TUYA ZS2S User manual

Hangzhou Tuya Information Technology Co., Ltd. 1 V1.0.0
1 Product Overview
ZS2S is a low-power embedded Zigbee module that Tuya has developed. It consists of a
highly integrated Zigbee chip (EFR32MG21A020F768) and several peripheral circuits,
with an embedded Zigbee network protocol stack and robust library functions. ZS2S also
contains a 32-bit, 80 MHz, low-powerArm Cortex-M33 core, 768 KB flash memory, 64 KB
static random-access memory (SRAM), and extensive peripherals.
1.1 Features
Embedded low-power 32-bit microcontroller unit (MCU), which can also function as
an application processor
Clock rate: 80 MHz
Working voltage: 2.0 V to 3.8 V
Peripherals: five pulse width modulation (PWM) pins, one analog to digital converter
(ADC), and one universal asynchronous receiver/transmitter (UART)
Zigbee RF features
Channels 11 to 26 at 2.400 GHz to 2.483 GHz, 250 kbit/s air interface rate
TX power: +20 dBm; dynamic output power: > 35 dB
Runtime power consumption: 60 µA/MHz; current in sleep mode: 5 µA
Embedded Advanced Encryption Standard (AES) hardware encryption
Onboard PCB antenna
Working temperature: –20°C to +85°C
Tuya ZS2S Zigbee Module
Version: 1.0.0
Date: 2019-12-06
No.: 0000000001
Global Intelligent Platform
Product
Manual

Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.0
1.2 Application Scenarios
Intelligent building
Smart household and home appliances
Smart low-power sensors
Smart socket and light
Asset tracing
Industrial wireless control

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Change History
No.
Date
Change Description
Version After Change
1
2019-12-06
This is the first release.
1.0.0

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Contents
1 Product Overview...........................................................................................................1
1.1 Features...............................................................................................................1
1.2 Application Scenarios........................................................................................... 2
Change History ................................................................................................................. 3
2 Module Interfaces...........................................................................................................6
2.1 Dimensions and Footprint....................................................................................6
2.2 Interface Pin Definition.........................................................................................6
3 Electrical Parameters.....................................................................................................7
3.1 Absolute Electrical Parameters............................................................................7
3.2 Working Conditions..............................................................................................8
3.3 RF Current Consumption.....................................................................................9
3.4 Working Current...................................................................................................9
4 RF Features.................................................................................................................10
4.1 Basic RF Features.............................................................................................10
4.2 RF TX Power .....................................................................................................10
4.3 RF RX Sensitivity............................................................................................... 11
5 Antenna Information..................................................................................................... 11
5.1 Antenna Type..................................................................................................... 11
5.2 Antenna Interference Reduction......................................................................... 11
6 Packaging Information and Production Instructions.....................................................12
6.1 Mechanical Dimensions and Rear Solder Pad Dimensions...............................12
6.2 Production Instructions ......................................................................................12
6.3 Recommended Oven Temperature Curve..........................................................14
6.4 Storage Conditions............................................................................................. 15
7 MOQ and Packing Information.....................................................................................16
8 Appendix: Statement.................................................................................................... 16

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Figures
Figure 2-1 ZS2S front and rear views........................................................................6
Figure 6-1 ZS2S mechanical dimensions and rear solder pad dimensions .............12
Figure 6-2 Oven temperature curve.........................................................................14
Figure 6-3 HIC for ZS2S..........................................................................................15
Tables
Table 2-1 ZS2S interface pins.................................................................................... 6
Table 3-1 Absolute electrical parameters ................................................................... 7
Table 3-2 Normal working conditions.........................................................................8
Table 3-3 RF current consumption.............................................................................9
Table 3-4 Working current..........................................................................................9
Table 4-1 Basic RF features.....................................................................................10
Table 4-2 Power during constant transmission.........................................................10
Table 4-3 RX sensitivity............................................................................................ 11
Table 6-1 Recommended wave soldering temperature............................................14

Hangzhou Tuya Information Technology Co., Ltd. 6 V1.0.0
2 Module Interfaces
2.1 Dimensions and Footprint
ZS2S has two rows of pins with a 2 mm pin spacing.
The ZS2S dimensions (H x W x L) are 2.8±0.15 mm x 14.9±0.35 mm x 17.9±0.35 mm.
The PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the ZS2S front and rear views.
Figure 2-1 ZS2S front and rear views
2.2 Interface Pin Definition
Table 2-1 ZS2S interface pins
Pin No.
Symbol
I/O Type
Function
1
3V3
P
Power supply pin (3.3 V)
2
PA00
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA00 pin on the internal IC
3
GND
P
Power supply reference ground pin
4
PA03
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA03 pin on the internal IC
5
RX
I/O
Serial interface receiving pin (UART RX), which

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Pin No.
Symbol
I/O Type
Function
is connected to the PA06 pin on the internal IC
6
PA04
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA04 pin on the internal IC
7
TX
I/O
Serial interface transmission pin (UART TX),
which is connected to the PA05 pin on the
internal IC
8
ADC
Input
ADC pin, which is connected to the PC01 pin on
the internal IC
9
PB00
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PB00 pin on the internal IC
10
RST
Input
Reset pin, which is connected to the RESETn pin
on the internal IC
11
PB01
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PB01 pin on the internal IC
Note:
Pindicates a power supply pin, and I/O indicates an input/output pin.
If you have special requirements for light colors controlled by PWM outputs, contact Tuya
business personnel.
3 Electrical Parameters
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
Parameter
Description
Minimu
m
Value
Maximum
Value
Unit
Ts
Storage
temperature
–50
150
°C

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Parameter
Description
Minimu
m
Value
Maximum
Value
Unit
VCC
Power supply
voltage
–0.3
3.8
V
Static electricity voltage
(human body model)
Tamb = 25°C
N/A
2
kV
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
3.2 Working Conditions
Table 3-2 Normal working conditions
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Unit
Ta
Working
temperature
–20
N/A
85
°C
VCC
Working
voltage
2.0
3.0
3.8
V
VIL
I/O low-level
input
N/A
N/A
0.3 x
IOVDD
V
VIH
I/O
high-level
input
0.7 x
IOVDD
N/A
N/A
V
VOL
I/O low-level
output
N/A
N/A
0.2 x
IOVDD
V
VOH
I/O
high-level
output
0.8 x
IOVDD
N/A
N/A
V

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3.3 RF Current Consumption
Table 3-3 RF current consumption
Working
Status
Parameter
Average
Value
Maximum
Value
(Typical
Value)
Unit
Mode
Rate
TX Power/
Receiving
TX
250
kbit/s
+20 dBm
200
210
mA
250
kbit/s
+10 dBm
62
64
mA
250
kbit/s
+0 dBm
26
28
mA
RX
250
kbit/s
Constant
receiving
10
12
mA
250
kbit/s
Constant
receiving
10
12
mA
250
kbit/s
Constant
receiving
10
12
mA
3.4 Working Current
Table 3-4 Working current
Working Mode
Working Status
(Ta = 25°C)
Average Value
Maximum Value
(Typical Value)
Unit
EZ
The module is in
EZ mode.
10
40
mA
Connected and
idle
The module is
connected to the
network.
4.2
5
mA
Deep sleep
mode
The module is in
deep sleep mode,
with 64 KB flash
memory.
5
N/A
μA

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4 RF Features
4.1 Basic RF Features
Table 4-1 Basic RF features
Parameter
Description
Working frequency
2.4 GHz ISM band
Wireless standard
IEEE 802.15.4
Data transmission rate
125 kbit/s, 250 kbit/s, 1 Mbit/s, or 2 Mbit/s
Antenna type
Onboard PCB antenna
4.2 RF TX Power
Table 4-2 Power during constant transmission
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power
–30
20
N/A
dBm
Output power fluctuation (–40°C
to +125°C)
N/A
1.5
N/A
dB
Output power fluctuation (3.0 V to
3.8 V)
N/A
0.8
N/A
dB