TUYA TYWRD1S User manual

Hangzhou Tuya Information
Technology Co., Ltd. 1 V3.0.0
1. Product Overview
TYWRD1S is a low-power embedded Wi-Fi module that Tuya has developed. It consists
of a highly integrated RF chip (RDA5981B) and several peripheral components, with an
embedded Wi-Fi network protocol stack and robust library functions. TYWRD1S is
embedded with a low-power 32-bit CPU, 2 MB flash memory, and 448 KB static
random-access memory (SRAM), and has extensive peripherals.
TYWRD1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and
TCP/IP protocols. You can develop embedded Wi-Fi products as required.
1.1 Features
Embedded low-power 32-bit CPU, which can also function as an application
processor
⚫Clock rate: 160 MHz
Working voltage: 3.0 V to 3.6 V
Peripherals: eight GPIOs, one universal asynchronous receiver/transmitter (UART),
and one analog-to-digital converter (ADC)
Wi-Fi connectivity
⚫802.11b/g/n
⚫2.4GHz WiFi
⚫WPA and WPA2 security modes
⚫Up to +20±2 dBm output power
Tuya TYWRD1S Wi-Fi Module
Version: 3.0.0
Date: 2019-10-12
No.: 0000000004
Global Intelligent Platform
Product
Manual

TYWRD1S Datasheet
Hangzhou Tuya Information
Technology Co., Ltd. 2 V3.0.0
⚫STA, AP, and STA+AP working modes
⚫Smart and AP network configuration modes for Android and iOS devices
⚫Onboard PCB antenna with a gain of 1.0 dBi
⚫Working temperature: –20°C to +85°C
1.2 Applications
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus

TYWRD1S Datasheet
Hangzhou Tuya Information
Technology Co., Ltd. 3 V3.0.0
Change History
No.
Date
Change Description
Version After
Change
1
2019-06-20
This is the first release.
1.0.0
2
2019-07-26
Revised the document.
2.0.0
3
2019-10-12
Revised the document.
3.0.0

TYWRD1S Datasheet
Hangzhou Tuya Information
Technology Co., Ltd. 4 V3.0.0
Contents
1. Product Overview ............................................................................................................1
1.1 Features .................................................................................................................1
1.2 Applications ............................................................................................................2
2 Module Interfaces .............................................................................................................6
2.1 Dimensions and Footprint ......................................................................................6
2.2 Interface Pin Definition ...........................................................................................6
2.3 Test Pin Definition...................................................................................................8
3. Electrical Parameters.......................................................................................................8
3.1 Absolute Electrical Parameters ..............................................................................8
3.2 Electrical Conditions ...............................................................................................9
3.3 Working Current ...................................................................................................10
4 RF Features ....................................................................................................................11
4.1 Basic RF Features................................................................................................11
4.2 TX Performance ...................................................................................................11
4.3 RX Performance...................................................................................................12
5 Antenna Information........................................................................................................12
5.1 Antenna Type........................................................................................................12
5.2 Antenna Interference Reduction...........................................................................12
5.3 Antenna Connector Specifications .......................................................................12
6 Packaging Information and Production Instructions.......................................................13
6.1 Mechanical Dimensions .......................................................................................13
6.2 Recommended PCB Layout.................................................................................15
6.3 Production Instructions.........................................................................................16
6.4 Recommended Oven Temperature Curve ...........................................................18
6.5 Storage Conditions ...............................................................................................19
7 MOQ and Packing Information .......................................................................................20

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8 Appendix: Statement.......................................................................................................21
Tables
Table 2-1 TYWRD1S interface pins.....................................................................................6
Table 2-2 TYWRD1S test pins.............................................................................................8
Table 3-1 Absolute electrical parameters ............................................................................8
Table 3-2 Normal electrical conditions.................................................................................9
Table 3-4 TYWRD1S working current................................................................................10
Table 4-1 Basic RF features ..............................................................................................11
Table 4-2 Performance during constant transmission .......................................................11
Table 4-3 RX sensitivity .....................................................................................................12
Figures
Figure 2-1 TYWRD1S dimensions ......................................................................................6
Figure 5-1 U.FL RF connector parameters........................................................................13
Figure 6-1 TYWRD1S mechanical dimensions .................................................................14
Figure 6-2 Side view ..........................................................................................................14
Figure 6-3 TYWRD1S pins ................................................................................................15
Figure 6-4 Layout of the PCB to which TYWRD1S applies ..............................................16
Figure 6-5 HIC for TYWRD1S ...........................................................................................17
Figure 6-6 Oven temperature curve ..................................................................................18

TYWRD1S Datasheet
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2 Module Interfaces
2.1 Dimensions and Footprint
TYWRD1S has two rows of pins with a 1.5±0.1 mm pin spacing.
The TYWRD1S dimensions (H x W x D) are 3.3±0.1 mm x 18±0.35 mm x 23.5±0.35 mm.
Figure 1-1 shows the TYWRD1S dimensions.
Figure 2-1 TYWRD1S dimensions
2.2 Interface Pin Definition
Table 2-1 TYWRD1S interface pins
Pin No.
Symbol
I/O Type
Function
1
VCC
P
Power input pin for the internal level conversion

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Pin No.
Symbol
I/O Type
Function
circuit (3.3 V or 5 V)
2
UART-TX
I/O
UART0_TXD (See the following Note 3.)
3
UART-RX
I/O
UART0_RXD (See the following Note 3.)
4
3.3 V
P
Power supply pin (3.3 V)
5
GND
P
Power supply reference ground pin
6
GPIO23
I/O
Hardware PWM pin, which is connected to
GPIO23 (pin 33) on the internal IC
7
GPIO22
I/O
Hardware PWM pin, which is connected to
GPIO22 (pin 34) on the internal IC
8
GPIO25
I/O
Hardware PWM pin, which is connected to
GPIO25 (pin 31) on the IC
9
GPIO0
I/O
Common GPIO, which is connected to GPIO0 (pin
36) on the IC
10
GPIO24
I/O
Hardware PWM pin, which is connected to
GPIO24 (pin 32) on the internal IC
11
GPIO1
I/O
Common GPIO, which is connected to GPIO1 (pin
21) on the internal IC
12
GPIO8
I/O
Common GPIO, which is connected to GPIO8 (pin
13) on the internal IC
13
GPIO3
I/O
Hardware PWM pin, which is connected to GPIO3
(pin 23) on the internal IC
14
GND
P
Power supply reference ground pin
15
GND
P
Power supply reference ground pin
16
nRST
I/O
Hardware reset pin (The module has an internal
pull-up resistor, and the reset pin is active at a low
level.)
17
ADC
AI
10-bit SAR ADC (See the following Note 2.)
18
GND
P
Power supply reference ground pin

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Note:
1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog
input pins. nRST is only a hardware reset pin and cannot clear the Wi-Fi network
configuration.
2. This pin can only function as an ADC input and not a common I/O. If this pin is not
used, it must be disconnected. When this pin is used as an ADC input, the input
voltage range is 0 V to 1.0 V.
3. UART0 is a user-side serial interface, which generates information when the module
is powered on and starts.
2.3 Test Pin Definition
Table 2-2 TYWRD1S test pins
Pin No.
Symbol
I/O Type
Function
N/A
TEST
Input
Used for the module production test
Note:
Test pins are not recommended.
3. Electrical Parameters
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
Parameter
Description
Minimum
Value
Maximum
Value
Unit
Ts
Storage
temperature
–20
85
°C
VBAT
Power supply
voltage
3.0
3.6
V
Static electricity voltage
(human body model)
Tamb = 25°C
N/A
2
kV

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Parameter
Description
Minimum
Value
Maximum
Value
Unit
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
3.2 Electrical Conditions
Table 3-2 Normal electrical conditions
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Unit
Ta
Working
temperature
–20
N/A
85
°C
VBAT
Power supply
voltage
3.0
3.3
3.6
V
VIL
I/O low-level input
–0.3
N/A
VCC x 0.25
V
VIH
I/O high-level input
VCC x 0.75
N/A
VCC
V
VOL
I/O low-level
output
N/A
N/A
VCC x 0.1
V
VOH
I/O high-level
output
VCC x 0.8
N/A
VCC
V
Imax
I/O drive current
N/A
N/A
12
mA

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3.3 Working Current
Table 3-4 TYWRD1S working current
Working
Mode
Working Status (Ta = 25°C)
Average
Value
Unit
EZ
The module is in EZ mode, and the Wi-Fi
indicator blinks quickly.
70
mA
AP
The module is in AP mode, and the Wi-Fi
indicator blinks slowly.
80
mA
Connected
The module is connected to the network,
and the Wi-Fi indicator is steady on.
70
mA

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4 RF Features
4.1 Basic RF Features
Table 4-1 Basic RF features
Parameter
Description
Frequency band
2.4GHz
Wi-Fi standard
IEEE 802.11b/g/n
Data transmission rate
802.11b: 1, 2, 5.5, or 11 (Mbit/s)
802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
802.11n: HT20 MCS0 to MCS7
Antenna type
PCB antenna with a gain of 1.0 dBi
4.2 TX Performance
Table 4-2 Performance during constant transmission
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power,
802.11b CCK mode
11 Mbit/s
N/A
17
N/A
dBm
Average RF output power,
802.11g OFDM mode
54 Mbit/s
N/A
14.5
N/A
dBm
Average RF output power,
802.11n OFDM mode
MCS7
N/A
12.5
N/A
dBm
Frequency error
–10
N/A
+10
ppm

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4.3 RX Performance
Table 4-3 RX sensitivity
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
PER < 8%, 802.11b CCK
mode
11 Mbit/s
N/A
–90
N/A
dBm
PER < 10%, 802.11g OFDM
mode
54 Mbit/s
N/A
–73
N/A
dBm
PER < 10%, 802.11n OFDM
mode
MCS7
N/A
–70
N/A
dBm
5 Antenna Information
5.1 Antenna Type
TYWRD1S supports an onboard PCB antenna or external antenna. By default,
TYWRD1S uses an onboard PCB antenna.
5.2 Antenna Interference Reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB
antenna, it is recommended that the antenna be at least 15 mm away from other metal
parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces
along the antenna area on the PCB.
For details about the onboard PCB antenna area on TYWRD1S, see Figure 6-1.
5.3 Antenna Connector Specifications
Figure 5-1 shows the U.FL RF connector parameters.

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Figure 5-1 U.FL RF connector parameters
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 0.8±0.1 mm x 18±0.35 mm x 23.5±0.35 mm.

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Figure 6-1 TYWRD1S mechanical dimensions
Figure 6-2 Side view

TYWRD1S Datasheet
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6.2 Recommended PCB Layout
Figure 6-3 TYWRD1S pins

TYWRD1S Datasheet
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Figure 6-4 Layout of the PCB to which TYWRD1S applies
6.3 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. iAutomated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven

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ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-5 HIC for TYWRD1S
3. Bake a module based on HIC status as follows when you unpack the module
package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking.

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5. Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and
AOI before first SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
batches for visual inspection and AOI.
6.4 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The
highest temperature is 245°C.
Figure 6-6 Oven temperature curve

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6.5 Storage Conditions

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7 MOQ and Packing Information
MOQ and packing information
Product
Model
MOQ
Packing Method
Number of Modules in
Each Reel Pack
Number of Reel
Packs in Each Box
TYWRD1S
4000
Carrier tape and
reel packing
1000
4