Advantech MIC-3332 User manual

User Manual
MIC-3332
3U CompactPCI 6th Generation
Intel® Core™i7 Processor Blade,
ECC optional

MIC-3332 User Manual ii
Copyright
The documentation and the software included with this product are copyrighted 2020
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. Information provided in this manual is intended to be accurate and reliable. How-
ever, Advantech Co., Ltd. assumes no responsibility for its use, nor for any infringe-
ments of the rights of third parties, which may result from its use.
Acknowledgments
All other product names or trademarks are properties of their respective owners.
Product Warranty (2 years)
Advantech warrants to you, the original purchaser, that each of its products will be
free from defects in materials and workmanship for two years from the date of pur-
chase.
This warranty does not apply to any products which have been repaired or altered by
persons other than repair personnel authorized by Advantech, or which have been
subject to misuse, abuse, accident or improper installation. Advantech assumes no
liability under the terms of this warranty as a consequence of such events.
Because of Advantech’s high quality-control standards and rigorous testing, most of
our customers never need to use our repair service. If an Advantech product is defec-
tive, it will be repaired or replaced at no charge during the warranty period. For out-
of-warranty repairs, you will be billed according to the cost of replacement materials,
service time and freight. Please consult your dealer for more details.
If you think you have a defective product, follow these steps:
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages you get when the problem
occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain an RMA (return merchandize
authorization) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a fully-completed Repair and Replacement
Order Card and a photocopy proof of purchase date (such as your sales receipt)
in a shippable container. A product returned without proof of the purchase date
is not eligible for warranty service.
5. Write the RMA number visibly on the outside of the package and ship it prepaid
to your dealer.
Part No. 2002333210 Edition 1
Printed in China January 2021

iii MIC-3332 User Manual
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables.
FCC Class A
Note: This equipment has been tested and found to comply with the limits for a Class
A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Opera-
tion of this equipment in a residential area is likely to cause harmful interference in
which case the user will be required to correct the interference at his own expense.
FM
This equipment has passed the FM certification. According to the National Fire Pro-
tection Association, work sites are classified into different classes, divisions and
groups, based on hazard considerations. This equipment is compliant with the speci-
fications of Class I, Division 2, Groups A, B, C and D indoor hazards.
Technical Support and Assistance
1. Visit the Advantech website at http://support.advantech.com where you can find
the latest information about the product.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before you call:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages

MIC-3332 User Manual iv
Warnings, Cautions and Notes
Document Feedback
To assist us in making improvements to this manual, we would welcome comments
and constructive criticism. Please send all such - in writing to: support@advant-
ech.com
Packing List
Before setting up the system, check that the items listed below are included and in
good condition. If any item is not accord with the table, please contact your dealer
immediately.
MIC-3332 all-in-one single board computer (CPU heatsink and PCH heatsink
included) x1
Daughter board for SATA HDD x1(Assembled)
HDD tray and screws package x 1
Solder-side cover (Assembled) x1
Warranty certificate document x1
Safety Warnings: CE, FCC class A
If any of these items are missing or damaged, contact your distributor or sales repre-
sentative immediately.
Warning! Warnings indicate conditions, which if not observed, can cause personal
injury!
Caution! Cautions are included to help you avoid damaging hardware or losing
data. e.g.
There is a danger of a new battery exploding if it is incorrectly installed.
Do not attempt to recharge, force open, or heat the battery. Replace the
battery only with the same or equivalent type recommended by the man-
ufacturer. Discard used batteries according to the manufacturer's
instructions.
Note! Notes provide optional additional information.

v MIC-3332 User Manual
Safety Instructions
1. Read these safety instructions carefully.
2. Keep this User Manual for later reference.
3. Disconnect this equipment from any AC outlet before cleaning. Use a damp
cloth. Do not use liquid or spray detergents for cleaning.
4. For plug-in equipment, the power outlet socket must be located near the equip-
ment and must be easily accessible.
5. Keep this equipment away from humidity.
6. Put this equipment on a reliable surface during installation. Dropping it or letting
it fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. DO NOT COVER THE OPENINGS.
8. Make sure the voltage of the power source is correct before connecting the
equipment to the power outlet.
9. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage by transient overvoltage.
12. Never pour any liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
14. If one of the following situations arises, get the equipment checked by service
personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment does not work well, or you cannot get it to work according to
the user's manual.
The equipment has been dropped and damaged.
The equipment has obvious signs of breakage.
15. DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT WHERE THE
STORAGE TEMPERATURE MAY GO BELOW -20° C (-4° F) OR ABOVE 60° C
(140° F). THIS COULD DAMAGE THE EQUIPMENT. THE EQUIPMENT
SHOULD BE IN A CONTROLLED ENVIRONMENT.
16. CAUTION: DANGER OF EXPLOSION IF BATTERY IS INCORRECTLY
REPLACED. REPLACE ONLY WITH THE SAME OR EQUIVALENT TYPE
RECOMMENDED BY THE MANUFACTURER, DISCARD USED BATTERIES
ACCORDING TO THE MANUFACTURER'S INSTRUCTIONS.
The sound pressure level at the operator's position according to IEC 704-1:1982 is
no more than 70 dB (A).
DISCLAIMER: This set of instructions is given according to IEC 704-1. Advantech
disclaims all responsibility for the accuracy of any statements contained herein.

MIC-3332 User Manual vi
Safety Precaution - Static Electricity
Follow these simple precautions to protect yourself from harm and the products from
damage.
To avoid electrical shock, always disconnect the power from your PC chassis
before you work on it. Don't touch any components on the CPU card or other
cards while the PC is on.
Disconnect power before making any configuration changes. The sudden rush
of power as you connect a jumper or install a card may damage sensitive elec-
tronic components.
We Appreciate Your Input
Please let us know of any aspect of this product, including the manual, which could
use improvement or correction. We appreciate your valuable input in helping make
our products better.

vii MIC-3332 User Manual
Contents
Chapter 1 Hardware Configuration......................1
1.1 Introduction ............................................................................................... 2
1.2 Specifications............................................................................................ 3
1.2.1 CompactPCI Bridge ...................................................................... 3
1.2.2 Processor...................................................................................... 3
Table 1.1: Processor Type .......................................................... 3
1.2.3 Chipset.......................................................................................... 4
1.2.4 Memory......................................................................................... 4
1.2.5 Ethernet ........................................................................................ 4
1.2.6 Storage Interface .......................................................................... 4
1.2.7 Serial ports.................................................................................... 4
1.2.8 USB Ports ..................................................................................... 4
1.2.9 Watchdog Timer............................................................................ 5
1.2.10 BIOS ............................................................................................. 5
1.2.11 I/O Connectivity............................................................................. 5
1.2.12 Optional Rear I/O Modules ........................................................... 5
Table 1.2: MIC-3332R1-S1E Configuration................................. 5
1.2.13 Optional Extension Modules ......................................................... 6
Table 1.3: The Second Layer 8HP XTM Configurations ............. 6
1.2.14 Mechanical and Environmental Specifications.............................. 6
1.2.15 Compact Mechanical Design ........................................................ 6
1.2.16 Hardware Monitor ......................................................................... 6
1.2.17 Super I/O....................................................................................... 6
1.2.18 RTC and Battery ........................................................................... 7
1.3 Functional Block Diagram ......................................................................... 7
Figure 1.1 MIC-3332 functional block diagrams .......................... 7
1.4 Jumpers and Switches .............................................................................. 8
Figure 1.2 MIC-3332 COM mode setting..................................... 8
1.5 Connector Definitions................................................................................ 9
Table 1.4: MIC-3332 on board connector descriptions (Front IO
Board)......................................................................... 9
Table 1.5: MIC-3332 on board connector descriptions (Rear IO
Board)......................................................................... 9
Figure 1.3 MIC-3332 Front Panel Ports, Indicators and Buttons . 9
Figure 1.4 MIC-3332R1-S1E REAR IO Panel Ports and Indicators
10
1.6 Safety Precautions.................................................................................. 10
1.7 Installation Steps..................................................................................... 11
1.7.1 HDD/SSD Installation Steps ....................................................... 11
Figure 1.5 Assembly of MIC-3332 with 1 x 2.5" HDD/SSD........ 11
1.8 Battery Replacement............................................................................... 12
1.9 Software Support .................................................................................... 12
Chapter 2 AMI BIOS Setup .................................13
2.1 Introduction ............................................................................................. 14
Figure 2.1 Setup program initial screen..................................... 14
2.2 BIOS Setup ............................................................................................. 15
2.3 Entering Setup ........................................................................................ 15
Figure 2.2 Setup Screen............................................................ 15
2.3.1 Main Setup.................................................................................. 16
Figure 2.3 Main setup screen .................................................... 16
2.3.2 Platform BIOS Features Setup ................................................... 17
Figure 2.4 Platform BIOS features setup screen ....................... 17

MIC-3332 User Manual viii
Figure 2.5 Serial Console Setting.............................................. 17
Figure 2.6 USB configuration .................................................... 18
Figure 2.7 Virtualization............................................................. 19
Figure 2.8 Platform Management .............................................. 20
2.3.3 Hardware settings....................................................................... 21
Figure 2.9 Hardware BIOS Setup Screen ................................. 21
Figure 2.10CPU Configuration ................................................... 21
Figure 2.11Northbridge............................................................... 22
Figure 2.12Memory Configuration .............................................. 23
Figure 2.13PCI Subsystem......................................................... 23
Figure 2.14Southbridge .............................................................. 24
Figure 2.15SATA Configuration.................................................. 24
Figure 2.16NCT5523D Super IO Configuration.......................... 25
Figure 2.17Serial Port1 Configuration ........................................ 26
Figure 2.18NCT5523D H/W Monitor configuration..................... 26
Figure 2.19H/W Monitor configuration........................................ 27
Figure 2.20H/W Monitor configuration........................................ 27
2.3.4 Post & Boot................................................................................. 28
Figure 2.21Post & Boot Setup Screen........................................ 28
Figure 2.22CSM16 Parameters.................................................. 29
Figure 2.23CSM Parameters...................................................... 30
2.3.5 Security....................................................................................... 31
Figure 2.24Security Settings ...................................................... 31
2.3.6 Save & Exit ................................................................................. 32
Figure 2.25Save & Exit............................................................... 32
Appendix A Pin Assignments............................... 35
A.1 J1 Connector........................................................................................... 36
Table A.1: J1 CompactPCI I/O .................................................. 36
A.2 J2 Connector........................................................................................... 37
Table A.2: J2 CompactPCI I/O .................................................. 37
Table A.3: VGA1 Connector ...................................................... 38
Table A.4: RJ45 LAN1/LAN2 Connector on 4HP board ............ 38
Table A.5: RJ45 LAN1/LAN2 Connector on 8HP XTM-1 Board &
RJ45 LAN1~LAN4 Connector on 8HP XTM-2 Board38
Table A.6: M12 LAN1/LAN2 Connector on 8HP XTM-1 Board &
M12 LAN1~LAN4 Connector on 8HP XTM-2 Board 39
Table A.7: USB3CN1(4HP), USB3CN2(4HP), USB3_CN1(8HP
XTM-1 Board)........................................................... 39
Table A.8: COM1 (RJ45) Connector on 8HP XTM-1 Board ...... 39
Table A.9: BAT_CN CMOS battery ........................................... 39
A.3 M/D, PWR, HDD, Hot-swap & LAN LEDs............................................... 40
Table A.10:Front Panel LEDs Indication..................................... 40
Appendix B Programming the Watchdog Timer . 41
Appendix C FPGA Specification........................... 43
C.1 Overview ................................................................................................. 44
C.1.1 CPLD Functional Blocks............................................................. 44
Figure C.1 CPLD Block Diagram ............................................... 44
C.2 Features.................................................................................................. 44
C.3 FPGA I/O Registers ................................................................................ 45
Table C.1: Register Map ............................................................ 45
C.4 CPLD Upgrade........................................................................................ 48
C.4.1 JTAG Interface............................................................................ 48

ix MIC-3332 User Manual
Table C.2: JTAG Interface ......................................................... 48
Appendix D Glossary .............................................49

MIC-3332 User Manual x

Chapter 1
1Hardware
Configuration
This chapter describes how to
configure MIC-3332 hardware.

MIC-3332 User Manual 2
1.1 Introduction
MIC-3332 series are 3U CompactPCI single board computers with 6th Gen Intel®
Quad Core™ i7/Xeon®E3 processors and CM236 chipset. It supports single-channel
memory with ECC optional, up to 16 GB on board DDR4 of 2133MHz speed. There
are various types of storage on the XTM board: including a 2.5" SATA connector, a
Cfast socket, and an additional Micro-SD slot on the XTM-2 board. MIC-3332 is avail-
able in single and dual slot width form factors, to offer various I/O functionality by
XTM(8HP) and rear I/O extensions. Front panel I/O on the single slot (4HP) provides
1x VGA port, 2 x USB 3.0 ports, and 2 x RJ45 GbE ports. Front Panel I/O on the 8HP
XTM layer have multiple options; 8HP XTM-1 board provides 1x RJ45 COM port, 1 x
HDMI display port, 1 x USB 3.0 port, 2 x GbE LAN ports by M12 X-coding or RJ45
connectors; 8HP XTM-2 Board provides 4 x GbE LAN ports by M12 X-coding or
RJ45 connectors.
MIC-3332 provides an ideal solution for transportation, railway, and factory Automa-
tion applications. With its robust board layout and thermal efficiency, it meets and
exceeds EN50155 and EN50121-4 standards.
MIC-3332 series can be installed in a standard CompactPCI system slot, designed to
meet harsh environments, and is ideally suitable for data centers, telecom, military,
defense systems, and many other vertical segment applications. It is compliant with
PICMG 2.0 Rev. 3.0 / PICMG 2.1/ PICMG 2.3 Rev.1.0, and supports 32-bit / 33 MHz
PCI bus at +3.3 V or +5 V VIO.
Ordering Information:
Single
board
Front Panel Main On board Features
4HP 8HP XTM 4HP 8HP XTM
(Conn./Socket/Pin head) Others
LAN
(RJ45)
USB
3.0 VGA LAN (M12)
LAN
(RJ45) COM HDMI USB 3.0 CPU Mem- ory
SATA
Conn.
Cfast
Socke
t
Micro-
SD
Socket
COM
-Pin
head
Slot
Width
Plu-
sIO
MIC-
3332C1-
D1E
2 2 1 - 4 - - -
i7-
6822
EQ
8GB 1 1 1 - 2 No
MIC-
3332D1-
D1E
2 2 1 4 - - - -
i7-
6820
EQ
16GB 1 1 1 - 2 No
MIC-
3332C4-
D2E
2 2 1 - 2 1 1 1
i7-
6822
EQ
8GB 1 1 - 1 2 No
MIC-
3332C5-
D2E
2 2 1 2 - 1 1 1
i7-
6822
EQ
16GB 1 1 - 1 2 No

3 MIC-3332 User Manual
Chapter 1 Hardware Configuration
1.2 Specifications
1.2.1 CompactPCI Bridge
The MIC-3332 uses a Pericom PI7C9X110 universal bridge as a gateway to an intel-
ligent subsystem. When configured as a system controller, the bridge acts as a stan-
dard transparent PCI Express to PCI/PCI-X Bridge. As a peripheral controller it
allows the local MIC-3332 processor to configure and control the onboard local sub-
system independently from the CompactPCI bus host processor. When the MIC-
3332 is in drone mode, the Pericom PI7C9X110 is electrically isolated from the Com-
pactPCI bus, it receives power from the backplane, and supports rear I/O only. The
Pericom PI7C9X110 PCI Bridge offers the following features:
PCI Interface
–Full compliance with the PCI local bus specification, revision 3.0
–Supports 3.3V PCI signaling with 5V I/O tolerance
Supports transparent mode operations.
Supports forward bridging
32-bit, 33MHz asynchronous operation
Provides two-level arbitration support for 7 PCI bus masters
16-bit address decode for VGA
Usable in CompactPCI system slot
Please consult the Pericom PI7C9X110 datasheet for details.
1.2.2 Processor
The MIC-3332 supports the Intel® 6th generation Core™i7 or Xeon® E3 Skylake
processor family with clock frequencies up to 2.8 GHz and a Direct Media Interface
(DMI) up to 8GT/s. Please contact local sales for Xeon/Corei3/i5/Celeron processor
configurations more information.
Table 1.1: Processor Type
Intel CPU
Model
Number
CPU
Architec-
ture
#Cores #Threads Freq. Cache DMI CPU
TDP
Pack-
age
Required
Airflow
I7-6822EQ Skylake
(14nm) 4 8 2.0GHz 8MB 8GT/s 25W FCBGA 30 CFM
I7-6820EQ Skylake
(14nm) 4 8 2.8GHz 8MB 8GT/s 45W FCBGA 30 CFM
XEON E3-
1505M v5
Skylake
(14nm) 4 8 2.8GHz 8MB 8GT/s 45W FCBGA 30 CFM
XEON E3-
1505L v5
Skylake
(14nm) 4 8 2.0GHz 8MB 8GT/s 25W FCBGA 30 CFM
Note! Because power consumption and thermal restrictions, specifications
vary between different CompactPCI systems, please double check
these items before installing a higher speed CPU not listed in the table
above.

MIC-3332 User Manual 4
1.2.3 Chipset
The mobile Intel® CM236 chipset provides excellent flexibility for developers of
embedded applications by offering improved graphics and increased I/O bandwidth
over previous Intel chipsets, which offers up to 8 GT/s for fast access to peripheral
devices. It delivers outstanding system performance through high bandwidth inter-
faces such as PCI Express Gen III, Serial ATA Gen III and Hi-Speed USB 2.0 and
USB 3.0.
1.2.4 Memory
MIC-3332 has up to 16GB onboard soldered DDR4 memory, and ECC support is in
Xeon processor series. Default SKUs are 8GB and 16GB on board, you can check
the ordering information for the difference, or you can contact your local salesperson
for more information.
1.2.5 Ethernet
MIC-3332 is equipped with several high-performance PCI-Express based network
interface controllers which provide full IEEE802.3 compliant 10/100/1000Base-TX
Ethernet interfaces. There are 2 x RJ45 GbE LAN ports on the front 4HP panel, 2 x
RJ45 or 2 x M12 GbE LAN ports on front 8HP XTM-1 panel; 4 x RJ45 or 4 x M12
GbE LAN ports on the front 8HP XTM-2 panel, and another two RTM J2, You can
choose RJ-45 or X-code M12 Ethernet ports based on your requirements. For details
contact with your local salesperson for more information.
Front I/O (RJ45 or M12)
Rear I/O (Rear Transition Module)
1.2.6 Storage Interface
MIC-3332 provides up to 5 SATA III interface. Two SATA interfaces are routed to the
front XTM board with 2.5" SATA connector and CFast socket; for Plus IO SKU, there
are 3 x SATA available for PICMG, for Non Plus IO SKU, there are 2 x SATA available
for RTM. Advantech rear board MIC-3332R1-S1E with 2 x SATA 2.0 interface with
M.2 B key connector (22 x 42mm) is compatible and available, Please contact a
sales representative for more details.
1.2.7 Serial ports
One RJ-45 COM1 port (RS-232/422/485) is provided on the front panel of MIC-3332.
Another COM pin header with RS-232/422/485 is provided on the MIC-3332 8HP
XTM-1 board. If you have problems with a serial device, be sure to check pin assign-
ments in appendix A pin assignments. The IRQ and address range for these ports
are fixed. If disabled port or parameter modification is required, please refer to Chap-
ter 2.
1.2.8 USB Ports
MIC-3332 provides two or three USB 3.0 type A ports on the front panel and up to
two USB2.0 interface for CPCI Conn via J2. The MIC-3332 USB interface complies
with USB Specification R2.0 and R3.0, and is fuse protected. Please contact a sales
representative for more details.
Note! ECC support is optional. Please contact your local sales.

5 MIC-3332 User Manual
Chapter 1 Hardware Configuration
1.2.9 Watchdog Timer
An onboard watchdog timer provides system reset capabilities via software control.
The programmable time interval is from 1 to 255 seconds.
1.2.10 BIOS
BIOS is a dual 16MB SPI flash containing a specific AMI BIOS FW with fail-over
mechanism to meet industrial and embedded system requirements.
1.2.11 I/O Connectivity
For MIC-3332, the front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE
ports, 1 x VGA port and 2 x USB3.0 ports. Front Panel I/O on the 8HP XTM layer has
multiple options: 8HP XTM-1 board provides 1 x RJ45 COM port, 1 x HDMI display
port, 1 x USB 3.0 port, 2 x GbE LAN ports by M12 X-coding or RJ45 connectors; 8HP
XTM-2 Board provides 4 x GbE LAN ports by M12 X-coding or RJ45 connectors.
There are various types of storage on 8HP XTM Board: 1 x 2.5" SATA connector, 1 x
CFast socket, and an additional Micro-SD socket on the 8HP XTM-2 Board.
It can also offer various I/O connectivity by Rear IO extensions and CompactPCI
PlusIO.
1.2.12 Optional Rear I/O Modules
The MIC-3332R1-S1E is the optional RTM (also known as rear I/O module) for the
MIC-3332. It offers a wide variety of I/O features, such as two RJ45 LAN ports, one
VGA port, two USB2.0s shown in the rear panel, and two M.2 with 22*42 size storage
connector. Rear I/O modules are available with following different I/O options:
RTM Connector Connector Type Reserved interface
J2 HM
One VGA
Two PCIe x1
Two LAN
Two SATA 2.0
Two USB 2.0
J2 UHM
Four PCIe x 1
Two LAN
Four USB 2.0
Three SATA III
Table 1.2: MIC-3332R1-S1E Configuration
RTM Model Number
Rear Panel
LAN(RJ45) VGA USB 2.0 M.2 Storage
(22*42 size)
MIC-332R1-S1E 2 1 2 2

MIC-3332 User Manual 6
1.2.13 Optional Extension Modules
MIC-3332 has two kinds of second layer. One 8HP XTM-1 is used for multi-display
applications and also other rich I/O features; Another 8HP XTM-2 is used for multi-
Ethernets applications. XTM connectivity is described in the list below. For a custom-
ized extension module demand, please contact Advantech local sales.
1.2.14 Mechanical and Environmental Specifications
Operating temperature: 0 ~ 55 °C (-32 ~ 131 °F)
Storage Temperature: -40 ~ 85 °C (-40 ~ 185 °F)
Humidity: 95% @ 40 °C (non-condensing)
Humidity (Non-operating): 95% @ 60 °C (non-condensing)
Vibration: 5~100Hz, 2Grms (without on-board 2.5" SATA HDD)
Shock: 10G (without on-board 2.5" SATA HDD)
Board size: 100 x 160 x 40.64 mm (3U size)
Weight:
3U 8HP FIO Board: 0.84 kg
3U 4HP REAR IO Board (MIC-3332R1-S1E): 0.15kg
1.2.15 Compact Mechanical Design
Forced-air cooling in the chassis is recommended for MIC-3332 board to optimize its
system stability and reliability even though there is a special Cu-designed heatsink
assembled in unit already.
1.2.16 Hardware Monitor
For HWM management system in MIC-3332 series, In order to monitor processor
temperature and core voltage information.
NCT7802Y is connected to SMBUS interface.
NCT7902D is optional function on MIC-3332 SKUs with 8HP XTM-1 board based on
customer request, and used for FAN speed monitor and alarms.
NCT5523D also has optional functions on MIC-3332 SKUs with 8HP XTM-1 board
based on customer request.
1.2.17 Super I/O
MIC-3332 Super I/O device can enable or disable serial ports, and you can select the
serial port mode RS232/RS422/RS485 by jumper setting. For the details, please
check item 1.4.
Table 1.3: The Second Layer 8HP XTM Configurations
8HP XTM
IO Panel On-board Header/
Socket/Connector
LAN
(RJ45/M12) COM HDMI USB3.0 SATA Cfast Micro- SD COM
8HP XTM-1 board 2 1 1 1 1 1 0 1
8HP XTM-2 board 4 0 0 0 1 1 1 0
Note! The operating temperature range of the MIC-3332 depends on the
installed processor and the airflow through the chassis.

7 MIC-3332 User Manual
Chapter 1 Hardware Configuration
1.2.18 RTC and Battery
The RTC module keeps the date and time. On the MIC-3332 model the RTC circuitry
is connected to battery sources.
1.3 Functional Block Diagram
Figure 1.1 MIC-3332 functional block diagrams

MIC-3332 User Manual 8
1.4 Jumpers and Switches
For 1xRJ45 COM on 8HP XTM-1 Board, the default COM setting is RS-232. You can
select COM mode by setting jumper as below table.
For 1x COM2 pin header on 8HP XTM-1 board, the default COM setting is also RS-
232, and you can select COM mode by setting jumper as below table.
Figure 1.2 MIC-3332 COM mode setting

9 MIC-3332 User Manual
Chapter 1 Hardware Configuration
1.5 Connector Definitions
Table 1.4 lists the function of each connector and Figure 1.3 and 1.4 illustrates each
connector location.
MIC-3332 series with 8HP(XTM-1) IO functions
MIC-3332 series with 8HP(XTM-2) IO functions
Figure 1.3 MIC-3332 Front Panel Ports, Indicators and Buttons
Table 1.4: MIC-3332 on board connector descriptions (Front IO Board)
Number Function Note
SATA1 SATA HDD daughter board
CFast1 CFast Socket
SD1 Micro-SD Connector
(on MIC-3332 with 8HP XTM-2 board)
J1 Primary CompactPCI Bus
J2 Rear I/O Transition
Table 1.5: MIC-3332 on board connector descriptions (Rear IO Board)
Number Function Note
M2_CN1 M.2 connector
M2_CN2 M.2 connector

MIC-3332 User Manual 10
Figure 1.4 MIC-3332R1-S1E REAR IO Panel Ports and Indicators
1.6 Safety Precautions
Follow these simple precautions to protect yourself from harm and the products from
damage.
To avoid electric shock, always disconnect the power from your CompactPCI
chassis before you work on it. Don't touch any components on the CPU board or
other boards while the CompactPCI chassis is powered.
Disconnect power before making any configuration changes. The sudden rush
of power as you connect a jumper or install a board may damage sensitive elec-
tronic components.
Always ground yourself to remove any static charge before you touch your CPU
board. Be particularly careful not to touch the chip connectors.
Modern integrated electronic devices, especially CPUs and memory chips, are
extremely sensitive to static electric discharges and fields. Keep the board in its
anti-static packaging when it is not installed in the chassis, and place it on a
static dissipative mat when you are working with it. Wear a grounding wrist strap
for continuous protection.