Fibocom H330SS Instructions for use

H330SS LGA Module
Hardware User Manual
Version: V1.0.0
Date: 2013-05-14

H330SS LGA Module Hardware User Manual Page 2 of 38
Confidential Material
This document contains information highly confidential to Fibocom Wireless Inc. (Fibocom). Fibocom offers this
information as a service to its customers, to support application and engineering efforts that use the products
designed by Fibocom. The information provided is based upon requirements specifically provided to Fibocom
by the customers. All specifications supplied herein are subject to change. Disclosure of this information to
other parties is prohibited without the written consent of Fibocom.
Copyright
Copy, Reproduce, Distribute and/or Edit of this document or part of it as well as utilization of its contents and
communication thereof to others without express authorization are prohibited. Offenders will be held liable for
payment of damages. All rights created by patent grant or registration of a utility model or design patent are
reserved. Copyright ©2013 Fibocom Wireless Inc. All rights reserved.
Trademarks Notice
The FIBOCOM Logo is registered by Fibocom Wireless Inc. All other product or service names or logos are the
property of their respective owners. Copyright ©2013 Fibocom Wireless Inc. All rights reserved.
Revision History
Version
Date
Remarks
V1.0.0 2013-05-14 Initial Version

H330SS LGA Module Hardware User Manual Page 3 of 38
Contents
1Preface..................................................................................................................................................................................................... 5
1.1 Scope......................................................................................................................................................................................... 5
1.2 Standards................................................................................................................................................................................. 5
2Introduction .......................................................................................................................................................................................... 6
2.1 Description.............................................................................................................................................................................. 6
2.2 Specifications ......................................................................................................................................................................... 6
2.3 Appearance............................................................................................................................................................................. 8
3Mechanical............................................................................................................................................................................................. 9
3.1 Dimensions ............................................................................................................................................................................. 9
3.2 PCB Layout Design ............................................................................................................................................................... 9
4Hardware Overview..........................................................................................................................................................................10
4.1 Block Diagram......................................................................................................................................................................10
4.2 Pin Definition........................................................................................................................................................................11
4.2.1 Pin Map.........................................................................................................................................................................11
4.2.2 Pin Description...........................................................................................................................................................11
5Hardware Interface ...........................................................................................................................................................................17
5.1 Power Interface....................................................................................................................................................................17
5.1.1 VBAT ...............................................................................................................................................................................17
5.1.2 Power Consumption................................................................................................................................................17
5.1.3 VIO ..................................................................................................................................................................................21
5.1.4 VRTC...............................................................................................................................................................................21
5.2 ON/OFF and Reset..............................................................................................................................................................22
5.2.1 Pin Definition..............................................................................................................................................................22
5.2.2 Power ON Signal........................................................................................................................................................22
5.2.3 Power off Signal.........................................................................................................................................................23
5.2.4 Reset Signal.................................................................................................................................................................23
5.3 Indicator Signal....................................................................................................................................................................24
5.3.1 Pin Description...........................................................................................................................................................24
5.3.2 Indicator Description...............................................................................................................................................24
5.4 USB Interface........................................................................................................................................................................25
5.4.1 USB Interface Description......................................................................................................................................25

H330SS LGA Module Hardware User Manual Page 4 of 38
5.4.2 USB Interface Application......................................................................................................................................26
5.5 UART Interface .....................................................................................................................................................................27
5.5.1 UART Interface Description...................................................................................................................................27
5.5.2 UART Design ...............................................................................................................................................................28
5.5.3 Ring Indicator .............................................................................................................................................................29
5.6 USIM.........................................................................................................................................................................................29
5.6.1 USIM Interface............................................................................................................................................................29
5.6.2 USIM Design................................................................................................................................................................30
5.6.3 USIM Design Notice .................................................................................................................................................30
5.6.4 USIM Hot Plug ............................................................................................................................................................31
5.7 Analog Audio .......................................................................................................................................................................31
5.7.1 Audio Interface Signal Description ....................................................................................................................31
5.7.2 Audio Description.....................................................................................................................................................32
5.8 Digital Audio.........................................................................................................................................................................33
5.8.1 I2S ...................................................................................................................................................................................33
5.8.2 I2C...................................................................................................................................................................................33
5.9 Others......................................................................................................................................................................................34
6Electrical and Environmental Features......................................................................................................................................35
6.1 Electrical Features...............................................................................................................................................................35
6.2 Environmental Features ...................................................................................................................................................35
7RF Interface..........................................................................................................................................................................................36
7.1 Operation Frequency Band.............................................................................................................................................36
7.1.1 Main Antenna.............................................................................................................................................................36
7.1.2 Diversity Antenna .....................................................................................................................................................36
7.2 RF PCB Design......................................................................................................................................................................37
7.2.1 Layout Guideline .......................................................................................................................................................37
7.2.2 Impedance...................................................................................................................................................................37
7.3 Antenna Design...................................................................................................................................................................37
7.3.1 Main Antenna Design Requirements ................................................................................................................37
7.3.2 Diversity Antenna Design......................................................................................................................................38

H330SS LGA Module Hardware User Manual Page 5 of 38
1Preface
1.1 Scope
This manual provides the electrical, mechanical and environmental requirements for properly integrating the
H330S wireless communications module. This manual gives a complete set of hardware features and functions
that may be provided by H330S, ensures the users can quickly and conveniently develop wireless
communications using H330S Module.
1.2 Standards
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)
3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment (DTE-DCE)
interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)
3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile radio
interface
3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol
3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services
3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell
reselection in connected mode
3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description; Stage 2
3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2
3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information
3GPP TS 21.111 -v6.3.0: USIM and IC card requirements
3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path
3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity Module -
Mobile Equipment (SIM-ME) interface
3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 22.004 -v6.0.0: General on supplementary services
3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2
3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;

H330SS LGA Module Hardware User Manual Page 6 of 38
2Introduction
2.1 Description
H330S is a highly integrated 3G wireless communication module, supports GSM / GPRS / EDGE and UMTS /
HSDPA / HSUPA / HSPA+.
2.2 Specifications
Specifications
UMTS (WCDMA/FDD): 850/900/1900/2100 MHz
Bands
GSM/GPRS/EDGE: 850/900/1800/1900 MHz
Data
UMTS/HSDPA/HSUPA 3GPP release 7
HSUPA 5.76Mbps (Cat 6)
HSDPA 21Mbps (Cat 14)
GSM 3GPP release 7
EDGE (E-GPRS) multi-slot class 33
GPRS multi-slot class 33
Physical
L x W x H: 33.8mm x 27.8mm x 2.45mm
Interface: LGA
Weight: <5.5 grams
Environment
Operating Temperature: -30℃~ +85℃
Storage Temperature: -40℃ ~ +85℃
Performance
Operating Voltage Voltage: 3.3V ~ 4.2V Normal: 3.8V
Operating Current
(Typical Value)
2mA (Sleep Mode)
3G Idle: 13mA
3G Talk: 500mA
2G Talk: 260mA (GSM PCL5)
Tx Power
(Typical Value)
Class 4 (2W)：850/900 MHz, GSM
Class 1 (1W)：1800/1900 MHz, GSM
Class E2 (0.5W)：850/900 MHz, EDGE
Class E2 (0.4W)：1800/1900 MHz, EDGE
Class 3 (0.25W)：850/900/1900/2100 MHz, WCDMA

H330SS LGA Module Hardware User Manual Page 7 of 38
Performance
Rx Sensitivity (Typical
Value)
UMTS/HSPA：-109dBm
GSM：-108dBm
Interfaces
Connectors
Main Antenna
Diversity Antenna
Connectivity
1 x USB 2.0
2 x UART
MUX Over UART1
Multiple Profiles over USB
SPI Support (not supported so far)
I2C Support
I2S Support
PCM, HSIC, GPIO, A/D, RTC
Data Features
Protocol Stack Embedded TCP/IP and UDP/IP protocol stack
EDGE
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~9
GPRS
Multi-slot class 33(5 Down; 4 Up; 6 Total)
Coding Scheme CS1~4
CSD UMTS, GSM
USSD
Support
SMS
MO / MT Text and PDU modes
Cell broadcast
Voice Features
Analog Audio and Digital Audio
Voice coders: EFR/HR/FR/AMR
Audio Control Gain Control, Echo Suppression, Noise Suppression, Side Tone
Character Set IRA, GSM, UCS2, HEX
AT Commands
FIBOCOM proprietary AT commands
GSM 07.05, GSM 07.07
Accessories Firmware Loader Tool over USB/UART, User Manual, Developer Kit

H330SS LGA Module Hardware User Manual Page 8 of 38
2.3 Appearance
The following picture shows the H330S Wireless Communication Module.
Top view:
Figure 2-1
Bottom view:
Figure 2-2

H330SS LGA Module Hardware User Manual Page 9 of 38
3Mechanical
3.1 Dimensions
Figure 3-1
3.2 PCB Layout Design
Figure 3-2

H330SS LGA Module Hardware User Manual Page 10 of 38
4Hardware Overview
4.1 Block Diagram
JTAG
I2S
SPI
USIF
USB HS
ARM1176
MIPI HSI
PCM
32KHz XO Ext. Memory
Interface
PMU
Digital RF
Interface
I2C
Audio DSP
2G Layer1
DSP/Timer 3G/HSPA Layer1
Memories(ARM,ROM,cache)
MCP
Nand 1Gb + DDR
256Mb
1
2
0
-
p
i
n
L
G
A
C
o
n
n
e
c
t
o
r
I
n
t
e
r
f
a
c
Dig RF
v3.09
Control
DAC
RX
Diversity
VCTCXO
FE
Control
2G/3G
TX
2G/3G
RX
Main
Duplexer
PA Power
Management
RF6561
RFPA
RF6261 Main
Antenna
Switch
Module
SPI
Diversity
Duplexer
Diversity
Antenna Switch
Module
CLK
CLK in
Power Supply 3.3~4.2V
UART
USB
SPI
I2S
I2C
PCM
USIM
USIM
JTAG
VBACKUP
SMARTi-UE2
PMB 5712
X-Gold 62xx
PMB 98xx
Audio Codec
EAR +/-
MIC +/-
AUXO +/-
AUXI +/-
Vspeaker
Power_on
Reset_ALL_N
Reset_PMU_N
LDO
Output:1.8V
Ant_div
Ant_main
H330S Module:
GSM/GPRS/EDGE,WCDMA
ADC/DAC
MIPI
MMC
MMC
Figure 4-1

H330SS LGA Module Hardware User Manual Page 11 of 38
4.2 Pin Definition
4.2.1 Pin Map
TOP (View)
Figure 4-2
4.2.2 Pin Description
The logic electrical lever of H330S is 1.8V. The following table shows H330S pin description:
Pin#
Pin Name
I/O
Description
Power Supply
59 VBAT I
Module main power input, voltage range: 3.3V ~ 4.2V
60 VBAT I
61 VBAT I
62 VBAT I
64 VPA O Power supply indicator for RF PA
1 VTRX O Power supply indicator for RF transceiver
46 VIO O 1.8V voltage output inside module
47 VRTC I/O Backup battery power input.

H330SS LGA Module Hardware User Manual Page 12 of 38
Power ON/OFF Signal
48 POWER_OFF I Power off signal
49 POWER_ON I Power on signal
Reset Signal
77 RESET_ALL_N I External reset signal
USIM
4 USIM_CD I USIM card insert detected.Low activity
5 USIM_VCC O USIM card supplies the power, 1.8V or 3.3V
6 USIM_RST O USIM card reset
7 USIM_CLK O USIM card clock
8 USIM_DATA I/O USIM card data
High Speed SIM
9 USIM_D+ High Speed SIM card USB data line+ (not supported)
10 USIM_D- High Speed SIM card USB data line- ( not supported)
Audio
13 AUXO+ O Speaker output signal+
14 AUXO- O Speaker output signal-
15 EAR- O Earphone output signal -
16 EAR+ O Earphone output signal+
17 MIC+ I Main MIC input signal +
18 MIC- I Main MIC input signal-
19 AUXI- I Auxiliary MIC input signal -
20 AUXI+ I Auxiliary MIC input signal +
21 AGND GND Audio GND
22 VSPK I Audio codec speaker part power supply, connect to
VBAT
I2S

H330SS LGA Module Hardware User Manual Page 13 of 38
11 I2S2_CLK1 O I2S2 Clock SCLK1
24 I2S2_CLK0 O I2S2 l Clock SCLK0 (I2S2 use CLK0 by default)
25 I2S2_WA0 O I2S2 word alignment select
26 I2S2_TX O I2S2 transmit line
27 I2S2_RX I I2S2 receive line
USB
31 USB_DP I/O USB data line+
32 USB_DM I/O USB data line-
33 USB_ID — USB ID line
34 VUSB I USB Power Input
92 USB_TEST — USB TEST line
I2C
28 I2C_SDA I/O I2C data line
29 I2C_SCL O I2C clock line
UART1
35 UART1_RI O UART1 Ring Indicator
36 UART1_DSR I UART1 DTE Ready
37 UART1_DTR O UART1 DCE Ready
38 UART1_DCD O UART1 Carrier Detect
39 UART1_CTS I UART1 Clear To Send
40 UART1_RTS O UART1 Request To Send
41 UART1_TXD O UART1 Transmitted Data
42 UART1_RXD I UART1 Received Data
UART2
45 UART2_TXD O UART2 Transmitted Data
44 UART2_RXD I UART2 Received Data

H330SS LGA Module Hardware User Manual Page 14 of 38
ADC
50 ADC2 Analog digital converter 2 ( not supported)
51 ADC1 Analog digital converter 1 ( not supported)
EINT
56 WAKE_UP I External wake-up interrupt, Low activity.
57 EINT2 I External interrupt, Low activity.
USB HSIC
90 HSIC_USB_DATA HSIC USB data signal ( not supported)
91 HSIC_USB_STRB HSIC USB pulse signal ( not supported)
Antenna
67 ANT_MAIN I Main antenna interface, 50 ohm Impedance
71 ANT_DIV I Diversity antenna interface, 50 ohm Impedance
Others
54 CLKOUT0 O Digital audio clock output
89 SMI I Sleep Mode Indicator
86 LPG O Status Indicator
Not Connect
3 NC
23 NC
55 NC
52 NC
53 NC
73 NC
74 NC
75 NC
76 NC

H330SS LGA Module Hardware User Manual Page 15 of 38
78 NC
79 NC
80 NC
81 NC
82 NC
83 NC
84 NC
85 NC
87 NC
88 NC
94 NC
95 NC
96 NC
101 NC
105 NC
106 NC
107 NC
108 NC
GND
2 GND
12 GND
30 GND
43 GND
58 GND
63 GND
65 GND

H330SS LGA Module Hardware User Manual Page 16 of 38
66 GND
68 GND
69 GND
70 GND
72 GND
93 GND
97 GND
98 GND
99 GND
100 GND
102 GND
103 GND
104 GND
109 GND
110 GND
111 GND
112 GND
113 GND
114 GND
115 GND
116 GND
117 GND
118 GND
119 GND
120 GND

H330SS LGA Module Hardware User Manual Page 17 of 38
5Hardware Interface
5.1 Power Interface
5.1.1 VBAT
H330S module requires a 3.3 V~ 4.2V DC power supply to provide 2A as GSM transmitter maximum current.
Input power supply requirements:
Parameter
Minimum Value
Recommended Value
Maximum Value
Unit
VBAT 3.3 3.8 4.2 V
Note:
1. Supply voltage fluctuations need to be lower than 300mV.
2. Supply voltage drop minimum value needs to be higher than 3.3V.
Filter capacitor description:
Recommended capacitor
Application
Description
1000uF GSM Transmit current serge Minimizes power supply losses during transmit
bursts. Use maximum possible value.
10nF, 100nF Digital signal to noise Filtering interference from clock and data sources
8.2pF, 10pF 1800/1900/2100 MHz GSM
bands
Filters transmission EMI.
33pF, 39pF 850/900 MHz GSM bands Filters transmission EMI.
5.1.2 Power Consumption
Parameter
Description
Condition
Typical Value
Unit
I off RTC mode 60 uA
I idle Idle mode
GSM 13 mA
WCDMA 13 mA
I sleep Low power
mode
DRX 2 2
mA
DRX 5 2
DRX 9 2
I
GSM voice -
1 TX slot
1 Rx slot
GSM-RMS GSM850 PCL
5 230
mA
10 80

H330SS LGA Module Hardware User Manual Page 18 of 38
15 50
19 46
EGSM900 PCL
5 240
10 83
15 50
19 47
DCS1800 PCL
0 156
5 71
10 49
15 46
PCS1900 PCL
0 165
5 70
10 50
15 46
I
GPRS Class 33 -
4 TX slot
1 Rx slot
GPRS-RMS
GSM850 PCL
5 355
mA
10 216
15 108
19 94
EGSM900 PCL
5 383
10 225
15 108
19 94
DCS1800 PCL
0 259
5 180
10 103
15 95

H330SS LGA Module Hardware User Manual Page 19 of 38
PCS1900 PCL
0 266
5 182
10 103
15 95
I
EGPRS Class 33 -
4 TX slot
1 Rx slot
EGPRS-RMS
GSM850 PCL
8 522
mA
14 145
19 95
EGSM900 PCL
8 522
14 150
19 95
DCS1800 PCL
2 484
9 117
15 103
PCS1900 PCL
2 493
9 118
15 103
IPeak current
During TX slot
GSM-MAX
GSM850 PCL
5 1655
mA
10 473
15 193
19 148
EGSM900 PCL
5 1715
10 536
15 208
19 147
DCS1800 PCL
0 1050
5 464

H330SS LGA Module Hardware User Manual Page 20 of 38
10 199
15 138
PCS1900 PCL
0 1100
5 489
10 203
15 139
IWCDMA
WCDMA-RMS
Band5 (850)
24dBm 387
mA
0dBm 127
-24dBm 121
-50dBm 119
Band2 (1900)
24dBm 439
0dBm 130
-24dBm 123
-50dBm 121
Band1 (2100)
24dBm 475
0dBm 131
-24dBm 121
-50dBm 119
Band8 (900)
24dBm 384
0dBm 127
-24dBm 123
-50dBm 121