YOKOGAWA ADMAG TI Series User manual

User’s
Manual ADMAG TI Series
AXG, AXW Magnetic Flowmeter
FOUNDATION™ Fieldbus Communi-
cation Type
IM 01E21A02-03EN
IM 01E21A02-03EN
2nd Edition

1
IM 01E21A02-03EN
ADMAG TI Series
AXG, AXW Magnetic Flowmeter
FOUNDATION Fieldbus Communication Type
IM 01E21A02-03EN 2nd Edition
2nd Edition: Mar. 2020
All Rights Reserved, Copyright © 2019, Yokogawa Electric Corporation
Contents
1. Introduction...................................................................................................7
1.1 For Safe Use of Product .................................................................................... 10
1.2 Warranty.............................................................................................................. 12
2. About Fieldbus .......................................................................................... 13
2.1 Overview ............................................................................................................. 13
2.2 Internal Structure ............................................................................................... 13
2.2.1 System/network Management VFD ................................................... 13
2.2.2 Function Block VFD ............................................................................ 13
2.3 Logical Structure of Each Block ...................................................................... 15
3. Getting Started........................................................................................... 16
3.1 Connection of Devices ...................................................................................... 16
3.2 Host Setting ........................................................................................................ 18
3.3 Bus Power ON .................................................................................................... 19
3.4 Integration of DD ................................................................................................ 20
3.5 Reading the Parameters.................................................................................... 20
3.6 Continuous Record of Values........................................................................... 20
3.7 Generation of Alarm........................................................................................... 20
4. Conguration............................................................................................. 21
4.1 Network Design.................................................................................................. 21
4.2 NetworkDenition ............................................................................................. 22
4.3 DenitionofCombiningFunctionBlocks....................................................... 24
4.4 Setting Tag and Address................................................................................... 25
4.5 Communication Setting .................................................................................... 26
4.5.1 VCR Setting ........................................................................................ 26
4.5.2 Function Block Execution Control....................................................... 27
4.5.3 Mode Transition .................................................................................. 27
4.6 VFDParameterConguration .......................................................................... 28
4.6.1 Link object ........................................................................................... 28
4.6.2 Alert Object ......................................................................................... 29
4.6.3 Trend Object ....................................................................................... 30
4.6.4 View Object ......................................................................................... 30
4.6.5 Function Block Parameters................................................................. 46

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5. Functions ................................................................................................... 47
5.1 Basic Settings .................................................................................................... 50
5.1.1 Overview ............................................................................................. 50
5.1.2 Connection of Process Value to AI Function....................................... 50
5.1.3 Display of the Process Value .............................................................. 53
5.1.4 Engineering Unit Setting .................................................................... 55
5.1.5 Span Setting........................................................................................ 56
5.1.6 Damping Time Constant Setting......................................................... 57
5.1.7 Low-cut Function Setting .................................................................... 59
5.1.8 Sensor’s Nominal Size Setting ........................................................... 61
5.1.9 Density Setting.................................................................................... 62
5.1.10 Temperature Setting ........................................................................... 63
5.1.11 Zero Adjustment.................................................................................. 64
5.2 Totalization Function ......................................................................................... 66
5.2.1 Totalized Value and Unit Setting ......................................................... 66
5.2.2 Totalized Value Display and Totalization Counter Function................ 66
5.2.3 Totalization Switch Function ............................................................... 67
5.2.4 Operation of Totalizer Function at Alarm Occurrence......................... 68
5.2.5 Start/Stop Setting for Totalization Function......................................... 68
5.2.6 Totalization Direction Setting .............................................................. 69
5.2.7 Totalized Value Reset/Preset Function............................................... 69
5.3 Limit Switch Function........................................................................................ 71
5.3.1 Limit Switch ......................................................................................... 71
5.3.2 Connection of Contact Point Output to DI Function............................ 79
5.4 Inputting External Temperature ....................................................................... 81
5.5 Auxiliary Calculation Function......................................................................... 82
5.5.1 Fluid Flow Direction Setting ................................................................ 82
5.5.2 Rate Limit Function Setting................................................................. 82
5.5.3 Pulsing Flow Support Function Setting............................................... 85
5.5.4 Power Frequency Synchronization Setting ........................................ 85
5.5.5 Density Correction Calculation ........................................................... 86
5.5.6 Calorie Calculation.............................................................................. 88
5.5.7 0% Signal Lock ................................................................................... 89
5.6 Alarm ................................................................................................................... 90
5.6.1 Alarm Display...................................................................................... 90
5.6.2 Errors and Countermeasures ............................................................. 90
5.6.3 Operation at the Time of Error ............................................................ 99
5.6.4 Alarm Display Setting........................................................................ 105
5.6.5 Alarm Record Function ..................................................................... 106
5.6.6 Alarm Mask Function ........................................................................ 107
5.7 Display............................................................................................................... 112
5.7.1 Language Setting...............................................................................112

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5.7.2 Display Item Setting ...........................................................................113
5.7.3 Decimal-Point Position Setting ..........................................................114
5.7.4 Display Line Count and Scroll Settings..............................................115
5.7.5 Trend Graph Setting ..........................................................................116
5.7.6 Other Settings ....................................................................................119
5.7.7 microSD Card Setting ....................................................................... 122
5.8 Device Information........................................................................................... 124
5.8.1 Order Information.............................................................................. 124
5.8.2 Device Revision ................................................................................ 125
5.8.3 Memo Function ................................................................................. 126
5.9 Self-check Function......................................................................................... 127
5.9.1 Types of Diagnosis Functions........................................................... 127
5.9.2 Alarm High/Low Limit Function......................................................... 127
5.9.3 Electrode Adhesion Detection .......................................................... 129
5.9.4 Sensor Empty Check ........................................................................ 131
5.9.5 Wiring Connection Diagnosis ........................................................... 131
5.9.6 Verication(DeviceHealthDiagnosis)Function .............................. 133
5.9.7 ElectrodeInsulationDeteriorationDiagnosis(onlyavailable
forAXG,notforAXW) ....................................................................... 136
5.9.8 DiagnosingFlowNoise(onlyavailableforAXG,notforAXW)......... 137
5.9.9 DiagnosingLowConductivity(onlyavailableforAXG,
notforAXW)...................................................................................... 138
5.9.10 Coil Insulation Diagnosis................................................................... 139
5.9.11 Other Setting..................................................................................... 140
5.10 Test Mode.......................................................................................................... 141
5.10.1 Test Mode Setting ............................................................................. 141
5.10.2 Test Value Setting ............................................................................. 142
5.10.3 Test 2 Mode....................................................................................... 142
5.10.4 Test Mode Auto Reset....................................................................... 143
5.11 Event Management Function.......................................................................... 144
5.11.1 StoringParameter(Backup) ............................................................. 144
5.11.2 Restore/Duplicate Parameter ........................................................... 149
5.11.3 Backup and Restore Parameters ..................................................... 154
5.11.4 Data Logging Function...................................................................... 157
5.12 Write Lock Function......................................................................................... 160
5.13 Simulation Function ........................................................................................ 162
5.14 Pulse Output, Frequency Output, and Status Output.................................. 164
5.14.1 Outputs of I/O2 Terminals ................................................................. 164
5.14.2 Alarm Output Function...................................................................... 164
5.14.3 Pulse Width Setting........................................................................... 165
5.14.4 Active Direction Setting..................................................................... 166
5.14.5 Pulse Rate Setting ............................................................................ 166
5.14.6 Frequency Output Range Setting..................................................... 168

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5.14.7 Status Output Function Setting......................................................... 168
6. Parameter Lists........................................................................................ 169
6.1 Resource Block................................................................................................ 169
6.2 Sensor Transducer Block ............................................................................... 177
6.3 Diagnosis Transducer Block .......................................................................... 189
6.4 Display Transducer Block............................................................................... 196
6.5 Maintenance Transducer Block...................................................................... 202
6.6 AI Function Block............................................................................................. 210
6.7 DI Function Block............................................................................................. 214
6.8 MAO Function Block (only AXG).................................................................... 217
6.9 Unit and Code................................................................................................... 219
7. Parameter Menu Tree.............................................................................. 220
7.1 Display Menu Tree ........................................................................................... 220
Appendix 1. Application, Setting and Change of Basic Parameters ........ 236
A1.1 Applications and Selection of Basic Parameters......................................... 236
A1.2 Setting and Change of Basic Parameters ..................................................... 237
A1.3 Setting the AI Function Block......................................................................... 238
A1.4 Setting the Integrator (IT) Function Block..................................................... 239
A1.5 Setting the DI Function Block......................................................................... 240
Appendix 2. Integrator (IT) Block .................................................................. 241
A2.1 Schematic Function Diagram of Integrator Block........................................ 241
A2.2 Input Process Section ..................................................................................... 242
A2.2.1 Determining Input Value Statuses .................................................... 242
A2.2.2 Converting RATE .............................................................................. 243
A2.2.3 Converting ACCUM .......................................................................... 243
A2.2.4 Determining the Input Flow Direction................................................ 244
A2.3 Adder................................................................................................................. 244
A2.3.1 Status of Value after Addition............................................................ 244
A2.3.2 Addition ............................................................................................. 244
A2.4 Integrator .......................................................................................................... 245
A2.5 Output Process ................................................................................................ 246
A2.5.1 Status Determination ........................................................................ 246
A2.5.2 Determining the Output Value........................................................... 247
A2.5.3 Mode Handling.................................................................................. 248
A2.6 Reset Processing............................................................................................. 249
A2.6.1 Reset Trigger..................................................................................... 249
A2.6.2 Reset Timing ..................................................................................... 249
A2.6.3 Reset Process................................................................................... 250
A2.7 List of Integrator Block Parameters............................................................... 251
Appendix 3. Arithmetic (AR) Block............................................................... 255
A3.1 Functional Block Diagram .............................................................................. 255

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A3.2 Input Section .................................................................................................... 256
A3.2.1 Main Inputs........................................................................................ 256
A3.2.2 Auxiliary Inputs.................................................................................. 257
A3.2.3 INPUT_OPTS ................................................................................... 257
A3.2.4 Relationship between the Main Inputs and PV................................. 258
A3.3 Computation Section....................................................................................... 259
A3.3.1 Computing Equations ....................................................................... 259
A3.3.2 Compensated Values........................................................................ 260
A3.3.3 Average Calculation.......................................................................... 260
A3.4 Output Section ................................................................................................. 260
A3.4.1 Mode Handling.................................................................................. 261
A3.4.2 Status Handling................................................................................. 262
A3.5 List of the Arithmetic Block Parameters ....................................................... 263
Appendix 4. Link Master Functions.............................................................. 266
A4.1 Link Active Scheduler (LAS)........................................................................... 266
A4.2 Link Master (LM)............................................................................................... 266
A4.3 Transition of LM Function ............................................................................... 267
A4.4 LM Functions.................................................................................................... 269
A4.4.1 LM Function List................................................................................ 269
A4.5 LM Parameters ................................................................................................. 270
A4.5.1 LM Parameter List............................................................................. 270
A4.5.2 Descriptions for LM Parameters ....................................................... 272
A4.6 FAQs .................................................................................................................. 276
Appendix 5. PID Block.................................................................................... 278
A5.1 Functional Block Diagram .............................................................................. 278
A5.2 Functions of PID Block.................................................................................... 279
A5.3 Parameter List of PID Block............................................................................ 280
A5.4 PID Computation Details................................................................................. 282
A5.4.1 Proportional Derivative Leading Type PID Control Algorithm
(I-PD)................................................................................................. 282
A5.4.2 PID Control Algorithm Parameters ................................................... 283
A5.5 Control Output Action ..................................................................................... 283
A5.5.1 Velocity Type ..................................................................................... 283
A5.6 Direction of Control Action ............................................................................. 283
A5.7 Control Action Bypass .................................................................................... 284
A5.8 Feed-forward .................................................................................................... 284
A5.9 Block Modes ..................................................................................................... 285
A5.9.1 Mode Transitions............................................................................... 285
A5.10 Bumpless Switching........................................................................................ 286
A5.11 Setpoint Limiter................................................................................................ 286
A5.11.1 When PID Block Is in Auto Mode ...................................................... 286
A5.11.2 When PID Block Is in Cas or RCas Mode ........................................ 286

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A5.12 External-output Tracking (LO)........................................................................ 287
A5.13 Measured-value Tracking................................................................................ 288
A5.13.1 CONTROL_OPTS ............................................................................ 288
A5.14 Initialization and Manual Fallback (IMan) ...................................................... 289
A5.14.1 IMan condition................................................................................... 289
A5.14.2 Establishment of IMan condition....................................................... 289
A5.15 Manual Fallback ............................................................................................... 289
A5.15.1 Condition of MAN Fallback ............................................................... 289
A5.15.2 SpecicationofMANFallback.......................................................... 289
A5.15.3 STATUS_OPTS ................................................................................ 289
A5.16 AUTO Fallback.................................................................................................. 290
A5.16.1 Condition of AUTO Fallback ............................................................. 290
A5.16.2 SpecicationofAUTOFallback ........................................................ 290
A5.17 Mode Shedding upon Computer Failure ....................................................... 290
A5.17.1 SHED_OPT....................................................................................... 291
A5.18 Alarm Processing of Block ............................................................................. 292
A5.18.1 BlockAlarm(BLOCK_ALM).............................................................. 292
A5.18.2 Process Alarms ................................................................................. 292
A5.19 Example of Block Connections...................................................................... 293
Appendix 6. Software Download Function .................................................. 294
A6.1 BenetsofSoftwareDownloadFunction ..................................................... 294
A6.2 SpecicationsofSoftwareDownloadFunction........................................... 294
A6.3 Preparations for Software Downloading....................................................... 295
A6.4 Software Download Sequence ....................................................................... 295
A6.5 Download Files................................................................................................. 296
A6.6 Steps after Activating a Field Device ............................................................. 297
A6.7 Troubleshooting............................................................................................... 298
A6.8 Maintenance Block’s Parameters Relating to Software Download............ 299
A6.9 System/Network Management VFD Parameter related to Software
Download.......................................................................................................... 301
A6.10 Comments on System/Network Management VFD Parameters
Relating to Software Download...................................................................... 303
Revision Information ......................................................................................... 305

<1. Introduction> 7
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1. Introduction
This manual provides the basic guidelines for basic operation of ADMAG TI Series AXG, AXW
magneticowmeterswithFOUNDATION™Fieldbus protocol.
For items which are not covered in this manual, read the applicable user’s manuals listed in
“Table1.1ManualandGeneralSpecicationsList”intheADMAGTISeriesInstallationManual.
ThesedocumentscanbedownloadedfromtheYOKOGAWAwebsite.Toensurethecorrectuse
of the product, read these manuals thoroughly and fully understand how to operate the product
beforeoperatingit.Toconrmthemodelnameandspecicationsoftheproduct,refertothe
generalspecications.
Websiteaddress:http://www.yokogawa.com/d/doc/
 Precautions related to the protection, safety, and alteration of the
product
The following safety symbol marks are used in this manual and the product.
WARNING
A WARNING sign denotes a hazard. It calls attention to a procedure, practice, condition, or the
like, which, if not correctly performed or adhered to, could result in injury or death of personnel.
CAUTION
A CAUTION sign denotes a hazard. It calls attention to a procedure, practice, condition, or the
like, which, if not correctly performed or adhered to, could result in damage to or destruction of
part or all of the product.
IMPORTANT
An IMPORTANT sign denotes that attention is required to avoid damage to the product or system
failure.
NOTE
A NOTE sign denotes information necessary for essential understanding of operation and
features.

<1. Introduction> 8
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The following symbols are used in the product and the manual to indicate the accompanying
safety precautions:
Protective grounding terminal
Functional grounding terminal
(Thisterminalshouldnotbeusedasaprotectivegroundingterminal.)
Alternating current
Direct current
Caution
This symbol indicates that the operator must refer to an explanation in the user’s manual in order to avoid
the risk of injury or death of personnel or damage to the product.
For the protection and safe use of the product and the system in which this product is
incorporated, be sure to follow the instructions and precautions on safety that are stated in user’s
manual whenever you handle the product. Take special note that if you handle the product in a
manner that violates these instructions, the protection function of the product may be damaged or
impaired,ormaynotbefullydemonstrated.Insuchacase,YOKOGAWAdoesnotguaranteethe
quality, performance, function, or safety of the product.

<1. Introduction> 9
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 Regarding this user’s manual
• This manual should be provided to the end user.
• The contents of this manual are subject to change without prior notice.
• NopartofthismanualmaybereproducedinanyformwithoutYOKOGAWA’swritten
permission.
• YOKOGAWAmakesnowarrantyofanykindwithregardtothismanual,including,butnot
limitedto,impliedwarrantyofmerchantabilityandtnessforaparticularpurpose.
• If any questions arise or errors are found, or if any information is missing from this manual,
informthenearestYOKOGAWAsaleso󰀩ceoragentfromwhichthecustomerhas
purchased this product.
• Thespecicationscoveredbythismanualarelimitedtothoseforthestandardtypeunder
thespeciedmodelnumberbreak-downanddonotcovercustom-madeproducts.
• Notethatchangesinthespecications,construction,orcomponentpartsoftheproduct
maynotimmediatelybereectedinthismanualatthetimeofchange,providedthat
postponementofrevisionswillnotcausedi󰀩cultytotheuserfromafunctionalor
performance standpoint.
• This manual is intended for the following personnel:
Engineers responsible for the installation and wiring of the product.
Personnel responsible for the normal daily device operation after this product starts running
(operator).
• To ensure correct use, read this manual and the applicable manuals thoroughly before
startingoperation.Readthegeneralspecicationsforspecicationsoftheproduct.
 Trademarks
• All the brands or names of Yokogawa Electric’s products used in this manual are either
trademarks or registered trademarks of Yokogawa Electric Corporation.
• All other company and product names mentioned in this manual are trade names,
trademarks or registered trademarks of their respective companies.
• Inthismanual,trademarksandregisteredtrademarksarenotmarkedwith“™”or“®”.
• “FOUNDATION”in“FOUNDATIONFieldbus”isaregisteredtrademarkofFieldCommGroup.

<1. Introduction> 10
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1.1 For Safe Use of Product
For the protection and safe use of the product and the system in which this product is
incorporated, be sure to follow the instructions and precautions on safety that are stated in user’s
manual whenever you handle the product. Take special note that if you handle the product in a
manner that violates these instructions, the protection function of the product may be damaged
orimpaired.Insuchacase,YOKOGAWAshallnotbeliableforanyindirectorconsequentialloss
incurred by either using or not being able to use the product.
 General
WARNING
• Do not open the cover in wet weather or humid environment. When the cover is open, the
stated enclosure protection is not applicable.
• Whenopeningthecover,waitformorethan20minutesafterturningo󰀨thepower.Onlyan
expert engineer or skilled personnel is permitted to open the cover.
 Operation
WARNING
Be sure to enable the write protection function to prevent parameters from being overwritten after
nishingparametersetting.
In rare cases, the IR switches may respond unexpectedly to water drops or extraneous
substances sticking on the surface of the display panel due to characteristics of the operating
principles. The possibility of malfunction arises after rain or cleaning near the place where the
owmeterisinstalled.Repeatedlyturningaashlight,etc.onando󰀨inthedirectionoftheIR
switch may also be a cause of malfunction.
Read the installation manual for the hardware write lock function, and Section 5.12 for the
software write lock function.

<1. Introduction> 11
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 Maintenance
WARNING
• If dirt, dust or other substances adhere to the glass of the display, wipe them clean with a soft
dry cloth.
• Maintenance of this product should be implemented in a maintenance service shop where
necessary devices and environment condition are provided. The required environmental
conditionisthattheambienttemperatureshouldbe5to40°C(humidityofwhichmaximum
relative humidity is 80% for temperatures 5 to 31 °C, and of which relative humidity linearly
decreasesto50%atatemperatureof40°Cwhenthetemperatureisover31°C).
 microSD card
IMPORTANT
• Do not store or use the microSD card in places with static electricity near electrically charged
objects or where electrical noise is present. Doing so can result in electric shock or damage
to the microSD card.
• Do not disassemble or modify the microSD card.
• Do not physically shock, bend, or twist the microSD card.
• Whilereading/writingdata,donotturno󰀨thepower,applyvibrationorshockorpulloutthe
card. Data can be corrupted or permanently lost.
• UseonlythemicroSDcardsspeciedbyYOKOGAWA.Theoperationcannotbeguaranteed
when other cards are used.
• When inserting the microSD card into the product, make sure to orient the microSD card
correctly(faceupordown)andinsertitsecurely.Ifnotinsertedcorrectly,themicroSDcard
will not be recognized by the product.
• Do not touch the microSD card with wet hands.
• Do not use the microSD card if it is dusty or dirty.
• The microSD card comes formatted. If you would like to format the microSD card, use the
product’s Format function.
• YOKOGAWAprovidesnowarrantyfordamageto,orlossofdatarecordedonthemicroSD
card, regardless of the cause of such damage or loss. We recommend regularly making
backup copies of your data.

<1. Introduction> 12
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1.2 Warranty
• The warranty shall cover the period described in the quotation presented to the purchaser at
the time of purchase. Problems that may occur during the warranty period shall be repaired
free of charge.
• Incaseofproblems,thecustomershouldcontacttheYOKOGAWArepresentativefrom
whichtheproductwaspurchasedorthenearestYOKOGAWAo󰀩ce.
• Ifaproblemariseswiththisproduct,pleaseinformYOKOGAWAofthenatureofthe
problem and the circumstances under which the problem developed, including the model
specicationandserialnumber.Anydiagrams,dataandotherinformationyoucaninclude
in your communication will also be helpful.
• ResponsiblepartforrepaircostsoftheproblemsshallbedeterminedbyYOKOGAWA
based on our investigation.
• The purchaser shall bear the responsibility for repair costs, even during the warranty period,
if the malfunction is due to:
- Failure due to improper and/or inadequate maintenance by the purchaser.
- Failure or damage due to improper handling, use, or storage which does not conform to
design conditions.
- Useoftheproductinquestioninalocationnotconformingtothestandardsspeciedby
YOKOGAWA,orproblemsduetoimpropermaintenanceoftheinstallationlocation.
- FailureordamageduetomodicationorrepairbyanypartyexceptYOKOGAWAoran
approvedrepresentativeofYOKOGAWA.
- Malfunction or damage from improper relocation of the product in question after delivery.
- Reasonofforcemajeuresuchasres,earthquakes,storms/oods,thunder/lightning,
or other natural disasters, as well as disturbances, riots, warfare, or radioactive
contamination.

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2. About Fieldbus
2.1 Overview
Fieldbusisawidelyusedbi-directionaldigitalcommunicationprotocolforelddevicesthat
enable the simultaneous output to many types of data to the process control system.
TheADMAGTISeriesFieldbuscommunicationtypeemploysthespecicationsstandardized
by FieldComm Group, and provides interoperability between Yokogawa devices and those
produced by other manufacturers. Fieldbus comes with software consisting of AI, DI, IT, AR, PID
andMAO(onlyAXG)functionblocksthatenabletheexibleimplementationofsystems.
For information on other features, engineering, design, construction work, startup and
maintenanceofFieldbus,referto“FieldbusTechnicalInformation”(TI38K03A01-01E).
2.2 Internal Structure
ThisproductcontainstwoVirtualFieldDevices(VFD)thatsharethefollowingfunctions.
2.2.1 System/network Management VFD
• SetsnodeaddressesandPhysicalDevicetags(PDTag)necessaryforcommunication.
• Controls the execution of function blocks.
• Managesoperationparametersandcommunicationresources(VirtualCommunication
Relationship:VCR).
2.2.2 Function Block VFD
(1) Resource block (RB)
• Manages the status of hardware.
• Automatically informs the host of any detected faults or other problems.
(2) Sensor transducer block (STB)
• Calculatestheowvelocity,volumetricowrate,massowrate,calorie,andtotalizedvalue
from a sensor output.
• TransfersthecalculatedprocessvaluetotheAIandDIfunctionblocks(totalizedvalueonly
totheAIfunctionblock).
• Obtains a temperature value from the MAO function block.
(3) Diagnosis transducer block (DTB)
• Obtainstransmitstheadhesionresistance,electrodepotential,ownoiseandconductivity
from the sensor output, and transfers them to the AI and DI function blocks.
• Hasfunctionstoseteachoftheadhesion,ownoise,conductivity,emptycheckand
vericationfunctionsandtomonitorthem.

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(4) Local Display transducer block (LTB)
• Controls the display.
(5) Maintenance transducer block (MTB)
• Is related to settings for detailed device information and manufacturing.
• Hasfunctionstodisplaydeviceinformation(detailedversionofthedevice,serialNo.
information,etc.),informationrelatedtoeventmanagement(backup/restore,datalogging
function),applicationforservice/factory/expert(fordebugging,manufacturing),alarm/error
log and software download results.
(6) AI function block (AIFB) (AXG: 4, AXW: 3)
• Outputsvariousowrates(includingowvelocity),calorieandtotalizedvalue.
• ForAXG,outputstheadhesionresistance,electrodepotential,ownoiseandconductivity.
• PerformsprocessingsuchastheSIMULATEfunction,damping(rst-orderlaglter),
scaling, etc.
(7) Dl function block (DIFB) (3)
• Performs discrete output for the process value, alarm and warning of STB and DTB.
(8) PID function block
• Performs the PID control computation based on the deviation of the measured value from
the setpoint.
(9) MAO function block (only AXG)
• Inputs a temperature value from other device.
(10) IT function block (2)
• Adds two main inputs and integrates them for output.
(11) AR function block
• Switchestwomaininputsofdi󰀨erentmeasurementrangesbumplesslyandcombinesthe
result with three auxiliary inputs through the selected compensation function to calculate the
output.
Indexes of each block are shown below:
Block Start Index
Resource block 1000
Sensor transducer block 2000
Diagnosis transducer block 2500
Local Display transducer block 2700
Maintenance transducer block 2900
AI1 function block 4000
AI2 function block 4100
AI3 function block 4200
AI4 function block 4300
DI1 function block 6000
DI2 function block 6100

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Block Start Index
DI3 function block 6200
PID function Block 8000
MAO function block 10000
IT1 function block 16000
IT2 function block 16100
AR function block 17500
2.3 Logical Structure of Each Block
ADMAG TI
Fieldbus
System/Network management VFD
FBAP VFD
Link Master
PD tag
Resource Block
Block tag
Parameters
Parameters
VCR
Node address
Function block
schedule
Local display
Transducer block
Block tag
Parameters
Diagnostic
Transducer block
Block tag
Parameters
Maintenance
Transducer block
Block tag
Parameters
Indicator
From
sensor
Sensor
Transducer block
Block tag
Parameters
PID function block
AR function block
IT function block (x 2)
DI function block (x 3)
MAO function block
AI function block
（AXG: x 4、AXW: x 3）
To/From
other block
OUT
Block tag
Parameters
F0201.ai
Figure 2.1 Logical Structure of Each Block
Settingofvariousparameters,nodeaddress,andPDTag(Physicaldevicetag)showninFigure
2.1isrequiredbeforestartingoperation.Forsettingmethod,referto“GETTINGSTARTED”in
Chapter 3 and later.

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3. Getting Started
Fieldbusfullyadoptsdigitalcommunicationprotocolanddi󰀨ersinoperationfromconventional4
to20mAtransmissionprotocol.Itisrecommendedthatthosenoviceuserswhouseelddevices
forthersttimeshouldusethedeviceinaccordancewiththeproceduresdescribedinthis
section.Theproceduresassumethatelddeviceswillbesetuponabench.
3.1 Connection of Devices
The following devices are required to use Fieldbus devices:
z Power supply:
Fieldbus requires a dedicated power supply. It is recommended that current capacity be well
overthetotalvalueofthemaximumcurrentconsumedbyalldevices(includingthehost).
The conventional 4 -20 mA DC current cannot be used as is.
z Terminator:
Fieldbus requires two dedicated terminators. Refer to the supplier for details of terminators
that are attached to the host.
z Field device:
Connect the Fieldbus communication type product. This product or other devices can be
connected.
In order to smoothly start Fieldbus, please use the devices that has passed the
interoperability test of the Fieldbus Foundation.
z Host:
 Usedforaccessingelddevices.Adedicatedhost(suchasDCS)isusedforan
instrumentation line while dedicated communication tools are used for experimental
purposes. For the operation of the host, refer to the instruction manual for each host. No
other details on the host are given in this manual. At least one device with the bus control
function is necessary.
z Cable:
 Usedforconnectingdevices.Referto“FieldbusTechnicalInformation”(TI38K03A01-01E)
for details of instrumentation cabling. For laboratory or other experimental use, a twisted
paircabletwotothreemetersinlength(acrosssection0.9mm2(AXG#18)ormoreanda
cycleperiodofwithin5cm(2inches))maybeused.Terminationprocessingdependsonthe
type of device being deployed. For this product, use an M4 screw terminal claw. Some hosts
require a connector.
Contact Yokogawa when making arrangements to purchase the recommended devices.

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Connect devices as shown in Figure 3.1. Connect the terminators at both ends of the trunk, with
the minimum length of the spur laid for connection. The polarity of signal and power must be
maintained.
ADMAG TI
Fieldbus power
supply
Terminator
Terminator
HOST
F0301.EPS
Figure 3.1 Connection of Devices
NOTE
NoCHECKterminalisusedforthisproduct.Donotconnecttheeldindicatorandcheckmeter.
IMPORTANT
Iftheowmeterisconnectedwithaparameter-settingtool,suchasaPC,whilebeingconnected
with the upper system, it may disturb the communication operation on the bus, and cause the
operational failure of the system. Use the parameter-setting tool after taking preventive measures
ofsettingtherelatedloopo󰀪ineinadvance.

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3.2 Host Setting
To activate Fieldbus, the following settings are required for the host. Particularly, pay attention so
that the address range to use includes setting values of this product.
IMPORTANT
Donotturno󰀨thepowerimmediatelyaftersetting.
To improve the reliability of the device, processing to store data to EEPROM is duplexing.
Ifthepoweristurnedo󰀨within60secondsaftersettingismade,themodiedparametersarenot
saved, and the settings may return to the original values.
Table 3.1 Operation Parameters
Symbol Parameter Name Description and Setting
V(ST) Slot-Time
Indicates the time necessary for the immediate reply of the device.
Unitoftimeisinoctets(256µs).Setthemaximumspecicationfor
all devices. For this product, set a value of 4 or greater.
V(MID) Minimum-Inter-PDU- Delay
Indicates the minimum value of communication data intervals to
startreply.Unitoftimeisinoctets(256µs).Setthemaximum
specicationforalldevices.Forthisproduct,setavalueof4or
greater.
V(MRD) Maximum-Response-Delay
Indicates the worst-case time elapsed until a reply is received.
SincetheunitisSlot-time,setthevaluesothatV(MRD)xV(ST)
isthemaximumvalueofthespecicationsforalldevices.Forthis
product,setV(MRD)xV(ST)toavalueof12orgreater.
V(FUN) First-Unpolled-Node Indicates the address next to the address range used by the host.
Set 14 or more in hexadecimal notation.
V(NUN) Number-of-consecutive-
Unpolled-Node
Unused address range. If a large value is set, it reduces the
communication load of the bus.
Not used
0x00
0xF7
0xF8
0x0F
0x10
0x13
0x14
0xFB
0xFC
0xFF
V(FUN)
V(FUN)+V(NUN)
LM device
Bridge device
Unused V(NUN)
Note 1: Bridge device: A linking device which brings data from one
or more H1 networks.
Note 2: LM device: with bus control function (Link Master function)
Note 3: BASIC device: without bus control function
BASIC device
Default address
Portable device address
F0302.EPS
Figure 3.2 Available Address Range

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3.3 Bus Power ON
Turn on the power of the host, the bus, and this product. If this product is equipped with a display,
rstallsegmentsarelit,andthenthedisplaybeginstooperate.Ifthedisplayisnotturnedon,or
abnormalcurrentows,checkthepolarityofpower.
Using the host device display function, check that this product is in operation on the bus.
The device information, including the PD tag, Node address, and Device ID, is described on
thesheet(seeFigure3.3)attachedtothedevice.Thesamedeviceinformationisgivenattwo
locations on this sheet.
Device ID : 5945430016XXXXXXXX
PD Tag : FT2001
Device Revision : 1
Node Address : 0xF4
Serial No. : XXXXXXXXXXXXXXXXX
Physical Location :
Note:
Our Device Description Files and Capabilities Files available at
http://www.yokogawa.com/fld/ (English) or
http://www.yokogawa.co.jp/fld/ (Japanese)
Device ID : 5945430016XXXXXXXX
PD Tag : FT2001
Device Revision : 1
Node Address : 0xF4
Serial No. : XXXXXXXXXXXXXXXXX
Physical Location :
Note:
Our Device Description Files and Capabilities Files available at
http://www.yokogawa.com/fld/ (English) or
http://www.yokogawa.co.jp/fld/ (Japanese)
F0303.ai
Figure 3.3 Device Information Attached to This Product.
If this product is not detected, check the address range in use and the polarity of power. If the
nodeaddressandPDtagarenotspeciedwhenordering,thedefaultvalue(0xF4)isfactoryset.
If two or more devices with the same node address are connected at the same time, one device
retains its factory-set address, while the other devices have default addresses of 0xF8 or later. In
such a case, set an individual address.