ADLINK Technology MCM-100 User manual

Leading EDGE COMPUTING
MCM-100/102
Edge IoT Platform for
Machine Condition Monitoring
User’s Manual
Manual Rev.: 1.0
Revision Date: June 18, 2019
Part No: 50-1Z298-1000

ii
Leading EDGE COMPUTING
Revision History
Revision Release Date Description of Change(s)
1.0 June 18, 2019 Initial Release

Preface iii
MCM-100/102
Preface
Copyright 2019 ADLINK Technology Inc.
This document contains proprietary information protected by copy-
right. All rights are reserved. No part of this manual may be repro-
duced by any mechanical, electronic, or other means in any form
without prior written permission of the manufacturer.
Disclaimer
The information in this document is subject to change without prior
notice in order to improve reliability, design, and function and does
not represent a commitment on the part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, spe-
cial, incidental, or consequential damages arising out of the use or
inability to use the product or documentation, even if advised of
the possibility of such damages.
Environmental Responsibility
ADLINK is committed to fulfill its social responsi-
bility to global environmental preservation
through compliance with the European Union's
Restriction of Hazardous Substances (RoHS)
directive and Waste Electrical and Electronic
Equipment (WEEE) directive. Environmental pro-
tection is a top priority for ADLINK. We have
enforced measures to ensure that our products,
manufacturing processes, components, and raw
materials have as little impact on the environment as possible.
When products are at their end of life, our customers are encour-
aged to dispose of them in accordance with the product disposal
and/or recovery programs prescribed by their nation or company.

iv Preface
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Battery Labels (for products with battery)
California Proposition 65 Warning
WARNING: This product can expose you to chemicals
including acrylamide, arsenic, benzene, cadmium,
Tris(1,3-dichloro-2-propyl) phosphate (TDCPP), 1,4-
Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC,
and vinyl materials, which are known to the State of California to
cause cancer, and acrylamide, benzene, cadmium, lead, mercury,
phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and
vinyl materials, which are known to the State of California to cause
birth defects or other reproductive harm. For more information go
to www.P65Warnings.ca.gov.
Trademarks
Product names mentioned herein are used for identification pur-
poses only and may be trademarks and/or registered trademarks
of their respective companies.
Conventions
Take note of the following conventions used throughout this
manual to make sure that users perform certain tasks and
instructions properly.
NOTE:
NOTE:
Additional information, aids, and tips that help users perform
tasks.
ᘄ㟁ụㄳᅇᨲ

Preface v
MCM-100/102
CAUTION:
Information to prevent minor physical injury, component dam-
age, data loss, and/or program corruption when trying to com-
plete a task.
WARNING:
Information to prevent serious physical injury, component
damage, data loss, and/or program corruption when trying to
complete a specific task.

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Table of Contents vii
MCM-100/102
Table of Contents
Preface .................................................................................... iii
List of Tables........................................................................ xiii
List of Figures ....................................................................... xv
1 Introduction ........................................................................ 1
1.1 Features............................................................................... 1
1.2 Specifications....................................................................... 2
1.2.1 General....................................................................... 2
1.2.2 I/O............................................................................... 3
1.2.3 Power Consumption ................................................... 6
1.3 Mechanical Drawings........................................................... 8
1.4 I/O Connectors................................................................... 10
1.4.1 Power Button ............................................................ 12
1.4.2 Reset Button............................................................. 13
1.4.3 DisplayPort Connector.............................................. 13
1.4.4 LED Indicators .......................................................... 14
1.4.5 DB-9P COM Port Connector .................................... 14
1.4.6 Dual Gigabit Ethernet Ports...................................... 15
1.4.7 USB 3.0 Port............................................................. 16
1.4.8 BNC Connectors....................................................... 16
1.4.9 4-pin GPI/O w/ DGND Connector............................. 17
1.4.10 DC Power Supply Connector.................................... 17
1.5 Adapters and Other Accessories ....................................... 17
2 Getting Started ................................................................. 19
2.1 Unpacking Checklist .......................................................... 19
2.2 Connecting DC Power ....................................................... 19
2.3 DIN Rail Mounting.............................................................. 19
2.4 Wall Mounting .................................................................... 22

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2.5 Cooling Considerations...................................................... 23
2.6 Installing Mini-PCIe WiFi Module (Optional) ...................... 24
3 Driver & Application Installation ..................................... 29
3.1 Installing the Chipset Driver ............................................... 29
3.2 Installing the Graphics Driver............................................. 30
3.3 Installing the Ethernet Driver.............................................. 30
3.4 Installing the USB 3.0 Driver.............................................. 31
3.5 Installing the I/O Controller Driver...................................... 31
3.6 Installing the SEMA Utility, WDT and DI/O Drivers............ 31
3.7 Installing AI and DI/O Drivers............................................. 32
MAPS Core ................................................................... 32
DAQ-LVIEW Plus .......................................................... 33
4 Operation ........................................................................... 35
4.1 Analog Input....................................................................... 35
4.1.1 Analog Input Front End Configuration ...................... 35
Input Configuration: Differential/Pseudo-Differential ..... 35
Input Coupling ............................................................... 36
IEPE Input ..................................................................... 36
4.1.2 AI Data Format ......................................................... 37
4.1.3 Sampling Rate .......................................................... 37
DDS Timing/Sampling Rate .......................................... 37
4.1.4 Data Transfer............................................................ 38
Software Polling Data Transfer
(Non-Buffering Programmed I/O) .................................. 38
Continuous Acquisition Mode ....................................... 38
4.1.5 Anti-Aliasing Filter and Frequency Response........... 38
4.2 Triggering........................................................................... 40
4.2.1 Analog Input Trigger Source..................................... 40
Software Triggering ...................................................... 40
External Analog Trigger ................................................ 41

Table of Contents ix
MCM-100/102
External Digital Triggering ............................................ 42
Trigger Modes ............................................................... 43
Delay-Trigger Acquisition (no retrigger) ........................ 44
Middle-Trigger Acquisition ............................................ 45
Gated Trigger ................................................................ 45
Post-Trigger or Delay-Trigger Acquisition
with Re-Trigger ............................................................. 46
4.3 Programmable Function I/O............................................... 46
4.3.1 Static Digital Input/Output......................................... 46
4.3.2 Frequency Counter................................................... 46
4.3.3 Pulse Output............................................................. 47
4.3.4 Digital Trigger IN for Continuous Analog Input ......... 47
4.3.5 Synchronization Sample Clock IN ............................ 47
5 Calibration......................................................................... 49
5.1 Loading Calibration Constants........................................... 49
5.2 Auto-Calibration ................................................................. 49
5.3 Saving Calibration Constants ............................................ 50
A Appendix: BIOS Setup...................................................... 51
A.1 Main ................................................................................... 52
A.1.1 BIOS Information ...................................................... 52
A.1.2 System Time/System Date ....................................... 52
A.1.3 Board Information ..................................................... 53
A.2 Advanced........................................................................... 54
A.2.1 CPU Configuration.................................................... 55
Active Processor Cores ................................................ 55
Intel Virtualization Technology ...................................... 55
VT-d .............................................................................. 55
Turbo Mode .................................................................. 55
Critical Trip Point .......................................................... 56
Passive Cooling Trip Point ............................................ 56

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A.2.2 Graphics Configuration ............................................. 56
GTT Size ....................................................................... 56
Aperture Size ................................................................ 56
DVMT Pre-Allocated ..................................................... 57
DVMT Total Gfx Mem ................................................... 57
A.2.3 Onboard Device Configuration ................................. 57
COM1 Control ............................................................... 57
COM2 Control ............................................................... 57
HSUART ....................................................................... 58
LAN #1 (Intel I210) ........................................................ 58
LAN #2 (Intel I210) ........................................................ 58
Realtek Audio Support .................................................. 58
Console Redirection ..................................................... 59
Console Redirection Settings (COM 1) ......................... 59
Console Redirection ..................................................... 62
Console Redirection Settings (COM 2) ......................... 62
A.2.4 Advanced Power Management................................. 64
Power Supply Unit ........................................................ 65
State After G3 ............................................................... 65
RTC Wake system from S5 .......................................... 65
LAN #1 Wake ................................................................ 65
LAN #2 Wake ................................................................ 65
A.2.5 USB Configuration .................................................... 66
XHCI Hand-off .............................................................. 66
USB Mass Storage Driver Support ............................... 66
USB transfer time-out ................................................... 66
Device reset time-out .................................................... 66
Device power-up delay ................................................. 67
A.2.6 SATA Configuration.................................................. 67
Port ............................................................................... 67
A.2.7 TPM Configuration.................................................... 68
Security Device Support ............................................... 68

Table of Contents xi
MCM-100/102
A.2.8 Network Stack Configuration .................................... 69
Network Stack ............................................................... 69
A.2.9 System Management................................................ 70
Flags ............................................................................. 74
Power Up ...................................................................... 75
A.2.10 Miscellaneous........................................................... 76
OS Selection ................................................................. 76
A.2.11 Intel® I210 Gigabit Network Connection .................. 77
Blink LEDs .................................................................... 77
A.2.12 NIC Configuration ..................................................... 78
Link Speed .................................................................... 78
Wake On LAN ............................................................... 78
A.3 Security.............................................................................. 79
Administrator Password ................................................ 79
User Password ............................................................. 79
BIOS Lock .................................................................... 79
A.3.1 Secure Boot.............................................................. 80
A.4 Boot ................................................................................... 81
Setup Prompt Timeout .................................................. 81
Bootup NumLock State ................................................. 81
Quiet Boot ..................................................................... 81
Fast Boot ...................................................................... 81
Boot Option Priorities .................................................... 82
A.5 Save & Exit ........................................................................ 82
Save Changes and Exit ................................................ 82
Discard Changes and Exit ............................................ 82
Save Changes and Reset ............................................. 83
Discard Changes and Reset ......................................... 83
Save Changes .............................................................. 83
Discard Changes .......................................................... 83
Restore Defaults ........................................................... 83
Save as User Defaults .................................................. 83

xii Table of Contents
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Restore User Defaults .................................................. 83
Launch EFI Shell from filesystem device ...................... 83
B Appendix: Functional Information ...................................85
B.1 AI and GPI/O Functional Layout ........................................ 86
B.2 Internal I/O Connectors...................................................... 87
B.2.1 Internal HSUART Interface Wafer ............................ 89
B.2.2 USIM Port ................................................................. 89
B.2.3 Internal USB2.0 Interface Wafer............................... 90
B.2.4 Internal I2C Interface Wafer...................................... 90
B.2.5 Clear CMOS Jumper ................................................ 91
B.2.6 +5V GPS Antenna Power Header ............................ 91
B.2.7 Internal SATA Interface Wafer.................................. 92
B.2.8 Extended Power Wafer............................................. 93
B.2.9 Internal I2C Interface Wafer...................................... 94
B.2.10 Extended Reset Wafer.............................................. 94
B.2.11 RTC Battery Header ................................................. 95
B.2.12 Internal Speaker Wafer (Optional) ............................ 95
B.2.13 Internal MIC-IN & HP-OUT Wafer (Optional)............ 96
Important Safety Instructions............................................... 97
Getting Service .................................................................... 101

List of Tables xiii
MCM-100/102
List of Tables
Table 1-1: DisplayPort Pin Assignment ..................................... 13
Table 1-2: LED Operation Indicators ......................................... 14
Table 1-3: DB-9P COM Port Pin Assignment ............................ 14
Table 1-4: Gigabit Ethernet Port LED Function ......................... 16
Table 4-1: Signal Source-Card Configuration............................ 35
Table 4-2: MCM-100/102 Input Ranges .................................... 37
Table B-1: Internal I/O Legend................................................... 89
Table B-2: HSUART Interface Wafer Pin Definitions ................. 89
Table B-3: USB2.0 Interface Wafer Pin Definitions.................... 90
Table B-4: Internal I2C Interface Wafer Pin Definitions ............. 91
Table B-5: Clear CMOS Jumper Pin Definition .......................... 91
Table B-6: +5V GPS Antenna Power Connector Pin Definition . 92
Table B-7: SATA Wafer Pin Definition ....................................... 92
Table B-8: Extended Power Header Connector Pin Definition... 93
Table B-9: I2C Box Header Connector Pin Definition ................ 94
Table B-10: Extended Reset Header Connector Pin Definition ... 94
Table B-11: RTC Battery Connector Pin Definition ...................... 95
Table B-12: Speaker Wafer Pin Definition ................................... 95
Table B-13: MIC-IN & HP-OUT Wafer Pin Definition ................... 96

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List of Figures xv
MCM-100/102
List of Figures
Figure 1-1: Top View..................................................................... 8
Figure 1-2: Front View .................................................................. 8
Figure 1-3: MCM-100 (Right) Side View ....................................... 9
Figure 1-4: MCM-102 (Right) Side View ....................................... 9
Figure 1-5: (Left) Side View ........................................................ 10
Figure 1-6: Front Panel I/O ......................................................... 10
Figure 1-7: MCM-100 Right Side Panel I/O ................................ 11
Figure 1-8: MCM-102 Right Side Panel I/O ................................ 11
Figure 1-9: Left Side Panel I/O ................................................... 12
Figure 1-10: DB-9P COM Port ...................................................... 14
Figure 1-11: BNC Connector Polarity ........................................... 16
Figure 1-12: 4-pin GPI/O w/ DGND Connector............................. 17
Figure 1-13: DC Power Connector................................................ 17
Figure 4-1: MCM-100/102 Analog Front End.............................. 35
Figure 4-2: Excitation Current for IEPE Sensor Measurement ... 36
Figure 4-3: Input Frequency Response
for High Resolution Mode ......................................... 39
Figure 4-4: Input Frequency Response for High Speed Mode ... 40
Figure 4-5: Below-Low Analog Triggering................................... 41
Figure 4-6: Above-High Analog Triggering ................................. 42
Figure 4-7: Digital Triggering ...................................................... 42
Figure 4-8: Post Trigger without Retrigger.................................. 43
Figure 4-9: Pre-trigger Mode Operation (valid trigger only) ........ 44
Figure 4-10: Pre-trigger Mode Operation (w/ invalid trigger) ........ 44
Figure 4-11: Delay-Trigger Mode Operation ................................. 45
Figure 4-12: Middle-Trigger Acquisition ........................................ 45
Figure 4-13: Gated Trigger ........................................................... 46
Figure B-1: MCM-100/102 System Functional Block Diagram .... 85
Figure B-2: MCM-100/102 AI and
GPI/O Functional Block Diagram.............................. 86
Figure B-3: Mainboard Top View................................................. 87
Figure B-4: Mainboard Underside View ...................................... 88

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Introduction 1
MCM-100/102
1 Introduction
ADLINK's MCM-100/102 features built-in vibration signal acquisi-
tion, with 2 or 4 BNC for analog input. The machine condition mon-
itoring edge platform highlights around-the-clock continuous data
collection and vibration measurement with maximized precision
and sampling rates for rotating machinery and equipment. Com-
bining data collection, vibration analysis algorithms, computation
and network connection capabilities in a single system, the MCM-
100/102 enables rotating machinery, tooling, and plant and auto-
mation equipment operators to easily overcome the challenges
inherent in conventional equipment maintenance.
1.1 Features
Intel® Atom x7-E3950 processor
Extremely compact 183 (W) x 110 (D) x 84 (H) mm
Rich I/O:
2X or 4X BNC for analog input

2Introduction
Leading EDGE COMPUTING
2X Digital I/O by terminal block
1x DP, 2x GbE, 2x COM(RS232/RS422/RS485), 2x USB
2.0, 2x USB 3.0
DIN rail mounting, wall mounting
1.2 Specifications
1.2.1 General
System Core
Processor Intel® Atom x7-E3950
Chipset SoC
Video 1 x DisplayPort 1.2 (supports DP++)
Memory 4 GB DDR3L 1600 MHz SODIMM module
(Up to 8 GB support)
I/O Interface
Ethernet 2 x GbE ports (2 x Intel I210IT)
Serial Ports 2 x BIOS-configurable RS232/422/485(COM1 and
COM2)
USB 2 x USB 3.0 ports + 2 x USB 2.0 ports
WDT Watchdog timer support from SEMA 3.5
Power Supply
DC Input Built-in 6 to 36 VDC wide-range DC input
3P pluggable connectors with latch (GND, V-, V+)
Storage
mSATA 1x mSATA slot with full size mini PCIe (SSD-128GB III
MLC)
Physical
Dimensions 183 (W) x 110 (D) x 54 (H) mm (7.2" x 4.3" x 3.3")
Weight 1.46 kg (3.77 lb.)
Mounting DIN rail, wall mounting
Environmental
Operating
Temperature Standard: 0°C to 55°C
Storage
Temperature -20°C to 70°C (excl. HDD/MicroSD)

Introduction 3
MCM-100/102
1.2.2 I/O
Analog/digital
Humidity Approx. 95% @ 40°C (non-condensing)
Vibration Operating, 5 Grms, 5-500 Hz, 3 axes (w/ mSATA)
ESD Contact +/-4 KV and Air +/-8 KV
Shock Operating 100 G, half sine 11 ms duration w/ mSATA
EMC CE & FCC Class A (EN61000-6-4/EN61000-6-2)
MCM-100 MCM-102
Analog input (AI)
Channels 4 (simultaneous-
sampling)
2 (simultaneous-
sampling)
ADC resolution 24-bit
ADC type Delta-sigma
Sampling rate 1kHz to 128kHz
Input range ±10V
FIFO buffer size 8kS across all channel
Input configuration Differential or pseudo-differential
Input impedance
200 kbetween positive input and
negative input.
16.93 kbetween negative input and
chassis ground.
Input coupling AC or DC, software selectable
Integrated electronic
piezoelectric (IEPE)
Current: 2 mA or 0 mA, software
selectable, IEPE compliance: 24V
Over-voltage protection ±60V
Input common mode range ±10V
Trigger source Analog or digital, software selectable
Trigger mode
Post trigger, delay trigger, middle trigger,
gated trigger, pre-trigger, post or delay
trigger with re-triggering
Data transfer Programmed I/O, continuous (bulk
transfer mode)

4Introduction
Leading EDGE COMPUTING
CMRR
AC (20Hz to 1kHz) 60 dB
Bandwidth
-3dB bandwidth 0.49 x fs (where fs = sampling rate)
AC cut-off frequency (-3dB) 0.4 Hz
AC cut-off frequency (-0.1dB) 2.4 Hz
Digital I/O
Channels 2 programmable function I/O
Compatibility 3.3V / TTL (single-ended)
Initial status Input (pulled low)
Input voltage
Logic low: VIL = 0.8 V max; IIL = 0.2 mA
max.
Logic high: VIH = 2.0 V min.; IIH = 0.2
mA max.
Output voltage
Logic low: VOL = 0.8 V max; IIL = 0.2 mA
max.
Logic high: VOH = 2.0 V min.; IIH = 24
mA max.
Over-voltage protection -2V to +7V
Supporting modes (only one
can be selected and function
at a time)
• Static digital input/output
• PWM output, max. frequency: 4 MHz
• Frequency/Event counter, max.
frequency: 4MHz
• Digital trigger IN
• Synchronization sample clock IN, max.
frequency: 128kHz
Data Transfer Programmed I/O