B&R Automation PC 510 User manual

1
Automation PC 510
User's Manual
Version: 1.10 (August 2013)
Model no.: MAAPC510-ENG
All information contained in this manual is current as of its creation/publication. B&R reserves the right to change
the contents of this manual without notice. The information contained herein is believed to be accurate as of
the date of publication; however, Bernecker + Rainer Industrie-Elektronik Ges.m.b.H. makes no warranty, ex-
pressed or implied, with regard to the products or documentation contained within this manual. In addition,
Bernecker + Rainer Industrie-Elektronik Ges.m.b.H. shall not be liable for any incidental or consequential damages
in connection with or arising from the furnishing, performance or use of the product(s) in this documentation. Soft-
ware names, hardware names and trademarks are registered by their respective companies.

2
Chapter 1: General information
Chapter 2: Technical data
Chapter 3: Installation
Chapter 4: Software
Chapter 5: Standards and certifications
Chapter 6: Accessories
Chapter 7: Maintenance and service
Appendix A

Table of contents
Table of contents
Automation PC 510 User's Manual V1.10 3
Chapter 1 General information................................................................................... 9
1 Manual history....................................................................................................................................................9
2 Safety guidelines..............................................................................................................................................10
2.1 Intended use...............................................................................................................................................10
2.2 Protection against electrostatic discharge..................................................................................................10
2.2.1 Packaging..............................................................................................................................................10
2.2.2 Guidelines for proper ESD handling.....................................................................................................10
2.3 Policies and procedures............................................................................................................................. 10
2.4 Transport and storage................................................................................................................................11
2.5 Installation...................................................................................................................................................11
2.6 Operation.................................................................................................................................................... 11
2.6.1 Protection against touching electrical parts..........................................................................................11
2.6.2 Environmental conditions - Dust, humidity, aggressive gases............................................................. 11
2.6.3 Viruses and dangerous programs........................................................................................................ 11
2.7 Environmentally friendly disposal............................................................................................................... 12
2.7.1 Separation of materials.........................................................................................................................12
3 Organization of safety notices......................................................................................................................... 13
4 Guidelines.........................................................................................................................................................13
5 Overview...........................................................................................................................................................14
Chapter 2 Technical data.......................................................................................... 16
1 Introduction.......................................................................................................................................................16
1.1 Features......................................................................................................................................................16
1.2 System components / configuration........................................................................................................... 17
1.2.1 Configuration - Base system................................................................................................................ 17
1.2.2 Configuration - Software and accessories............................................................................................18
2 Complete system............................................................................................................................................. 19
2.1 Temperature specifications.........................................................................................................................19
2.1.1 Temperature monitoring........................................................................................................................19
2.1.2 Temperature sensor locations.............................................................................................................. 19
2.2 Humidity specifications............................................................................................................................... 20
2.3 Power management................................................................................................................................... 21
2.3.1 Supply voltage block diagram...............................................................................................................21
2.4 Device interfaces and slots........................................................................................................................ 22
2.4.1 Overview of device interfaces...............................................................................................................22
2.4.2 +24 VDC supply voltage.......................................................................................................................23
2.4.3 COM1 serial interface........................................................................................................................... 24
2.4.4 Ethernet (ETH)...................................................................................................................................... 24
2.4.5 USB interfaces (USB1, 2).....................................................................................................................25
2.4.6 Battery................................................................................................................................................... 26
2.4.7 CompactFlash slot................................................................................................................................ 27
2.4.8 SD memory card slot............................................................................................................................27
2.4.9 Power button.........................................................................................................................................28
2.4.10 Reset button........................................................................................................................................28
2.4.11 LED status indicators.......................................................................................................................... 29
2.4.12 Interface board slot............................................................................................................................. 30
3 Individual components..................................................................................................................................... 31
3.1 System units............................................................................................................................................... 31
3.1.1 5PC510.SX01-00...................................................................................................................................31
3.2 US15W CPU boards.................................................................................................................................. 36
3.2.1 General information...............................................................................................................................36
3.2.2 Order data.............................................................................................................................................36
3.2.3 Technical data.......................................................................................................................................36
3.3 Main memory..............................................................................................................................................38
3.3.1 Order data.............................................................................................................................................38
3.3.2 Technical data.......................................................................................................................................38
3.4 Interface boards..........................................................................................................................................39

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4 Automation PC 510 User's Manual V1.10
3.4.1 5PP5IF.CETH-00...................................................................................................................................39
3.4.2 5PP5IF.CHDA-00...................................................................................................................................41
3.4.3 5PP5IF.FETH-00................................................................................................................................... 43
3.4.4 5PP5IF.FPLM-00................................................................................................................................... 45
3.4.5 5PP5IF.FCAN-00...................................................................................................................................49
3.4.6 5PP5IF.FX2X-00....................................................................................................................................51
3.4.7 5PP5IF.FXCM-00...................................................................................................................................53
3.5 I/O boards...................................................................................................................................................55
3.5.1 5PP5IO.GMAC-00................................................................................................................................. 55
3.6 Drives..........................................................................................................................................................62
3.6.1 5MMHDD.0250-00.................................................................................................................................62
3.6.2 5MMHDD.0500-00.................................................................................................................................64
3.6.3 5MMSSD.0060-00................................................................................................................................. 66
3.6.4 5MMSSD.0060-01................................................................................................................................. 68
3.6.5 5MMSSD.0128-01................................................................................................................................. 70
3.6.6 5MMSSD.0180-00................................................................................................................................. 72
Chapter 3 Installation.................................................................................................74
1 Installation........................................................................................................................................................ 74
1.1 Procedure................................................................................................................................................... 74
1.2 Important installation information............................................................................................................... 74
1.3 Mounting orientations................................................................................................................................. 75
1.3.1 Mounting orientation 0°.........................................................................................................................75
1.3.2 Mounting orientation 90°.......................................................................................................................75
1.3.3 Mounting orientation 180°.....................................................................................................................76
1.4 Spacing for air circulation...........................................................................................................................77
2 Cable connections............................................................................................................................................78
3 Grounding concept...........................................................................................................................................79
4 General instructions for performing temperature testing................................................................................. 80
4.1 Procedure................................................................................................................................................... 80
4.2 Evaluating temperatures in Windows operating systems.......................................................................... 80
4.2.1 Evaluating with the B&R Control Center.............................................................................................. 80
4.2.2 Evaluating with the BurnInTest tool from Passmark............................................................................ 81
4.3 Evaluating temperatures in operating systems other than Windows......................................................... 83
4.4 Evaluating the measurement results..........................................................................................................83
5 Connection examples.......................................................................................................................................84
5.1 Selecting the display units......................................................................................................................... 84
5.2 One Automation Panel 900 system via onboard DVI................................................................................ 85
5.2.1 Link modules.........................................................................................................................................85
5.2.2 Cables................................................................................................................................................... 85
5.2.3 Possible Automation Panel devices, resolutions and segment lengths................................................86
5.2.4 BIOS settings........................................................................................................................................ 86
5.3 One Automation Panel 900 system via onboard SDL............................................................................... 87
5.3.1 Link modules.........................................................................................................................................87
5.3.2 Cables................................................................................................................................................... 87
5.3.3 BIOS settings........................................................................................................................................ 88
5.4 One Automation Panel 800 system via onboard SDL............................................................................... 89
5.4.1 Cables................................................................................................................................................... 89
5.4.2 BIOS settings........................................................................................................................................ 89
5.5 One AP900 and one AP800 via onboard SDL.......................................................................................... 90
5.5.1 Link modules.........................................................................................................................................90
5.5.2 Cables................................................................................................................................................... 90
5.5.3 BIOS settings........................................................................................................................................ 90
5.6 Four Automation Panel 900 systems via onboard SDL.............................................................................91
5.6.1 Link modules.........................................................................................................................................91
5.6.2 Cables................................................................................................................................................... 91
5.6.3 BIOS settings........................................................................................................................................ 92

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Automation PC 510 User's Manual V1.10 5
6 Connecting peripheral USB devices................................................................................................................93
6.1 Locally on the APC510.............................................................................................................................. 93
6.2 Remote connection to Automation Panel 900 via DVI...............................................................................94
6.3 Remote connection to Automation Panel 800 / 900 via SDL.................................................................... 94
Chapter 4 Software.................................................................................................... 95
1 BIOS options.................................................................................................................................................... 95
1.1 General information.................................................................................................................................... 95
1.2 BIOS Setup and boot procedure................................................................................................................95
1.2.1 BIOS Setup keys.................................................................................................................................. 97
1.3 Main............................................................................................................................................................ 98
1.4 OEM features............................................................................................................................................. 99
1.4.1 CPU board features............................................................................................................................ 100
1.4.2 System unit features........................................................................................................................... 105
1.4.3 I/O board features...............................................................................................................................109
1.4.4 IF board features................................................................................................................................ 114
1.4.5 Memory module features.................................................................................................................... 116
1.5 Advanced.................................................................................................................................................. 117
1.5.1 RAM configuration...............................................................................................................................118
1.5.2 Boot configuration............................................................................................................................... 119
1.5.3 Peripheral configuration...................................................................................................................... 120
1.5.4 IDE configuration.................................................................................................................................121
1.5.5 Video configuration............................................................................................................................. 124
1.5.6 USB configuration............................................................................................................................... 125
1.5.7 SDIO configuration..............................................................................................................................126
1.5.8 ACPI table/features control.................................................................................................................127
1.5.9 PCI Express root port 1......................................................................................................................127
1.5.10 PCI Express root port 2....................................................................................................................130
1.5.11 Console redirection........................................................................................................................... 131
1.6 Security..................................................................................................................................................... 134
1.6.1 Set supervisor password.................................................................................................................... 135
1.6.2 Set user password.............................................................................................................................. 136
1.7 Power........................................................................................................................................................137
1.7.1 Advanced CPU control....................................................................................................................... 138
1.7.2 Platform power management..............................................................................................................141
1.8 Boot...........................................................................................................................................................142
1.8.1 Legacy.................................................................................................................................................143
1.9 Exit............................................................................................................................................................ 147
1.10 BIOS default settings..............................................................................................................................148
1.10.1 Main...................................................................................................................................................148
1.10.2 OEM features.................................................................................................................................... 148
1.10.3 Advanced...........................................................................................................................................150
1.10.4 Power................................................................................................................................................ 152
1.10.5 Boot................................................................................................................................................... 153
1.11 Allocation of resources........................................................................................................................... 154
1.11.1 RAM address assignment................................................................................................................. 154
1.11.2 I/O address assignment.................................................................................................................... 154
1.11.3 Interrupt assignments in PIC mode.................................................................................................. 154
1.11.4 Interrupt assignments in APIC mode................................................................................................155
2 Upgrade information.......................................................................................................................................156
2.1 BIOS upgrade...........................................................................................................................................156
2.1.1 Important information.......................................................................................................................... 156
2.1.2 Using the Control Center.................................................................................................................... 157
2.2 Firmware upgrade.................................................................................................................................... 158
2.2.1 Procedure............................................................................................................................................158
2.3 Upgrade problems.................................................................................................................................... 158
3 Windows XP Professional..............................................................................................................................159

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6 Automation PC 510 User's Manual V1.10
3.1 Order data................................................................................................................................................ 159
3.2 Overview................................................................................................................................................... 159
3.3 Installation.................................................................................................................................................159
3.4 Drivers.......................................................................................................................................................159
4 Windows 7......................................................................................................................................................160
4.1 General information.................................................................................................................................. 160
4.2 Order data................................................................................................................................................ 160
4.3 Overview................................................................................................................................................... 160
4.4 Installation.................................................................................................................................................161
4.5 Drivers.......................................................................................................................................................161
4.6 Special considerations, limitations........................................................................................................... 161
5 Windows Embedded Standard 2009............................................................................................................. 162
5.1 General information.................................................................................................................................. 162
5.2 Order data................................................................................................................................................ 162
5.3 Overview................................................................................................................................................... 162
5.4 Features with WES2009 (Windows Embedded Standard 2009)............................................................. 162
5.5 Touch screen driver..................................................................................................................................163
5.6 Installation.................................................................................................................................................163
5.7 Drivers.......................................................................................................................................................163
5.7.1 Touch screen driver............................................................................................................................ 163
6 Windows Embedded Standard 7................................................................................................................... 164
6.1 General information.................................................................................................................................. 164
6.2 Order data................................................................................................................................................ 164
6.3 Overview................................................................................................................................................... 164
6.4 Features with WES7 (Windows Embedded Standard 7)......................................................................... 164
6.5 Installation.................................................................................................................................................165
6.6 Drivers.......................................................................................................................................................165
6.6.1 Touch screen driver............................................................................................................................ 165
7 Windows CE...................................................................................................................................................166
7.1 General information.................................................................................................................................. 166
7.2 Order data................................................................................................................................................ 166
7.3 Overview................................................................................................................................................... 166
7.4 Windows CE 6.0 features........................................................................................................................ 166
7.5 Requirements............................................................................................................................................167
7.6 Installation.................................................................................................................................................167
7.7 B&R Embedded OS Installer................................................................................................................... 167
8 Automation Runtime.......................................................................................................................................168
8.1 General information.................................................................................................................................. 168
8.2 Order data................................................................................................................................................ 168
8.3 Automation Runtime Windows (ARwin)................................................................................................... 168
8.4 Automation Runtime Embedded (ARemb)...............................................................................................168
9 B&R Automation Device Interface (ADI) - Control Center.............................................................................169
9.1 Functions.................................................................................................................................................. 169
9.2 Installation.................................................................................................................................................170
10 B&R Automation Device Interface (ADI) Development Kit.......................................................................... 171
11 B&R Automation Device Interface (ADI) .NET SDK.................................................................................... 173
12 B&R Key Editor............................................................................................................................................175
Chapter 5 Standards and certifications................................................................. 177
1 Standards and guidelines.............................................................................................................................. 177
1.1 CE mark....................................................................................................................................................177
1.2 EMC directive........................................................................................................................................... 177
1.3 Low voltage directive................................................................................................................................177
2 Certifications...................................................................................................................................................178
2.1 UL certification..........................................................................................................................................178

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Automation PC 510 User's Manual V1.10 7
Chapter 6 Accessories............................................................................................ 179
1 Replacement CMOS batteries....................................................................................................................... 179
1.1 0AC201.91 / 4A0006.00-000....................................................................................................................179
1.1.1 General information.............................................................................................................................179
1.1.2 Order data...........................................................................................................................................179
1.1.3 Technical data.....................................................................................................................................179
2 Power connectors.......................................................................................................................................... 181
2.1 0TB103.9x.................................................................................................................................................181
2.1.1 General information.............................................................................................................................181
2.1.2 Order data...........................................................................................................................................181
2.1.3 Technical data.....................................................................................................................................181
3 Interface board connector..............................................................................................................................182
3.1 0TB1208.3100.......................................................................................................................................... 182
3.1.1 General information.............................................................................................................................182
3.1.2 Order data...........................................................................................................................................182
3.1.3 Technical data.....................................................................................................................................182
4 CompactFlash cards...................................................................................................................................... 183
4.1 General information.................................................................................................................................. 183
4.2 General information.................................................................................................................................. 183
4.2.1 Flash technology................................................................................................................................. 183
4.2.2 Wear leveling...................................................................................................................................... 183
4.2.3 ECC error correction...........................................................................................................................183
4.2.4 S.M.A.R.T. support.............................................................................................................................. 183
4.2.5 Maximum reliability..............................................................................................................................184
4.3 5CFCRD.xxxx-06...................................................................................................................................... 185
4.3.1 General information.............................................................................................................................185
4.3.2 Order data...........................................................................................................................................185
4.3.3 Technical data.....................................................................................................................................185
4.3.4 Temperature humidity diagram...........................................................................................................187
4.3.5 Dimensions..........................................................................................................................................187
4.3.6 Benchmark.......................................................................................................................................... 188
4.4 5CFCRD.xxxx-03...................................................................................................................................... 189
4.4.1 General information.............................................................................................................................189
4.4.2 Order data...........................................................................................................................................189
4.4.3 Technical data.....................................................................................................................................189
4.4.4 Temperature humidity diagram...........................................................................................................191
4.4.5 Dimensions..........................................................................................................................................191
4.5 Known problems/issues............................................................................................................................192
5 USB media drive............................................................................................................................................193
5.1 5MD900.USB2-02.....................................................................................................................................193
5.1.1 General information.............................................................................................................................193
5.1.2 Order data...........................................................................................................................................193
5.1.3 Interfaces.............................................................................................................................................193
5.1.4 Technical data.....................................................................................................................................193
5.1.5 Dimensions..........................................................................................................................................195
5.1.6 Dimensions with front cover............................................................................................................... 195
5.1.7 Cutout installation................................................................................................................................196
5.1.8 Contents of delivery............................................................................................................................ 196
5.1.9 Installation........................................................................................................................................... 196
5.2 5A5003.03.................................................................................................................................................197
5.2.1 General information.............................................................................................................................197
5.2.2 Order data...........................................................................................................................................197
5.2.3 Technical data.....................................................................................................................................197
5.2.4 Dimensions..........................................................................................................................................197
5.2.5 Contents of delivery............................................................................................................................ 197
5.2.6 Installation........................................................................................................................................... 198
6 USB flash drives............................................................................................................................................ 199

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8 Automation PC 510 User's Manual V1.10
6.1 5MMUSB.xxxx-01..................................................................................................................................... 199
6.1.1 General information.............................................................................................................................199
6.1.2 Order data...........................................................................................................................................199
6.1.3 Technical data.....................................................................................................................................199
6.1.4 Temperature humidity diagram...........................................................................................................200
7 Cables............................................................................................................................................................ 201
7.1 DVI cables................................................................................................................................................ 201
7.1.1 5CADVI.0xxx-00.................................................................................................................................. 201
7.2 SDL cables............................................................................................................................................... 204
7.2.1 5CASDL.0xxx-00................................................................................................................................. 204
7.3 SDL cables with 45° male connector.......................................................................................................207
7.3.1 5CASDL.0xxx-01................................................................................................................................. 207
7.4 SDL flex cables........................................................................................................................................ 210
7.4.1 5CASDL.0xxx-03................................................................................................................................. 210
7.5 SDL flex cables with extender................................................................................................................. 213
7.5.1 5CASDL.0xx0-13.................................................................................................................................213
7.6 USB cables...............................................................................................................................................217
7.6.1 5CAUSB.00xx-00................................................................................................................................ 217
7.7 RS232 cables........................................................................................................................................... 218
7.7.1 9A0014.xx.......................................................................................................................................... 218
8 HMI Drivers & Utilities DVD...........................................................................................................................220
8.1 5SWHMI.0000-00..................................................................................................................................... 220
8.1.1 General information.............................................................................................................................220
8.1.2 Order data...........................................................................................................................................220
8.1.3 Contents (V2.10)................................................................................................................................. 220
Chapter 7 Maintenance and service.......................................................................223
1 Changing the battery..................................................................................................................................... 223
1.1 Battery status evaluation.......................................................................................................................... 223
1.2 Procedure................................................................................................................................................. 223
2 Replacing a CompactFlash card................................................................................................................... 225
Appendix A .............................................................................................................. 226
1 Maintenance Controller Extended (MTCX)....................................................................................................226
2 Abbreviations..................................................................................................................................................227
3 Glossary......................................................................................................................................................... 228

General information • Manual history
Chapter 1
General information
Automation PC 510 User's Manual V1.10 9
Chapter 1 • General information
1 Manual history
Version Date Change
0.10 Preliminary 26-Aug-11 •First version
1.00 08-May-12 •Updated Chapter 4 "Software".
•Updated Chapter 7 "Maintenance and service".
•Updated terminal block 0TB1208.3100 (interface board plug) in Chapter 6 "Accessories".
•Added new CompactFlash cards 5CFCRD.xxxx-06 in Chapter 6 "Accessories". Discontinued Compact-
Flash cards 5CFCRD.xxxx-04.
•Updated interface board 5PP5IF.FETH-00 on page 5PP5IF.FETH-00.
•Updated hard disk 5MMHDD.0250-00 on page 5MMHDD.0250-00.
•Updated sections "Temperature specifications" on page 19, "Humidity specifications" on page 20
and "Power management" on page 21 in Chapter 2 "Technical data".
•Updated section "Mounting orientations" on page 75 in Chapter 3 "Installation".
1.01 18-Jun-12 •Updated section "Cable lengths and resolutions for SDL transmission" on page 56.
1.05 10-Apr-13 •Updated section "General instructions for performing temperature testing" on page 80.
•Modified "Organization of safety notices" on page 13, updated descriptions for cautions and warnings.
•Updated Windows 7 Service Pack 1 (see "Windows 7" on page 160).
•Updated Windows Embedded Standard 7 Service Pack 1 (see "Windows Embedded Standard 7" on
page 164).
•Updated "B&R Automation Device Interface (ADI) - Control Center" on page 169.
•Updated "B&R Automation Device Interface (ADI) Development Kit" on page 171 to version 3.40.
•Updated "B&R Automation Device Interface (ADI) .NET SDK" on page 173 to version 1.80.
•Updated "B&R Key Editor" on page 175 to version 3.30.
•Updated technical data for CPU boards, see "US15W CPU boards" on page 36.
•Updated section "Maintenance Controller Extended (MTCX)" on page 226.
•CompactFlash card 5CFCRD.032G-06 updated, see "5CFCRD.xxxx-06" on page 185.
•Updated drives "5MMHDD.0500-00" on page 64, "5MMSSD.0060-00" on page 66 and
"5MMSSD.0180-00" on page 72.
•Added "USB media drive" on page 193.
•Revised general information and technical data for I/O board "5PP5IO.GMAC-00" on page 55.
•Added "Connection examples" on page 84.
•Added section "HMI Drivers & Utilities DVD" on page 220.
•Updated all technical data.
1.10 14-Aug-13 •Updated B&R USB flash drive 5MMUSB.4096-01, see "USB flash drives" on page 199.
•Updated the slide-in compact drives "5MMSSD.0060-01" on page 68 and "5MMSSD.0128-01" on page
70.
•Updated tightening torque of locating screws in section "Cables" on page 201.
•Updated sections "B&R Automation Device Interface (ADI) Development Kit" on page 171 and "B&R
Automation Device Interface (ADI) .NET SDK" on page 173.

General information • Safety guidelines
10 Automation PC 510 User's Manual V1.10
2 Safety guidelines
2.1 Intended use
Programmable logic controllers (PLCs), operating/monitoring devices (industrial PCs, Power Panels, Mobile Pan-
els, etc.), and B&R uninterruptible power supplies have been designed, developed, and manufactured for conven-
tional use in industrial environments. They were not designed, developed and manufactured for any use involving
serious risks or hazards that could lead to death, injury, serious physical damage or loss of any kind without the
implementation of exceptionally stringent safety precautions. In particular, such risks and hazards include the use
of these devices to monitor nuclear reactions in nuclear power plants, their use in flight control or flight safety sys-
tems as well as in the control of mass transportation systems, medical life support systems or weapons systems.
2.2 Protection against electrostatic discharge
Electrical components that can be damaged by electrostatic discharge (ESD) must be handled accordingly.
2.2.1 Packaging
•Electrical components with a housing
...Do not require special ESD packaging but must be handled properly (see "Electrical components with
a housing").
•Electrical components without a housing
…Must be protected by ESD-suitable packaging.
2.2.2 Guidelines for proper ESD handling
Electrical components with a housing
•Do not touch the connector contacts on connected cables.
•Do not touch the contact tips on circuit boards.
Electrical components without a housing
The following applies in addition to the points listed under "Electrical components with a housing":
•Any persons handling electrical components or devices with installed electrical components must be
grounded.
•Components may only be touched on their narrow sides or front plate.
•Components should always be stored in a suitable medium (ESD packaging, conductive foam, etc.). Metal-
lic surfaces are not suitable storage surfaces!
•Components should not be subjected to electrostatic discharge (e.g. through the use of charged plastics).
•Ensure a minimum distance of 10 cm from monitors and TV sets.
•Measurement devices and equipment must be grounded.
•Measurement probes on potential-free measurement devices must be discharged on sufficiently grounded
surfaces before taking measurements.
Individual components
•ESD protective measures for individual components are thoroughly integrated at B&R (conductive floors,
footwear, arm bands, etc.).
•These increased ESD protective measures for individual components are not necessary for customers
handling B&R products.
2.3 Policies and procedures
Electronic devices are never completely failsafe. If the programmable control system, operating/monitoring device
or uninterruptible power supply fails, the user is responsible for ensuring that other connected devices, e.g. motors,
are brought to a secure state.

General information • Safety guidelines
Chapter 1
General information
Automation PC 510 User's Manual V1.10 11
When using programmable logic controllers or operating/monitoring devices as control systems together with a Soft
PLC (e.g. B&R Automation Runtime or comparable product) or Slot PLC (e.g. B&R LS251 or comparable product),
safety precautions relevant to industrial control systems (e.g. the provision of safety devices such as emergency
stop circuits, etc.) must be observed in accordance with applicable national and international regulations. The same
applies for all other devices connected to the system, such as drives.
All tasks such as the installation, commissioning and servicing of devices are only permitted to be carried out by
qualified personnel. Qualified personnel are those familiar with the transport, mounting, installation, commissioning
and operation of devices who also have the appropriate qualifications (e.g. IEC 60364). National accident preven-
tion regulations must be observed.
The safety notices, connection descriptions (type plate and documentation) and limit values listed in the technical
data are to be read carefully before installation and commissioning and must be observed.
2.4 Transport and storage
During transport and storage, devices must be protected against undue stress (mechanical loads, temperature,
humidity, aggressive atmospheres, etc.).
2.5 Installation
•Installation must be performed according to this documentation using suitable equipment and tools.
•Devices may only be installed by qualified personnel without voltage applied. Before installation, voltage
to the control cabinet must be switched off and prevented from being switched on again.
•General safety guidelines and national accident prevention regulations must be observed.
•Electrical installation must be carried out according to applicable guidelines (e.g. line cross sections, fuses,
protective ground connections).
2.6 Operation
2.6.1 Protection against touching electrical parts
To operate programmable logic controllers, operating/monitoring devices or uninterruptible power supplies, it is
necessary for certain parts to carry dangerous voltage levels over 42 VDC. Touching one of these parts can result
in a life-threatening electric shock. This could lead to death, severe injury or damage to equipment.
Before turning on the programmable logic controller, operating/monitoring devices or the uninterruptible power
supply, the housing must be properly grounded (PE rail). Ground connections must be established even when
testing or operating operating/monitoring devices or the uninterruptible power supply for a short time!
Before turning the device on, all parts that carry voltage must be securely covered. During operation, all covers
must remain closed.
2.6.2 Environmental conditions - Dust, humidity, aggressive gases
The use of operating/monitoring devices (e.g. industrial PCs, Power Panels, Mobile Panels, etc.) and uninterruptible
power supplies in very dusty environments should be avoided. Dust collection on the devices can affect functionality
and may prevent sufficient cooling, especially in systems with active cooling systems (fans).
The presence of aggressive gases can also lead to malfunctions. When combined with high temperature and
humidity, aggressive gases – e.g. with sulfur, nitrogen and chlorine components – can induce chemical reactions
that can damage electronic components very quickly. Signs of the presence of aggressive gases are blackened
copper surfaces and cable ends on existing equipment.
For operation in dusty or humid conditions, correctly installed (e.g. cutout installations) operating/monitoring devices
like the Automation Panel or Power Panel are protected on the front. The back of all devices must be protected
from dust and humidity and cleaned at suitable intervals.
2.6.3 Viruses and dangerous programs
This system is subject to potential risk each time data is exchanged or software is installed from a data medium
(e.g. diskette, CD-ROM, USB flash drive, etc.), a network connection or the Internet. The user is responsible for
assessing these dangers, implementing preventive measures such as virus protection programs, firewalls, etc. and
making sure that software is only obtained from trusted sources.

General information • Safety guidelines
12 Automation PC 510 User's Manual V1.10
2.7 Environmentally friendly disposal
All B&R programmable controllers, operating/monitoring devices and uninterruptible power supplies are designed
to inflict as little harm as possible on the environment.
2.7.1 Separation of materials
It is necessary to separate different materials so the device can undergo an environmentally friendly recycling
process.
Component Disposal
Programmable logic controllers
Operating/monitoring devices
Uninterruptible power supply
Batteries and rechargeable batteries
Cables
Electronics recycling
Cardboard box / paper packaging Paper / cardboard recycling
Plastic packaging Plastic recycling
Table 1: Environmentally friendly separation of materials
Disposal must comply with applicable legal regulations.

General information • Guidelines
Chapter 1
General information
Automation PC 510 User's Manual V1.10 13
3 Organization of safety notices
Safety notices in this manual are organized as follows:
Safety notice Description
Danger! Disregarding these safety guidelines and notices can be life-threatening.
Warning! Disregarding these safety guidelines and notices can result in severe injury or substantial damage to equipment.
Caution! Disregarding these safety guidelines and notices can result in injury or damage to equipment.
Information: This information is important for preventing errors.
Table 2: Description of the safety notices used in this documentation
4 Guidelines
E
European dimension standards apply to all dimension diagrams in this document.
All dimensions are specified in mm.
Range of nominal sizes General tolerance according to
DIN ISO 2768 (medium)
Up to 6 mm ± 0.1 mm
For 6 to 30 mm ± 0.2 mm
For 30 to 120 mm ± 0.3 mm
For 120 to 400 mm ± 0.5 mm
For 400 to 1000 mm ± 0.8 mm
Table 3: Range of nominal sizes

General information • Overview
14 Automation PC 510 User's Manual V1.10
5 Overview
Product ID Short description on page
Automation Runtime
1A4600.10-5 B&R Automation Runtime ARwin, including license sticker 168
1A4601.06-5 B&R Automation Runtime ARemb, including license sticker 168
1A4601.06-T B&R Automation Runtime ARemb Terminal, including license sticker 168
Batteries
0AC201.91 Lithium batteries 4 pcs., 3 V / 950 mAh button cell We hereby state that the lithium cells contained in this shipment
qualify as "partly regulated". Handle with care. If the package is damaged, inspect the cells, repack intact cells
and protect the cells against short circuit. For emergency information, call RENATA SA at [phone].
179
4A0006.00-000 Lithium battery, 3 V / 950 mAh, button cell 179
CPU boards
5PP5CP.US15-00 Intel Atom Z510 CPU board, 1100 MHz, single core, 400 MHz FSB, 512 kB L2 cache; US15W chipset; 1 slot
for SO-DIMM DDR2 module
36
5PP5CP.US15-01 Intel Atom Z520 CPU board, 1330 MHz, single core, 533 MHz FSB, 512 kB L2 cache; US15W chipset; 1 slot
for SO-DIMM DDR2 module
36
5PP5CP.US15-02 Intel Atom Z530 CPU board, 1600 MHz, single core, 533 MHz FSB, 512 kB L2 cache; US15W chipset; 1 slot
for SO-DIMM DDR2 module
36
CompactFlash
5CFCRD.0064-03 CompactFlash 64 MB Western Digital (SLC) 189
5CFCRD.0128-03 CompactFlash 128 MB Western Digital (SLC) 189
5CFCRD.016G-06 CompactFlash 16 GB B&R (SLC) 185
5CFCRD.0256-03 CompactFlash 256 MB Western Digital (SLC) 189
5CFCRD.032G-06 CompactFlash 32 GB B&R (SLC) 185
5CFCRD.0512-03 CompactFlash 512 MB Western Digital (SLC) 189
5CFCRD.0512-06 CompactFlash 512 MB B&R (SLC) 185
5CFCRD.1024-03 CompactFlash 1 GB Western Digital (SLC) 189
5CFCRD.1024-06 CompactFlash 1 GB B&R (SLC) 185
5CFCRD.2048-03 CompactFlash 2 GB Western Digital (SLC) 189
5CFCRD.2048-06 CompactFlash 2 GB B&R (SLC) 185
5CFCRD.4096-03 CompactFlash 4 GB Western Digital (SLC) 189
5CFCRD.4096-06 CompactFlash 4 GB B&R (SLC) 185
5CFCRD.8192-03 CompactFlash 8 GB Western Digital (SLC) 189
5CFCRD.8192-06 CompactFlash 8 GB B&R (SLC) 185
DVI cable
5CADVI.0018-00 DVI-D cable, 1.8 m 201
5CADVI.0050-00 DVI-D cable, 5 m 201
5CADVI.0100-00 DVI-D cable, 10 m 201
Drives
5MMHDD.0250-00 250 GB SATA hard disk; replacement for 5AC801.HDDI-03 and 5ACPCI.RAIC-05; note: please see the manual
for information about using this hard disk
62
5MMHDD.0500-00 500 GB SATA hard disk; replacement for 5AC801.HDDI-04, 5AC901.CHDD-01 and 5ACPCI.RAIC-06; note:
please see the manual for information about using this hard disk
64
5MMSSD.0060-00 60 GB SATA SSD (MLC); replacement for 5AC801.SSDI-01 and 5AC901.CSSD-01; SSD for
5PP5IO.GMAC-00; note: please see the manual for information about using this SSD
66
5MMSSD.0060-01 60 GB SATA SSD (MLC); replacement for 5AC801.SSDI-03 and 5AC901.CSSD-03; SSD for
5PP5IO.GMAC-00; note: please see the manual for information about using this SSD
68
5MMSSD.0128-01 128 GB SATA SSD (MLC); replacement for 5AC801.SSDI-04 and 5AC901.CSSD-04; SSD for
5PP5IO.GMAC-00; note: please see the manual for information about using this SSD
70
5MMSSD.0180-00 180 GB SATA SSD (MLC); replacement part for 5AC801.SSDI-02 and 5AC901.CSSD-02; SSD for
5PP5IO.GMAC-00; note: please see the manual for information about using this SSD
72
I/O board
5PP5IO.GMAC-00 APC510 I/O board; connections for 2x USB 2.0, 1x RS232/422/485, HDA sound, Smart Display Link/DVI-D;
optional hard disk
55
Interface boards
5PP5IF.CETH-00 PP500 interface board; connection for 1x Ethernet 10/100/1000 39
5PP5IF.CHDA-00 PP500 interface board; connection for 1x MIC, 1x Line IN, 1x Line OUT 41
5PP5IF.FCAN-00 PP500 interface board; connection for 1x CAN master, 512 kB SRAM; order connector separately (cage clamp
0TB1208.3100)
49
5PP5IF.FETH-00 PP500 interface board; connection for 1x Ethernet 10/100/1000, 512 kB SRAM 43
5PP5IF.FPLM-00 PP500 interface board; connections for 2x POWERLINK (with integrated hub); 512 kB SRAM 45
5PP5IF.FX2X-00 PP500 interface board; connection for 1x X2X master, 512 kB SRAM; order connector separately (cage clamp
0TB1208.3100)
51
5PP5IF.FXCM-00 PP500 interface board; connection for 1x CAN master, 1x X2X master, 512 kB SRAM; order connector sepa-
rately (cage clamp 0TB1208.3100)
53
Main memory
5MMDDR.0512-01 SO-DIMM DDR2 RAM 512 MB PC2-5300 38
5MMDDR.1024-01 SO-DIMM DDR2 RAM 1024 MB PC2-5300 38
5MMDDR.2048-01 SO-DIMM DDR2 RAM 2048 MB PC2-5300 38
Other
5SWHMI.0000-00 HMI Drivers & Utilities DVD 220
RS232 cable
9A0014.02 RS232 extension cable for remote operation of a display unit with touch screen, 1.8 m 218
9A0014.05 RS232 extension cable for remote operation of a display unit with touch screen, 5 m 218
9A0014.10 RS232 extension cable for remote operation of a display unit with touch screen, 10 m 218

General information • Overview
Chapter 1
General information
Automation PC 510 User's Manual V1.10 15
Product ID Short description on page
SDL cable - 45° connector
5CASDL.0018-01 SDL cable with 45° male connector, 1.8 m 207
5CASDL.0050-01 SDL cable with 45° male connector, 5 m 207
5CASDL.0100-01 SDL cable with 45° male connector, 10 m 207
5CASDL.0150-01 SDL cable with 45° male connector, 15 m 207
SDL cables
5CASDL.0018-00 SDL cable, 1.8 m 204
5CASDL.0050-00 SDL cable, 5 m 204
5CASDL.0100-00 SDL cable, 10 m 204
5CASDL.0150-00 SDL cable, 15 m 204
5CASDL.0200-00 SDL cable, 20 m 204
5CASDL.0250-00 SDL cable, 25 m 204
5CASDL.0300-00 SDL cable, 30 m 204
SDL flex cable
5CASDL.0018-03 SDL flex cable, 1.8 m 210
5CASDL.0050-03 SDL flex cable, 5 m 210
5CASDL.0100-03 SDL flex cable, 10 m 210
5CASDL.0150-03 SDL flex cable, 15 m 210
5CASDL.0200-03 SDL flex cable, 20 m 210
5CASDL.0250-03 SDL flex cable, 25 m 210
5CASDL.0300-03 SDL flex cable, 30 m 210
5CASDL.0300-13 SDL flex cable with extender, 30 m 213
5CASDL.0400-13 SDL flex cable with extender, 40 m 213
5CASDL.0430-13 SDL flex cable with extender, 43 m 213
System units
5PC510.SX01-00 APC510 system unit, connections for 1x RS232, 2x USB 2.0, 1x Ethernet 10/100/1000; can be expanded with
interface board; order I/O board (5PP5IO.GMAC-00) and 24 VDC connector for supply voltage separately (screw
clamp: 0TB103.9; cage clamp: 0TB103.91)
31
Terminal blocks
0TB103.9 Connector, 24 VDC, 3-pin female, 3.31 mm² screw clamp, protected against vibration by the screw flange 181
0TB103.91 Connector, 24 VDC, 3-pin female, 3.31 mm² cage clamp, protected against vibration by the screw flange 181
0TB1208.3100 Connector, 8-pin cage clamp, 1 mm², protected against vibration by the screw flange 182
USB accessories
5A5003.03 Front cover, for remote CD-ROM drive 5A5003.02 and USB 2.0 drive combination 5MD900.USB2-00,
5MD900.USB2-01 and 5MD900.USB2-02
197
5MD900.USB2-02 USB 2.0 drive combination, consists of DVD-R/RW DVD+R/RW, CompactFlash slot (Type II), USB connection
(Type A on the front, Type B on the back); 24V DC (order screw clamp terminal 0TB103.9 or cage clamp terminal
0TB103.91 separately)
193
5MMUSB.2048-01 USB 2.0 flash drive, 2048 MB, B&R 199
5MMUSB.4096-01 USB 2.0 flash drive, 4096 MB, B&R 199
USB cable
5CAUSB.0018-00 USB 2.0 connection cable type A - type B, 1.8 m 217
5CAUSB.0050-00 USB 2.0 connection cable type A - type B, 5 m 217
Windows 7 Professional/Ultimate
5SWWI7.0100-ENG Microsoft OEM Windows 7 Professional 32-bit, DVD, English. Only available with a new device. 160
5SWWI7.0100-GER Microsoft OEM Windows 7 Professional 32-bit, DVD, German. Only available with a new device. 160
5SWWI7.0300-MUL Microsoft OEM Windows 7 Ultimate 32-bit, DVD, multilingual. Only available with a new device. 160
5SWWI7.1100-ENG Microsoft OEM Windows 7 Professional 32-bit, Service Pack 1, DVD, English. Only available with a new device. 160
5SWWI7.1100-GER Microsoft OEM Windows 7 Professional 32-bit, Service Pack 1, DVD, German. Only available with a new device. 160
5SWWI7.1300-MUL Microsoft OEM Windows 7 Ultimate 32-bit, Service Pack 1, DVD, multilingual. Only available with a new device. 160
Windows CE 6.0
5SWWCE.0837-ENG Microsoft OEM Windows CE 6.0 Professional, English; for APC510; order CompactFlash separately (at least
128 MB)
166
Windows Embedded Standard 2009
5SWWXP.0737-ENG Microsoft OEM Windows Embedded Standard 2009, English; for APC510; order CompactFlash separately (at
least 1 GB)
162
Windows Embedded Standard 7
5SWWI7.0537-ENG Microsoft OEM Windows Embedded Standard 7 32-bit, English; for APC510; order CompactFlash separately
(at least 8 GB)
164
5SWWI7.0737-MUL Microsoft OEM Windows Embedded Standard 7 Premium 32-bit, multilingual; for APC510; order CompactFlash
separately (at least 8 GB)
164
5SWWI7.1537-ENG Microsoft OEM Windows Embedded Standard 7 32-bit, Service Pack 1, English; for APC510; order Compact-
Flash separately (at least 16 GB)
164
5SWWI7.1737-MUL Microsoft OEM Windows Embedded Standard 7 Premium 32-bit, Service Pack 1, multilingual; for APC510;
order CompactFlash separately (at least 16 GB)
164
Windows XP Professional
5SWWXP.0600-ENG Microsoft OEM Windows XP Professional Service Pack 3, CD, English. Only available with a new device. 159
5SWWXP.0600-GER Microsoft OEM Windows XP Professional Service Pack 3, CD, German. Only available with a new device. 159
5SWWXP.0600-MUL Microsoft OEM Windows XP Professional Service Pack 3, CD, multilingual. Only available with a new device. 159

Technical data • Introduction
16 Automation PC 510 User's Manual V1.10
Chapter 2 • Technical data
1 Introduction
The APC510 and APC511 are the first choices when it comes to running applications where good performance
needs to be combined with particularly compact dimensions. These devices are based on Intel Atom processors,
which are optimized for minimum power dissipation. In the consumer area, this means extended battery life for
laptops; for usage in industrial environments, however, the strength of Atom processors lies in their ability to reach
the upper end of the temperature scale without requiring the use of fans. B&R is able to draw on many years of
experience in the area of heat balancing, which makes it possible to operate even selected Core2 Duo processors
without fans. The most important factor considered when designing the APC510 and APC511 was keeping their
dimensions to an absolute minimum, and this meant doing away with the space normally taken up by fans. Another
factor that contributes to their compact design is the absence of slots for PCI and PCI Express cards, as well as for
standard drives such as CD/DVD-ROM. Despite this, however, these Automation PCs are not limited at all in terms
of modularity and flexibility. Gigabit Ethernet, USB 2.0 and serial interfaces are all part of the standard package,
along with sound output (HD audio) and a removable CompactFlash card.
The APC510 builds on the proven design of the Automation PC series. Its compact dimensions and minimal foot-
print mean that it requires very little space in the control cabinet. A CompactFlash slot, the CMOS battery and the
power/reset buttons are all located behind the front cover – easily accessible to the user.
1.1 Features
•Intel® Atom™ Z510, Z520 or Z530 processor
•Up to 2 GB SDRAM
•2x USB 2.0
•1x RS232
•1x Ethernet 10/100/1000 Mbit/s
•Optional interface boards
•1 CompactFlash slot (type I)
•24 VDC supply voltage
•Operation without a fan or heat sink
•BIOS (Insyde)
•Real-time clock (RTC, battery-backed)

Technical data • Introduction
Chapter 2
Technical data
Automation PC 510 User's Manual V1.10 17
1.2 System components / configuration
The APC510 system can be assembled to meet individual requirements and operating conditions.
The following components are absolutely essential for operation:
•System unit
•CPU board
•Main memory
•I/O board
•Drive (mass storage device such as CompactFlash card) for the operating system
•Power connector (terminal block)
1.2.1 Configuration - Base system
CPU board
Select 1
Select 1
System unit
Configuration - Base system
CPU board - Main memory
Main memory
A system unit consists
of a housing and mainboard.
5PP5CP.US15-00 - 1100 MHz
5PP5CP.US15-01 - 1330 MHz
5PP5CP.US15-02 - 1600 MHz
5MMDDR.0512-01
5MMDDR.1024-01
5MMDDR.2048-01
5PC510.SX01-00
I/O board Select 1
5PP5IO.GMAC-00
Figure 1: Configuration - Base system

Technical data • Introduction
18 Automation PC 510 User's Manual V1.10
1.2.2 Configuration - Software and accessories
O p t i o n a l d r i ve s
S e l e ct 1
S yst e m u n i t
5 P P 5 I F . C E T H - 0 0 - 1 x E T H 1 0 / 1 0 0 / 1 0 0
5 P P 5 I F . C H D A - 0 0 - 1 x H D A so u n d
5 P P 5 I F . F P L M - 0 0 - 2 x P O W E R L I N K , S R A M
5 P P 5 I F . F E T H - 0 0 - 1 x E T H 1 0 / 1 0 0 / 1 0 0 , S R A M
5 P P 5 I F . F C A N - 0 0 - 1 x C A N , S R A M
5 P P 5 I F . F X 2 X - 0 0 - 1 x X 2 X , S R A M
5 P P 5 I F . F X C M - 0 0 - 1 x C A N , 1 x X 2 X , S R A M
C o m p a ct F l a sh
S e l e ct 1
S e l e ct 1
U S B a cce sso r i e s
5 C F C R D . 0 5 1 2 - 0 6
5 C F C R D . 1 0 2 4 - 0 6
5 C F C R D . 2 0 4 8 - 0 6
5 M M U S B . 2 0 4 8 - 0 1
5 M M U S B . 4 0 9 6 - 0 1
S o f t w a r e
S e l e ct 1
T e r m i n a l b l o cks
5 S W W I 7 . 1 1 0 0 - E N G
5 S W W I 7 . 1 1 0 0 - G E R
5 S W W I 7 . 1 3 0 0 - M U L
W i n d o w s 7
W i n d o w s X P
5 S W W X P . 0 6 0 0 - E N G
5 S W W X P . 0 6 0 0 - G E R
5 S W W X P . 0 6 0 0 - M U L
A s y s t e m u n i t c o n s i s t s
o f a h o u s i n g a n d m a i n b o a r d .
5 C F C R D . 4 0 9 6 - 0 6
5 C F C R D . 8 1 9 2 - 0 6
5 C F C R D . 0 1 6 G - 0 6
5 C F C R D . 0 3 2 G - 0 6
I n t e r f a ce b o a r d
S e l e ct 1
A u t o m a t i o n R u n t i m e
1 A 4 6 0 0 . 1 0 - 5
1 A 4 6 0 1 . 0 6 - 5
1 A 4 6 0 1 . 0 6 - T
C o n f i g u r a t i o n - S o f t w a r e a n d a cce sso r i e s
5 P C 5 1 0 . S X 0 1 - 0 0
S e l e ct 1 e a ch
0 T B 1 0 3 . 9
0 T B 1 0 3 . 9 1
P o w e r c o n n e c t o r s
0 T B 1 2 0 8 . 3 1 0 0
I n t e r f a c e b o a r d c o n n e c t o r
5 S W W I 7 . 1 5 3 7 - E N G
5 S W W I 7 . 1 7 3 7 - M U L
W i n d o w s E m b e d d e d S t a n d a r d 7
W i n d o w s E m b e d d e d S t a n d a r d 2 0 0 9
5 S W W X P . 0 7 3 7 - E N G
W i n d o w s C E 6 . 0
5 S W W C E . 0 8 3 7 - E N G
5 M M S S D . 0 0 6 0 - 0 0 - S A T A - S S D 6 0 G B
5 M M S S D . 0 0 6 0 - 0 1 - S A T A - S S D 6 0 G B
5 M M S S D . 0 1 2 8 - 0 1 - S A T A S S D 1 2 8 G B
5 M M S S D . 0 1 8 0 - 0 0 - S A T A - S S D 1 8 0 G B
5 M M H D D . 0 2 5 0 - 0 0 - S A T A - H D D 2 5 0 G B
5 M M H D D . 0 5 0 0 - 0 0 - S A T A - H D D 5 0 0 G B
Figure 2: Configuration - Software and accessories

Technical data • Complete system
Chapter 2
Technical data
Automation PC 510 User's Manual V1.10 19
2 Complete system
2.1 Temperature specifications
Temperature specifications must take both the permissible temperature range of the system unit as well as that
of the installed components into consideration. The latter can be found in the technical data for the individual
components.
The permissible temperature ranges based on the type of installation must also be taken into consideration. For
more information about this, refer to section "Mounting orientations" on page 75.
Information regarding worst-case conditions
•Thermal Analysis Tool (TAT V2.02) from Intel for simulating a 100% processor load
•BurnInTest tool (BurnInTest V4.0 Pro from Passmark Software) for simulating a 100% load on the interface
via loop back adapters (serial interfaces, USB ports)
•Maximum system expansion and power consumption
2.1.1 Temperature monitoring
Sensors monitor temperature values at various places inside the APC510 (CPU, interfaces, interface board, I/O
board). The location of these temperature sensors is illustrated in "Figure 3: Temperature sensor locations" on page
19. The values listed in the table represent the defined maximum temperature1) for the respective measurement
point. An alarm is not triggered if this temperature is exceeded. These temperatures can be read in BIOS or in
approved Microsoft Windows operating systems together with Automation Runtime and the B&R Control Center.
2.1.2 Temperature sensor locations
Sensors monitor temperature values at various locations (USB ports, main memory) inside the APC510. These
temperatures2) can be read in Microsoft Windows operating systems using the B&R Control Center3) or in Automa-
tion Runtime using data points in Automation Studio.
For applications that don't use Windows, the temperatures can be evaluated using the B&R implementation guide.
In addition to the implementation guide, there are also programs available in MS-DOS.
Figure 3: Temperature sensor locations
Position Measurement point for Measurement Max. specified
A CPU Ambient temperature of the processor (sensor integrated in the processor) 100°C:
5PP5CP.US15-00,
5PP5CP.US15-01
90°C: 5PP5CP.US15-02
A Main memory Ambient temperature of the main memory (sensor integrated in the processor) 80°C
B Interfaces Temperature of the interfaces (sensor integrated next to the USB ports) 80°C
Interface board Temperature of an interface board (sensor integrated on the interface board) Board-dependent
I/O board Temperature of an I/O board (sensor integrated on the I/O board) Board-dependent
Table 4: Temperature sensor locations
1) The temperature measured approximates the immediate ambient temperature but may also be influenced by neighboring components.
2) The temperature measured approximates the immediate ambient temperature but may also be influenced by neighboring components.
3) The B&R Control Center is included in the ADI driver, which is available in the Downloads section of the B&R website (www.br-automation.com).

Technical data • Complete system
20 Automation PC 510 User's Manual V1.10
2.2 Humidity specifications
The following table lists the minimum and maximum relative humidity values for the individual components that
are relevant for the humidity limitations of a complete system. The lowest and highest common values are always
used when establishing these limits.
Component Operation1) Storage / Transport1)
System units 5 to 90% 5 to 95%
US15W CPU boards 5 to 90% 5 to 95%
Main memory for CPU boards 10 to 90% 5 to 95%
5PP5IF.CETH-00 5 to 90% 5 to 95%
5PP5IF.CHDA-00 5 to 90% 5 to 95%
5PP5IF.FETH-00 5 to 90% 5 to 95%
5PP5IF.FPLM-00 5 to 90% 5 to 95%
5PP5IF.FCAN-00 5 to 90% 5 to 95%
5PP5IF.FETH-00 5 to 90% 5 to 95%
5PP5IF.FX2X-00 5 to 90% 5 to 95%
Interface boards
5PP5IF.FXCM-00 5 to 90% 5 to 95%
I/O boards 5PP5IO.GMAC-00 5 to 90% 5 to 95%
5MMHDD.0250-00 5 to 95% 5 to 95%
5MMHDD.0500-00 5 to 95% 5 to 95%
5MMSSD.0060-00 5 to 95% 5 to 95%
5MMSSD.0060-01 8 to 95% 8 to 95%
5MMSSD.0128-01 8 to 95% 8 to 95%
Drives
5MMSSD.0180-00 5 to 95% 5 to 95%
5CFCRD.xxxx-06 CompactFlash cards 85% 85%
5CFCRD.xxxx-04 CompactFlash cards 85% 85%
5CFCRD.xxxx-03 CompactFlash cards 8 to 95% 8 to 95%
5MMUSB.2048-01 flash drive 10 to 90% 5 to 90%
Accessories
5MMUSB.4096-01 flash drive 85% 85%
Table 5: Overview of humidity specifications for individual components
1) Specifications correspond to non-condensing relative humidity.
The specifications listed correspond to the relative humidity at an ambient temperature of 30°C. More detailed
information about specific temperature-dependent humidity values can be found in the technical data for the indi-
vidual components.