Fibocom L830-EB-11 Instructions for use

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L830-EB-11 Hardware User Manual
Version: V1.0.2
Update date: 2017.09.21

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L830-EB-11 Hardware User Manual Page 2 of 39
Applicability Table
No. Product model Description
1 L830-EB-11 NA

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Copyright
Copyright © 2017 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Version Record
Version Update Remark
V1.0.0 2017.04.25 Initial version
V1.0.1 2017-09-21
1. Update timing of power on/off and reset
2. Modify the RF Band
3. Modify the packing description

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Contents
1 Preface....................................................................................................................................................................6
1.1 Introduction.....................................................................................................................................................6
1.2 Reference Standard......................................................................................................................................6
1.3 Related Documents...................................................................................................................................... 6
2 Overview.....................................................................................................................................................................7
2.1 Introduction.....................................................................................................................................................7
2.2 Specification...................................................................................................................................................7
2.3 Application Framework................................................................................................................................. 8
2.4 Hardware Framework................................................................................................................................... 9
3 Application Interface.................................................................................................................................................9
3.1 M.2 Interface.................................................................................................................................................. 9
3.1.1 Pin Map............................................................................................................................................. 10
3.1.2 Pin Definition.....................................................................................................................................11
3.2 Power Supply...............................................................................................................................................14
3.2.1 Power Supply................................................................................................................................... 15
3.2.2 Logic level......................................................................................................................................... 16
3.2.3 Power Consumption........................................................................................................................16
3.3 Control Signal.............................................................................................................................................. 17
3.3.1 Module Start-Up...............................................................................................................................17
3.3.1.1 Start-up Circuit................................................................................................................................................17
3.3.1.2 Start-up Timing Sequence............................................................................................................................ 18
3.3.2 Module Shutdown............................................................................................................................19
3.3.3 Module Reset................................................................................................................................... 20
3.4 USB Interface...............................................................................................................................................21
3.4.1 USB Interface Definition................................................................................................................. 21
3.4.2 USB Interface Application.............................................................................................................. 21
3.5 USIM Interface.............................................................................................................................................22
3.5.1 USIM Pins......................................................................................................................................... 22
3.5.2 USIM Interface Circuit.....................................................................................................................23
3.5.2.1 N.C. SIM Card Slot........................................................................................................................................ 23
3.5.2.2 N.O. SIM Card Slot........................................................................................................................................ 23
3.5.3 USIM Hot-Plugging..........................................................................................................................24

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3.5.4 USIM Design.................................................................................................................................... 25
3.6 Status Indicator............................................................................................................................................25
3.6.1 LED#1 Signal....................................................................................................................................26
3.6.2 WOWWAN#......................................................................................................................................26
3.7 Interrupt Control.......................................................................................................................................... 27
3.7.1 W_DISABLE1#.................................................................................................................................27
3.7.2 Body SAR..........................................................................................................................................28
3.8 Digital Audio................................................................................................................................................. 28
3.8.1 I2S Mode...........................................................................................................................................28
3.8.2 PCM Mode........................................................................................................................................ 29
3.9 I2C Interface Description........................................................................................................................... 29
3.10 Clock Interface.......................................................................................................................................... 30
3.11 Configuration Interface.............................................................................................................................30
3.12 Other Interfaces........................................................................................................................................ 31
4 Radio Frequency.................................................................................................................................................... 31
4.1 RF Interface................................................................................................................................................. 31
4.1.1 RF Interface Functionality.............................................................................................................. 31
4.1.2 RF Connector Characteristic......................................................................................................... 31
4.1.3 RF Connector Dimension...............................................................................................................32
4.2 Operating Band........................................................................................................................................... 33
4.3 Transmitting Power..................................................................................................................................... 33
4.4 Receiver Sensitivity.................................................................................................................................... 33
4.5 GNSS............................................................................................................................................................ 34
4.6 Antenna Design........................................................................................................................................... 34
5 Structure Specification...........................................................................................................................................35
5.1 Product Appearance................................................................................................................................... 35
5.2 Dimension of Structure...............................................................................................................................35
5.3 M.2 Interface Model....................................................................................................................................36
5.4 M.2 Connector............................................................................................................................................. 37
5.5 Storage..........................................................................................................................................................37
5.5.1 Storage Life...................................................................................................................................... 37
5.6 Packing......................................................................................................................................................... 37
5.6.1 Tray Package....................................................................................................................................38
5.6.2 Tray size............................................................................................................................................ 39

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1 Preface
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L830-EB (hereinafter referred to as L830). With the assistance of the document and
other instructions, the developers can quickly understand the hardware functions of L830 modules and
develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
PCI_Express_M.2_Specification_Rev1.1
1.3 Related Documents
RF Antenna Application Design Specification
L8-Family System Driver Integration and Application Guidance
L8-Family AT Commands Manual

EU Regulator Conformance
Hereby, We,Fibocom WirelessInc.declaresthatthe radio equipment type L830-EB-11isincompliance
with the Directive 2014/53/EU.
In all cases assessment of the final product must be mass against the Essential requirements of the
Directive 2014/53/EU Article 3.1(a) and (b), safety and EMC respectively,as well as any relevant Article
3.2 requirements.
External antenna is used with the module during the testing process, the maximum antenna gain for
frequency < 1G is 3dBi, for frequency > 1G is 5dBi and the antenna separation distance is 20cm.
EU Declaration of Conformity (DoC)
Hereby,
Name of manufacturer: Fibocom Wireless Inc.
Address: 5/F, Tower A, Technology Building II, 1057 Nanhai Blvd, Nanshan,
City: Shenzhen,
Country: China
declares that the DoC is issued under its sole responsibility and that this product:
Product description: LTE module
Type designation(s): L830-EB-11
Trademark: Fibocom
Product Identification
Element L830-EB-11
is in conformity with the relevant Union harmonization legislation:
Radio Equipment directive: 2014 / 53 / EU.
with reference to the following standards applied:
1. Health (Article 3.1(a) of Directive 2014/53/EU)
Applied Standard(s):
EN 62311 : 2008
2. Safety (Article 3.1(a) of Directive 2014/53/EU)
Applied Standard(s):
EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013
3. Electromagnetic compatibility (Article 3.1 (b) of Directive 2014/53/EU)
Applied Standard(s):
 Draft EN 301 489-1 V2.2.0 / -52 V1.1.0
4. Radio frequency spectrum usage (Article 3.2 of Directive 2014/53/EU)
Applied Standard(s):
EN 301 908-1 V11.1.1 / -2 V11.1.1 / -13 V11.1.1
The Notified Body SIEMIC INC. with Notified Body number 2200 performed:
Modules: B+C and issued the EU-type examination certificate.
Signed for and on behalf of:
Date: September 7, 2017
City: Shenzhen,
Name: Alan Yu
Title: Test Director
Signature:

Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.

Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1)
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However,
the OEM integrator is still responsible for testing their end-product for any additional
compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain
laptop configurations or co-location with another transmitter), then the FCC authorization is
no longer considered valid and the FCC ID can not be used on the final product. In these
circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be
installed such that 20 cm may be maintained between the antenna and users. The final end
product must be labeled in a visible area with the following: Contains FCC ID:
The grantee's FCC ID can be used only when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how
to install or remove this RF module in the user’s manual of the end product which integrates
this module. The end user manual shall include all required regulatory information/warning as
show in this manual.
ZMOL830EB11
External antenna is used with the module during the testing process, the maximum antenna gain for
frequency<1G is 3dBi, for frequency>1G is 5 dBi and the antenna separation distance is 20cm.for frequency>1G is 5 dBi and the antenna separation distance is 20cm.
External antenna is used with the module during the testing process, the maximum antenna gain

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2 Overview
2.1 Introduction
The L830 is a highly integrated 4G cellular module which uses the standard PCIe M.2 interface.It supports
LTE FDD/WCDMA mode cellular communication.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 1,3,7,8,20,28,32
WCDMA/HSPA+: Band I, VIII
GPS/GLONASS: Not Support
CA
LTE inter-band CA
1 +3,7,20
3 +7,8,20,28,32
7 +20,28
LTE intra-band CA 3,7
Data Transmission
LTE FDD 300Mbps DL/50Mbps UL(Cat 6)
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
Power Supply DC 3.135V～4.4V, Typical 3.3V
Temperature
Normal Operating temperature：-10°C ～+55°C
Extended Operating temperature：-30°C ～+65°C
Storage temperature：-40°C ～+85°C
Physical
characteristics
Interface: M.2 Key-B
Dimension：30 x 42 x 2.3mm
Weight: About 5.8 g
Interface
Antenna Connector
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1
Function Interface USIM 3V/1.8V