TUYA ZS2S User manual

Hangzhou Tuya Information Technology Co., Ltd. 1 V1.0.0
1 Product Overview
ZS2S is a low-power embedded Zigbee module that Tuya has developed. It consists of a
highly integrated Zigbee chip (EFR32MG21A020F768) and several peripheral circuits,
with an embedded Zigbee network protocol stack and robust library functions. ZS2S also
contains a 32-bit, 80 MHz, low-powerArm Cortex-M33 core, 768 KB flash memory, 64 KB
static random-access memory (SRAM), and extensive peripherals.
1.1 Features
Embedded low-power 32-bit microcontroller unit (MCU), which can also function as
an application processor
Clock rate: 80 MHz
Working voltage: 2.0 V to 3.8 V
Peripherals: five pulse width modulation (PWM) pins, one analog to digital converter
(ADC), and one universal asynchronous receiver/transmitter (UART)
Zigbee RF features
Channels 11 to 26 at 2.400 GHz to 2.483 GHz, 250 kbit/s air interface rate
TX power: +20 dBm; dynamic output power: > 35 dB
Runtime power consumption: 60 µA/MHz; current in sleep mode: 5 µA
Embedded Advanced Encryption Standard (AES) hardware encryption
Onboard PCB antenna
Working temperature: –20°C to +85°C
Tuya ZS2S Zigbee Module
Version: 1.0.0
Date: 2019-12-06
No.: 0000000001
Global Intelligent Platform
Product
Manual

Hangzhou Tuya Information Technology Co., Ltd. 2 V1.0.0
1.2 Application Scenarios
Intelligent building
Smart household and home appliances
Smart low-power sensors
Smart socket and light
Asset tracing
Industrial wireless control

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Change History
No.
Date
Change Description
Version After Change
1
2019-12-06
This is the first release.
1.0.0

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Contents
1 Product Overview...........................................................................................................1
1.1 Features...............................................................................................................1
1.2 Application Scenarios........................................................................................... 2
Change History ................................................................................................................. 3
2 Module Interfaces...........................................................................................................6
2.1 Dimensions and Footprint....................................................................................6
2.2 Interface Pin Definition.........................................................................................6
3 Electrical Parameters.....................................................................................................7
3.1 Absolute Electrical Parameters............................................................................7
3.2 Working Conditions..............................................................................................8
3.3 RF Current Consumption.....................................................................................9
3.4 Working Current...................................................................................................9
4 RF Features.................................................................................................................10
4.1 Basic RF Features.............................................................................................10
4.2 RF TX Power .....................................................................................................10
4.3 RF RX Sensitivity............................................................................................... 11
5 Antenna Information..................................................................................................... 11
5.1 Antenna Type..................................................................................................... 11
5.2 Antenna Interference Reduction......................................................................... 11
6 Packaging Information and Production Instructions.....................................................12
6.1 Mechanical Dimensions and Rear Solder Pad Dimensions...............................12
6.2 Production Instructions ......................................................................................12
6.3 Recommended Oven Temperature Curve..........................................................14
6.4 Storage Conditions............................................................................................. 15
7 MOQ and Packing Information.....................................................................................16
8 Appendix: Statement.................................................................................................... 16

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Figures
Figure 2-1 ZS2S front and rear views........................................................................6
Figure 6-1 ZS2S mechanical dimensions and rear solder pad dimensions .............12
Figure 6-2 Oven temperature curve.........................................................................14
Figure 6-3 HIC for ZS2S..........................................................................................15
Tables
Table 2-1 ZS2S interface pins.................................................................................... 6
Table 3-1 Absolute electrical parameters ................................................................... 7
Table 3-2 Normal working conditions.........................................................................8
Table 3-3 RF current consumption.............................................................................9
Table 3-4 Working current..........................................................................................9
Table 4-1 Basic RF features.....................................................................................10
Table 4-2 Power during constant transmission.........................................................10
Table 4-3 RX sensitivity............................................................................................ 11
Table 6-1 Recommended wave soldering temperature............................................14

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2 Module Interfaces
2.1 Dimensions and Footprint
ZS2S has two rows of pins with a 2 mm pin spacing.
The ZS2S dimensions (H x W x L) are 2.8±0.15 mm x 14.9±0.35 mm x 17.9±0.35 mm.
The PCB thickness is 0.8±0.1 mm. Figure 2-1 shows the ZS2S front and rear views.
Figure 2-1 ZS2S front and rear views
2.2 Interface Pin Definition
Table 2-1 ZS2S interface pins
Pin No.
Symbol
I/O Type
Function
1
3V3
P
Power supply pin (3.3 V)
2
PA00
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA00 pin on the internal IC
3
GND
P
Power supply reference ground pin
4
PA03
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA03 pin on the internal IC
5
RX
I/O
Serial interface receiving pin (UART RX), which

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Pin No.
Symbol
I/O Type
Function
is connected to the PA06 pin on the internal IC
6
PA04
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PA04 pin on the internal IC
7
TX
I/O
Serial interface transmission pin (UART TX),
which is connected to the PA05 pin on the
internal IC
8
ADC
Input
ADC pin, which is connected to the PC01 pin on
the internal IC
9
PB00
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PB00 pin on the internal IC
10
RST
Input
Reset pin, which is connected to the RESETn pin
on the internal IC
11
PB01
I/O
Common I/O pin, which can be used as a PWM
output of the LED drive and is connected to the
PB01 pin on the internal IC
Note:
Pindicates a power supply pin, and I/O indicates an input/output pin.
If you have special requirements for light colors controlled by PWM outputs, contact Tuya
business personnel.
3 Electrical Parameters
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
Parameter
Description
Minimu
m
Value
Maximum
Value
Unit
Ts
Storage
temperature
–50
150
°C

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Parameter
Description
Minimu
m
Value
Maximum
Value
Unit
VCC
Power supply
voltage
–0.3
3.8
V
Static electricity voltage
(human body model)
Tamb = 25°C
N/A
2
kV
Static electricity voltage
(machine model)
Tamb = 25°C
N/A
0.5
kV
3.2 Working Conditions
Table 3-2 Normal working conditions
Parameter
Description
Minimum
Value
Typical
Value
Maximum
Value
Unit
Ta
Working
temperature
–20
N/A
85
°C
VCC
Working
voltage
2.0
3.0
3.8
V
VIL
I/O low-level
input
N/A
N/A
0.3 x
IOVDD
V
VIH
I/O
high-level
input
0.7 x
IOVDD
N/A
N/A
V
VOL
I/O low-level
output
N/A
N/A
0.2 x
IOVDD
V
VOH
I/O
high-level
output
0.8 x
IOVDD
N/A
N/A
V

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3.3 RF Current Consumption
Table 3-3 RF current consumption
Working
Status
Parameter
Average
Value
Maximum
Value
(Typical
Value)
Unit
Mode
Rate
TX Power/
Receiving
TX
250
kbit/s
+20 dBm
200
210
mA
250
kbit/s
+10 dBm
62
64
mA
250
kbit/s
+0 dBm
26
28
mA
RX
250
kbit/s
Constant
receiving
10
12
mA
250
kbit/s
Constant
receiving
10
12
mA
250
kbit/s
Constant
receiving
10
12
mA
3.4 Working Current
Table 3-4 Working current
Working Mode
Working Status
(Ta = 25°C)
Average Value
Maximum Value
(Typical Value)
Unit
EZ
The module is in
EZ mode.
10
40
mA
Connected and
idle
The module is
connected to the
network.
4.2
5
mA
Deep sleep
mode
The module is in
deep sleep mode,
with 64 KB flash
memory.
5
N/A
μA

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4 RF Features
4.1 Basic RF Features
Table 4-1 Basic RF features
Parameter
Description
Working frequency
2.4 GHz ISM band
Wireless standard
IEEE 802.15.4
Data transmission rate
125 kbit/s, 250 kbit/s, 1 Mbit/s, or 2 Mbit/s
Antenna type
Onboard PCB antenna
4.2 RF TX Power
Table 4-2 Power during constant transmission
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power
–30
20
N/A
dBm
Output power fluctuation (–40°C
to +125°C)
N/A
1.5
N/A
dB
Output power fluctuation (3.0 V to
3.8 V)
N/A
0.8
N/A
dB

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4.3 RF RX Sensitivity
Table 4-3 RX sensitivity
Parameter
Minimum
Value
Typical
Value
Maximum
Value
Unit
RX sensitivity
125 kbit/s
N/A
–103
N/A
dBm
250 kbit/s
N/A
–102
N/A
1 Mbit/s
N/A
–97
N/A
2 Mbit/s
N/A
–94
N/A
5 Antenna Information
5.1 Antenna Type
ZS2S uses an onboard PCB antenna.
5.2 Antenna Interference Reduction
To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm
away from other metal parts. If metal materials are wrapped around the antenna, the
wireless signals will be reduced greatly, deteriorating the RF performance. As a dual
in-line package (DIP), ZS2S is through-hole mounted onto the PCB. Sufficient space
needs to be reserved for the antenna.

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6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions and Rear Solder Pad Dimensions
Figure 6-1 ZS2S mechanical dimensions and rear solder pad dimensions
6.2 Production Instructions
1. Preferentially use the wave soldering machine to solder the module, which is
recommended for Tuya-developed modules that are through-hole mounted onto
PCBs. Use hand soldering only when there is no operational wave soldering machine.
Complete soldering within 24 hours after the module is unpacked. If not, vacuum
pack the module again.
2. Required materials for soldering:
i. Wave soldering machine
ii. Wave soldering fixture

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iii. Constant-temperature iron
iv. Wave solder bar, wire, and flux
v. Oven temperature tester
(1) Baking equipment:
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
3. Bake the module if any of the following conditions is met:
(1) The vacuum package is damaged before the module is unpacked.
(2) The package does not contain a humidity indicator card (HIC).
(3) After the module is unpacked, the HIC shows that the 30% and higher rate circles
are pink.
(4) Production is not completed within 72 hours after the module is unpacked.
(5) The module has been packed for more than six months.
4. Baking settings:
(1) Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack mode
(2) Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
(3) Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode
(4) Production ready temperature after natural cooling: < 36°C
(5) Number of baking times: 1
(6) Rebaking condition: Production is not completed within 72 hours after baking.
5. Do not wave solder modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Throughout the production process, take electrostatic discharge (ESD) protective
measures.
7. For a good product quality, ensure that the following items meet requirements:
(1) Flux amount
(2) Wave height
(3) Amount of tin dross and copper in the solder pot

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(4) Wave soldering fixture window and thickness
(5) Oven temperature curve for wave soldering
6.3 Recommended Oven Temperature Curve
Set the oven temperature to a value recommended for wave soldering. The peak
temperature is 260±5°C. Figure 6-2 shows the oven temperature curve for wave
soldering.
Figure 6-2 Oven temperature curve
Table 6-1 Recommended wave soldering temperature
Wave Soldering
Hand Soldering
Preheat
temperature
80°C to 130°C
Wave soldering
temperature
360±20°C
Preheat time
75s to 100s
Soldering time
< 3s per point
Contact time
3s to 5s
N/A
N/A

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Wave Soldering
Hand Soldering
Solder pot
temperature
260±5°C
N/A
N/A
Temperature
increase rate
≤ 2°C per second
N/A
N/A
Temperature
drop rate
≤ 6°C per second
N/A
N/A
6.4 Storage Conditions
Storage conditions for a delivered module are as follows:
1. The moisture-proof bag is placed in an environment where the temperature is below
30°C and the relative humidity is lower than 70%.
2. The shelf life of a dry-packaged product is six months from the date when the product
is packaged and sealed.
3. The package contains a HIC.
Figure 6-3 HIC for ZS2S

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7 MOQ and Packing Information
8 Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
MOQ and packing information
Product
Model
MOQ
Packing Method
Number of Modules in
Each Reel Pack
Number of Reel
Packs in Each Box
ZS2S
3600
Carrier tape and
reel packing
900
4

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two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
Note:
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This equipment should be installed and operated with minimum
distance 20 cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operate simultaneously with
other radios in host system except in accordance with FCC multi-transmitter product
procedures. Additional testing and equipment authorization may be required to operating
simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands is country
dependent and are firmware programmed at the factory to match the intended destination.
The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that
apply to the host not covered by the modular transmitter grant of certification. The final
host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in
this manual, including: This product must be installed and operated with a minimum

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distance of 20 cm between the radiator and user body.
This device has gotten an FCC ID: 2ANDL-ZS2S. The final end product must be labeled in
a visible area with the following: "Contains Transmitter Module FCC ID: 2ANDL-ZS2S"
This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna
and users.
2. The transmitter module may not be co-located with any other transmitter or antenna.
As long as two conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
The device could be used with a separation distance of 20 cm to the human body.
This product must not be disposed of as normal household waste, in
accordance with EU directive for waste electrical and electronic
equipment (WEEE-2012/19/EU). Instead, it should be disposed of by
returning it to the point of sale, or to a municipal recycling collection point.
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that
this module product is in compliance with essential requirements and
other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of
the Declaration of conformity can be found at https://www.tuya.com