Contents
2
3.3.8 LCD Interface...........................................................................................46
3.3.9 Camera Interface .....................................................................................46
3.4 Operating Mode.............................................................................................46
3.4.1 Flight Mode ..............................................................................................47
3.4.2 Sleep Mode..............................................................................................48
3.4.3 PSM Mode ...............................................................................................49
4 RF Interface...................................................................................................51
4.1 RF Indicators .................................................................................................51
4.2 RF Antenna....................................................................................................54
4.2.1 Antenna Introduction................................................................................54
4.2.2 Impedance Design Principles ..................................................................54
4.2.3 Antenna Passive Test...............................................................................57
5 Reliability .......................................................................................................60
5.1 Temperature and Humidity Requirements.....................................................60
5.2 Reliability Indicators.......................................................................................60
5.3 ESD Indicators...............................................................................................62
6 Thermal Design ............................................................................................63
6.1 Overview........................................................................................................63
6.2 Thermal Basis................................................................................................63
6.3 Thermal Design .............................................................................................64
6.3.1 Main Board...............................................................................................64
6.3.2 Product Structure.....................................................................................65
7 Structure Specifications...............................................................................67
7.1 Appearance....................................................................................................67
7.2 Dimensions....................................................................................................68
8 Packaging and Production..........................................................................70
8.1 Packaging......................................................................................................70
8.2 Storage ..........................................................................................................73
8.3 SMT ...............................................................................................................73
Appendix A Acronyms and Abbreviations....................................................74
Appendix B Reference Standards..................................................................76