Ublox NEO-8Q Series Quick setup guide

NEO-8Q / NEO-M8
u-blox 8 / M8 GNSS modules
Hardware Integration Manual
Abstract
This document describes the features and specifications of u-blox
NEO-8Q and NEO-M8 series modules.
www.u-blox.com
UBX-15029985 - R04

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Document Information
Title
NEO-8Q / NEO-M8
Subtitle
u-blox 8 / M8 GNSS modules
Document type
Hardware Integration Manual
Document number
UBX-15029985
Revision and Date
R04
11-Nov-2017
Document status
Production Information
Document status explanation
Objective Specification
Document contains target values. Revised and supplementary data will be published later.
Advance Information
Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Document contains data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
European Union regulatory compliance
NEO-8Q and NEO-M8N/M/Q/T modules comply with all relevant requirements for RED 2014/53/EU. The NEO-8Q andNEO-M8N/M/Q/T
Declaration of Conformity (DoC) is available at www.u-blox.com within Support > Product resources > Conformity Declaration.
This document applies to the following products:
Product name
Type number
ROM/FLASH version
PCN reference
NEO-M8N
NEO-M8N-0-10
FLASH FW SPG 3.01
UBX-15030279
NEO-M8M
NEO-M8M-0-10
ROM SPG 3.01
UBX-16013121
NEO-M8Q
NEO-M8Q-0-10
ROM SPG 3.01
UBX-16013121
NEO-M8T
NEO-M8T-0-10
FLASH FW3.01 TIM 1.10
UBX-16005636
NEO-8Q
NEO-8Q-0-10
ROM SPG 3.01
N/A
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein
may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this
document or any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit
www.u-blox.com.
Copyright © 2017, u-blox AG
u-blox is a registered trademark of u-blox Holding AG in the EU and other countries

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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
GPS Compendium: This document, also known as the GPS book, provides a wealth of information
regarding generic questions about GPS system functionalities and technology.
Receiver Description including Protocol Specification: This document describes messages, configuration
and functionalities of the NEO-8Q / NEO-M8 software releases and receivers.
Hardware Integration Manuals: These manuals provide hardware design instructions and information on
how to set up production and final product tests.
Application Notes: These documents provide general design instructions and information that applies to all
u-blox GNSS positioning modules.
How to use this Manual
This manual has a modular structure. It is not necessary to read it from beginning to end.
The following symbols highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively influence or damage the module.
Questions
If you have any questions about NEO-8Q / NEO-M8 integration, please:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com.
Read the questions and answers on our FAQ database on the homepage.
Technical Support
Worldwide Web
Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and
helpful FAQ can be accessed 24h a day.
By E-mail
If you have technical problems or cannot find the required information in the provided documents, contact the
closest Technical Support office. To ensure that we process your request as soon as possible, use our service pool
email addresses rather than personal staff email addresses. Contact details are at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support please have the following information ready:
Receiver type (e.g. NEO-M8N-0-10), Datacode (e.g. 180200.1000) and firmware version (e.g. FLASH FW
SPG3.01)
Receiver/module configuration
Clear description of your question or the problem (may include a u-center logfile)
A short description of the application
Your complete contact details

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Contents
Preface ........................................................................................................................................... 3
Contents ........................................................................................................................................ 4
1Hardware description ............................................................................................................. 6
1.1 Overview .............................................................................................................................................................. 6
1.2 Configuration ....................................................................................................................................................... 6
1.3 Connecting power................................................................................................................................................ 6
1.3.1 VCC: Main supply voltage............................................................................................................................. 6
1.3.2 V_BCKP: Backup supply voltage .................................................................................................................... 6
1.3.3 VDD_USB: USB interface power supply ......................................................................................................... 7
1.3.4 VCC_RF: Output voltage RF .......................................................................................................................... 7
1.4 Interfaces.............................................................................................................................................................. 7
1.4.1 UART............................................................................................................................................................ 7
1.4.2 USB .............................................................................................................................................................. 7
1.4.3 Display Data Channel (DDC).......................................................................................................................... 8
1.4.4 SPI................................................................................................................................................................ 8
1.4.5 TX_READY.................................................................................................................................................... 8
1.5 I/O pins................................................................................................................................................................. 9
1.5.1 RESET_N: Reset............................................................................................................................................. 9
1.5.2 EXTINT: External interrupt ............................................................................................................................. 9
1.5.3 SAFEBOOT_N................................................................................................................................................ 9
1.5.4 D_SEL: Interface select .................................................................................................................................. 9
1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T)......................................................................................................... 9
1.5.6 TIMEPULSE2 ............................................................................................................................................... 10
1.5.7 LNA_EN: LNA enable .................................................................................................................................. 10
1.6 Electromagnetic interference on I/O lines ............................................................................................................ 10
2Design.................................................................................................................................... 11
2.1 Pin description .................................................................................................................................................... 11
2.1.1 Pin name changes....................................................................................................................................... 12
2.2 Minimal design ................................................................................................................................................... 13
2.3 Layout: Footprint and paste mask ....................................................................................................................... 13
2.4 Antenna ............................................................................................................................................................. 14
2.4.1 Antenna design with passive antenna ......................................................................................................... 14
2.4.2 Active antenna design................................................................................................................................. 15
3Migration to u-blox 8 / M8 modules.................................................................................... 17
3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series modules.................................................................... 17
3.2 Hardware migration NEO-6 -> NEO-8Q and NEO-M8 series................................................................................. 17
3.3 Software migration............................................................................................................................................. 18
4Product handling................................................................................................................... 19
4.1 Packaging, shipping, storage and moisture preconditioning ................................................................................ 19
4.2 Soldering............................................................................................................................................................ 19
4.3 EOS/ESD/EMI precautions.................................................................................................................................... 22
4.4 Applications with cellular modules ...................................................................................................................... 26

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Appendix ..................................................................................................................................... 28
AGlossary................................................................................................................................. 28
BRecommended parts ............................................................................................................. 29
Related documents...................................................................................................................... 30
Revision history........................................................................................................................... 30
Contact......................................................................................................................................... 31

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1Hardware description
1.1 Overview
u-blox NEO-8Q, NEO-M8N, NEO-M8Q, and NEO-M8M standard precision GNSS modules, and the NEO-M8T
timing GNSS module, all feature the high performance u-blox M8 GNSS engine. Available in the industry
standard NEO form factor in a leadless chip carrier (LCC) package, they are easy to integrate and combine
exceptional positioning performance with highly flexible power, design, and connectivity options. SMT pads
allow fully automated assembly with standard pick & place and reflow-soldering equipment for cost-efficient,
high-volume production enabling short time-to-market.
For product features, see the corresponding product data sheet in the Related documents.
To determine which u-blox product best meets your needs, see the product selector tables on the u-blox
website www.u-blox.com.
1.2 Configuration
The configuration settings can be modified using UBX protocol configuration messages, see the u-blox 8 / u-blox
M8 Receiver Description including Protocol Specification [4]. The modified settings remain effective until power-
down or reset. If these settings have been stored in BBR (Battery Backed RAM), then the modified configuration
will be retained, as long as the backup battery supply is not interrupted.
For the NEO-M8N module, configuration can be saved permanently in SQI flash.
1.3 Connecting power
The u-blox NEO-8Q and NEO-M8 series modules have three power supply pins: VCC, V_BCKP, and VDD_USB.
1.3.1 VCC: Main supply voltage
The VCC pin provides the main supply voltage. During operation, the current drawn by the module can vary by
some orders of magnitude, especially if enabling low-power operation modes. For this reason, it is important
that the supply circuitry be able to support the peak power for a short time (see the corresponding product data
sheet in Related documents for the specifications).
When switching from backup mode to normal operation or at start-up, u-blox NEO-8Q and NEO-M8 series
modules must charge the internal capacitors in the core domain. In certain situations, this can result in a
significant current draw. For low power applications using Power Save and backup modes, it is important
that the power supply or low ESR capacitors at the module input can deliver this current/charge.
Use a proper GND concept. Do not use any resistors or coils in the power line.
1.3.2 V_BCKP: Backup supply voltage
If the module supply has a power failure, the V_BCKP pin supplies the real-time clock (RTC) and battery backed
RAM (BBR). Use of valid time and the GNSS orbit data at start up will improve the GNSS performance, as with
hot starts, warm starts, AssistNow Autonomous and AssistNow Offline. If no backup battery is connected, the
module performs a cold start at power up.
Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply, a short
current adjustment peak can cause high voltage drop on the pin with possible malfunctions.
If no backup supply voltage is available, connect the V_BCKP pin to VCC.
As long as power is supplied to the NEO-8Q and NEO-M8 series modules through the VCC pin, the backup
battery is disconnected from the RTC and the BBR to avoid unnecessary battery drain (see Figure 1). In this
case, VCC supplies power to the RTC and BBR.

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Figure 1: Backup battery and voltage (for exact pin orientation, see the corresponding product data sheet in Related
documents)
Real-Time Clock (RTC)
The RTC is driven by a 32 kHz oscillator using an RTC crystal. If the main supply voltage fails, and a battery is
connected to V_BCKP, parts of the receiver switch off, but the RTC still runs providing a timing reference for the
receiver. This operating mode is called Hardware Backup Mode, which enables all relevant data to be saved in
the backup RAM to allow a hot or warm start later
1.3.3 VDD_USB: USB interface power supply
VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be connected to
GND. For more information about correctly handling the VDD_USB pin, see section 1.4
1.3.4 VCC_RF: Output voltage RF
The VCC_RF pin can supply an active antenna or external LNA. For more information, see section 2.4.
1.4 Interfaces
1.4.1 UART
The NEO-8Q and NEO-M8 series modules include a Universal Asynchronous Receiver Transmitter (UART) serial
interface RXD/TXD supporting configurable baud rates. The baud rates supported are specified in the
corresponding product data sheet in Related documents.
The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/- 12 V) can be
implemented using level shifters such as Maxim MAX3232. Hardware handshake signals and synchronous
operation are not supported.
Designs must allow access to the UART pin for future service and reconfiguration.
1.4.2 USB
A USB version 2.0 FS (Full Speed, 12 Mbit/s) compatible interface is available for communication as an alternative
to the UART. The USB_DP integrates a pull-up resistor to signal a full-speed device to the host. The VDD_USB
pin supplies the USB interface.
u-blox provides Microsoft® certified USB drivers for Windows Vista, Windows 7, Windows 8 and Windows 10
operating systems. These drivers are available at our website at www.u-blox.com
USB external components
The USB interface requires some external components to implement the physical characteristics required by the
USB 2.0 specification. These external components are shown in Figure 2 and listed in Table 1. To comply with
USB specifications, VBUS must be connected through an LDO (U1) to pin VDD_USB on the module.
In USB self-powered mode, the power supply (VCC) can be turned off and the digital block is not powered. In
this case, since VBUS is still available, the USB host would still receive the signal indicating that the device is

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present and ready to communicate. This should be avoided by disabling the LDO (U1) using the enable signal
(EN) of the VCC-LDO or the output of a voltage supervisor. Depending on the characteristics of the LDO (U1) it is
recommended to add a pull-down resistor (R11) at its output to ensure VDD_USB is not floating if the LDO (U1)
is disabled or the USB cable is not connected i.e. VBUS is not supplied.
USB bus-powered mode is not supported.
Module
VDD_USB
LDO
VDD_USB
R4
USB_DP
USB_DM
R5
C24 C23
D2
VBUS
DP
DM
GND
USB Device Connector
U1
EN R11
EN
Figure 2: USB Interface
Name
Component
Function
Comments
U1
LDO
Regulates VBUS (4.4 …5.25 V)
down to a voltage of 3.3 V.
Almost no current requirement (~1 mA) if the GNSS receiver is operated as a
USB self-powered device.
C23,
C24
Capacitors
Required according to the specification of LDO U1
D2
Protection
diodes
Protect circuit from overvoltage
/ ESD when connecting.
Use low capacitance ESD protection such as ST Microelectronics USBLC6-2.
R4, R5
Serial
termination
resistors
Establish a full-speed driver
impedance of 28…44 
A value of 27 is recommended.
R11
Resistor
100 kis recommended for USB self-powered setup.
Table 1: Summary of USB external components
1.4.3 Display Data Channel (DDC)
An I2C compatible Display Data Channel (DDC) interface is available on NEO-8Q and NEO-M8 series modules for
serial communication with an external host CPU. The interface only supports operation in slave mode (master
mode is not supported). The DDC protocol and electrical interface are fully compatible with the Fast-Mode of the
I2C industry standard. DDC pins SDA and SCL have internal pull-up resistors.
For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver Description
Including Protocol Specification [4]. For bandwidth information, see the corresponding product data sheet in the
Related documents.For timing parameters, consult the I2C-bus specification [7].
The NEO-8Q and NEO-M8 series DDC interface supports serial communication with most u-blox cellular
modules. See the specification of the applicable cellular module to confirm compatibility.
1.4.4 SPI
An SPI interface is available for communication to a host CPU.
SPI is not available in the default configuration, because its pins are shared with the UART and DDC
interfaces. The SPI interface can be enabled by connecting D_SEL to ground. For speed and clock
frequency, see the corresponding product data sheet in the Related documents.
1.4.5 TX_READY
The TX_READY function is used to indicate when the receiver has data to transmit. A listener can wait on the
TX_READY signal instead of polling the DDC or SPI interfaces. The UBX-CFG-PRT message lets you configure the
polarity and the number of bytes in the buffer before the TX READY signal goes active. The TX_READY function
can be mapped to TXD (PIO 06). The TX_READY function is disabled by default.

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The TX_READY functionality can be enabled and configured by AT commands sent to the u-blox cellular
module supporting the feature. For more information, see the GPS Implementation and Aiding Features in
u-blox wireless modules [8].
1.5 I/O pins
1.5.1 RESET_N: Reset
Driving RESET_N low activates a hardware reset of the system. Use this pin only to reset the module. Do not use
RESET_N to turn the module on and off, since the reset state increases power consumption. With NEO-8Q and
NEO-M8 series modules RESET_N is an input only.
The RTC time is also reset (but not BBR)
1.5.2 EXTINT: External interrupt
EXTINT (EXTINT0 on NEO-M8T) is an external interrupt pin with fixed input voltage thresholds with respect to
VCC (see the corresponding product data sheet in Related documents for more information). It can be used for
wake-up functions in Power Save Mode on NEO-8Q and NEO-M8 series modules and for aiding. Leave open if
unused. The function is disabled by default.
EXTINT1 is an external interrupt pin on NEO-M8T with fixed input voltage thresholds with respect to VCC (see
the corresponding product data sheet in Related documents for more information). It can be used for wake-up
functions in Power Save Mode on NEO-M8T module and for aiding. Leave open if unused. The function is
disabled by default.
Power Control
The power control feature allows overriding the automatic active/inactive cycle of Power Save Mode. The state of
the receiver can be controlled through the EXTINT (EXTINT0 on NEO-M8T) pin. The receiver can also be forced
OFF using EXTINT (EXTINT0 on NEO-M8T) when Power Save Mode is not active.
Frequency aiding
The EXTINT (EXTINT0 on NEO-M8T) pin can be used to supply time or frequency aiding data to the receiver.
For time aiding, hardware time synchronization can be achieved by connecting an accurate time pulse to the
EXTINT (EXTINT0 on NEO-M8T) pin.
Frequency aiding can be implemented by connecting a periodic rectangular signal with a frequency up to 500
kHz and arbitrary duty cycle (low/high phase duration must not be shorter than 50 ns) to the EXTINT (EXTINT0
on NEO-M8T) pin. Provide the applied frequency value to the receiver using UBX messages.
1.5.3 SAFEBOOT_N
The SAFEBOOT_N pin is for future service, updates and reconfiguration.
On the NEO-M8T module, a configurable TIMEPULSE2 signal can be programmed on TP2/SAFEBOOT_N.
Do not pull low during reset
1.5.4 D_SEL: Interface select
The D_SEL pin selects the available interfaces. SPI cannot be used simultaneously with UART/DDC. If open, UART
and DDC are available. If pulled low, the SPI interface is available. See the corresponding product data sheet in
the Related documents.
1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T)
On NEO-8Q and NEO-M8 series modules, a configurable time pulse signal is available. By default, the time pulse
signal is configured to one pulse per second. For more information, see the u-blox 8 / u-blox M8 Receiver

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Description including Protocol Specification [4]
1.5.6 TIMEPULSE2
On the NEO-M8T module, a configurable TIMEPULSE2 signal can be programmed on TP2/SAFEBOOT_N.
For more information, see the u-blox 8 / u-blox M8 Receiver Description including Protocol Specification [4]
The TIMEPULSE2 output must not be held LOW during start-up.
1.5.7 LNA_EN: LNA enable
On NEO-M8N, NEO-M8Q, NEO-M8T and NEO-8Q modules, in Power Save Mode, the system can turn on/off
an optional external LNA using the LNA_EN signal in order to optimize power consumption.
Signals: "high" = Turn ON LNA, "low" = Turn OFF LNA
1.6 Electromagnetic interference on I/O lines
Any I/O signal line with a length greater than approximately 3 mm can act as an antenna and may pick up
arbitrary RF signals transferring them as noise into the GNSS receiver. This specifically applies to unshielded lines,
in which the corresponding GND layer is remote or missing entirely, and lines close to the edges of the printed
circuit board.
If, for example, a cellular signal radiates into an unshielded high-impedance line, it is possible to generate noise
in the order of volts and not only distort receiver operation but also damage it permanently.
On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver performance
may be degraded when this noise is coupled into the GNSS antenna (see Figure 15).
To avoid interference by improperly shielded lines, it is recommended to use resistors (e.g. R>20 ), ferrite beads
(e.g. BLM15HD102SN1) or inductors (e.g. LQG15HS47NJ02) on the I/O lines in series. These components should
be chosen with care because they will affect also the signal rise times.
Figure 3 shows an example of EMI protection measures on the RXD/TXD line using a ferrite bead. For more
information, see section 4.3.
Figure 3: EMI Precautions

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2Design
2.1 Pin description
Function
PIN
No
I/O
Description
Remarks
Power
VCC
23
Supply Voltage
Provide clean and stable supply.
GND
10,12,13
, 24
Ground
Assure a good GND connection to all GND pins of the module,
preferably with a large ground plane.
V_BCKP
22
Backup Supply
Voltage
It is recommended to connect a backup supply voltage to V_BCKP in
order to enable warm and hot start features on the positioning
modules. Otherwise, connect to VCC.
VDD_USB
7
USB Power
Supply
To use the USB interface, connect this pin to 3.0 –3.6 V.
If no USB serial port used connect to GND.
Antenna
RF_IN
11
I
GNSS signal
input from
antenna
The connection to the antenna must be routed on the PCB. Use a
controlled impedance of 50 to connect RF_IN to the antenna or
the antenna connector.
VCC_RF
9
O
Output Voltage
RF section
VCC_RF can be used to power an external active antenna.
UART
TXD / SPI
MISO
20
O
UART_TX/ SPI
MISO
Communication interface,
Can be programmed as TX_READY for DDC interface.
If pin 2 low => SPI MISO.
RXD / SPI
MOSI
21
I
UART_RX / SPI
MOSI
Serial input. Internal pull-up resistor to VCC. Leave open if not used.
If pin 2 low => SPI MOSI.
USB
USB_DM
5
I/O
USB I/O line
USB bidirectional communication pin. Leave open if unused.
USB_DP
6
I/O
USB I/O line
System
TIMEPULSE
TIMEPULSE
1 (NEO-M8T)
3
O
Timepulse
Signal
Configurable Timepulse signal (one pulse per second by default).
Leave open if not used.
SAFEBOOT_
N
TP2/SAFEB
OOT_N
(NEO-M8T)
1
I
SAFEBOOT_N
SAFEBOOT_N, leave OPEN
I/O
TP2 /
SAFEBOOT_N
Configurable Timepulse2 signal
SAFEBOOT_N, leave open if not used. Do not pull low during reset.
EXTINT
4
I
External
Interrupt
External Interrupt Pin.
Internal pull-up resistor to VCC. Leave open if not used. Function is
disabled by default.
EXTINT0
(NEO-M8T)
RESERVED
EXTINT1
(NEO-M8T)
15
-
Reserved
Leave open.
I
External
Interrupt
External Interrupt Pin.
Internal pull-up resistor to VCC. Leave open if not used. Function is
disabled by default.
SDA / SPI
CS_N
18
I/O
DDC Data / SPI
CS_N
DDC Data
If pin 2 low => SPI chip select.
SCL / SPI
CLK
19
I
DDC Clock /
SPI
SCK
DDC Clock.
If pin 2 low => SPI clock.
LNA_EN
14
O
LNA_EN
Antenna control can be used to turn on and off an optional external
LNA.
RESERVED
(NEO-M8M)
-
Reserved
Leave open.
RESET_N
8
I
Reset input
Reset input
D_SEL
2
I
selects the
interface
Allow selecting UART/DDC or SPI
open-> UART/DDC; low->SPI
RESERVED
16,17
-
Reserved
Leave open.
Table 2: NEO-8Q and NEO-M8 series Pinout

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2.1.1 Pin name changes
Selected pin names have been updated to agree with a common naming convention across u-blox modules. The
pins have not changed their operation and are the same physical hardware but with updated names. The table
below lists the pins that have changed name along with their old and new names.
No
Previous Name
New name
14
ANT_ON
LNA_EN
20
TxD
SPI MISO
TXD /
SPI MISO
21
RxD
SPI MOSI
RXD /
SPI MOSI
Table 3: Pin name changes

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2.2 Minimal design
This is a minimal design for a NEO-8Q and NEO-M8 series GNSS receiver.
Figure 4: NEO-8Q / NEO-M8 passive antenna design
NEO-M8M can have a passive antenna, but for optimal operation requires an external SAW and LNA, see
Figure 7.
2.3 Layout: Footprint and paste mask
Figure 5 describes the footprint of the NEO-8Q and NEO-M8 series modules and provides recommendations (not
specifications) for the paste mask Note that the copper and solder masks have the same size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the copper mask. For the stencil thickness, see section 4.2.
Consider the paste mask outline when defining the minimal distance to the next component. The exact
geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific
production processes (e.g. soldering) of the customer.
Stencil: 150  m
10.4 mm [409.5 mil]
14.6 mm [575 mil]
12.2 mm [480 mil]
0.8 mm
[31.5 mil]
0.6 mm
[23.5 mil]
Figure 5: NEO-8Q and NEO-M8 series paste mask NEO-8Q and NEO-M8 series footprint
12.2 mm [480.3 mil]
16.0 mm [630 mil]
1.0 mm
[39.3 mil]
0.8 mm
[31.5 mil]
0.8 mm
[31.5 mil]
3.0 mm
[118.1 mil]
1.0 mm
[39.3 mil]
1.1 mm
[43.3 mil]

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2.4 Antenna
2.4.1 Antenna design with passive antenna
A design using a passive antenna requires more attention to the layout of the RF section. Typically, a passive
antenna is located near electronic components; therefore, care should be taken to reduce electrical noise that
may interfere with the antenna performance. Passive antennas do not require a DC bias voltage and can be
directly connected to the RF input pin RF_IN. Sometimes, they may also need a passive matching network to
match the impedance to 50 .
Use an antenna that has sufficient bandwidth to receive all GNSS constellations. See Appendix.
Figure 6 shows a minimal setup for a design with a good GNSS patch antenna. For exact pin orientation, see the
corresponding product data sheet in the Related documents.
Figure 6: NEO-M8N / NEO-M8T / NEO-M8Q / NEO-8Q passive antenna design
Figure 7 and Figure 8 show designs using an external LNA and SAW to increase the sensitivity for optimum
performance with passive antenna. For exact pin orientation, see the corresponding product data sheet in the
Related documents.
Figure 7: NEO-M8M module design with passive antenna and an external LNA and SAW
The VCC_RF output can be used to supply the LNA with a filtered supply voltage.
An external LNA is only required if the antenna is far away. In that case, the LNA must be placed close to
the passive antenna.

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Figure 8: NEO-M8N / NEO-M8Q / NEO-M8T / NEO-8Q module design with passive antenna and an external LNA
The LNA_EN pin (LNA enable) can be used to turn on and off an optional external LNA.
The VCC_RF output can be used to supply the LNA with a filtered supply voltage.
A standard GNSS LNA has enough bandwidth to amplify GPS/GLONASS/Galileo/BeiDou signals.
An external LNA is only required if the antenna is far away. In that case the LNA must be placed close to the
passive antenna.
2.4.2 Active antenna design
Active antennas have an integrated low-noise amplifier. Active antennas require a power supply that will
contribute to the total GNSS system power consumption budget with additional 5 to 20 mA typically.
For maximum external gain see the corresponding product data sheet in Related documents.
If the supply voltage of the NEO-8Q / NEO-M8 receiver matches the supply voltage of the antenna (e.g. 3.0 V),
use the filtered supply voltage available at pin VCC_RF as shown in Figure 9. For exact pin orientation, see the
corresponding product data sheet in the Related documents.
Active antenna design using VCC_RF pin to supply the active antenna
Figure 9: Active antenna design, external supply from VCC_RF

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If the VCC_RF voltage does not match the supply voltage of the active antenna, use a filtered external supply, as
shown in Figure 10. For the exact pin orientation, see the corresponding product data sheet in Related
documents.
Active antenna design powered from external supply
Figure 10: Active antenna design, direct external supply
The circuit shown in Figure 10 works with all u-blox M8 modules, and also with modules without VCC_RF
output.

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3Migration to u-blox 8 / M8 modules
3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series modules
u-blox is committed to ensuring that products in the same form factor are backwards compatible over several
technology generations. Utmost care has been taken to ensure there is no negative impact on function or
performance and to make NEO-8Q and NEO-M8 series modules as fully compatible as possible with u-blox 7
modules. If using BeiDou, check the bandwidth of the external RF components and the antenna. For information
about power consumption, see the corresponding product data sheet in the Related documents.
It is highly advisable that customers consider a design review with the u-blox support team to ensure the
compatibility of key functionalities.
Selected pin names have been updated to agree with a common naming convention across u-blox modules.
The pins have not changed their operation and are the same physical hardware but with updated names.
3.2 Hardware migration NEO-6 -> NEO-8Q and NEO-M8 series
Pin
NEO-6
NEO-8Q and NEO-M8 series
Remarks for Migration
Pin Name
Typical
Assignment
Pin Name
Typical
Assignment
1
SAFEBOOT_N
Leave open.
SAFEBOOT_N
Leave open.
No difference
2
SS_N
SPI Slave Select
D_SEL
selects the
interface
-> Various functions, compatible only when not
using SPI for communication.
3
TIMEPULSE 1
Timepulse 1
(1PPS)
TIMEPULSE/
TIMEPULSE1
Timepulse1
No difference
4
EXTINT0
External Interrupt
Pin
EXTINT/
EXTINT0
External Interrupt
No difference
5
USB_DM
USB Data
USB_DM
USB Data
No difference
6
USB_DP
USB Data
USB_DP
USB Data
No difference
7
VDD_USB
USB Supply
VDD_USB
USB Supply
No difference
8
RESERVED
Pin 8 and 9
must be
connected
together.
RESET_N
Reset
If pin 8 is connected directly to pin 9, the RESET_N
function is not available. If the RESET_N function
shall be used, a 3k3 resistor from pin 8 to pin 9 in
conjunction with an open drain buffer is required
for u-blox 6. For NEO-8Q / NEO-M8 modules pin 8
can be connected to pin 9 or can be left open. Do
not populate the 3k3 resistor.
Behavior of RESET_N has changed; For u-blox 7
and M8, a RESET_N will erase the time
information in the BBR, which has maintained in
u-blox 6. Therefore, with u-blox 7 and M8 a
RESET_N will not result in a hot start, etc.
9
VCC_RF
Can be used for
active antenna or
external LNA
supply.
VCC_RF
Can be used for
active antenna or
external LNA
supply.
No difference
10
GND
GND
GND
GND
No difference
11
RF_IN
GNSS signal
input
RF_IN
GNSS signal input
No difference
12
GND
GND
GND
GND
No difference
13
GND
GND
GND
GND
No difference
14
MOSI/
CFG_COM0
SPI MOSI /
Configuration
Pin.
Leave open if
not used.
LNA_EN
Used to turn on
and off an
optional external
LNA
LNA_EN (Active Antenna Control) can be used to
turn on and off an optional external LNA.
-> Different functions, no SPI MOSI and
configuration pins with NEO-8Q / NEO-M8. If not
used as default configuration, it must be set using
software command!
It is not possible to migrate from NEO-6 to NEO-
8Q / NEO-M8, if NEO-6 pin 14 is connected to
GND. In this case, migrate to NEO-M8M!

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Pin
NEO-6
NEO-8Q and NEO-M8 series
Remarks for Migration
Pin Name
Typical
Assignment
Pin Name
Typical
Assignment
15
MISO/
CFG_COM1
SPI MISO /
Configuration
Pin. Leave open
if not used.
RESERVED
Leave open.
16
CFG_GPS0/
SCK
Power Mode
Configuration
Pin / SPI Clock.
Leave open if
not used.
RESERVED
Leave open.
17
RESERVED
Leave open.
RESERVED
Leave open.
No difference
18
SDA
DDC Data
SDA
DDC Data / SPI
CS_N
No difference for DDC. If pin 2 low = SPI chip
select
19
SCL
DDC Clock
SCL
DDC Clock / SPI
SCK
No difference for DDC. If pin 2 low = SPI clock
20
TxD
Serial Port
TXD
UART_TX / SPI
MISO
No difference for UART. If pin 2 low = SPI MISO
21
RxD
Serial Port
RXD
UART_RX / SPI
MOSI
No difference for UART. If pin 2 low = SPI MOSI
22
V_BCKP
Backup Supply
Voltage
V_BCKP
Backup Supply
Voltage
Check current in Data Sheet
If on u-blox 6 module this was connected to GND,
no problem to do the same in u-blox M8/8.
23
VCC
Supply voltage
NEO-
6Q/M/P/V/T:
2.7 –3.6 V
VCC
Supply voltage
NEO-8Q / NEO-
M8:
2.7 –3.6 V
No difference
24
GND
GND
GND
GND
No difference
Table 4: Pin-out comparison NEO-6 vs. NEO-8Q and NEO-M8 series
Make sure that the RF path (antenna and filtering) matches that of the GNSS constellations used.
3.3 Software migration
For an overall description of the module software operation, see the u-blox 8 / u-blox M8 Receiver
Description including Protocol Specification [4]
For migration, see the u-blox M8 FW SPG3.01 Migration Guide [9].

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4Product handling
4.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, Moisture Sensitivity levels (MSL), shipment and storage
information, as well as drying for preconditioning see the corresponding product data sheet in the Related
documents.
Population of Modules
When populating the modules, make sure that the pick and place machine is aligned to the copper pins of
the module and not on the module edge.
4.2 Soldering
Soldering paste
Use of “No Clean”soldering paste is highly recommended, as it does not require cleaning after the soldering
process has taken place. The paste listed in the example below meets these criteria.
Soldering Paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper)
Melting Temperature: +217 °C
Stencil Thickness: see section 2.3
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations.
The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC specification.
Reflow soldering
A convection type-soldering oven is highly recommended over the infrared type radiation oven.
Convection heated ovens allow precise control of the temperature, and all parts will heat up evenly, regardless
of material properties, thickness of components and surface color.
As a reference, see the “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave)
processes”, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that this
preheat phase will not replace prior baking procedures.
Temperature rise rate: max. 3 °C/s. If the temperature rise is too rapid in the preheat phase it may cause
excessive slumping.
Time: 60 –120 s. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if
performed excessively, fine balls and large balls will be generated in clusters.
End Temperature: 150 –200 °C. If the temperature is too low, non-melting tends to be caused in areas
containing large heat capacity.
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature as the
slump of the paste could become worse.
Limit time above 217 °C liquidus temperature: 40 –60 s
Peak reflow temperature: 245 °C

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Cooling phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and
possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good
shape and low contact angle.
Temperature fall rate: max 4 °C/s
To avoid falling off, the u-blox module should be placed on the topside of the motherboard during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Figure 11: Recommended soldering profile
u-blox modules must not be soldered with a damp heat process.
Optical inspection
After soldering the u-blox module, consider an optical inspection step to check whether:
The module is properly aligned and centered over the pads
All pads are properly soldered
No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residues underneath the modules cannot be
easily removed with a washing process.
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard
and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits
or resistor-like interconnections between neighboring pads.
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two
housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker
and the ink-jet printed text.
Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
The best approach is to use a “no clean”soldering paste and eliminate the cleaning step after the soldering.