TUYA TYZS11 User manual

TYZS11 Module Datasheet
Hardware Product Development > Network Modules > Zigbee Module
> TYZS Series Module
Version: 20210315
Online Version

Contents
Contents
1 Overview 2
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Major application fields . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Module interfaces 4
2.1 Dimensions and footprint . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3 Test pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3 Electrical Characteristics 9
3.1 Absolute Electrical Characteristics . . . . . . . . . . . . . . . . . . . . 9
3.2 Electrical Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3 Zigbee TX Power Consumption . . . . . . . . . . . . . . . . . . . . . 10
3.4 Zigbee RX Power Consumption . . . . . . . . . . . . . . . . . . . . . 11
3.5 Power Consumption in Operating Mode . . . . . . . . . . . . . . . . . 11
4 RF Features 12
4.1 Basic RF Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 Zigbee Output Performance . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 Zigbee RX Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Antenna Information 14
5.1 Antenna Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Antenna Interference Reduction . . . . . . . . . . . . . . . . . . . . . 14
6 Packaging information and production instructions 15
6.1 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 Recommended PCB Encapsulation . . . . . . . . . . . . . . . . . . . 16
6.3 Production Instructions . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.4 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 19
6.5 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7 Appendix: Statement 22
i

Contents
TYZS11 is a low power-consuming embedded Zigbee module developed by
Hangzhou Tuya Information Technology Co., Ltd. It consists of a highly integrated
wireless radio processor chip (EFR32MG13P732) and several peripherals, with
a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library
functions.
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1 OVERVIEW
1 Overview
TYZS11 is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512
KB flash, 64 KB RAM data memory, and robust peripheral resources.
TYZS11 runs on the FreeRTOS platform that integrates all Zigbee MAC library func-
tions. You can develop built-in Zigbee products as required.
Figure 1 shows the architecture of TYZS11.
Figure 1 TYZS11 architecture
1.1 Features
• Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions
and floating-point unit functioning as an application processor
• Basic frequency: 40 MHz supported
• Wide working voltage: 1.8 V to 3.8 V
• Peripherals: 12 GPIOs, one UART, and one ADC
• Zigbee features
–802.15.4 MAC/PHY supported
–Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface
rate of 250 kbit/s
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1 OVERVIEW
–Built-in DC-DC circuit, maximizing the power-supply efficiency
–Maximum output power: +19 dBm; dynamic difference of output power:
> 35 dB
–Power consumption when TYZS11 is working: 63 uA/MHz; current when
TYZS11 is in the sleep state: 1.4 uA
–Proactive network configuration for terminals
–Copper column antenna and onboard PCB antenna
–Working temperature: -40°C to 85°C
–AES 128/256-based hardware encryption
1.2 Major application elds
• Intelligent building
• Intelligent home and household applications
• Intelligent socket and light
• Industrial wireless control
• Health care and measurement
• Asset tracing
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2 MODULE INTERFACES
2 Module interfaces
2.1 Dimensions and footprint
TYZS11 provides three rows of pins with a distance of 1.0 mm between every two
pins.
TYZS11 dimension: 15.3 mm (W) x 22 mm (L) x 2 mm (H). Figure 2 shows the overall
pin layout of TYZS11.
Figure 2 Front view of TYZS11
2.2 Pin denition
Table 1 describes the interface pins.
Table 1 TYZS11 interface pins
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2 MODULE INTERFACES
No. Symbol I/O Type Functions
1, 2, 11, 12, 13,
and 17
GND P Module reference
ground pins
19, 22, and 27
3 GPIO3 I/O Corresponds to
PD15 pin of the IC
and functions as a
GPIO.
4 PF3 I/O PF3 pin of the IC
and functions as a
GPIO.
5 SWCLK I/O JLINK SWCLK
programming pin,
which can also be
used as a GPIO in
normal programs.
6 SWDIO I/O JLINK SWDIO
programming pin,
which can also be
used as a GPIO in
normal programs.
7 ADC AI ADC port 1,
corresponding to
PB11 pin of the
IC. ADC is a 12-bit
precision SAR
analog-to-digital
converter.
8 and 18 3.3 V P Power-supply pins
of TYZS11 (typical
power-supply
voltage: 3.3 V)
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2 MODULE INTERFACES
No. Symbol I/O Type Functions
9 SWO I/O Corresponds to
PF2 pin of the IC
and functions as a
GPIO. It can be
used as an output
pin when J-Link is
used.
10 PF6 I/O Corresponds to
PF6 pin of the IC
and functions as a
GPIO.
14 UART_TXD O UART0_TXD
communication
interface,
corresponding to
PA0 pin of the IC.
15 UART_RXD I UART0_RXD
communication
interface,
corresponding to
PA1 pin of the IC.
16 PD14 I/O Corresponds to
PD14 pin of the IC
and functions as a
GPIO.
20 PWM3 I/O Corresponds to
PF4 pin of the IC
and functions as a
light drive
interface. It can
also be
configured as a
GPIO.
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2 MODULE INTERFACES
No. Symbol I/O Type Functions
21 PWM2 I/O Corresponds to
PA2 pin of the IC
and functions as a
light drive
interface. It can
also be
configured as a
GPIO.
23 nRST I Hardware reset
pin, and the chip
is reset when the
level is low.
TYZS11 has a
power-on reset
function, and this
pin is not
necessary for the
actual situation.
24 GPIO2 I/O Corresponds to
PA5 pin of the IC
and functions as a
GPIO.
25 GPIO0 I/O Corresponds to
PA3 pin of the IC
and functions as a
GPIO.
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2 MODULE INTERFACES
No. Symbol I/O Type Functions
26 PWM1 I/O Corresponds to
PF5 pin of the IC
and functions as a
light drive
interface. It can
also be
configured as a
GPIO.
Note: P indicates power-supply pins, I/O indicates input/output pins, and AI
indicates analog input pins.
nRST is only a module hardware reset pin, which cannot clear the Zigbee network
configuration.
This pin can only be used as the ADC interface and cannot be used as the common
I/O pin. If this pin is not used, it must be disconnected. When this pin is used as
the ADC input interface, the input voltage range must be 0–AVDD, which can be
configured using the software.
2.3 Test pin denition
Table 2 describes the test pins.
Table 2 TYZS11 test pins
No. Symbol I/O Type Functions
- - I Used for the
module
production test.
Note: It is recommended that test pins not be used.
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3 ELECTRICAL CHARACTERISTICS
3 Electrical Characteristics
3.1 Absolute Electrical Characteristics
Table 3Absolute electrical characteristics
Parameter Description
Minimum
Value
Maximum
Value Unit
Ts Storage
temperature
-50 150 °C
VCC Power-supply
voltage
-0.3 3.8 V
Static
electricity
voltage
(human
model)
TAMB -25°C - 2.5 kV
Static
electricity
voltage
(machine
model)
TAMB -25°C - 0.5 kV
3.2 Electrical Conditions
Table 4 Normal electrical conditions
Parameter Description
Minimum
Value
Typical
Value
Maximum
Value Unit
Ta Working
tempera-
ture
-40 - 85 °C
VCC Working
voltage
1.8 3.3 3.8 V
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3 ELECTRICAL CHARACTERISTICS
Parameter Description
Minimum
Value
Typical
Value
Maximum
Value Unit
VIL I/O
low-level
input
-0.3 - VCC x 0.25 V
VIH I/O
high-level
input
VCC x 0.75 - VCC V
VOL I/O
low-level
output
- - VCC x 0.1 V
VOH I/O
high-level
output
VCC x 0.8 - VCC V
Imax I/O drive
current
- - 12 mA
3.3 Zigbee TX Power Consumption
Table 5 TX power consumption during constant emission
Symbol Rate TX power
Typical
Value Unit
IRF 250 kbit/s +19 dBm 120 mA
IRF 250 kbit/s +13 dBm 50 mA
IRF 250 kbit/s +10 dBm 32 mA
IRF 250 kbit/s +4 dBm 17 mA
IRF 250 kbit/s +1 dBm 11.8 mA
Note: When the preceding data is being tested, the duty cycle is set to 100%.
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3 ELECTRICAL CHARACTERISTICS
3.4 Zigbee RX Power Consumption
Table 6 RX power consumption during constant receiving
Symbol Rate Typical Value Unit
IRF 250 kbit/s 8 mA
Note: When the UART is in the active state, the received current is 14 mA.
3.5 Power Consumption in Operating Mode
Table 7 TYZS11 working current
Working
Mode
Working
Status (Ta =
25°C)
Average
Value
Maximum
Value Unit
EZ mode The module is
in the EZ
state.
10 40 mA
Operation
mode
The module is
in the
connected
state.
3 5 mA
Deep sleep
mode
The module is
in the deep
sleep mode,
with the 64
KB flash.
3.5 6 uA
Low power
EM2
Low power
EM2 mode,
with the 64
KB flash.
5 - uA
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4 RF FEATURES
4 RF Features
4.1 Basic RF Features
Table 8 Basic RF features
Parameter Description
Frequency band 2.400 GHz to 2.484 GHz
Physical-layer standard IEEE 802.15.4
Data transmitting rate 250 kbit/s
Antenna type External copper column spring
antenna and onboard PCB antenna
Line-of-sight transmission distance > 120 m
4.2 Zigbee Output Performance
Table 9 TX continuous transmission performance
Parameter
Minimum
Value
Typical
Value
Maximum
Value Unit
Maximum
output power
- +19 - dBm
Minimum
output power
- -30 - dBm
Output power
adjustment
step
- 0.5 1 dB
Frequency
error
-15 - +15 ppm
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4 RF FEATURES
Parameter
Minimum
Value
Typical
Value
Maximum
Value Unit
Output
spectrum
adjacent-
channel
rejection ratio
-31 dBc
Note: The maximum output power can reach +19 dBm. The power output can be
adjusted under normal use. The high-power output can be used for overlay trans-
mission in extremely complex conditions, such as modules embedded in a wall.
4.3 Zigbee RX Sensitivity
Table 10 RX sensitivity
Parameter
Minimum
Value
Typical
Value
Maximum
Value Unit
PER < 10%,
RX
sensitivity,
250
kbit/s@OQPSK
- -101 - dBm
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5 ANTENNA INFORMATION
5 Antenna Information
5.1 Antenna Types
By default, the onboard PCB antenna is used. It can be connected to an external cop-
per spring antenna using a connector, which is used for wireless extended coverage
in complex installation conditions.
5.2 Antenna Interference Reduction
When you use a copper column antenna on a Zigbee module, make sure that the
antenna on the module is at least 15 mm away from other metal parts to ensure
optimal wireless performance. It is recommended that the antenna location on the
PCB be hollowed out.
To prevent a negative effect on antenna radiation performance, do not route copper
or cable wires along the antenna area of the user PCB board.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6 Packaging information and production instructions
6.1 Mechanical Dimensions
Figure 3 Mechanical dimensions of TYZS11
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.2 Recommended PCB Encapsulation
Figure 4 TYZS11 schematic diagram and pin connection
Comply with the encapsulation diagram provided in Figure 5.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
Figure 5 Encapsulation diagram of TYZS11
6.3 Production Instructions
• The stamp-hole module must be mounted by the SMT machine. After being
unpacked, it must be soldered within 24 hours. Otherwise, it must be put into
the drying cupboard where the RH is not greater than 10%, or it needs to be
packaged under vacuum again and the exposure time needs to be recorded
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
(the total exposure time cannot exceed 168 hours).
–SMT equipment:
∗ Mounter
∗ SPI
∗ Reflow soldering machine
∗ Oven temperature tester
∗ Automated optical inspection (AOI) equipment
–Baking equipment:
∗ Cabinet oven
∗ Anti-static heat-resistant pallets
∗ Anti-static heat-resistant gloves
• Storage conditions for a delivered module are as follows:
–The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
–The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
–The package contains a humidity indicator card (HIC).
• The module needs to be baked in the following cases:
–Vacuum packing bag was found to be damaged before being unpacked.
–There is no humidity indicator card (HIC) in the vacuum packing bag.
–After being unpacked, 10% and above circles on the HIC become pink.
–The total exposure time has been more than 168 hours since unpacking.
–More than 12 months have passed since the sealing date of the bag.
• Baking settings:
–Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for
palletizing (please use heat-resistant pallet rather than plastic pallet)
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