Zeiss Crossbeam 550L User manual

Instruction Manual
ZEISS Crossbeam 550L, Crossbeam 550
Focused Ion Beam - Scanning Electron Microscope (FIB-SEM)

ZEISS Crossbeam 550L, Crossbeam 550
Original Manual
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Promenade 10
07745 Jena
Germany
[email protected]
www.zeiss.com/microscopy
Carl Zeiss Microscopy GmbH
Carl-Zeiss-Straße 22
73447 Oberkochen
Germany
Document Name: ZEISS Crossbeam 550L, Crossbeam 550 Instruction Manual
Order Number: 349500-8122-000
Revision: 3
Language: en-US
Effective from: 06/2020
© 2020 Without the prior written consent of ZEISS, this document or any part of it must neither be translated nor reproduced or
transmitted in any form or by any means - including electronic or mechanic methods, by photocopying, recording or by any in-
formation or filing system. The right to make backup-copies for archiving purposes shall remain unaffected thereby. Any viola-
tions may be prosecuted as copyright infringements.
The use of general descriptive names, registered names, trademarks, etc. in this document does not imply that such names are
exempt from the relevant intellectual property laws and regulations and therefore free for general use. This shall also apply if
this is not specifically referred to. Software programs shall entirely remain the property of ZEISS. No program or subsequent up-
grade thereof may be disclosed to any third party, copied or reproduced in any other form without the prior written consent of
ZEISS, even if these copies or reproductions are destined for internal use at the customer's only, the only exception being one
single back-up copy for archiving purposes.
ZEISS reserves the right to make modifications to this document without notice.

ZEISS  Table of Contents
Table of Contents
Glossary................................................................................................................. 6
1 General Information ............................................................................................. 9
1.1 Text Conventions and Link Types ............................................................................. 9
1.2 Explanation on Warnings and Additional Information .............................................. 10
1.3 Further Applicable Documents ................................................................................. 11
1.4 Contact.................................................................................................................... 12
2 Safety .................................................................................................................... 13
2.1 Intended Use ........................................................................................................... 13
2.2 Safety Procedures .................................................................................................... 14
2.2.1 Safe Operation Conditions............................................................................ 14
2.2.2 Requirements for Personnel.......................................................................... 14
2.2.3 Preventive Maintenance ............................................................................... 14
2.2.4 Safe Handling of Spare Parts ........................................................................ 15
2.3 Prevention of Hazards.............................................................................................. 15
2.3.1 Biological Hazards ........................................................................................ 15
2.3.2 Burn Hazards................................................................................................ 15
2.3.3 Chemical Hazards......................................................................................... 15
2.3.4 Electrical Hazards ......................................................................................... 16
2.3.5 High Pressure Hazards.................................................................................. 16
2.3.6 Magnetic Field Hazards ................................................................................ 16
2.3.7 Mechanical Hazards ..................................................................................... 16
2.3.8 Radiation Hazards ........................................................................................ 17
2.3.9 Suffocation Hazards ..................................................................................... 17
2.4 Safety Equipment..................................................................................................... 18
2.4.1 Protective Cover Panels ................................................................................ 18
2.4.2 Main Switch ................................................................................................. 19
2.4.3 Emergency Off (EMO) Option ....................................................................... 19
2.4.4 Locking Devices............................................................................................ 20
2.4.5 Lockout/Tagout Equipment .......................................................................... 21
2.4.6 Safety Labels ................................................................................................ 22
3 Product and Functional Description..................................................................... 27
3.1 System Overview ..................................................................................................... 27
3.2 Main Components ................................................................................................... 29
3.2.1 Vacuum System............................................................................................ 29
3.2.2 Electron Optical Column | Gemini II .............................................................. 31
3.2.3 Ion-sculptor Focused Ion Beam (FIB) Column (Optional)................................ 35
3.2.4 Detectors ..................................................................................................... 37
3.2.5 Specimen Stage............................................................................................ 42
3.2.6 Dual Joystick ................................................................................................ 43
3.3 Optional Components and Accessories .................................................................... 44
3.3.1 Optional Detectors ....................................................................................... 44
3.3.2 Control Panel ............................................................................................... 53
4 Software Description ............................................................................................ 55
4.1 SmartSEM................................................................................................................ 55
4.1.1 SmartSEM User Interface.............................................................................. 55
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 3

 Table of Contents ZEISS
4.1.2 Graphical Control Elements .......................................................................... 56
4.1.3 User Access Levels and User Privileges.......................................................... 57
4.1.4 SmartSEM Program Suite.............................................................................. 59
4.2 SmartFIB .................................................................................................................. 61
4.2.1 SmartFIB User Interface ................................................................................ 61
4.2.2 Graphical Control Elements .......................................................................... 62
4.2.3 SmartFIB Program Suite................................................................................ 63
5 Installation............................................................................................................ 64
6 Operation .............................................................................................................. 65
6.1 Starting the System.................................................................................................. 65
6.1.1 Energizing the Microscope ........................................................................... 65
6.1.2 Starting the Microscope ............................................................................... 66
6.1.3 Starting SmartSEM ....................................................................................... 66
6.2 Obtaining a First Image............................................................................................ 68
6.2.1 Preparing the Specimen Holder .................................................................... 69
6.2.2 Loading the Specimen Chamber................................................................... 70
6.2.3 Locating the Specimen ................................................................................. 72
6.2.4 Switching on the Gun................................................................................... 73
6.2.5 Switching on the EHT ................................................................................... 74
6.2.6 Acquiring an Image ...................................................................................... 74
6.2.7 Optimizing the Image................................................................................... 76
6.2.8 Saving the Image.......................................................................................... 78
6.3 Modifying Gun Parameters ...................................................................................... 79
6.3.1 Selecting the Gun Mode............................................................................... 79
6.3.2 Setting the Probe Current............................................................................. 80
6.3.3 Measuring the Probe Current ....................................................................... 80
6.3.4 Changing the Extractor Voltage.................................................................... 81
6.4 Working with Different Aperture Configurations and Beam Modes ......................... 81
6.4.1 Determining the Installed Aperture Configuration | Gemini II Column ........... 81
6.4.2 Selecting the Column Mode ......................................................................... 82
6.5 Finding Appropriate Detector Settings ..................................................................... 82
6.5.1 Selecting a Detector ..................................................................................... 82
6.5.2 Setting up the InLens SE Detector................................................................. 83
6.5.3 Setting up the SE Detector ........................................................................... 83
6.5.4 Setting up the EsB Detector.......................................................................... 84
6.5.5 Setting up the SESI Detector......................................................................... 85
6.5.6 Setting up the aBSD/BSD Detector................................................................ 86
6.5.7 Setting up the aSTEM/STEM Detector........................................................... 88
6.5.8 Setting up the CL Detector ........................................................................... 91
6.6 Shutting down the System....................................................................................... 91
6.6.1 Finishing the Work Session........................................................................... 91
6.6.2 De-energizing the Microscope...................................................................... 92
6.6.3 Performing a Lockout/Tagout....................................................................... 93
6.7 Performing an Emergency Shutdown ....................................................................... 93
7 Maintenance and Repair....................................................................................... 94
7.1 Maintenance Work .................................................................................................. 94
7.2 Maintenance Intervals.............................................................................................. 94
7.3 Change of Consumables and Chemicals................................................................... 94
4 Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS  Table of Contents
8 Troubleshooting.................................................................................................... 96
8.1 Overview ................................................................................................................. 96
8.2 Overall System ......................................................................................................... 99
8.2.1 Checking the CAN Communication .............................................................. 99
8.3 Chamber.................................................................................................................. 99
8.3.1 Initializing the Stage ..................................................................................... 99
8.3.2 Defining the Post Initialization Position of the Stage ..................................... 100
8.3.3 Changing the Joystick TV Angle.................................................................... 100
8.3.4 Replacing the Chamber Door Seal ................................................................ 101
8.3.5 Resetting the Touch Alarm ........................................................................... 101
8.3.6 Checking the Water Flow and Temperature.................................................. 102
8.4 Column.................................................................................................................... 102
8.4.1 Baking out the Gun Head ............................................................................. 102
8.4.2 Calibrating the Probe Current....................................................................... 103
8.5 Power Circuit ........................................................................................................... 104
8.5.1 Checking the Position of the Circuit Breakers................................................ 104
8.6 Detectors................................................................................................................. 105
8.6.1 Lubricating the Rod...................................................................................... 105
8.7 Focused Ion Beam ................................................................................................... 106
8.7.1 Checking the Lifetime of the Ion Source ....................................................... 106
8.7.2 Regenerating the Ion Source by Heating....................................................... 106
8.7.3 Manually Finding a New Extractor Value ...................................................... 107
9 Shutdown and Disposal........................................................................................108
9.1 Putting the Microscope out of Operation................................................................. 108
9.2 Transport and Storage ............................................................................................. 108
9.3 Disposal................................................................................................................... 110
9.3.1 Disposing of Solid Waste (Consumables) ...................................................... 110
9.3.2 Disposing of the Microscope ........................................................................ 110
10 Technical Data and Conformity ............................................................................111
10.1 Product Specification ............................................................................................... 111
10.2 Installation Requirements......................................................................................... 114
10.2.1 Layout and Connections............................................................................... 124
10.2.2 System Layout.............................................................................................. 127
10.3 Declaration of Conformity........................................................................................ 129
11 Parts and Tools .....................................................................................................130
11.1 Consumables ........................................................................................................... 130
11.2 Spare Parts .............................................................................................................. 130
11.3 Tools and Accessories .............................................................................................. 130
Index .....................................................................................................................132
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 5

Glossary ZEISS
Glossary
aBSD
Annular Backscattered Electron Detector
AIC
Ampere Interrupting Capacity
Aperture
Mechanical limitation of an opening ori-
ented perpendicular to the optical axis,
which filters out electrons whose trajec-
tories (tracks) do not run close to the op-
tical axis.
aSTEM
Annular Scanning Transmission Electron
Microscopy
Astigmatism
Lens aberration that distorts the shape of
the electron beam, compensated by the
stigmator.
Backscattered electrons
High-energy electrons that are liberated
from the specimen surface when the
specimen is hit by the primary electron
beam.
Bakeout
Degassing of surfaces of a vacuum sys-
tem by heating during the pumping
process.
Beam booster
Anode and liner tube of the Gemini col-
umn are connected mechanically and
electrically forming the beam booster. A
booster voltage (UB, liner voltage) of
+8kV is applied to the beam booster, so
that a high beam energy is maintained
throughout the entire column. The beam
booster technique has two main advan-
tages: It minimizes beam widening, that
may occur due to stochastic electron-
electron interactions. Consequently there
is almost no loss in beam brightness,
even at low acceleration voltages. Sec-
ondly, the beam booster technique en-
hances protection against external stray
fields.
BSD
Backscattered Electron Detector
BSE
Backscattered Electron
CAN
Controller Area Network
CCD
Charge-Coupled Device
CL
Cathodoluminescence
Condenser
Device that collects and focuses the elec-
tron beam onto the specimen.
D
Depth
DECT
Digital Enhanced Cordless Telecommuni-
cations
EBSD
Electron Backscatter Diffraction
EC
European Community
EDS
Energy Dispersive X-ray Spectroscopy
EDX
Energy Dispersive X-ray Spectroscopy
EHT
Extra High Tension
EIGA
European Industrial Gases Association
EM
Electron Microscope
EM server
A server that implements the internal
communication between control soft-
ware and microscope hardware.
6 Instruction Manual ZEISS Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS Glossary
EMC
Electromagnetic Compatibility
EMO
Emergency Off
EsB
Energy-selective Backscattered
Eucentric
Type of stage, the rotation axes of which
intersect in the same point. The specimen
surface is located in the eucentric point,
where the tilt axis meets the beam axis.
This guarantees that the focus is main-
tained when the specimen is tilted at a
certain working distance.
Extractor
Positive electrode that attracts electrons
from the filament.
Faraday cup
Small insulated metal container,
equipped with an aperture where elec-
trons can enter but not escape. Used to
measure the specimen current in the mi-
croscope.
FESEM
Field Emission Scanning Electron Micro-
scope
FIB
Focused Ion Beam
Focus wobble
Function that sweeps the focus of the
objective lens backwards and forward
through the focus on the specimen
plane. When the aperture is misaligned a
lateral shift is observed.
FTP
File Transfer Protocol
GIS
Gas Injection System
GUI
Graphical User Interface
H
Height
IGC
Industrial Gases Council
IGP
Ion Getter Pump
IR
Infrared
LOTO
Lockout/Tagout
M
M-axis
MSDS
Material Safety Data Sheet
PC
Personal Computer
PE
Protective Earth (ground)
PE
Primary Electron
Penning gauge
Device for measuring high vacuum in the
vacuum system.
Pre-vacuum pump
A pump for generating a pre-vacuum.
Primary electron beam
Narrowly bundled beam of accelerated
electrons that hit the specimen surface.
R
R-axis (Rotation)
RF
Radio Frequency
RMS
Root Mean Square
Schottky field emitter
Type of electron source in which emis-
sion occurs at or near the work function
barrier.
Instruction Manual ZEISS Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 7

Glossary ZEISS
Scintillator
Substance that absorbs electrons and in
response, fluoresces photons while re-
leasing the previously absorbed energy.
SE
Secondary Electron
Secondary electrons
Low-energy electrons that are emitted
from the specimen surface when the
specimen is hit by the primary electron
beam. Secondary electrons are generated
by inelastic scattering.
SEM
Scanning Electron Microscope
SEMI
Semiconductor Equipment and Materials
International (SEMI) is a industry associa-
tion comprising companies involved in
the electronics design and manufacturing
supply chain.
SESI
Secondary Electron Secondary Ion
SIMS
Secondary Ion Mass Spectrometry
STEM
Scanning Transmission Electron Micro-
scope
Stigmator
Compensates astigmatism (lens aberra-
tion), so that the electron beam becomes
rotationally symmetrical.
Suppressor
Electrode (anode) that suppresses un-
wanted thermionic emission from the
shank of the Schottky field emitter.
T
T-axis (Tilt)
TEM
Transmission Electron Microscope
U
Voltage
User
Person examining a sample under the mi-
croscope.
W
Width
WD
Working Distance
WDS
Wavelength Dispersive X-ray Spec-
troscopy
WDX
Wavelength Dispersive X-ray Spec-
troscopy
WEEE
Waste Electrical and Electronic Equip-
ment
X
X-axis
XeF₂ precursor
Xenon difluoride precursor
X-ray
Type of high energy electromagnetic ra-
diation, that is generated during the op-
eration of electron microscopes.
Y
Y-axis
Z
Z-axis
ZEISS Sales & Servicepartner
The sales and servicepartner is generally
in the field for customer support in a re-
gional area and / or a clearly defined cus-
tomer group.
8 Instruction Manual ZEISS Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS 1 General Information | 1.1 Text Conventions and Link Types
1 General Information
This manual is part of the SEM workstation, hereinafter referred to as the “microscope”. Read the
instructions carefully. Keep the manual nearby the microscope and hand it over to future owners
of the microscope.
The manual is designed for operators who have been trained to operate the microscope by a
ZEISS service representative. Basic operator training and safety instructions will be provided within
the scope of initial start-up by ZEISS. Operators of the microscope must not deviate from the in-
structions provided in this manual.
This manual contains the following chapters:
Chapter Content
Glossary Lists important technical terms.
General Information Explains the function and structure of this manual.
Safety Summarizes important safety details.
Device Description Describes the microscope and its main hardware components.
Software Description Provides an overview of the user interface.
Installation Refers to the ZEISS service representatives.
Operation Contains information about starting the microscope and the software,
obtaining a first image, adjusting important parameters, and power-
ing down the microscope, also in emergency.
Maintenance and
Repair
Informs you about preventive maintenance work and intervals and the
change of consumables.
Troubleshooting Describes common issues and how to resolve them.
Shutdown and Dis-
posal
Summarizes notes on shutdown and disposal.
Technical Data and
Conformity
Lists hardware specifications as well as the manufacturer’s declaration
that the equipment is in conformity with all applicable European Di-
rectives.
Parts and Tools Lists consumables, spare parts, tools, and accessories.
Abbreviations Lists abbreviations used in this manual.
Index Lists keywords to help you find relevant information quickly.
1.1 Text Conventions and Link Types
The following text conventions and link types are used:
Text convention Meaning
Click Start.
Press the STANDBY button.
Press [Enter] on the keyboard.
The names of controls and important infor-
mation are shown in bold letters.
Press <Ctrl+Alt+Del> Press several keys on the keyboard simultane-
ously.
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 9

1 General Information | 1.2 Explanation on Warnings and Additional Information ZEISS
Text convention Meaning
Select Tools > Goto Control Panel > Air-
lock.
Follow a path in the software.
Text input
Text output
§Text to be entered by the user
§Text displayed by the system
Programming and Macros Anything typed in literally during program-
ming, including, for example, macro codes,
keywords, data types, method names, vari-
ables, class names, and interface names.
Tab.1: Text convention
Link type Meaning
See: Text Conventions and Link Types [ } 9].Link to further information for this topic.
https://www.zeiss.com/corporate/int/
home.html
Link to a website on the internet.
Tab.2: Link types
1.2 Explanation on Warnings and Additional Information
DANGER, WARNING, CAUTION, and NOTICE are standard signal words used to determine the lev-
els of hazards and risks of personal injury and property damage. Not only the safety instructions
and warnings in the Safety chapter are to be considered but also the safety instructions and
warnings in other chapters. Failure to comply with these instructions and warnings can result in
both personal injury and property damage and involve the loss of any claims for damages.
The following symbols and warnings indicating dangerous situations and hazards are used in this
document.
DANGER
Type and source of danger
DANGER indicates an imminently hazardous situation which, if not avoided, will result in death
or serious injury.
WARNING
Type and source of danger
WARNING indicates a potentially hazardous situation which, if not avoided, may result in
death or serious injury.
CAUTION
Type and source of danger
CAUTION indicates a potentially hazardous situation which, if not avoided, may result in minor
or moderate injury.
10 Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS 1 General Information | 1.3 Further Applicable Documents
NOTICE
Type and source of danger
NOTICE indicates a potentially harmful situation which, if not avoided, may result in property
damage.
Info
Provides additional information or explanations to help users better understand the contents
of this Instruction Manual.
1.3 Further Applicable Documents
SmartSEM Software Manual
For detailed information on how to use the SmartSEM software for imaging and hardware con-
trol, refer to the SmartSEM software manual.
SmartFIB Software Manual
For detailed information on how to use the SmartFIB software for ion beam exposure, refer to the
SmartFIB software manual.
Instruction Manual for Options
For detailed information regarding optional accessories, refer to the respective instruction manual
in your document folder.
Product Specification and Installation Requirements
For details on technical data, refer to the documents Product Specification and Installation Re-
quirements.
Material Safety Data Sheets
Material safety data sheets (MSDS) of chemicals used in combination with the microscope are
contained in the document folder delivered with the microscope.
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 11

1 General Information | 1.4 Contact ZEISS
1.4 Contact
If you have any questions or problems, please contact your local ZEISS Sales & Servicepartner or
one of the following addresses:
Headquarter
Phone: [phone]
Fax: [phone]
Email: [email protected]
Service Germany
Phone: [phone]
Fax: [phone]
Email: [email protected]
Courses and training
Email: [email protected]
ZEISS Sales & Servicepartner
You can find a ZEISS Sales & Servicepartner in your area under https://www.zeiss.de/mikroskopie/
website/forms/sales-and-service-contacts.html.
12 Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS 2 Safety | 2.1 Intended Use
2 Safety
This chapter contains general requirements for safe working practices. Any person using the Mi-
croscope System or commissioned with installation or maintenance must read and observe these
general safety instructions. Knowledge on basic safety instructions and requirements is a precon-
dition for safe and fault-free operation. Operational safety of the supplied Microscope System is
only ensured if it is operated according to its intended use.
If any work is associated with residual risks, this is mentioned in the relevant parts of this docu-
ment in a specific note. When components must be handled with special caution, they are
marked with a warning label. These warnings must always be observed.
2.1 Intended Use
The microscope has been designed to generate an image or to analyze appropriate specimens,
which is achieved by scanning a focused electron or ion beam across the specimen.
In addition to microscopic examination, the microscope also allows for the modification of appro-
priate specimens. For these purposes, the specimen is placed in the evacuated specimen chamber.
The microscope has been designed for the following applications:
§Imaging
Image generation and specimen analysis can be performed by means of a focused electron
beam (SEM Imaging) or a focused ion beam (FIB Imaging) that is scanned across the speci-
men.
This application allows for the analysis of surface structures and near-surface structures of ap-
propriate specimens.
§Milling
Milling comprises all applications that include material removal from the specimen surface by
a focused ion beam.
In combination with a gas injection system option, the microscope has been designed for the fol-
lowing applications:
§Gas-assisted deposition
A process gas in combination with either a focused electron beam or a focused ion beam can
be used to deposit material onto the specimen surface.
§Gas-assisted etching
This application enables an accelerated material removal by a focused electron beam or a fo-
cused ion beam in combination with a process gas.
Info
Not for therapeutic, treatment or medical diagnostic evidence.
Info
Not all products are available in every country. Contact your local ZEISS representative for
more information.
SmartSEM Software
The SmartSEM software is intended for the operation of scanning electron microscopes (SEMs).
The SmartSEM software has to be run exclusively on a personal computer delivered by ZEISS. Any
other applications are not allowed.
Regarding the operation of the microscope, the following regulations must be met:
§Only operate the microscope according to the operating conditions after correct installation
by a ZEISS service representative.
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 13

2 Safety | 2.2 Safety Procedures ZEISS
§The microscope is only to be used by operators who have been trained by a ZEISS service rep-
resentative. Basic operator training and safety instructions will be provided within the scope
of the initial start-up by ZEISS. Make sure that everyone who operates the microscope only
performs the tasks for which he/she is trained.
§Operators of the microscope must not deviate from the instructions provided in this manual.
§Only perform preventive maintenance tasks described in this manual. All tasks of mainte-
nance, service, and repair not described in this manual have to be performed by an authorized
ZEISS service representative.
§The microscope is to be used in a laboratory environment for commercial and scientific pur-
poses only.
Using the microscope for any other purpose is not allowed and can be hazardous.
2.2 Safety Procedures
2.2.1 Safe Operation Conditions
If the product safety labels are covered or worn or if any of the safety devices are not in proper
working condition, operation of the microscope can be hazardous.
§Periodically check the function of safety equipment.
§Periodically check that all protective cover panels are installed.
§Always follow the instructions given on the safety labels.
§Inspect and clean the product safety labels to maintain good legibility.
2.2.2 Requirements for Personnel
Deviating from the instructions given in this manual and on the safety labels can be hazardous or
can lead to property damage.
§Do not operate the microscope until you have completely read and understood the entire user
documentation delivered with the microscope.
§Observe all safety labels on the microscope and within this manual.
§Only operate the microscope according to the operating conditions after correct installation
by a ZEISS service representative.
§Only ZEISS service representatives, who have specialized knowledge of radiation protection,
are permitted to service the microscope.
Operator Training
Within the scope of initial start-up, the ZEISS service representative will perform a basic operator
training. The basic operator training consists of fundamental operation procedures including
safety instructions. Besides, an introduction to basic maintenance tasks will be given for an ad-
vanced operator, who has to be an electrically skilled person. The training performed must be
documented appropriately.
Special application training is offered on request.
2.2.3 Preventive Maintenance
Deviating from the maintenance and repair tasks described in this manual can be hazardous or
can lead to property damage.
§Only perform preventive maintenance and repair tasks described in this manual.
§All tasks of maintenance, service, and repair not described in this manual have to be per-
formed by an authorized ZEISS service representative.
14 Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS 2 Safety | 2.3 Prevention of Hazards
§To maintain best performance of the microscope, it is essential to perform preventive mainte-
nance on a regular basis. Moreover, it is recommended that you conclude a service contract
with your local ZEISS service representative or organization.
2.2.4 Safe Handling of Spare Parts
Using spare parts that are not provided by ZEISS can be hazardous or can lead to property dam-
age:
§Only genuine parts supplied by ZEISS are to be used in servicing the microscope.
§Contact your ZEISS service representative for information regarding how to order spare parts.
§Unless authorized by ZEISS, all spare parts should be installed by a ZEISS service representa-
tive.
2.3 Prevention of Hazards
This section summarizes potential hazards and recommended safety precautions. Failure to follow
the safety instructions and instructions may result in personal injury and property damage.
2.3.1 Biological Hazards
Danger to life:
Biological
substances
Biological substances may pose a threat to the health of humans and other living organisms.
§Keep a logbook of the biological substances loaded into the microscope and show it to the
ZEISS service representatives before they perform any work on the microscope.
2.3.2 Burn Hazards
Risk of property
damage: Hot
surfaces during
bakeout
Parts of the enclosure in the upper range of the column may become hot during bakeout, particu-
larly after a long bakeout cycle.
§Do not place any combustible objects on the grids of the electron optical column during bake-
out.
§After the bakeout procedure, let surfaces cool down before working around the column.
§Only advanced operators are allowed to perform the bakeout procedure.
2.3.3 Chemical Hazards
Risk of injury:
Aggressive or toxic
chemicals
Aggressive or toxic chemicals can cause chemical burns.
§When handling aggressive or toxic chemicals, wear suitable protective clothing, gloves, and
eye/face protection.
§Do not eat, drink, or smoke while handling toxic chemicals.
§Refer to local safety regulations.
§Read and follow the instructions in the material safety data sheet of the chemical. The mate-
rial safety data sheet can be obtained from the supplier of the chemicals.
Risk of injury:
Reaction products
Dangerous reaction products can be present in the specimen chamber during or after operation.
§Ensure that there is an appropriate exhaust gas line to remove the waste gas of the pre-vac-
uum pump and to transmit it to the outside.
§Wear lint-free gloves when touching the inner parts of the specimen chamber or the speci-
men.
Risk of injury:
Irritant gases
If a gas injection system (GIS) is used, irritant gases might be released from the precursors. Gases
can cause irritation to eyes, skin, and respiratory system.
§Do not remove a reservoir from the gas injection system.
§Contact your ZEISS service representative to have an empty reservoir replaced.
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 15

2 Safety | 2.3 Prevention of Hazards ZEISS
§Never try to open a reservoir.
§For further information, refer to the GIS instruction manual.
Environmental
risk: Disposal of
aggressive or toxic
chemicals
When disposing of aggressive or toxic chemicals, there is a threat of damage to the environment.
§When disposing of waste that has been generated during a service operation (e.g. used rotary
pump oil), comply with all national and local safety and environmental protection regulations.
2.3.4 Electrical Hazards
Danger to life:
Hazardous voltage
inside the
microscope
High voltages are present inside the microscope. Contact may cause burn or electrical shock.
§Ensure proper grounding. For more information, refer to the Installation Requirements docu-
ment.
§Only authorized ZEISS service representatives are allowed to service the microscope.
§Do not try to service the microscope yourself.
Danger to life:
High leakage
currents
High leakage currents are present in the microscope. Contact may cause burn or electrical shock.
§Ensure proper grounding. For more information, refer to the Installation Requirements docu-
ment.
§Do not operate the microscope without the separate ground connection.
2.3.5 High Pressure Hazards
Risk of injury or
property damage:
High pressure in
gas cylinders
Gas cylinders containing for example nitrogen or compressed air have a high internal pressure of
approximately 200bar. If not properly handled, the contained gas can abruptly escape and cause
the gas cylinder to move in an uncontrollable manner.
§Observe all safety labels on the gas cylinders and all safety instructions given by the gas cylin-
der manufacturer.
§Always operate gas cylinders in an upright position and secure them so they will not tip over.
§Before transporting gas cylinders, place protective caps on them.
2.3.6 Magnetic Field Hazards
Risk of injury:
Malfunction of
medical devices
near ion getter
pumps
Magnetic fields present at the ion getter pumps may disturb the function of medical devices. The
magnetic fields are also present if the microscope is switched off.
If you wear medical implants that are susceptible to magnetic fields (e.g. cardiac pacemakers), do
the following:
§Keep a distance of at least 1m from the ion getter pumps.
§Follow the safety instructions provided by the pump manufacturer.
2.3.7 Mechanical Hazards
Risk of injury:
Moving the
specimen stage
Fingers can be trapped by the moving specimen stage.
§Always close the chamber door before moving the specimen stage.
§To remove parts fallen into or near to the stage use a tool (e.g. tweezers) instead of your fin-
gers.
Risk of injury:
Closing the
chamber door
Fingers can be pinched when closing the chamber door.
§Use the recessed grip or door handle to close the chamber door.
§Ensure not to get your fingers caught in the chamber door gap.
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ZEISS 2 Safety | 2.3 Prevention of Hazards
Risk of property
damage: Short
working distance
When opening the chamber door, the microscope or specimen can be damaged if the specimen
stage is at a short working distance. If a BSD detector is inserted, it can be damaged as well.
§Always move the specimen stage to a long working distance before opening the chamber
door.
2.3.8 Radiation Hazards
Danger to life: X-
rays
X-rays are generated inside the microscope during operation. This is unavoidable because elec-
trons are accelerated by voltages up to 30kV.
§Do not remove any parts around the column and chamber that are essential for radiation pro-
tection.
§Use genuine ZEISS parts exclusively.
§Ensure that all local safety and X-ray protection regulations are met.
§Only authorized ZEISS service representatives are allowed to service the microscope.
The microscope is equipped with several radiation protection devices, which, under regular oper-
ating conditions, ensure that the microscope operates in accordance with the German X-ray pro-
tection regulation (RöV), the German radiation protection regulation (StrSchV) as well as with the
EC Directive 2013/59/EURATOM.
In the EU, the operation of the microscope is permission-free as the following requirements are
fulfilled:
§The acceleration voltage is limited to 30kV.
§The local dose rate at a distance of 0.1m from the accessible surface of the microscope does
not exceed 1μSv/h.
§A respective label is attached to the microscope.
Outside the EU, the user of the microscope has to comply with the local regulations of the coun-
try where the microscope is operated.
Radiation Protection
For questions regarding radiation protection, contact the ZEISS Radiation Safety Officer, Carl Zeiss
AG, 73447 Oberkochen, Germany
phone: [phone]
2.3.9 Suffocation Hazards
Danger to life:
Lack of oxygen
Gaseous dry nitrogen is used to vent the specimen chamber during specimen exchange and parts
exchange. Inhaling nitrogen may cause unconsciousness.
§During specimen exchange, keep the chamber door open as short as possible.
§Do not inhale the air from within the specimen chamber.
§Ensure that the area around the microscope is sufficiently ventilated.
§If you begin to experience symptoms of asphyxia (for example: rapid breathing, loss of mental
alertness and/or muscular coordination, depression of sensations, emotional instability, fa-
tigue) leave the room immediately and inform the facility’s safety officer.
Concerning the hazards of nitrogen installations and associated safety precautions refer to the
current version of the guideline IGC Doc 44/18: Hazards of Oxygen-Deficient Atmospheres, pub-
lished by EIGA (European Industrial Gases Association).
To download the document:
1. Go to EIGA homepage www.eiga.eu.
2. Select Publications > EIGA Documents.
3. From the list, select Doc. 44/18.
4. Click Download.
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 17

2 Safety | 2.4 Safety Equipment ZEISS
2.4 Safety Equipment
In order to prevent hazards to human health or property damage, the microscope is equipped
with several safety features.
2.4.1 Protective Cover Panels
Due to hazardous voltages and X-rays inside the microscope, the microscope is equipped with
protective cover panels.
1
2
3
Fig.1: Protective cover panels
1Electron optical column protective cover panels
2Specimen chamber protective cover panels
3Plinth protective cover panels
Operation of the microscope is only allowed with attached protective cover panels.
18 Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000

ZEISS 2 Safety | 2.4 Safety Equipment
2.4.2 Main Switch
The Main Switch cuts off both phases of the mains power from the microscope.
The Main Switch guarantees an ampere interrupting capacity (AIC) of at least 10,000Arms. In the
OFF position, the Main Switch can be secured with a padlock against inadvertent activation, for
example during repair and maintenance work.
The Main Switch is located at the rear side of the plinth.
Fig.2: Main Switch
2.4.3 Emergency Off (EMO) Option
With the Emergency Off (EMO) option, the microscope is equipped with the following additional
safety equipment.
Microscopes with SEMI certification must be equipped with the Emergency Off (EMO) option.
Emergency Off (EMO) Button
The EMO button is located on the plinth adjacent to the specimen chamber.
The EMO button must be pressed in an emergency to cut off mains power from the microscope
and all devices connected to the AC Unit.
The EMO button must always be readily accessible and operable.
Up to three additional EMO buttons may be connected.
Fig.3: EMO button
Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000 19

2 Safety | 2.4 Safety Equipment ZEISS
S2 (Start) Button
The green S2 (Start) button is attached below the MAIN switch at the rear side of the plinth.
The S2 (Start) button is required to confirm the setting of the MAIN switch. It cuts off all devices
connected to the EMO box from the main power supply.
The S2 (Start) button must be pushed in the following cases:
§After the MAIN switch has been set to the ON position, or
§After the EMO button has been released.
Fig.4: S2 (Start) button below the MAIN switch
2.4.4 Locking Devices
The microscope is equipped with several locking devices.
2.4.4.1 Chamber Door Locking Device
The chamber door locking device ensures that the door of the specimen chamber is closed prop-
erly.
It is located at the inner bottom front side of the specimen chamber.
When this locking device is activated (i.e. no electrical contact) EHT Vac ready = no is indi-
cated in the SmartSEM user interface. EHT and SE detector voltages are blocked.
2.4.4.2 Vacuum Locking Device
The vacuum locking device ensures that gun vacuum and system vacuum are better than the re-
quired thresholds.
2.4.4.3 Interlock System of Optional Airlock
The interlock function ensures that the gate valve can only be operated if the chamber door and
the airlock door are properly closed.
Fig.5: Airlock Error LED
Additional blocking functions ensure that the specimen can only be transferred if the following
conditions are fulfilled:
§The airlock rod is retracted.
§The specimen stage is in transfer position.
§The EHT (Extra high tension) is off.
§The column chamber valve is closed.
This is to prevent any risk of damaging the airlock rod or the gate valve.
20 Instruction Manual ZEISS Crossbeam 550L, Crossbeam 550 | en-US | Rev. 3 | 349500-8122-000