TUYA ZS3L User manual

Hangzhou Tuya Information Technology Co., Ltd. 1 V1.0.1
1. Product Overview
ZS3L is a low-power embedded Zigbee module that Tuya has developed. It consists of a
highly integrated RF processor chip (EFR32MG21A020F768IM32-B) and several
peripheral components, with an embedded 802.15.4 PHY/MAC Zigbee network protocol
stack and robust library functions. ZS3L is embedded with a 32-bit low-power Arm
Cortex-M33 core, 768 KB flash memory, and 64 KB random-access memory (RAM), and
has extensive peripherals.
ZS3L is a FreeRTOS platform that integrates all the function libraries of the Zigbee MAC
and TCP/IP protocols. You can develop embedded Zigbee products as required.
1.1 Features
Embedded low-power 32-bit Arm Cortex-M33 processor, which provides digital signal
processor (DSP) instructions and floating-point units (FPUs) and can also function as
an application processor
⚫Clock rate: 80 MHz
Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART),
and one analog-to-digital converter (ADC)
White ink, black silkscreen; mounted onto a PCB by using an SMT placement
machine or through-hole mounted onto the PCB through a pin header
Zigbee features
Working voltage: 2.0 V to 3.8 V
⚫802.15.4 MAC/PHY
⚫Channels 11 to 26 at 2.400 GHz to 2.483 GHz, 250 kbit/s air interface rate
⚫Maximum output power: +20 dBm; dynamic output power: > 35 dB
⚫Runtime power consumption: 60 µA/MHz; current in sleep mode: 5 µA
⚫Proactive device pairing for terminals
Tuya ZS3L Zigbee Module
Version: 1.0.1
Date: 2019-12-18
No.: TY-Zigbee-DS022
Global Intelligent Platform
Product
Manual

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.1
⚫Onboard PCB antenna
⚫Working temperature: –20°C to +105°C
⚫AES-128 or AES-256 hardware encryption
1.2 Application Scenarios
Intelligent building
Smart household and home appliances
Smart socket and light
Industrial wireless control
Baby monitor
Network camera
Intelligent bus

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 3 V1.0.1
Change History
No.
Date
Change Description
Version After
Change
1
2019-12-10
This is the first release.
1.0.0
1
2019-12-18
Updated pin 3 description and antenna gain.
1.0.1

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 4 V1.0.1
Contents
1. Product Overview ............................................................................................................1
1.1 Features..................................................................................................................1
1.2 Application Scenarios .............................................................................................2
2. Module Interfaces ............................................................................................................6
2.1 Dimensions and Footprint ......................................................................................6
2.2 Interface Pin Definition ...........................................................................................6
2.3 Test Pin Definition...................................................................................................7
3. Electrical Parameters.......................................................................................................9
3.1 Absolute Electrical Parameters ..............................................................................9
3.2 Working Conditions ................................................................................................9
3.3 RF Current Consumption .....................................................................................10
3.4 Working Current ...................................................................................................10
4. RF Features...................................................................................................................11
4.1 Basic RF Features................................................................................................11
4.2 TX Performance ...................................................................................................11
4.3 RX Performance...................................................................................................11
5. Antenna Information.......................................................................................................12
5.1 Antenna Type........................................................................................................12
5.2 Antenna Interference Reduction...........................................................................12
6. Packaging Information and Production Instructions......................................................13
6.1 Mechanical Dimensions .......................................................................................13
6.2 Recommended PCB Layout.................................................................................14
6.3 Production Instructions.........................................................................................15
6.4 Recommended Oven Temperature Curve ...........................................................16
6.5 Storage Conditions...............................................................................................18
7. MOQ and Packing Information ......................................................................................19
8. Appendix: Statement......................................................................................................20

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 5 V1.0.1
Tables
Table 2-1 ZS3L interface pins...............................................................................................6
Table 2-2 ZS3L test pins........................................................................................................7
Table 3-1 Absolute electrical parameters............................................................................9
Table 3-2 Normal working conditions ..................................................................................9
Table 3-3 Current consumption during constant transmission and receiving..............10
Table 3-4 Working current ...................................................................................................10
Table 4-1 Basic RF features ...............................................................................................11
Table 4-2 Performance during constant transmission.....................................................11
Table 4-3 RX sensitivity .......................................................................................................11
Figures
Figure 2-1 ZS3L front and rear views..................................................................................6
Figure 6-1 ZS3L mechanical dimensions .........................................................................13
Figure 6-2 Side view ............................................................................................................13
Figure 6-3 ZS3L pins............................................................................................................14
Figure 6-4 ZS3L pin header dimensions...........................................................................14
Figure 6-5 Layout of the PCB to which ZS3L applies .....................................................15
Figure 6-6 HIC for ZS3L ......................................................................................................16
Figure 6-7 Oven temperature curve ..................................................................................17

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 6 V1.0.1
2. Module Interfaces
2.1 Dimensions and Footprint
ZS3L has two rows of pins with a 2±0.1 mm pin spacing.
The ZS3L dimensions (H x W x D) are 2.8±0.15 mm x 24±0.35 mm x 16±0.35 mm. Figure
2-1 shows the ZS3L front and rear views.
Figure 2-1 ZS3L front and rear views
2.2 Interface Pin Definition
Table 2-1 ZS3L interface pins
Pin No.
Symbol
I/O Type
Function
1
RST
Input
Hardware reset pin, which is at a high level by default and is
active at a low level
2
ADC_PC01
I/O
12-bit SAR ADC pin
3
NC
Input
Disconnected, which can be used as the reset pin in special
scenarios
4
PC00
I/O
Hardware PWM pin, which is connected to PC00 (pin 1) on
the internal IC
5
PA00
I/O
Hardware PWM pin, which is connected to PA00 (pin 17) on

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 7 V1.0.1
Pin No.
Symbol
I/O Type
Function
the internal IC
6
PA03
I/O
Hardware PWM pin, which is connected to PA03 (pin 20) on
the internal IC
7
PA04
I/O
Hardware PWM pin, which is connected to PA04 (pin 21) on
the internal IC
8
3V3
P
Power supply pin (typical power supply voltage: 3.3 V)
9
GND
P
Power supply reference ground pin
10
PD01
I/O
Hardware PWM pin, which is connected to PD01 (pin 31) on
the internal IC
11
PD00
I/O
Hardware PWM pin, which is connected to PD00 (pin 32) on
the internal IC
12
PC02
I/O
Hardware PWM pin, which is connected to PC02 (pin 3) on
the internal IC
13
PB00
I/O
Hardware PWM pin, which is connected to PB00 (pin 16) on
the internal IC
14
PB01
I/O
Hardware PWM pin, which is connected to PB01 (pin 15) on
the internal IC
15
RXD
I/O
UART_RXD, which is connected to PA06 (pin 23) on the
internal IC
16
TXD
Input
UART_TXD, which is connected to PA05 (pin 22) on the
internal IC
Note:
P indicates a power supply pin, and I/O indicates an input/output pin.
2.3 Test Pin Definition
Table 2-2 ZS3L test pins
Pin No.
Symbol
I/O Type
Function
17
3V3
P
Power supply pin (typical power supply voltage: 3.3 V)
18
SWDIO
I/O
J-Link SWDIO programming pin
19
SWCLK
I/O
J-Link SWCLK programming pin
20
GND1
P
Power supply reference ground pin
21
RST2
I/O
Hardware reset pin, which is at a high level by default
and is active at a low level

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 8 V1.0.1
Pin No.
Symbol
I/O Type
Function
22
GND2
P
Power supply reference ground pin
Note:
Test pins are not recommended.

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 9 V1.0.1
3. Electrical Parameters
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
Parameter
Description
Minimum
Value
Maximum
Value
Unit
Ts
Storage
temperature
–20
105
°C
VBAT
Power supply
voltage
3.0
3.6
V
Static electricity voltage
(human body model)
Tamb = 25°C
N/A
2
kV
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
3.2 Working Conditions
Table 3-2 Normal working conditions
Parameter
Description
Minimum
Value
Average
Value
Maximum
Value
(Typical
Value)
Unit
Ta
Working
temperature
–20
N/A
105
°C
VBAT
Power supply
voltage
3.0
3.3
3.6
V
VIL
I/O low-level
input
–0.3
N/A
VCC x 0.25
V
VIH
I/O high-level
input
VCC x
0.75
N/A
VCC
V
VOL
I/O low-level
output
N/A
N/A
VCC x 0.1
V
VOH
I/O high-level
output
VCC x
0.8
N/A
VCC
V
Imax
I/O drive current
N/A
N/A
12
mA

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 10 V1.0.1
3.3 RF Current Consumption
Table 3-3 Current consumption during constant transmission and receiving
Working
Status
Parameter
Average
Value
Maximum
Value
(Typical
Value)
Unit
Mode
Rate
TX Power/
Receiving
TX
250 kbit/s
+20 dBm
200
206
mA
250 kbit/s
+10 dBm
62
64
mA
250 kbit/s
+0 dBm
26
28
mA
RX
250 kbit/s
Constant
receiving
10
12
mA
250 kbit/s
Constant
receiving
10
12
mA
250 kbit/s
Constant
receiving
10
12
mA
3.4 Working Current
Table 3-4 Working current
Working Mode
Working Status (Ta = 25°C)
Average
Value
Maximum
Value (Typical
Value)
Unit
EZ
The module is in EZ mode.
10
40
mA
Connected and
idle
The module is connected to the
network.
4.2
5
mA
Deep sleep
mode
The module is in deep sleep
mode, with 64 KB flash memory.
5
μA

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 11 V1.0.1
4. RF Features
4.1 Basic RF Features
Table 4-1 Basic RF features
Parameter
Description
Frequency range
2.4 GHz to 2.4835 GHz
Zigbee standard
IEEE 802.15.4
Data transmission rate
250 kbit/s
Antenna type
PCB antenna with a gain of 1 dBi
4.2 TX Performance
Table 4-2 Performance during constant transmission
Parameter
Minimum
Value
Average
Value
Maximum Value
(Typical Value)
Unit
Maximum output power
250 kbit/s
N/A
20
N/A
dBm
Minimum output power
250 kbit/s
–30
dBm
Output power
adjustment step
0.5
1
dBm
Output spectrum
adjacent-channel
rejection ratio
–31
dBc
Frequency error
–15
N/A
+15
ppm
4.3 RX Performance
Table 4-3 RX sensitivity
Parameter
Minimum
Value
Average
Value
Maximum Value
(Typical Value)
Unit
PER < 10%, 802.11n
OFDM mode
250 kbit/s
–102
–101
–99
dBm

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 12 V1.0.1
5. Antenna Information
5.1 Antenna Type
ZS3L uses an onboard PCB antenna
5.2 Antenna Interference Reduction
To ensure optimal Zigbee performance when the Zigbee module uses an onboard PCB
antenna, it is recommended that the antenna be at least 5 mm away from other metal
parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces
along the antenna area on the PCB.

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 13 V1.0.1
6. Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 2.8±0.15 mm x 24±0.35 mm x 16±0.35 mm.
Figure 6-1 ZS3L mechanical dimensions
Figure 6-2 Side view

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 14 V1.0.1
6.2 Recommended PCB Layout
Figure 6-3 ZS3L pins
ZS3L can be mounted onto a PCB by using an SMT placement machine or through-hole
mounted onto the PCB through a pin header. Figure 6-4 shows the pin header
dimensions.
Figure 6-4 ZS3L pin header dimensions

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 15 V1.0.1
Figure 6-5 Layout of the PCB to which ZS3L applies
6.3 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 16 V1.0.1
(2) The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-6 HIC for ZS3L
3. Bake a module based on HIC status as follows when you unpack the module
package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and
AOI before first SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent
batches for visual inspection and AOI.
6.4 Recommended Oven Temperature Curve
Perform SMT placement based on the following reflow oven temperature curve. The

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 17 V1.0.1
highest temperature is 245°C.
Figure 6-7 Oven temperature curve

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 18 V1.0.1
6.5 Storage Conditions

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 19 V1.0.1
7. MOQ and Packing Information
MOQ and packing information
Product
Model
MOQ
Packing Method
Number of Modules
in Each Reel Pack
Number of Reel
Packs in Each Box
ZS3L
4000
Carrier tape and
reel packing
1000
4

ZS3L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. 20 V1.0.1
8. Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This equipment should be installed and operated with minimum
distance 20cm between the radiator and your body.
Important Note
This radio module must not installed to co-locate and operating simultaneously with other
radios in host system except in accordance with FCC multi-transmitter product procedures.
Additional testing and equipment authorization may be required to operating
simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country
dependent and are firmware programmed at the factory to match the intended destination.
The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that
apply to the host not covered by the modular transmitter grant of certification. The final
host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in
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