Fibocom FG621-LA Series Installation instructions

FIBOCOM FG621-LA Series
Hardware Guide
Version: V0.0.1
Date: 2020-09-29

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Applicability Type
No. Product Model Description
1 FG621-LA-00
LPDDR2 1Gb, SPI NAND 1Gb，support MAIN_ANT、
DIV_ANT

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Copyright
Copyright ©2020 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Change History
Version Author Reviewer Approver Update Date Description
V0.0.1 Tan Lefan
Hu Wenkai
Jin Haibo
Liu Ke 2020-09-29 Initial version
V0.0.2 Hu wenkai
Tan Lefan
Jin Haibo
Liu Ke 2021-01-22 CA Combo

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Contents
1 Foreword ........................................................................................................................... 7
1.1 Document Introduction ......................................................................................................... 7
1.2 Safety Precautions ............................................................................................................... 7
2 Product Overview ............................................................................................................. 9
2.1 Product Introduction ............................................................................................................. 9
2.2 Product Specification ............................................................................................................ 9
2.3 Functional Diagram ............................................................................................................ 11
2.4 Development Board ........................................................................................................... 12
3 Pin Description ............................................................................................................... 13
3.1 Pin Distribution ................................................................................................................... 13
3.2 Pin Function ....................................................................................................................... 14
4 Electrical Characteristics ............................................................................................... 21
4.1 Power ................................................................................................................................. 21
4.2 Power Supply ..................................................................................................................... 21
4.3 Power Output ..................................................................................................................... 23
4.4 Power Consumption ........................................................................................................... 23
5 Functional Interface........................................................................................................ 26
5.1 Control Interface................................................................................................................. 26
5.1.1 Power-on/Off ....................................................................................................................... 26
5.1.1.1 Power-on ........................................................................................................................................ 26
5.1.1.2 Shutdown ....................................................................................................................................... 27
5.1.2 Reset................................................................................................................................... 28
5.2 Network Status Indication Interface .................................................................................... 29
5.3 (U)SIM Card Interface ........................................................................................................ 31
5.3.1 (U)SIM Pin Definition .......................................................................................................... 31
5.3.2 (U)SIM Interface Circuit ...................................................................................................... 31
5.3.2.1 (U)SIM Card Connector with Card Detection Signal ....................................................................... 31
5.3.2.2 (U)SIM Card Connector without Detection Signal .......................................................................... 33
5.3.3 (U)SIM Hot Plug.................................................................................................................. 33
5.3.4 (U)SIM Design Requirements ............................................................................................ 34
5.4 USB Interface ..................................................................................................................... 34
5.5 UART Interface .................................................................................................................. 35

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5.6 ADC Interface ..................................................................................................................... 35
5.7 I2C Interface ...................................................................................................................... 35
5.8 PCM Digital Audio Interface ............................................................................................... 36
5.8.1 Support Model .................................................................................................................... 36
5.8.2 PCM Interface Definition..................................................................................................... 36
5.8.3 PCM Interface Description.................................................................................................. 36
5.8.4 PCM Signal Description ...................................................................................................... 37
5.9 SD Interface ....................................................................................................................... 38
5.9.1 SD Pin Definition................................................................................................................. 38
5.9.2 SD Interface Routing Rules ................................................................................................ 38
5.9.3 SD Interface Application Circuit .......................................................................................... 38
5.10 SPI Interface .................................................................................................................... 39
5.11 GPIO Interface ................................................................................................................. 39
6 Low Power Consumption ............................................................................................... 41
6.1 Flight Mode ........................................................................................................................ 41
6.2 Sleep Mode ........................................................................................................................ 41
7 RF Interface ..................................................................................................................... 42
7.1 Operating Bands ................................................................................................................ 42
7.2 Transmission Power ........................................................................................................... 42
7.3 Receiving Sensitivity .......................................................................................................... 43
7.4 Antenna Design .................................................................................................................. 43
7.4.1 Antenna Indexes ................................................................................................................. 43
7.4.2 Antenna Reference Design ................................................................................................ 45
8 Reliability ......................................................................................................................... 47
8.1 Limiting Voltage Range ...................................................................................................... 47
8.1.1 Absolute Limiting Voltage ................................................................................................... 47
8.1.2 Operating Limiting Voltage ................................................................................................. 47
8.2 Ambient Temperature Range .............................................................................................. 47
8.3 Environmental Reliability Requirements ............................................................................. 48
8.4 ESD Characteristics ........................................................................................................... 48
9 Structure Specification................................................................................................... 50
9.1 Product Appearance ........................................................................................................... 50
9.2 Structural Dimension .......................................................................................................... 50
9.3 PCB Soldering Pad and Stencil Design .............................................................................. 51

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9.4 SMT Patch ......................................................................................................................... 51
9.5 Packaging and Storage ...................................................................................................... 51
10 Certification ................................................................................................................... 52
11 OEM/Integrators Installation Manual ........................................................................... 52
12 Appendix ....................................................................................................................... 55
12.1 Terms and Abbreviations .................................................................................................. 55
12.2 Related Documents .......................................................................................................... 56
12.3 Reference Standards........................................................................................................ 57
12.4 Contact............................................................................................................................. 57

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1 Foreword
1.1 Document Introduction
The document describes the electrical characteristics, RF performance, dimensions, and application
environment, etc. of FG621-LA series wireless module. With the assistance of the document and other
instructions, the developers can quickly understand the hardware functions of FG621-LA series module
and develop products.
1.2 Safety Precautions
By following the safety guidelines below, you can ensure your personal safety and help protect the
product and work environment from potential damage. Product manufacturers need to communicate the
following safety instructions to end users. In case of failure to comply with these safety rules, Fibocom will
not be responsible for the consequences caused by the user’s misuse.
Road safety first! When you drive, do not use the handheld devices even if it has a
hand-free feature. Please stop and call!
Please turn off the mobile device before boarding. The wireless feature of the mobile
device is not allowed on the aircraft to prevent interference with the aircraft
communication system. Ignoring this note may result in flight safety issue or even
violate the law.
When in a hospital or health care facility, please be aware of restrictions on the use of
mobile devices. Radio frequency interference may cause medical equipment to
malfunction, so it may be necessary to turn off the mobile device.
The mobile device does not guarantee that an effective connection can be made under
any circumstances, for example, when there is no prepayment for the mobile device or
the (U)SIM is invalid. When you encounter the above situation in an emergency,
remember to use an emergency call, while keeping your device turned on and in areas
where signal is strong.
Your mobile device receives and transmits RF signals when it is powered on. Radio

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interference occurs when it is near televisions, radios, computers, or other electronic
devices.
Keep the mobile device away from flammable gases. Turn off the mobile device when
you get near to gas stations, oil depots, chemical plants or explosive workplaces. There
are potential safety hazards when operating electronic equipment in any potentially
explosive area.

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2 Product Overview
2.1 Product Introduction
Fibocom FG621-LA series module is a CAT6 module designed based on UNISOC SL8563 platform and
can support CA network architecture. FG621-LA series module integrates core devices such as
Baseband, Memory, PMIC, Transceiver, and PA, and supports multi-format long-distance communication
modes including FDD-LTE, TDD-LTE, and WCDMA. It supports the maximum downlink rate of 300Mbps
and the maximum uplink rate of 50Mbps in CA mode. FG621-LA is designed with LGA package and is
applicable for various scenarios such as CPE, VR/AR, gateway, internet TV set-top box, and intelligent
monitoring.
2.2 Product Specification
Table 2-1 Product specification
Specification
Operating
frequency
FG621-LA-00
LTE FDD: Band2,4,5,7,12,13,28,66
LTE TDD: Band40
WCDMA/HSPA+: Band2,4,5
2xCA
combination
Intra-band
contiguous
CA_2C / CA_5B / CA_7C / CA_7B / CA_12B / CA_B40C
CA_66B / CA_66C
Intra-band
non-contiguous
CA_2A-2A / CA_4A-4A / CA_5A-5A / CA_7A-7A / CA_12A-12A
CA_B40A-B40A / CA_66A-66A
Inter-band
CA_B2-B4/B5/B7/B12/B13/B28/B66
CA_B4-B5/B7/B12/B13/B28
CA_B5-B7/B66
CA_B7-B12/B28/B66
CA_B12-B66
Data
transmission
LTE FDD 300Mbps DL, 50Mbps UL
LTE TDD 260Mbps DL, 30Mbps UL
WCDMA
HSPA/HSPA+: 42Mbps DL, 11Mbps UL
UMTS: 384 kbps DL/384 kbps UL
Power 3.4V~4.3V (3.8V recommended)

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Specification
Temperature
Normal operation: -30°C~+75°C①
Extended operation: -40°C~+85°C②
Storage: -40°C~+85°C③
Power
consumption
(TBD)
Power-off leakage current: ≤ 100uA
Base current: ≤ 2.5mA
Sleep mode: ≤ 4.5mA
Idle mode: ≤ 50mA
Physical
characteristic
s
Package: LGA 299Pin
Size: 39.5mm×37mm×2.6 mm
Weight: About 8.3g
Interface
Antenna Antenna: Main×1, DIV×1
Function
interface
(U)SIM 3.0V/1.8V
USB 2.0×1
Status Indicator
UART×4, PCM, I2C, SDIO, SPI, GPIOs, RESET_N, PWRKEY
ADC×2
Software
Protocol stack
IPV4 and IPV6
AT command 3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT
Firmware
update USB
Voice service VoLTE, AMR, DTMF and caller ID
SMS service Point-to-point MO, MT, Text and PDU modes
Note:
indicates that the module works normally within this temperature range, and the related ①
performance meets the requirements of 3GPP standards.
②indicates that the module works normally within this temperature range, and the baseband
and RF functions are normal, but some indicators may exceed the range specified in 3GPP
standards. While the temperature returns to the normal operating range of the module, all the
indicators of the module meet the requirements of 3GPP standards.

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indicates the range of the ③temperature where the module can perform storage without being
damaged or powered on.
2.3 Functional Diagram
Functional diagram shows the main hardware features of FG621-LA series module, including baseband
and RF features.
Baseband includes:
 CPU
 PMIC
 LPDDR2
 NAND
 USB, (U)SIM, PCM, I2C, SPI, UART, SDIO, GPIOs, ADCs
 WCDMA /LTE TDD/LTE FDD controller
RF includes:
 RF Transceiver
 RF PA
 RF Switch
 RF filter
 Antenna

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Baseband
PMIC
LPDDR2
Transceiver
VDD_EXT USB (U)SIM PCM I
2
C SPI UART SDIO GPIOs STATUS
ADCs
RESET_N
PWRKEY
VBAT_BB
VBAT_RF
TRX Blocks
Control
Control
IQ
ANT_MAIN ANT_DIV
TX RX
26M
XO
NAND
Figure 2-1 Functional diagram
2.4 Development Board
Fibocom provides EVK-FG150-00, ADP-FG621-LA-00 development board to facilitate module’s debug
and use.

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3 Pin Description
3.1 Pin Distribution
FG621-LA series module is available with a total of 299 LGA pins. The top view of the pin distribution is
shown in the figure below:
Figure 3-1 Pin distribution (top view)

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3.2 Pin Function
The pin function description of FG621-LA series module is shown in the following table:
Table 3-1 Pin function description
Pin# Pin Name I/O Level Description
1 RESET_N DI
VILmin=-0.3V
VILmax=0.5V
VIHmax=VBAT_BB
Module reset signal,
active low, no need pull
up externally
2 PWRKEY DI
VILmin=-0.3V
VILmax=0.5V
VIHmax=VBAT_BB
Module power-on/off
signal, active low, no
need pull up externally
3 BT_EN* DO
VOLmax=0.45V
VOHmin=1.35V
BT function enabling pin,
Reserved
5
WLAN_PWR_EN
*
DO VOHmin=1.35V
VOLmax=0.45V
WLAN power supply
enabling, Reserved
24 USIM_GND G -
(U)SIM ground signal,
directly connected to the
main ground
25 USIM_DET DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Detect (U)SIM for
hot-swap
26 USIM_VDD PO
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=2.95V
Vmin=2.75V
IOmax=50mA
(U)SIM power supply,
the module automatically
identifies 1.8V or 3.0V
(U)SIM
27 USIM_CLK DO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.5V
VIHmin=1.3V
VIHmax=2.0V
(U)SIM clock signal line
28 USIM_RST DO
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
(U)SIM reset signal line
29 USIM_DATA DIO
For 1.8V (U)SIM:
VILmax=0.5V
VIHmin=1.3V
VOLmax=0.45V
(U)SIM data signal line

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Pin# Pin Name I/O Level Description
VOHmin=1.35V
For3.0V (U)SIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
32 USB_VBUS PI
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V USB plug detection
33 USB_DM DIO
Conform to USB2.0
standard
specification
USB differential data
signal (-)
34 USB_DP DIO
Conform to USB2.0
standard
specification
USB differential data
signal (+)
36 USB_ID* DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
OTG identification
signal, Reserved
42 I2C_SDA OD 1.8V domain
I2C interface data signal,
pulled up inside the
module
43 I2C_SCL OD 1.8V domain
I2C interface clock
signal, pulled up inside
the module
46 SD_VDD PO
For 1.8V SD:
Vmax=1.9V
Vmin=1.75V
For 3.0V SD:
Vmax=3.15V
Vmin=2.75V
IOmax=400mA
SD card power supply
47 SD_DATA2 DIO For1.8V SD:
VOLmax=0.45V
VOHmin=1.4V
VILmin=-0.3V
VILmax=0.58V
VIHmin=1.3V
VIHmax=2.0V
For 3.0V SD:
VOLmax=0.35V
VOHmin=2.15V
VILmin=-0.3V
VILmax=0.7V
VIHmin=1.8V
VIHmax=3.15V
SD card data signal
48 SD_DATA3 DIO SD card data signal
49 SD_DATA0 DIO SD card data signal
50 SD_DATA1 DIO SD card data signal
51 SD_CMD DO SD card command
signal
53 SD_CLK DO SD card clock signal

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Pin# Pin Name I/O Level Description
52 SD_ DETECT DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
V
IH
max=2.0V
SD card hot-swap
detection signal
56 RTS DO VOLmax=0.45V
VOHmin=1.35V
Request to send data,
Reserved
57 CTS DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Clear to send, Reserved
58 RXD DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Module Receive data,
Reserved
59 DCD DO VOLmax=0.45V
VOHmin=1.35V
Module output carrier
detection, Reserved
60 TXD DO VOLmax=0.45V
VOHmin=1.35V
Module Transmit data,
Reserved
61 RI DO VOLmax=0.45V
VOHmin=1.35V
Module output ring
indicator
62 DTR DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Ready, sleep mode
control, Reserved
65 PCM_SYNC DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
PCM synchronization
signal
66 PCM_IN DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
PCM input signal
67 PCM_CLK DO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
PCM clock signal
68 PCM_OUT DO VOLmax=0.45V
VOHmin=1.35V PCM output signal
71 RFFE_CLK DO VOLmax=0.45V
VOHmin=1.35V
RF MIPI clock signal,
Reserved
73 RFFE_DATA DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
RF MIPI data signal,
Reserved

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Pin# Pin Name I/O Level Description
VIHmin=1.2V
VIHmax=2.0V
77 SPI_MOSI DO VOLmax=0.45V
VOHmin=1.35V SPI output signal
78 SPI_MISO DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
SPI input signal
79 SPI_CS DO VOLmax=0.45V
VOHmin=1.35V
SPI Chip Selection
signal
80 SPI_CLK DO VOLmax=0.45V
VOHmin=1.35V SPI clock signal
85~88 VBAT_RF PI
Vmax=4.3V
Vmin=3.4V
Vnorm=3.8V
RF power input
(3.4V~4.3V)
107 ANT_MAIN AIO - Main antenna
127 ANT_DIV AI - Diversity antenna
136 DBG_RXD DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
DEBUG serial port
receiving
137 DBG_TXD DO VOLmax=0.45V
VOHmin=1.35V
DEBUG serial port
sending
138 GPIO_1 DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
GPIO
139 GPIO_2 DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
GPIO
140 USB_BOOT DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Emergency download,
active low,
recommended to reserve
test point
143 OTG_PWR_EN*
DO VOLmax=0.45V
VOHmin=1.35V
OTG power enabling,
Reserved
144 SLEEP_IND DO VOLmax=0.45V
VOHmin=1.35V Sleep status indicator
145
COEX_UART_T
X*
DO VOLmax=0.45V
VOHmin=1.35V
LTE/WLAN shared serial
port sending signal line,

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Pin# Pin Name I/O Level Description
Reserved
146
COEX_UART_R
X*
DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
LTE/WLAN shared serial
port sending signal line,
Reserved
147 NET_MODE DO VOLmax=0.45V
VOHmin=1.35V
Module network state
indicate
149 WLAN_EN* DO VOLmax=0.45V
VOHmin=1.35V
Wake up WLAN module,
Reserved
150 WAKEUP_IN DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
External device wakeup
module, active low by
default, configurable by
software
151 W_DISABLE# DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Module flight mode
control, pull up by
default, low level can
make the module enter
flight mode
152 I2S_MCLK DO VOLmax=0.45V
VOHmin=1.35V I2S output clock signal
155,156 VBAT_BB PI
Vmax=4.3V
Vmin=3.4V
Vnorm=3.8V
Baseband power input
(3.4V~4.3V)
159 GPIO_3 DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
GPIO
160
WAKE_ON_WIR
ELESS*
DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
WLAN chip wakeup
signal for the module,
Reserved
161 GPIO_4 DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
GPIO
162 VDD_2V8 PO Vnorm=2.8V
I
O
max=200mA 2.8V voltage output
163 BT_TXD* DO VOLmax=0.45V
VOHmin=1.35V Bluetooth serial port

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Pin# Pin Name I/O Level Description
sends data signal,
Reserved
164 BT_RTS* DO VOLmax=0.45V
VOHmin=1.35V
Bluetooth serial port
requests to send data
signal, Reserved
165 BT_RXD* DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Bluetooth serial port
receives data signal,
Reserved
166 BT_CTS* DI
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
Bluetooth serial port
clears to send data
signal, Reserved
168 VDD_EXT PO Vnorm=1.85V
I
O
max=50mA 1.85V power output
169
WLAN_SLP_CL
K*
DO VOLmax=0.45V
VOHmin=1.35V
WLAN sleep clock
signal, Reserved
170 NET_STATUS DO VOLmax=0.45V
VOHmin=1.35V
Module network state
indicate (by default).
171 STATUS DO VOLmax=0.45V
VOHmin=1.35V
Module network state
indicate
172 GPIO_5 DIO
VOLmax=0.45V
VOHmin=1.35V
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
GPIO
173 ADC0 AI
Input voltage
ranged from 0 to
1.2V
Analog to digital
converter input port 0
175 ADC1 AI
Input voltage
ranged from 0 to
1.2V
Analog to digital
converter input port 1
10,13,16,17,24,30,31,35,
39,44,45,54,55,63,64,69,
70,75,76,81~84,89,90,92
~94,96~100,102~106,10
8~112,114,116~118,120
~126,128~133,141,142,1
GND G - Ground

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Pin# Pin Name I/O Level Description
48,153,154,157,158,167,
174,177,178,181,184,18
7,191,196,202~208,214~
299
4,6~9,11,12,14,15,18~23
,37,38,40,41,72,74,91,95
,101,113,115,119,134,13
5,176,179,180,182,183,1
85,186,188~190,192~19
5,197~201,209~213
NC - - -
Note:
Keep the unused pins floating.
Table 3-2 I/O parameter description
Type Description
PI Power input
PO Power output
DI Digital input
DO Digital output
DIO Digital input/output
AI Analog input
AO Analog output
AIO Analog input/output
OD Open drain