
1
PSEL
2
PG
3
STAT
4
SCL
5
SDA
6
INT
7
OTG
8
CE
9
ILIM
10
TS 11
QON 12
BAT 13
BAT 14
SYS 15
SYS 16
PGND 17
PGND 18
SW 19
SW 20
BTST 21
REGN 22
PMID
23
VBUS
24
PAD 25
U1
bq24296MRGE
130
R1
D1
DNP
D5
ZLLS350TA
1uH
L1
D2
DNP
TS2
TS1
PGNDAGND
10µF
C5
10µF
C6
10µF
C15
DNP
10µF
C16
DNP
10µF
C7
10µF
C19
DNP
1µF
C1
10µF
C2
0.1µF
C21
150k
R16
75.0k
R17
4.7µF
C3
www.ti.com Board Layout, Schematic, and Bill of Materials
4.2 Schematics
This section includes the bq24296M and bq24298 schematics.
Figure 11. bq24296M Schematic
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PGND
VBUS
VBUS
GND
PMID
GND
System
GND
Battery
GND
Vbus: 3.9V to 6.2V
2.2µF
C9
DNP
1
2
J3
VBUS 1
D- 2
D+ 3
ID 4
GND 5
6 7 8
11 10 9
J5
1
2
J2
1
2
J1
1000pF
C8
DNP
1
2 3 4 5
TP1
PGNDPGND
PMID
0
R13
10.0k
R14
10.0k
R15
10.0k
R5
0.047µF
C4
AGND
REGN
1000pF
C10
DNP
1000pF
C17
DNP
PGND
PGND
SYS
PGND
1
2
J4
1000pF
C20
DNP
BAT
PGND
1 2
3 4
5 6
7 8
9 10
J7
D+/PSEL
D-/PG
1
2
JP6
1
2
3
JP2
STAT
SCL
SDA
1 2
JP8
PULL-UP
PULL-UP
INT
OTG
CE
AGND
10.0k
R6
DNP
PULL-UP
10.0k
R7
1
2
JP7
AGND
768
R18
ILIM
TS1
Green
D3
Green
D4
2.21k
R21
2.21k
R22
PULL-UP
STAT PG
AGND
D-
PG
10µF
C13
DNP
200
R8
30.1k
R3
5.23k
R2
VBUS
1
2JP5
D-
D+/PSEL
4
1
2
3
J6
INT
OTG
CE
200
R9
200
R10
200
R11
200
R12
OTG CE
D+/PSEL
SDASCL
1 2
JP9
REGN
1
2
J8
10.0k
R23
1
2
JP10
AGND
1
2
J9
1
2
3
JP4
30.1k
R25
DNP
5.23k
R24
DNP
REGN
10.0k
R26
DNP
1
2
JP11
AGND
TS1
GND
TS2
GND
TS1
TS2
TS2-1
TP2
TP3
TP10
TP4
TP5
D-/PG
ILIM
OTG
TP14
TP18
REGN
STAT
CE
TP19
TP11
TP15
SCLSDA
D+/PSEL
TS1
TP12
TP16
TP20
INT
TP13
TP17
TP9
10µF
C12
DNP
10µF
C11
DNP
TP6
PGND
TP8
AGND
TP7
AGND
REGN
SYS
1
2
3
JP3
QON
TS2
QON/TS2
QON
TS2
S1
KSR221GLFS
0
C22
100k
R20
DNP
AGND
PG
D-
0.1µF
C14
DNP
1µF
C18
DNP
1
2
3
JP1
D+/PSEL
AGND
REGN
PSEL
HI
LOW
TEST POINTS
10.0k
R4
QON/TS2
NT1
Net-Tie
PGND
PGND
PGND
PGND
50k
R19
VBUS
1
PSEL
2
PG
3
STAT
4
SCL
5
SDA
6
INT
7
OTG
8
CE
9
ILIM
10
TS 11
QON 12
BAT 13
BAT 14
SYS 15
SYS 16
PGND 17
PGND 18
SW 19
SW 20
BTST 21
REGN 22
PMID
23
VBUS
24
PAD 25
U1
BQ24298RTWR
130
R1
D1
DNP
D5
ZLLS350TA
DNP
1uH
L1
D2
DNP
TS2
TS1
PGNDAGND
10µF
C5
10µF
C6
10µF
C15
DNP
10µF
C16
DNP
10µF
C7
10µF
C19
DNP
1µF
C1
10µF
C2
0.1µF
C21
150k
R16
75.0k
R17
4.7µF
C3
Board Layout, Schematic, and Bill of Materials www.ti.com
Figure 12. bq24298 Schematic
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4.3 Bill of Materials
This section includes the bq24296M and bq24298 BOMs.
Table 6. bq24296M Bill of Materials
Designator Qty Value Description Package Reference Part Number Manufacturer
PCB 1 Printed Circuit Board PWR655 Any
C1 1 1uF CAP, CERM, 1uF, 25V, ±10%, X7R, 0603 0603 C1608X7R1E105K080AB TDK
C2 1 10uF CAP, CERM, 10uF, 25V, ±10%, X5R, 0805 0805 C2012X5R1E106K125AB TDK
C3 1 4.7uF CAP, CERM, 4.7uF, 10V, ±20%, X5R, 0402 0402 GRM155R61A475M MuRata
C4 1 0.047uF CAP, CERM, 0.047uF, 25V, ±10%, X7R, 0402 0402 GRM155R71E473KA88D MuRata
C5, C6, C7, C15, C16, C19 6 10uF CAP, CERM, 10uF, 10V, ±20%, X5R, 0603 0603 C1608X5R1A106M TDK
C21 1 0.1uF CAP, CERM, 0.1uF, 10V, ±10%, X7R, 0402 0402 GRM155R71A104KA01D MuRata
C22 1 1uF CAP, CERM, 1uF, 10V, ±10%, X5R, 0402 0402 GRM155R61A105KE15D MuRata
D3, D4 2 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
D5 1 40V Diode, Schottky, 40V, 0.38A, SOD-523 SOD-523 ZLLS350TA Diodes Inc.
H1, H2, H3, H4 4 Bumpon, Cylindrical, 0.312 X 0.200, Black Black Bumpon SJ61A1 3M
J1, J2, J3, J4 4 2x1 Conn Term Block, 2POS, 3.81mm, TH 2POS Terminal Block 1727010 Phoenix Contact
J5 1 Connector, Receptacle, Micro-USB Type B, R/A, Bottom Mount SMT 7.5x2.45x5mm 0473460001 Molex
J6 1 Terminal Block, 6A, 3.5mm Pitch, 4-Pos, TH 14x8.2x6.5mm ED555/4DS On-Shore Technology
J7 1 Header (shrouded), 100mil, 5x2, High-Temperature, Gold, TH 5x2 Shrouded header N2510-6002-RB 3M
J8, J9, JP5, JP6, JP7, JP8, JP9, 9 Header, 100mil, 2x1, Tin plated, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions
JP10, JP11
JP1, JP2, JP3, JP4 4 Header, 100mil, 3x1, Tin plated, TH Header, 3 PIN, 100mil, Tin PEC03SAAN Sullins Connector Solutions
L1 1 1uH Inductor, Flat Wire, Powdered Iron, 1uH, 4.8A, 0.0336 ohm, SMD 4.7x1.2x4.0mm SRP4012-1R0M Bourns
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll PCB Label 0.650"H x 0.200"W THT-14-423-10 Brady
R1 1 130 RES, 130 ohm, 1%, 0.063W, 0402 0402 CRCW0402130RFKED Vishay-Dale
R2 1 5.23k RES, 5.23k ohm, 1%, 0.063W, 0402 0402 CRCW04025K23FKED Vishay-Dale
R3 1 30.1k RES, 30.1k ohm, 1%, 0.063W, 0402 0402 CRCW040230K1FKED Vishay-Dale
R4, R5, R7, R14, R15, R23 6 10.0k RES, 10.0k ohm, 1%, 0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R8, R9, R10, R11, R12 5 200 RES, 200 ohm, 1%, 0.063W, 0402 0402 CRCW0402200RFKED Vishay-Dale
R13 1 0 RES, 0 ohm, 5%, 0.063W, 0402 0402 CRCW04020000Z0ED Vishay-Dale
R16 1 150k RES, 150k ohm, 1%, 0.063W, 0402 0402 CRCW0402150KFKED Vishay-Dale
R17 1 75.0k RES, 75.0k ohm, 1%, 0.063W, 0402 0402 CRCW040275K0FKED Vishay-Dale
R18 1 768 RES, 768 ohm, 1%, 0.063W, 0402 0402 CRCW0402768RFKED Vishay-Dale
R19 1 50k Trimmer, 50k, 0.25W, SMT 4.8x5.3x3.5mm 3214W-1-503E Bourns
R20 1 100k RES, 100k ohm, 1%, 0.063W, 0402 0402 CRCW0402100KFKED Vishay-Dale
R21, R22 2 2.21k RES, 2.21k ohm, 1%, 0.063W, 0402 0402 CRCW04022K21FKED Vishay-Dale
S1 1 Switch, Normally open, 2.3N force, 200k operations, SMD KSR KSR221GLFS C and K Components
TP1 1 Compact Probe Tip Circuit Board Test Points, TH, 25 per TH Scope Probe 131-5031-00 Tektronix
TP2, TP3 2 Red Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone
TP4, TP11 2 Orange Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone
TP5 1 Yellow Test Point, Miniature, Yellow, TH Yellow Miniature Testpoint 5004 Keystone
17
SLUUB62A–August 2014–Revised March 2015 bq24296M and bq24298 EVM (PWR655) User’s Guide
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Table 6. bq24296M Bill of Materials (continued)
Designator Qty Value Description Package Reference Part Number Manufacturer
TP6, TP7, TP8 3 SMT Test Point, Compact, SMT Testpoint_Keystone_Compact 5016 Keystone
TP9, TP10, TP12, TP13, TP14, 11 White Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone
TP15, TP16, TP17, TP18, TP19,
TP20
U1 1 I2C Controlled 3A Single Cell USB Charger With Narrow VDC Power Path RGE0024H bq24296MRGE Texas Instruments
Management and Adjustable Voltage USB OTG, RGE0024H
C8, C10, C17, C20 0 1000pF CAP, CERM, 1000pF, 25V, ±5%, C0G/NP0, 0402 0402 C1005C0G1E102J TDK
C9 0 2.2uF CAP, CERM, 2.2uF, 25V, ±10%, X5R, 0402 0402 C1005X5R1E225K050BC TDK
C11, C12, C13 0 10uF CAP, CERM, 10uF, 25V, ±20%, X5R, 0603 0603 GRM188R61E106MA73 MuRata
C14 0 0.1uF CAP, CERM, 0.1uF, 10V, ±10%, X5R, 0402 0402 GRM155R61A104KA01D MuRata
C18 0 1uF CAP, CERM, 1uF, 10V, ±10%, X5R, 0402 0402 GRM155R61A105KE15D MuRata
D1 0 40V Diode, Schottky, 40V, 0.38A, SOD-523 SOD-523 ZLLS350TA Diodes Inc.
D2 0 20V Diode, Schottky, 20V, 1A, 1.4x0.6x0.31mm 1.4x0.6x0.31mm NSR10F20NXT5G ON Semiconductor
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A
R6, R26 0 10.0k RES, 10.0k ohm, 1%, 0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R24 0 5.23k RES, 5.23k ohm, 1%, 0.063W, 0402 0402 CRCW04025K23FKED Vishay-Dale
R25 0 30.1k RES, 30.1k ohm, 1%, 0.063W, 0402 0402 CRCW040230K1FKED Vishay-Dale
18 bq24296M and bq24298 EVM (PWR655) User’s Guide SLUUB62A–August 2014–Revised March 2015
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Table 7. bq24298 Bill of Materials(1)
Designator Qty Value Description Package Reference Part Number Manufacturer Alternate Part Alternate
Number Manufacturer
PCB 1 Printed Circuit Board PWR655 Any - -
C1 1 1uF CAP, CERM, 1uF, 25V, +/-10%, X7R, 0603 0603 C1608X7R1E105K080AB TDK
C2 1 10uF CAP, CERM, 10uF, 25V, +/-10%, X5R, 0805 0805 C2012X5R1E106K125AB TDK
C3 1 4.7uF CAP, CERM, 4.7uF, 16V, +/-10%, X5R, 0603 0603 GRM188R61C475KAAJ MuRata
C4 1 0.047uF CAP, CERM, 0.047uF, 25V, +/-10%, X7R, 0402 0402 GRM155R71E473KA88D MuRata
C5, C6, C7 3 10uF CAP, CERM, 10uF, 10V, +/-20%, X5R, 0603 0603 C1608X5R1A106M TDK
C21 1 0.1uF CAP, CERM, 0.1uF, 10V, +/-10%, X7R, 0402 0402 GRM155R71A104KA01D MuRata
C22 1 0 RES, 0, 5%, 0.063 W, 0402 0402 CRCW04020000Z0ED Vishay-Dale
D3, D4 2 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
H1, H2, H3, H4 4 Bumpon, Cylindrical, 0.312 X 0.200, Black Black Bumpon SJ61A1 3M
J1, J2, J3, J4 4 2x1 Conn Term Block, 2POS, 3.81mm, TH 2POS Terminal Block 1727010 Phoenix Contact
J5 1 Connector, Receptacle, Micro-USB Type B, R/A, 7.5x2.45x5mm 0473460001 Molex
Bottom Mount SMT
J6 1 Terminal Block, 6A, 3.5mm Pitch, 4-Pos, TH 14x8.2x6.5mm ED555/4DS On-Shore Technology
J7 1 Header (shrouded), 100mil, 5x2, High-Temperature, 5x2 Shrouded header N2510-6002-RB 3M
Gold, TH
J8, J9, JP5, JP6, JP7, 9 Header, 100mil, 2x1, Tin plated, TH Header, 2 PIN, 100mil, PEC02SAAN Sullins Connector Solutions
JP8, JP9, JP10, JP11 Tin
JP1, JP2, JP3, JP4 4 Header, 100mil, 3x1, Tin plated, TH Header, 3 PIN, 100mil, PEC03SAAN Sullins Connector Solutions
Tin
L1 1 1uH Inductor, Flat Wire, Powdered Iron, 1uH, 4.8A, 4.7x1.2x4.0mm SRP4012-1R0M Bourns
0.0336 ohm, SMD
LBL1 1 Thermal Transfer Printable Labels, 0.650" W x 0.200" PCB Label 0.650"H x THT-14-423-10 Brady - -
H - 10,000 per roll 0.200"W
R1 1 130 RES, 130 ohm, 1%, 0.063W, 0402 0402 CRCW0402130RFKED Vishay-Dale
R2 1 5.23k RES, 5.23k ohm, 1%, 0.063W, 0402 0402 CRCW04025K23FKED Vishay-Dale
R3 1 30.1k RES, 30.1k ohm, 1%, 0.063W, 0402 0402 CRCW040230K1FKED Vishay-Dale
R4, R5, R7, R14, R15, 6 10.0k RES, 10.0k ohm, 1%, 0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R23
R8, R9, R10, R11, 5 200 RES, 200 ohm, 1%, 0.063W, 0402 0402 CRCW0402200RFKED Vishay-Dale
R12
R13 1 0 RES, 0 ohm, 5%, 0.063W, 0402 0402 CRCW04020000Z0ED Vishay-Dale
R16 1 150k RES, 150k ohm, 1%, 0.063W, 0402 0402 CRCW0402150KFKED Vishay-Dale
R17 1 75.0k RES, 75.0k ohm, 1%, 0.063W, 0402 0402 CRCW040275K0FKED Vishay-Dale
R18 1 768 RES, 768 ohm, 1%, 0.063W, 0402 0402 CRCW0402768RFKED Vishay-Dale
R19 1 50k Trimmer, 50k, 0.25W, SMT 4.8x5.3x3.5mm 3214W-1-503E Bourns
R21, R22 2 2.21k RES, 2.21k ohm, 1%, 0.063W, 0402 0402 CRCW04022K21FKED Vishay-Dale
S1 1 Switch, Normally open, 2.3N force, 200k operations, KSR KSR221GLFS C and K Components
SMD
SH-JP1, SH-JP2, SH- 6 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M SNT-100-BK-G Samtec
JP3, SH-JP8, SH-JP9,
SH-JP10
(1) Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
19
SLUUB62A–August 2014–Revised March 2015 bq24296M and bq24298 EVM (PWR655) User’s Guide
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Table 7. bq24298 Bill of Materials(1) (continued)
Designator Qty Value Description Package Reference Part Number Manufacturer Alternate Part Alternate
Number Manufacturer
TP1 1 Compact Probe Tip Circuit Board Test Points, TH, 25 TH Scope Probe 131-5031-00 Tektronix
per
TP2, TP3 2 Red Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone
TP4, TP11 2 Orange Test Point, Miniature, Orange, TH Orange Miniature 5003 Keystone
Testpoint
TP5 1 Yellow Test Point, Miniature, Yellow, TH Yellow Miniature 5004 Keystone
Testpoint
TP6, TP7, TP8 3 SMT Test Point, Compact, SMT Testpoint_Keystone_Co 5016 Keystone
mpact
TP9, TP10, TP12, 11 White Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone
TP13, TP14, TP15,
TP16, TP17, TP18,
TP19, TP20
U1 1 I2C Controlled 3A Single Cell USB Charger With RTW0024H BQ24298RTWR Texas Instruments BQ24298RTWT Texas Instruments
Narrow VDC Power Path Management and
Adjustable Voltage USB OTG, RTW0024H
C8, C10, C17, C20 0 1000pF CAP, CERM, 1000pF, 25V, +/-5%, C0G/NP0, 0402 0402 C1005C0G1E102J TDK
C9 0 2.2uF CAP, CERM, 2.2uF, 25V, +/-10%, X5R, 0402 0402 C1005X5R1E225K050BC TDK
C11, C12, C13 0 10uF CAP, CERM, 10uF, 25V, +/-20%, X5R, 0603 0603 GRM188R61E106MA73 MuRata
C14 0 0.1uF CAP, CERM, 0.1uF, 10V, +/-10%, X5R, 0402 0402 GRM155R61A104KA01D MuRata
C15, C16, C19 0 10uF CAP, CERM, 10uF, 10V, +/-20%, X5R, 0603 0603 C1608X5R1A106M TDK
C18 0 1uF CAP, CERM, 1uF, 10V, +/-10%, X5R, 0402 0402 GRM155R61A105KE15D MuRata
D1, D5 0 40V Diode, Schottky, 40V, 0.38A, SOD-523 SOD-523 ZLLS350TA Diodes Inc.
D2 0 20V Diode, Schottky, 20V, 1A, 1.4x0.6x0.31mm 1.4x0.6x0.31mm NSR10F20NXT5G ON Semiconductor
FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A
R6, R26 0 10.0k RES, 10.0k ohm, 1%, 0.063W, 0402 0402 CRCW040210K0FKED Vishay-Dale
R20 0 100k RES, 100k ohm, 1%, 0.063W, 0402 0402 CRCW0402100KFKED Vishay-Dale
R24 0 5.23k RES, 5.23k ohm, 1%, 0.063W, 0402 0402 CRCW04025K23FKED Vishay-Dale
R25 0 30.1k RES, 30.1k ohm, 1%, 0.063W, 0402 0402 CRCW040230K1FKED Vishay-Dale
20 bq24296M and bq24298 EVM (PWR655) User’s Guide SLUUB62A–August 2014–Revised March 2015
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