Texas Instruments WiLink WL 1MOD Series User manual

WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module –
Wi-Fi®, Bluetooth ®, and Bluetooth Low Energy (LE)
1 Features
• General
– Integrates RF, power amplifiers (PAs), clock,
RF switches, filters, passives, and power
management
– Quick hardware design with TI module
collateral and reference designs
– Operating temperature: –20°C to +70°C
– Small form factor: 13.3 × 13.4 × 2 mm
– 100-pin MOC package
– FCC, IC, ETSI/CE, and TELEC certified with
PCB, dipole, chip, and PIFA antennas
• Wi-Fi®
– WLAN baseband processor and RF transceiver
support of IEEE Std 802.11b, 802.11g, and
802.11n
– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO
at 2.4 GHz for high throughput: 80 Mbps (TCP),
100 Mbps (UDP)
– 2.4-GHz MRC support for extended range
– Fully calibrated: production calibration not
required
– 4-bit SDIO host interface support
– Wi-Fi direct concurrent operation (multichannel,
multirole)
• Bluetooth® and Bluetooth low energy
(WL183xMOD only)
– Bluetooth 5.1 secure connection compliant and
CSA2 support (declaration ID: D032799)
– Host controller interface (HCI) transport for
Bluetooth over UART
– Dedicated audio processor support of SBC
encoding + A2DP
– Dual-mode Bluetooth and Bluetooth low energy
– TI's Bluetooth and Bluetooth low energy
certified stack
• Key benefits
– Reduces design overhead
– Differentiated use cases by configuring
WiLink™ 8 simultaneously in two roles (STA
and AP) to connect directly with other Wi-
Fi devices on different RF channel (Wi-Fi
networks)
– Best-in-class Wi-Fi with high-performance
audio and video streaming reference
applications with up to 1.4× the range versus
one antenna
– Different provisioning methods for in-home
devices connectivity to Wi-Fi in one step
– Lowest Wi-Fi power consumption in connected
idle (< 800 µA)
– Configurable wake on WLAN filters to only
wake up the system
– Wi-Fi and Bluetooth single antenna coexistence
2 Applications
• Internet of things (IoT)
• Multimedia
• Home electronics
• Home appliances and white goods
• Industrial and home automation
• Smart gateway and metering
• Video conferencing
• Video camera and security
3 Description
The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and
Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz
module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers
drivers for high-level operating systems such as Linux® and Android™. Additional drivers, such as WinCE and
RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE
WL1801MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm
WL1805MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm
WL1831MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm
WL1835MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm
(1) For more information, see Section 12.
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

4 Functional Block Diagram
Figure 4-1 shows a functional block diagram of the WL1835MOD variant.
VIO
ZigBee
COEX
PM
MAC/PHY
32.768 kHz
WLAN_SDIO
BT_UART
WRF1
BTRF
BG2
BT
BG1
MAC/PHY
BT_EN
WLAN_EN
VBAT
RF_ANT1
RF_ANT2
26M XTAL
2.4-GHz
SPDT
WRF2
F
F
Interface
Copyright © 2017, Texas Instruments Incorporated
NOTE: Dashed lines indicate optional configurations and are not applied by default.
Figure 4-1. WL1835MOD Functional Block Diagram
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Functional Block Diagram.............................................. 2
5 Revision History.............................................................. 3
6 Device Comparison......................................................... 4
6.1 Related Products........................................................ 4
7 Terminal Configuration and Functions..........................5
7.1 Pin Attributes...............................................................6
8 Specifications.................................................................. 9
8.1 Absolute Maximum Ratings........................................ 9
8.2 ESD Ratings............................................................... 9
8.3 Recommended Operating Conditions.........................9
8.4 External Digital Slow Clock Requirements................10
8.5 Thermal Resistance Characteristics for MOC
100-Pin Package......................................................... 10
8.6 WLAN Performance: 2.4-GHz Receiver
Characteristics.............................................................11
8.7 WLAN Performance: 2.4-GHz Transmitter Power.... 12
8.8 WLAN Performance: Currents.................................. 13
8.9 Bluetooth Performance: BR, EDR Receiver
Characteristics—In-Band Signals................................13
8.10 Bluetooth Performance: Transmitter, BR ............... 15
8.11 Bluetooth Performance: Transmitter, EDR.............. 15
8.12 Bluetooth Performance: Modulation, BR.................15
8.13 Bluetooth Performance: Modulation, EDR.............. 16
8.14 Bluetooth low energy Performance: Receiver
Characteristics – In-Band Signals............................... 16
8.15 Bluetooth low energy Performance: Transmitter
Characteristics.............................................................16
8.16 Bluetooth low energy Performance: Modulation
Characteristics.............................................................17
8.17 Bluetooth BR and EDR Dynamic Currents............. 17
8.18 Bluetooth low energy Currents................................17
8.19 Timing and Switching Characteristics..................... 18
9 Detailed Description......................................................26
9.1 WLAN Features........................................................ 27
9.2 Bluetooth Features....................................................27
9.3 Bluetooth Low Energy Features................................28
9.4 Device Certification................................................... 28
9.5 Module Markings.......................................................30
9.6 Test Grades...............................................................30
9.7 End Product Labeling................................................31
9.8 Manual Information to the End User......................... 31
10 Applications, Implementation, and Layout............... 32
10.1 Application Information........................................... 32
11 Device and Documentation Support..........................38
11.1 Device Support........................................................38
11.2 Support Resources................................................. 41
11.3 Trademarks............................................................. 41
11.4 Electrostatic Discharge Caution.............................. 41
11.5 Glossary.................................................................. 41
12 Mechanical, Packaging, and Orderable
Information.................................................................... 42
12.1 TI Module Mechanical Outline................................ 42
12.2 Tape and Reel Information......................................42
12.3 Packaging Information............................................ 45
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from November 1, 2017 to April 26, 2021 Page
• Updated the numbering format for tables, figures and cross-references throughout the document...................1
• Updated to "Bluetooth 5.1 Secure Connection..." in Section 1 .......................................................................... 1
• Updated Section 6.1, Related Products .............................................................................................................4
• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.2 ...............................................................................27
• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.3 ...............................................................................28
• Deleted the sentence that began "Moreover, the module is also Wi-Fi certified..." in the first paragraph in
Section 9.4, Device Certification ......................................................................................................................28
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6 Device Comparison
The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and
Bluetooth combo connectivity. Table 6-1 compares the features of the module variants.
Table 6-1. TI WiLink™ 8 Module Variants
FEATURE DEVICE
WL1835MOD WL1831MOD WL1805MOD WL1801MOD
WLAN 2.4-GHz SISO(1) ✓ ✓ ✓ ✓
WLAN 2.4-GHz MIMO(1) ✓ ✓
WLAN 2.4-GHz MRC(1) ✓ ✓
Bluetooth ✓ ✓
(1) SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n.
6.1 Related Products
For information about other devices in this family of products or related products, see the following links.
Wireless connectivity overview Lowest power and longest range across 14 wireless connectivity
standards
Sub-1 GHz SimpleLink™ wireless
MCUs
High performance, long range wireless and ultra-low power
consumption
Reference Designs for WL1835MOD Find reference designs leveraging the best in TI technology to solve
your system-level challenges
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7 Terminal Configuration and Functions
Figure 7-1 shows the pin assignments for the 100-pin MOC package.
PIN 19 - GND
PIN 17 - GND
PIN 20 - GND
PIN 23 - GND
PIN 24 - GND
PIN 28 - GND
PIN 29 - GND
PIN 30 - GND
PIN 31 - GND
PIN 18 - RF_ANT2
PIN 21 - RESERVED1
PIN 22 - RESERVED2
PIN 25 - GPIO4
PIN 26 - GPIO2
PIN 27 - GPIO1
PIN 32 - RF_ANT1
PIN 1 - GND
PIN 4 - GPIO10
PIN 5 - GPIO12
PIN 2 - GPIO11
PIN 3 - GPIO9
PIN 6 - WL_SDIO_CMD
PIN 8 - WL_SDIO_CLK
PIN 7 - GND
PIN 9 - GND
PIN 10 - WL_SDIO_D0
PIN 11 - WL_SDIO_D1
PIN 12 - WL_SDIO_D2
PIN 13 - WL_SDIO_D3
PIN 14 - WLAN_IRQ
PIN 15 - GND PIN 16 - GND
PIN 33 - GND
PIN 40 - WLAN_EN
PIN 38 - VIO
PIN 39 - GND PIN 37 - GND PIN 41 - BT_EN PIN 43 - BT_UART_DBG PIN 46 - VBAT_IN
PIN 36 - EXT_32K
PIN 34 - GND
PIN 35 - GND
PIN 42 - WL_UART_DBG
PIN 44 - GND
PIN 45 - GND PIN 47 - VBAT_IN
PIN 48 - GND
PIN 49 - GND
PIN 50 - BT_HCI_RTS
PIN 51 - BT_HCI_CTS
PIN 52 - BT_HCI_TX
PIN 53 - BT_HCI_RX
PIN 54 - GND
PIN 55 - GND
PIN 56 - BT_AUD_IN
PIN 57 - BT_AUD_OUT
PIN 58 - BT_AUD_FSYNC
PIN 60 - BT_AUD_CLK
PIN 59 - GND
PIN 61 - GND
PIN 63 - GND
PIN 62 - RESERVED3
PIN 64 - GND
GND GND
GND GND
GND
GND
GND GND GND
GND GND
GND GND
GND
GND
GND GND GND
GND GND
GND GND
GND
GND
GND GND GND
GND GND
GND GND
GND
GND
GND GND
GND
Pin 2 Indicator
Figure 7-1. 100-Pin MOC Package (Bottom View)
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7.1 Pin Attributes
Table 7-1 describes the module pins.
Table 7-1. Pin Attributes
PIN NAME PIN
NO.
TYPE/
DIR
SHUTDOWN
STATE(1)
AFTER
POWER
UP(1)
VOLTAGE
LEVEL
CONNECTIVITY(2)
DESCRIPTION(3)
1801 1805 1831 1835
Clocks and Reset Signals
WL_SDIO_CLK 8 I Hi-Z Hi-Z 1.8 V v v v v
WLAN SDIO clock.
Must be driven by the
host.
EXT_32K 36 ANA – v v v v Input sleep clock:
32.768 kHz
WLAN_EN 40 I PD PD 1.8 V v v v v Mode setting: high =
enable
BT_EN 41 I PD PD 1.8 V x x v v Mode setting: high =
enable
Power-Management Signals
VIO_IN 38 POW PD PD 1.8 V v v v v Connect to 1.8-V
external VIO
VBAT_IN 46 POW VBAT v v v v Power supply input, 2.9
to 4.8 V
VBAT_IN 47 POW VBAT v v v v Power supply input, 2.9
to 4.8 V
TI Reserved
GPIO11 2 I/O PD PD 1.8 V v v v v Reserved for future
use. NC if not used.
GPIO9 3 I/O PD PD 1.8 V v v v v Reserved for future
use. NC if not used.
GPIO10 4 I/O PU PU 1.8 V v v v v Reserved for future
use. NC if not used.
GPIO12 5 I/O PU PU 1.8 V v v v v Reserved for future
use. NC if not used.
RESERVED1 21 I PD PD 1.8 V x x x x Reserved for future
use. NC if not used.
RESERVED2 22 I PD PD 1.8 V x x x x Reserved for future
use. NC if not used.
GPIO4 25 I/O PD PD 1.8 V v v v v Reserved for future
use. NC if not used.
RESERVED3 62 O PD PD 1.8 V x x x x Reserved for future
use. NC if not used.
WLAN Functional Block: Int Signals
WL_SDIO_CMD_1V8 6 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO command
WL_SDIO_D0_1V8 10 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 0
WL_SDIO_D1_1V8 11 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 1
WL_SDIO_D2_1V8 12 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 2
WL_SDIO_D3_1V8 13 I/O Hi-Z PU 1.8 V v v v v
WLAN SDIO data bit
3. Changes state to
PU at WL_EN or
BT_EN assertion for
card detects. Later
disabled by software
during initialization.
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Table 7-1. Pin Attributes (continued)
PIN NAME PIN
NO.
TYPE/
DIR
SHUTDOWN
STATE(1)
AFTER
POWER
UP(1)
VOLTAGE
LEVEL
CONNECTIVITY(2)
DESCRIPTION(3)
1801 1805 1831 1835
WL_IRQ_1V8 14 O PD 0 1.8 V v v v v
WLAN SDIO out-of-
band interrupt line.
Set to rising edge
(active high) by
default. (To extract
the debug option
WL_RS232_TX/RX
interface out, pull up
the IRQ line at power
up before applying
enable.)
RF_ANT2 18 ANA – x v x v
2.4-GHz ANT2 TX, RX;
2.4-GHz secondary
antenna MRC/MIMO
only.
GPIO2 26 I/O PD PD 1.8 V v v v v
WL_RS232_RX (when
WLAN_IRQ = 1 at
power up)
GPIO1 27 I/O PD PD 1.8 V v v v v
WL_RS232_TX (when
WLAN_IRQ = 1 at
power up)
RF_ANT1 32 ANA – v v v v
2.4-GHz WLAN
main antenna SISO,
Bluetooth
WL_UART_DBG 42 O PU PU 1.8 V v v v v Option: WLAN logger
Bluetooth Functional Block: Int Signals
BT_UART_DBG 43 O PU PU 1.8 V x x v v Option: Bluetooth
logger
BT_HCI_RTS_1V8 50 O PU PU 1.8 V x x v v UART RTS to host. NC
if not used.
BT_HCI_CTS_1V8 51 I PU PU 1.8 V x x v v UART CTS from host.
NC if not used.
BT_HCI_TX_1V8 52 O PU PU 1.8 V x x v v UART TX to host. NC if
not used.
BT_HCI_RX_1V8 53 I PU PU 1.8 V x x v v UART RX from host.
NC if not used.
BT_AUD_IN 56 I PD PD 1.8 V x x v v
Bluetooth PCM/I2S
bus. Data in. NC if not
used.
BT_AUD_OUT 57 O PD PD 1.8 V x x v v
Bluetooth PCM/I2S
bus. Data out. NC if not
used.
BT_AUD_FSYNC 58 I/O PD PD 1.8 V x x v v
Bluetooth PCM/I2S
bus. Frame sync. NC if
not used.
BT_AUD_CLK 60 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S
bus. NC if not used.
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Table 7-1. Pin Attributes (continued)
PIN NAME PIN
NO.
TYPE/
DIR
SHUTDOWN
STATE(1)
AFTER
POWER
UP(1)
VOLTAGE
LEVEL
CONNECTIVITY(2)
DESCRIPTION(3)
1801 1805 1831 1835
Ground Pins
GND 1 GND – v v v v
GND 7 GND – v v v v
GND 9 GND – v v v v
GND 15 GND – v v v v
GND 16 GND – v v v v
GND 17 GND – v v v v
GND 19 GND – v v v v
GND 20 GND – v v v v
GND 23 GND – v v v v
GND 24 GND – v v v v
GND 28 GND – v v v v
GND 29 GND – v v v v
GND 30 GND – v v v v
GND 31 GND – v v v v
GND 33 GND – v v v v
GND 34 GND – v v v v
GND 35 GND – v v v v
GND 37 GND – v v v v
GND 39 GND – v v v v
GND 44 GND – v v v v
GND 45 GND – v v v v
GND 48 GND – v v v v
GND 49 GND – v v v v
GND 54 GND – v v v v
GND 55 GND – v v v v
GND 59 GND – v v v v
GND 61 GND – v v v v
GND 63 GND – v v v v
GND 64 GND – v v v v
GND G1 –
G36 GND – v v v v
(1) PU = pullup; PD = pulldown; Hi-Z = high-impedance
(2) v = connect; x = no connect
(3) Host must provide PU using a 10-kΩ resistor for all non-CLK SDIO signals.
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8 Specifications
All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All
measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF antennas,
unless otherwise indicated.
Note
For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os application report.
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VBAT 4.8(2) V
VIO –0.5 2.1 V
Input voltage to analog pins –0.5 2.1 V
Input voltage limits (CLK_IN) –0.5 VDD_IO V
Input voltage to all other pins –0.5 (VDD_IO + 0.5 V) V
Operating ambient temperature –20 70 (3) °C
Storage temperature, Tstg –40 85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks
(3) In the WL18xx system, a control mechanism exists to ensure Tj < 125°C. When Tj approaches this threshold, the control mechanism
manages the transmitter patterns.
8.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
VBAT (1) DC supply range for all modes 2.9 3.7 4.8 V
VIO 1.8-V I/O ring power supply voltage 1.62 1.8 1.95 V
VIH I/O high-level input voltage 0.65 × VDD_IO VDD_IO V
VIL I/O low-level input voltage 0 0.35 × VDD_IO V
VIH_EN Enable inputs high-level input voltage 1.365 VDD_IO V
VIL_EN Enable inputs low-level input voltage 0 0.4 V
VOH High-level output voltage At 4 mA VDD_IO –0.45 VDD_IO V
VOL Low-level output voltage At 4 mA 0 0.45 V
Tr,TfInput transitions time Tr,Tf from 10% to 90% (digital I/O)(2) 1 10 ns
TrOutput rise time from 10% to 90% (digital pins)(2) CL < 25 pF 5.3 ns
TfOutput fall time from 10% to 90% (digital pins)(2) CL < 25 pF 4.9 ns
Ambient operating temperature –20 70 °C
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over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
Maximum
power
dissipation
WLAN operation 2.8 W
Bluetooth operation 0.2
(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.
(2) Applies to all digital lines except PCM and slow clock lines.
8.4 External Digital Slow Clock Requirements
The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.
CONDITION MIN TYP MAX UNIT
Input slow clock frequency 32768 Hz
Input slow clock accuracy (initial,
temperature, and aging)
WLAN, Bluetooth ±250 ppm
Tr, TfInput transition time (10% to 90%) 200 ns
Frequency input duty cycle 15% 50% 85%
VIH, VIL Input voltage limits Square wave,
DC coupled
0.65 x VDD_IO VDD_IO Vpeak
0 0.35 x VDD_IO
Input impedance 1 MΩ
Input capacitance 5 pF
8.5 Thermal Resistance Characteristics for MOC 100-Pin Package
THERMAL METRICS(1) (°C/W)(2)
θJA Junction to free air(3) 16.6
θJB Junction to board 6.06
θJC Junction to case(4) 5.13
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application
Report.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70°C is assumed.
(3) According to the JEDEC EIA/JESD 51 document
(4) Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias
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8.6 WLAN Performance: 2.4-GHz Receiver Characteristics
over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the
module pin.
PARAMETER CONDITION MIN TYP MAX UNIT
RF_ANT1 pin 2.4-GHz SISO
Operation frequency range 2412 2484 MHz
Sensitivity: 20-MHz bandwidth. At < 10% PER limit
1 Mbps DSSS –96.3
dBm
2 Mbps DSSS –93.2
5.5 Mbps CCK –90.6
11 Mbps CCK –87.9
6 Mbps OFDM –92.0
9 Mbps OFDM –90.4
12 Mbps OFDM –89.5
18 Mbps OFDM –87.2
24 Mbps OFDM –84.1
36 Mbps OFDM –80.7
48 Mbps OFDM –76.5
54 Mbps OFDM –74.9
MCS0 MM 4K –90.4
MCS1 MM 4K –87.6
MCS2 MM 4K –85.9
MCS3 MM 4K –82.8
MCS4 MM 4K –79.4
MCS5 MM 4K –75.2
MCS6 MM 4K –73.5
MCS7 MM 4K –72.4
MCS0 MM 4K 40 MHz –86.7
MCS7 MM 4K 40 MHz –67.0
MCS0 MM 4K MRC –92.7
MCS7 MM 4K MRC –75.2
MCS13 MM 4K –73.7
MCS14 MM 4K –72.3
MCS15 MM 4K –71.0
Maximum input level
OFDM –20.0 –10.0
dBmCCK –10.0 –6.0
DSSS –4.0 –1.0
Adjacent channel rejection: Sensitivity level +3 dB for
OFDM; Sensitivity level +6 dB for 11b
2 Mbps DSSS 42.0
dB11 Mbps CCK 38.0
54 Mbps OFDM 2.0
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8.7 WLAN Performance: 2.4-GHz Transmitter Power
over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the
module pin.
PARAMETER CONDITION(1) MIN TYP MAX UNIT
RF_ANT1 Pin 2.4-GHz SISO
Output Power: Maximum RMS output power measured
at 1 dB from IEEE spectral mask or EVM(2)
1 Mbps DSSS 17.3
dBm
2 Mbps DSSS 17.3
5.5 Mbps CCK 17.3
11 Mbps CCK 17.3
6 Mbps OFDM 17.1
9 Mbps OFDM 17.1
12 Mbps OFDM 17.1
18 Mbps OFDM 17.1
24 Mbps OFDM 16.2
36 Mbps OFDM 15.3
48 Mbps OFDM 14.6
54 Mbps OFDM 13.8
MCS0 MM 16.1
MCS1 MM 16.1
MCS2 MM 16.1
MCS3 MM 16.1
MCS4 MM 15.3
MCS5 MM 14.6
MCS6 MM 13.8
MCS7 MM(3) 12.6
MCS0 MM 40 MHz 14.8
MCS7 MM 40 MHz 11.3
RF_ANT1 + RF_ANT2
MCS12 (WL18x5) 18.5
dBm
MCS13 (WL18x5) 17.4
MCS14 (WL18x5) 14.5
MCS15 (WL18x5) 13.4
RF_ANT1 + RF_ANT2
Operation frequency range 2412 2484 MHz
Return loss –10.0 dB
Reference input impedance 50.0 Ω
(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80°C ambient temperature on MIMO operation
(2) Regulatory constraints limit TI module output power to the following:
• Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.
• Channels 1, 11 at OFDM legacy and HT 20-MHz rates: 12 dBm
• Channels 1, 11 at HT 40-MHz rates: 10 dBm
• Channel 7 at HT 40-MHz lower rates: 10 dBm
• Channel 5 at HT 40-MHz upper rates: 10 dBm
• All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.
• All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.
• For clarification regarding power limitation, see the WL18xx .INI File Application Report.
(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:
• MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.
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• MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.
8.8 WLAN Performance: Currents
over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the
module pin.
PARAMETER SPECIFICATION TYP (AVG) –25°C UNIT
Receiver
Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 49
mA
2.4 GHz RX search SISO20 54
2.4-GHz RX search MIMO20 74
2.4-GHz RX search SISO40 59
2.4-GHz RX 20 M SISO 11 CCK 56
2.4-GHz RX 20 M SISO 6 OFDM 61
2.4-GHz RX 20 M SISO MCS7 65
2.4-GHz RX 20 M MRC 1 DSSS 74
2.4-GHz RX 20 M MRC 6 OFDM 81
2.4-GHz RX 20 M MRC 54 OFDM 85
2.4-GHz RX 40-MHz MCS7 77
Transmitter
2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm 285
mA
2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm 273
2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm 247
2.4-GHz TX 20 M SISO MCS7 11.2 dBm 238
2.4-GHz TX 20 M MIMO MCS15 11.2 dBm 420
2.4-GHz TX 40 M SISO MCS7 8.2 dBm 243
8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) (2) CONDITION MIN TYP MAX UNIT
Bluetooth BR, EDR operation
frequency range
2402 2480 MHz
Bluetooth BR, EDR channel
spacing
1 MHz
Bluetooth BR, EDR input
impedance
50 Ω
Bluetooth BR, EDR
sensitivity(2)
Dirty TX on
BR, BER = 0.1% –92.2
dBm
EDR2, BER = 0.01% –91.7
EDR3, BER = 0.01% –84.7
Bluetooth EDR BER floor at
sensitivity + 10 dB
Dirty TX off (for 1,600,000
bits)
EDR2 1e-6
EDR3 1e-6
Bluetooth BR, EDR maximum
usable input power
BR, BER = 0.1% –5.0
dBmEDR2, BER = 0.1% –15.0
EDR3, BER = 0.1% –15.0
Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 –36.0 –30.0 dBm
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over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) (2) CONDITION MIN TYP MAX UNIT
Bluetooth BR, EDR C/I
performance
Numbers show wanted
signal-to-interfering-signal
ratio. Smaller numbers
indicate better C/I
performances (Image
frequency = –1 MHz)
BR, co-channel 10
dB
EDR, co-channel EDR2 12
EDR3 20
BR, adjacent ±1 MHz –3.0
EDR, adjacent ±1 MHz,
(image)
EDR2 –3.0
EDR3 2.0
BR, adjacent +2 MHz –33.0
EDR, adjacent +2 MHz EDR2 –33.0
EDR3 –28.0
BR, adjacent –2 MHz –20.0
EDR, adjacent –2 MHz EDR2 –20.0
EDR3 –13.0
BR, adjacent ≥Ι±3Ι MHz –42.0
EDR, adjacent ≥Ι±3Ι MHz EDR2 –42.0
EDR3 –36.0
Bluetooth BR, EDR RF return
loss
–10.0 dB
(1) All RF and performance numbers are aligned to the module pin.
(2) Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.
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8.10 Bluetooth Performance: Transmitter, BR
over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) MIN TYP MAX UNIT
BR RF output power(2) VBAT ≥ 3 V(3) 11.7 dBm
VBAT < 3 V(3) 7.2
BR gain control range 30.0 dB
BR power control step 5.0 dB
BR adjacent channel power |M-N| = 2 –43.0 dBm
BR adjacent channel power |M-N| > 2 –48.0 dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.
(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.
8.11 Bluetooth Performance: Transmitter, EDR
over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) MIN TYP MAX UNIT
EDR output power(2) VBAT ≥ 3 V(3) 7.2 dBm
VBAT < 3 V(3) 5.2
EDR gain control range 30 dB
EDR power control step 5 dB
EDR adjacent channel power |M-N| = 1 –36 dBc
EDR adjacent channel power |M-N| = 2 –30 dBm
EDR adjacent channel power |M-N| > 2 –42 dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) Values reflect default maximum power. Maximum power can be changed using a VS command.
(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.
8.12 Bluetooth Performance: Modulation, BR
over operating free-air temperature range (unless otherwise noted)
CHARACTERISTICS(1) CONDITION(2) MIN TYP MAX UNIT
BR –20-dB bandwidth 925 995 kHz
BR modulation characteristics
∆f1avg Mod data = 4 1s, 4 0s:
111100001111...
145 160 170 kHz
∆f2max ≥ limit for
at least 99.9% of all
Δf2max
Mod data = 1010101... 120 130 kHz
∆f2avg, ∆f1avg 85% 88%
BR carrier frequency drift One-slot packet –25 25 kHz
Three- and five-slot
packet
–35 35 kHz
BR drift rate lfk+5 – fkl , k = 0 to max 15 kHz/50 µs
BR initial carrier frequency tolerance(3) f0–fTX ±75 ±75 kHz
(1) All RF and performance numbers are aligned to the module pin.
(2) Performance values reflect maximum power.
(3) Numbers include XTAL frequency drift over temperature and aging.
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8.13 Bluetooth Performance: Modulation, EDR
over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) (2) CONDITION MIN TYP MAX UNIT
EDR carrier frequency stability –5 5 kHz
EDR initial carrier frequency tolerance(3) ±75 ±75 kHz
EDR RMS DEVM EDR2 4% 15%
EDR3 4% 10%
EDR 99% DEVM EDR2 30%
EDR3 20%
EDR peak DEVM EDR2 9% 25%
EDR3 9% 18%
(1) All RF and performance numbers are aligned to the module pin.
(2) Performance values reflect maximum power.
(3) Numbers include XTAL frequency drift over temperature and aging.
8.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals
over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) CONDITION(2) MIN TYP MAX UNIT
Bluetooth low energy operation frequency range 2402 2480 MHz
Bluetooth low energy channel spacing 2 MHz
Bluetooth low energy input impedance 50 Ω
Bluetooth low energy sensitivity(3)
Dirty TX on
–92.2 dBm
Bluetooth low energy maximum usable input power –5 dBm
Bluetooth low energy intermodulation
characteristics
Level of interferers.
For n = 3, 4, 5
–36 –30 dBm
Bluetooth low energy C/I performance.
Note: Numbers show wanted signal-to-interfering-
signal ratio. Smaller numbers indicate better C/I
performance.
Image = –1 MHz
Low energy, co-channel 12
dB
Low energy, adjacent ±1 MHz 0
Low energy, adjacent +2 MHz –38
Low energy, adjacent –2 MHz –15
Low energy, adjacent ≥ |±3| MHz –40
(1) All RF and performance numbers are aligned to the module pin.
(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test
specification.
(3) Sensitivity degradation of up to –3 dB can occur due to fast clock harmonics.
8.15 Bluetooth low energy Performance: Transmitter Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER(1) MIN TYP MAX UNIT
Bluetooth low energy RF output power(2) VBAT ≥ 3 V(3) 7.0 dBm
VBAT < 3 V(3) 7.0
Bluetooth low energy adjacent channel power |M-N| = 2 –51.0 dBm
Bluetooth low energy adjacent channel power |M-N| > 2 –54.0 dBm
(1) All RF and performance numbers are aligned to the module pin.
(2) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement.
(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.
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8.16 Bluetooth low energy Performance: Modulation Characteristics
over operating free-air temperature range (unless otherwise noted)
CHARACTERISTICS(1) CONDITION(2) MIN TYP MAX UNIT
Bluetooth low energy
modulation characteristics
∆f1avg Mod data = 4 1s, 4 0s:
111100001111... 240 250 260
kHz
∆f2max ≥ limit for
at least 99.9% of all
Δf2max
Mod data = 1010101...
195 215
∆f2avg, ∆f1avg 85% 90%
Bluetooth low energy carrier
frequency drift lf0 – fnl , n = 2,3 …. K –25 25 kHz
Bluetooth low energy drift rate lf1 – f0l and lfn – fn-5l , n = 6,7…. K 15 kHz/50 µs
Bluetooth low energy initial
carrier frequency tolerance(3) fn – fTX ±75 ±75 kHz
(1) All RF and performance numbers are aligned to the module pin.
(2) Performance values reflect maximum power.
(3) Numbers include XTAL frequency drift over temperature and aging.
8.17 Bluetooth BR and EDR Dynamic Currents
Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm.
USE CASE(1) (2) TYP UNIT
BR voice HV3 + sniff 11.6 mA
EDR voice 2-EV3 no retransmission + sniff 5.9 mA
Sniff 1 attempt 1.28 s 178.0 µA
EDR A2DP EDR2 (master). SBC high quality – 345 kbps 10.4 mA
EDR A2DP EDR2 (master). MP3 high quality – 192 kbps 7.5 mA
Full throughput ACL RX: RX-2DH5(3) (4) 18.0 mA
Full throughput BR ACL TX: TX-DH5(4) 50.0 mA
Full throughput EDR ACL TX: TX-2DH5(4) 33.0 mA
Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) 253.0 µA
Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively) 332.0 µA
(1) The role of Bluetooth in all scenarios except A2DP is slave.
(2) CL1P5 PA is connected to VBAT, 3.7 V.
(3) ACL RX has the same current in all modulations.
(4) Full throughput assumes data transfer in one direction.
8.18 Bluetooth low energy Currents
All current measured at output power of 7.0 dBm
USE CASE(1) TYP UNIT
Advertising, not connectable(2) 131 µA
Advertising, discoverable(2) 143 µA
Scanning(3) 266 µA
Connected, master role, 1.28-s connect interval(4) 124 µA
Connected, slave role, 1.28-s connect interval (4) 132 µA
(1) CL1p% PA is connected to VBAT, 3.7 V.
(2) Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data
(3) Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window
(4) Zero slave connection latency, empty TX and RX LL packets
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8.19 Timing and Switching Characteristics
8.19.1 Power Management
8.19.1.1 Block Diagram – Internal DC-DCs
The device incorporates three internal DC-DCs (switched-mode power supplies) to provide efficient internal
supplies, derived from VBAT.
WL18xx Top Level
Main DC2DC
VBAT
VIO
FB
SW
PA
DC2DC FB
SW
Digital DC2DC
FB
SW
1.8 V 2.2 – 2.7 V
VBAT
VIO_IN
VBAT_IN_MAIN_DC2DC
VBAT_IN_PA_DC2DC
VBAT
MAIN_DC2DC_OUT
DIG_DC2DC_OUT
VDD_DIG
LDO_IN_DIG
PA_DC2DC_OUT
FB_IN_PA_DC2DC
1 V
Figure 8-1. Internal DC-DCs
8.19.2 Power-Up and Shut-Down States
The correct power-up and shut-down sequences must be followed to avoid damage to the device.
While VBAT or VIO or both are deasserted, no signals should be driven to the device. The only exception is the
slow clock that is a fail-safe I/O.
While VBAT, VIO, and slow clock are fed to the device, but WL_EN is deasserted (low), the device is in
SHUTDOWN state. In SHUTDOWN state all functional blocks, internal DC-DCs, clocks, and LDOs are disabled.
To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock start
to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the enable
signals.
To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device (VBAT,
VIO, and slow clock) are still stable and available. The supplies to the chip (VBAT and VIO) can be deasserted only
after both enable signals are deasserted (low).
Figure 8-2 shows the general power scheme for the module, including the power-down sequence.
>10 µs
1
2
3
>10 µs 4
5 5
>60 µs
VBAT
VIO
EXT_32K
WLEN
NOTE: 1. Either VBAT or VIO can come up first.
NOTE: 2. VBAT and VIO supplies and slow clock (SCLK), must be stable prior to EN being asserted and at all times
NOTE: when the EN is active.
NOTE: 3. At least 60 µs is required between two successive device enables. The device is assumed to be in
NOTE: shutdown state during that period, meaning all enables to the device are LOW for that minimum duration.
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NOTE: 4. EN must be deasserted at least 10 µs before VBAT or VIO supply can be lowered (order of supply turn off
NOTE: after EN shutdown is immaterial).
NOTE: 5. EXT_32K - Fail safe I/O
Figure 8-2. Power-Up System
8.19.3 Chip Top-level Power-Up Sequence
Figure 8-3 shows the top-level power-up sequence for the chip.
VBAT / VIO
input
EXT_32K
input
WL_EN
input
Main 1V8 DC2DC
TCXO_CLK_REQ
output
DIG DC2DC
SRAM LDO
Internal power stable = 5 ms
Top RESETZ
4.5 ms delay
Figure 8-3. Chip Top-Level Power-Up Sequence
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8.19.4 WLAN Power-Up Sequence
Figure 8-4 shows the WLAN power-up sequence.
Indicates completion of firmware download
and internal initialization
Wake-up time
SLOWCLK
input
WL_EN
input
SDIO_CLK
input
WLAN_IRQ
output
TCXO
input
TCXO_CLK_REQ
output
TXCO_LDO
output
VBAT / VIO
input
NLCP
WLAN_IRQ
output
MCP
Host configures device to
reverse WLAN_IRQ polarity
Wake-up time
Indicates completion of firmware download
and internal initialization
NLCP: trigger at rising edge
MCP: trigger at low level
Figure 8-4. WLAN Power-Up Sequence
8.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence
Figure 8-5 shows the Bluetooth-Bluetooth low energy power-up sequence.
Completion of Bluetooth firmware initialztion.
Initialization time
Figure 8-5. Bluetooth-Bluetooth low energy Power-Up Sequence
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