ADLINK Technology MCM-100 User manual

Leading EDGE COMPUTING
MCM-100/102
Edge IoT Platform for
Machine Condition Monitoring
User’s Manual
Manual Rev.: 1.0
Revision Date: June 18, 2019
Part No: 50-1Z298-1000

ii
Leading EDGE COMPUTING
Revision History
Revision Release Date Description of Change(s)
1.0 June 18, 2019 Initial Release

Preface iii
MCM-100/102
Preface
Copyright 2019 ADLINK Technology Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsi-
bility to global environmental preservation
through compliance with the European Union's
Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental pro-
tection is a top priority for ADLINK. We have
enforced measures to ensure that our products,
manufacturing processes, components, and raw
materials have as little impact on the environment as possible.
When products are at their end of life, our customers are encour-
aged to dispose of them in accordance with the product disposal
and/or recovery programs prescribed by their nation or company.

iv Preface
Leading EDGE COMPUTING
Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals
including acrylamide, arsenic, benzene, cadmium,
Tris(1,3-dichloro-2-propyl) phosphate (TDCPP), 1,4-
Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC,
and vinyl materials, which are known to the State of California to
cause cancer, and acrylamide, benzene, cadmium, lead, mercury,
phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and
vinyl materials, which are known to the State of California to cause
birth defects or other reproductive harm. For more information go
to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
ᘄ㟁ụㄳᅇᨲ

Preface v
MCM-100/102
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.

vi Preface
Leading EDGE COMPUTING
This page intentionally left blank.

Table of Contents vii
MCM-100/102
Table of Contents
Preface .................................................................................... iii
List of Tables........................................................................ xiii
List of Figures ....................................................................... xv
1 Introduction ........................................................................ 1
1.1 Features............................................................................... 1
1.2 Specifications....................................................................... 2
1.2.1 General....................................................................... 2
1.2.2 I/O............................................................................... 3
1.2.3 Power Consumption ................................................... 6
1.3 Mechanical Drawings........................................................... 8
1.4 I/O Connectors................................................................... 10
1.4.1 Power Button ............................................................ 12
1.4.2 Reset Button............................................................. 13
1.4.3 DisplayPort Connector.............................................. 13
1.4.4 LED Indicators .......................................................... 14
1.4.5 DB-9P COM Port Connector .................................... 14
1.4.6 Dual Gigabit Ethernet Ports...................................... 15
1.4.7 USB 3.0 Port............................................................. 16
1.4.8 BNC Connectors....................................................... 16
1.4.9 4-pin GPI/O w/ DGND Connector............................. 17
1.4.10 DC Power Supply Connector.................................... 17
1.5 Adapters and Other Accessories ....................................... 17
2 Getting Started ................................................................. 19
2.1 Unpacking Checklist .......................................................... 19
2.2 Connecting DC Power ....................................................... 19
2.3 DIN Rail Mounting.............................................................. 19
2.4 Wall Mounting .................................................................... 22

viii Table of Contents
Leading EDGE COMPUTING
2.5 Cooling Considerations...................................................... 23
2.6 Installing Mini-PCIe WiFi Module (Optional) ...................... 24
3 Driver & Application Installation ..................................... 29
3.1 Installing the Chipset Driver ............................................... 29
3.2 Installing the Graphics Driver............................................. 30
3.3 Installing the Ethernet Driver.............................................. 30
3.4 Installing the USB 3.0 Driver.............................................. 31
3.5 Installing the I/O Controller Driver...................................... 31
3.6 Installing the SEMA Utility, WDT and DI/O Drivers............ 31
3.7 Installing AI and DI/O Drivers............................................. 32
MAPS Core ................................................................... 32
DAQ-LVIEW Plus .......................................................... 33
4 Operation ........................................................................... 35
4.1 Analog Input....................................................................... 35
4.1.1 Analog Input Front End Configuration ...................... 35
Input Configuration: Differential/Pseudo-Differential ..... 35
Input Coupling ............................................................... 36
IEPE Input ..................................................................... 36
4.1.2 AI Data Format ......................................................... 37
4.1.3 Sampling Rate .......................................................... 37
DDS Timing/Sampling Rate .......................................... 37
4.1.4 Data Transfer............................................................ 38
Software Polling Data Transfer
(Non-Buffering Programmed I/O) .................................. 38
Continuous Acquisition Mode ....................................... 38
4.1.5 Anti-Aliasing Filter and Frequency Response........... 38
4.2 Triggering........................................................................... 40
4.2.1 Analog Input Trigger Source..................................... 40
Software Triggering ...................................................... 40
External Analog Trigger ................................................ 41

Table of Contents ix
MCM-100/102
External Digital Triggering ............................................ 42
Trigger Modes ............................................................... 43
Delay-Trigger Acquisition (no retrigger) ........................ 44
Middle-Trigger Acquisition ............................................ 45
Gated Trigger ................................................................ 45
Post-Trigger or Delay-Trigger Acquisition
with Re-Trigger ............................................................. 46
4.3 Programmable Function I/O............................................... 46
4.3.1 Static Digital Input/Output......................................... 46
4.3.2 Frequency Counter................................................... 46
4.3.3 Pulse Output............................................................. 47
4.3.4 Digital Trigger IN for Continuous Analog Input ......... 47
4.3.5 Synchronization Sample Clock IN ............................ 47
5 Calibration......................................................................... 49
5.1 Loading Calibration Constants........................................... 49
5.2 Auto-Calibration ................................................................. 49
5.3 Saving Calibration Constants ............................................ 50
A Appendix: BIOS Setup...................................................... 51
A.1 Main ................................................................................... 52
A.1.1 BIOS Information ...................................................... 52
A.1.2 System Time/System Date ....................................... 52
A.1.3 Board Information ..................................................... 53
A.2 Advanced........................................................................... 54
A.2.1 CPU Configuration.................................................... 55
Active Processor Cores ................................................ 55
Intel Virtualization Technology ...................................... 55
VT-d .............................................................................. 55
Turbo Mode .................................................................. 55
Critical Trip Point .......................................................... 56
Passive Cooling Trip Point ............................................ 56

xTableofContents
Leading EDGE COMPUTING
A.2.2 Graphics Configuration ............................................. 56
GTT Size ....................................................................... 56
Aperture Size ................................................................ 56
DVMT Pre-Allocated ..................................................... 57
DVMT Total Gfx Mem ................................................... 57
A.2.3 Onboard Device Configuration ................................. 57
COM1 Control ............................................................... 57
COM2 Control ............................................................... 57
HSUART ....................................................................... 58
LAN #1 (Intel I210) ........................................................ 58
LAN #2 (Intel I210) ........................................................ 58
Realtek Audio Support .................................................. 58
Console Redirection ..................................................... 59
Console Redirection Settings (COM 1) ......................... 59
Console Redirection ..................................................... 62
Console Redirection Settings (COM 2) ......................... 62
A.2.4 Advanced Power Management................................. 64
Power Supply Unit ........................................................ 65
State After G3 ............................................................... 65
RTC Wake system from S5 .......................................... 65
LAN #1 Wake ................................................................ 65
LAN #2 Wake ................................................................ 65
A.2.5 USB Configuration .................................................... 66
XHCI Hand-off .............................................................. 66
USB Mass Storage Driver Support ............................... 66
USB transfer time-out ................................................... 66
Device reset time-out .................................................... 66
Device power-up delay ................................................. 67
A.2.6 SATA Configuration.................................................. 67
Port ............................................................................... 67
A.2.7 TPM Configuration.................................................... 68
Security Device Support ............................................... 68