Fibocom SU806 Series Installation instructions

FIBOCOM SU806 Series
Hardware Guide
Version: V2.0.0
Date: 2021-02-01

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FIBOCOM SU806 Series Hardware Guide Page 2 of 91
Applicability Type
NO
Product Model
Description
1
SU806-CN-00
8GB e.MMC+8Gb LPDDR3.SDRAM, 4G frequency, Android 10,
applicable to China
2
SU806-CN-01
8GB e.MMC+8Gb LPDDR3.SDRAM, 4G frequency diversity
removal,Android 9, applicable to China
3
SU806-CN-11
16GB e.MMC+16Gb LPDDR3.SDRAM, 4G frequency diversity
removal,Android 9, applicable to China
4
SU806-CN-10
16GB e.MMC+16Gb LPDDR3.SDRAM, 4G frequency, Android 10,
applicable to China
5
SU806-EAU-00
8GB e.MMC+8Gb LPDDR3.SDRAM, 4G frequency, Android 10,
applicable to Eurasian

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Copyright
Copyright ©2021 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.

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Change History
Version
Author
Reviewer
Approver
Update Date
Description
V2.0.0
Mo Xiaoke
He Sihai
Tu Min
Li Xiyi
Chen Guojiang
2021-02-01
Initial version, modify pin
function based on SU806
Series Hardware Guide v1.0.2

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FIBOCOM SU806 Series Hardware Guide Page 5 of 91
Contents
1Introduction .................................................................................................................. 8
1.1 Instruction.....................................................................................................................8
1.2 Reference Standards....................................................................................................8
1.3 Related Document........................................................................................................9
2Product Overview........................................................................................................11
2.1 Product Introduction ...................................................................................................11
2.2 Product Specification..................................................................................................12
2.3 Functional Block Diagram...........................................................................................14
2.4 Pin Definition..............................................................................................................16
2.4.1 Pin Assignment................................................................................................................... 16
2.4.2 Pin Descriptions.................................................................................................................. 17
3Application Interface...................................................................................................27
3.1 Power Supply .............................................................................................................27
3.1.1 Power Input.........................................................................................................................27
3.1.2 VRTC.................................................................................................................................. 28
3.1.3 Power Output...................................................................................................................... 29
3.2 Control Signal.............................................................................................................30
3.2.1 Power on/off........................................................................................................................30
3.2.1.1 Power on ...................................................................................................................................30
3.2.1.2 Power off ...................................................................................................................................31
3.2.1.3 Sleep/Wake up ..........................................................................................................................31
3.2.2 Reset...................................................................................................................................32
3.2.3 Volume Control................................................................................................................... 32
3.3 USB............................................................................................................................32
3.4 UART .........................................................................................................................35
3.5 SPI .............................................................................................................................36
3.6 (U)SIM........................................................................................................................37
3.7 SDIO ..........................................................................................................................38
3.8 GPIO..........................................................................................................................39
3.9 I2C..............................................................................................................................41
3.10 RBG ...........................................................................................................................42
3.11 ADC............................................................................................................................42
3.12 Battery Power Supply Interface ..................................................................................43

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3.13 Charge Enable Interface.............................................................................................44
3.14 Vibration Motor Driver Interface..................................................................................44
3.15 LCM............................................................................................................................44
3.16 TP...............................................................................................................................46
3.17 Camera ......................................................................................................................47
3.17.1 Rear Camera.................................................................................................................... 49
3.17.2 Front Camera....................................................................................................................50
3.17.3 Depth Camera .................................................................................................................. 51
3.17.4 Design Notice ................................................................................................................... 51
3.18 Sensor........................................................................................................................53
3.19 Audio..........................................................................................................................53
3.19.1 Audio Interface Pin Definition...........................................................................................53
3.19.2 Microphone Circuit Design ............................................................................................... 55
3.19.3 Earpiece Circuit Design.................................................................................................... 55
3.19.4 Headset Circuit Design.....................................................................................................56
3.19.5 Speaker Circuit Design.....................................................................................................56
3.20 Force Download Interface...........................................................................................57
4Antenna Interface........................................................................................................58
4.1 MAIN/DRX Antenna....................................................................................................58
4.1.1 Operating Band..................................................................................................................58
4.1.2 Antenna Reference Design ................................................................................................ 60
4.2 WIFI/BT Antenna ........................................................................................................60
4.2.1 WIFI/BT Operating Frequency ........................................................................................... 60
4.2.2 WIFI/BT Antenna Reference Design.................................................................................. 61
4.3 GNSS Antenna...........................................................................................................61
4.3.1 Operating Frequency..........................................................................................................61
4.3.2 GNSS Antenna Reference Design..................................................................................... 61
4.3.2.1 Passive Antenna Reference Design:.........................................................................................61
4.3.2.2 Active Antenna Reference Design.............................................................................................62
4.4 Antenna Requirement.................................................................................................63
5RF PCB Layout Design Guide....................................................................................65
6WIFI and Bluetooth......................................................................................................67
6.1 WIFI Overview............................................................................................................67
6.2 WIFI Performance ......................................................................................................67
6.3 Bluetooth Overview ....................................................................................................68

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6.4 Bluetooth Performance...............................................................................................68
7GNSS............................................................................................................................69
7.1 Overview ....................................................................................................................69
7.2 Performance...............................................................................................................69
8Electrical, Reliability and RF Performance................................................................70
8.1 Recommended Parameters........................................................................................70
8.2 Absolute Maximum Ratings........................................................................................70
8.3 Power Consumption...................................................................................................70
8.4 RF Transmit Power.....................................................................................................77
8.5 RF Receiver Sensitivity...............................................................................................79
8.6 Electrostatic Protection...............................................................................................82
9Structural Specification..............................................................................................83
9.1 Product Appearance...................................................................................................83
9.2 Structural Dimension..................................................................................................83
9.3 PCB Soldering Pad and Stencil Design......................................................................84
10 Production and Storage .......................................................................................85
10.1 SMT............................................................................................................................85
10.2 Carrier and Storage....................................................................................................85
Appendix A Terms and Acronyms....................................................................................86
Appendix B GPRS Encoding Scheme..............................................................................89
Appendix C GPRS Multislot..............................................................................................90
Appendix D EDGE Modulation and Encoding Method...................................................91

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1 Introduction
1.1 Instruction
This document describes the electrical characteristics, RF performance, structure size, application
environment, etc. of SU806 series module. With the assistance of the document and other instructions,
the developers can quickly understand the hardware functions of the SU806 series module and develop
products.
1.2 Reference Standards
The design of product refers to the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio transmission
and reception (FDD); Part 1: Conformance specification
3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio transmission
and reception (TDD)
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)
3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8:AT command set for User Equipment (UE)
3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE
- DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
IEEE 802.11n WLAN MAC and PHY, October 2009+ IEEE 802.11-2007 WLAN MAC and PHY, June
2007
IEEE Std 802.11b, IEEE Std 802.11d, IEEE Std 802.11e, IEEE Std 802.11g, IEEE Std 802.11i:
IEEE 802.11-2007 WLAN MAC and PHY, June 2007

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Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0+EDR/2.1/2.1+EDR/3.0/3.0+HS,
August 6, 2009
Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009
1.3 Related Document
FIBOCOM Sx806 Series SMT Design Guide
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
-Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment.
This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Any changes or modifications not expressly approved by the party responsible for compliance
could void the user’s authority to operate the equipment.
Please notice that if the FCC identification number is not visible when the module is
installed inside another device, then the outside of the device into which the module is
installed must also display a label referring to the enclosed module. This exterior label

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can use wording such as the following: “Contains FCC ID: ZMOSU806EAU” any similar wording
that expresses the same meaning may be used.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with a minimum distance of
20cm between the radiator & your body. This transmitter must not be co-located or operating
in conjunction with any other antenna or transmitter.
The module is limited to OEM installation ONLY.
The OEM integrator is responsible for ensuring that the end-user has no manual instruction
to remove or install module.
The module is limited to installation in mobile or fixed application.
A separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and difference antenna configurations.
There is requirement that the grantee provide guidance to the host manufacturer for
compliance with Part 15B requirements.
Hereby, Fibocom Wireless Inc. declares that the radio equipment type SU806-EAU is in compliance with
Directive 2014/53/EU.

2 Product Overview
2.1 Product Introduction
SU806 series smart module integrates core components such as Baseband, eMCP, PMU, Transceiver,
PA; it supports long distance multi-mode communication such as FDD/TDD-LTE, WCDMA, GSM and
WIFI/BT short-distance radio transmission technology, as well as GNSS wireless positioning technology.
SU806 series module is embedded with Android operating system and support various interfaces such as
MIPI/USB/UART/SPI/I2C. It is the optimal solution for the core system of wireless smart products. Its
corresponding network modes and frequency bands are as follows:
Table 2-1 Bands supported of SU806-CN
Mode
Band
GSM/GPRS/EDGE
EGSM900/DCS1800
WCDMA
Band 1/8
FDD-LTE
Band1/3/5/8
TDD-LTE
Band34/38/39/40/41 (2535-2675 MHz)
WIFI 802.11b/g/n
2402-2482 MHz
BT4.2 LE
2402-2480 MHz
GNSS
GPS/BeiDou
Table 2-2 Bands supported of SU806-EAU
Mode
Band
GSM/GPRS/EDGE
GSM850/EGSM900/DCS1800/PCS1900
WCDMA
Band 1/2/5/8
FDD-LTE
Band1/3/5/7/8/20/28
TDD-LTE
Band38/40/41 (2496-2690MHz)
WIFI 802.11b/g/n
2402-2482 MHz
BT4.2 LE
2402-2480 MHz
GNSS
GPS/BeiDou

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2.2 Product Specification
SU806 series module is available in 262 LCC+LGA package that includes 146 LCC pins and 116 LGA
pins. The dimension is 40.5mm×40.5mm×2.8mm. It can be embedded in various M2M applications. It is
suitable for the development of smart devices such as smart POS, cash registers, robots, UAVs, smart
homes, security monitoring and multimedia terminals. Its detailed performance is shown in the following
table.
Table 2-3 Main performance
Performance
Description
Power Supply
DC:3.5~4.2V, typical:3.8V
Application processor
Quad-core ARM® CortexTM A53 MP processor, up to 1.4GHz
Memory
8GB e.MMC+8Gb LPDDR3
16GB e.MMC+16Gb LPDDR3
Power class
Class 4 (33dBm±2dB) for GSM850/EGSM900
Class 1 (30dBm±2dB) for DCS1800/PCS1900
Class E2 (27dBm±3dB) for GSM850/EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800/PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE FDD bands
Class 3 (23dBm±2dB) for LTE TDD bands
GSM/GPRS/EDGE features
R99:
CSD transmission rate:9.6kbps,14.4kbps
GPRS:
Support GPRS multi-slot class 12
Coding formats:CS-1/CS-2/CS-3 and CS-4
4 Rx time slots per frame maximum
EDGE:
Support EDGE multi-slot class 12
Support GMSK and 8-PSK
Uplink encoding formats: CS 1-4 and MCS 1-9
Uplink encoding formats: CS 1-4 and MCS 1-9
WCDMA features
Support 3GPP R9
Support 16-QAM, 64-QAM and QPSK modulation
CAT7 HSUPA: Maximum uplink rate 11Mbps

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Performance
Description
CAT14 HSDPA: Maximum downlink rate 21Mbps
LTE features
Support 3GPP R10
Support FDD/TDD CAT4
Support 1.4-20M RF bandwidth
Downlink support 2 ×2 MIMO
Maximum uplink rate 50Mbps, maximum downlink rate 150Mbps
WLAN features
Support 2.4G WLAN wireless communication, support 802.11b,
802.11g, 802.11n, the maximum rate up to 72.2Mbps
Bluetooth
BT4.2 (BR/EDR+BLE)
Satellite positioning
GPS/BeiDou
SMS
Text and PDU modes
Point-to-Point MO and MT
SMS cell broadcast
SMS storage: stored in the module by default
LCD interface
One 4 lane MIPI_DSI interface
Support maximum HD+ 60fps (1440x720)
Camera interface
Two 4 lane MIPI_CSI interface, can support three cameras;
Main camera can support 13M 30fps at maximum
Audio interface
Audio Input:
3 analog microphone inputs
Integrated internal bias
Audio output:
Class AB stereo headphone output
Class AB differential handset output
Class D differential speaker amplifier output
USB interface
USB2.0 HS interface, with data transfer rate up to 480 Mbps
Support USB OTG (external 5V power supply)
(U)SIM interface
Two (U)SIM card interfaces supporting (U)SIM card: 1.8/3V adaptive
Support dual (U)SIM dual standby single pass, support hot plug
(closed by default)
UART interface
Three UART serial interfaces

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Performance
Description
One 4-line serial interface supporting RTS and CTS hardware flow
control
One 2-line serial interface (reserved)
One 2 line debug serial interface
SDIO interface
Support SD3.0, 4bit SDIO; SD card supports hot plug
I2C interface
Multiple I2C interfaces, can be used for peripherals such as TP,
camera, and sensor
ADC interface
One universal 12bits ADC
RTC
Support
Antenna interface
MAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna
Physical characteristics
Dimension: 40.5mm×40.5mm×2.8mm
Encapsulation: 146 LCC pin + 116 LGApin
Weight: about 9.0g
Temperature range
Operating temperature: -20°C~75°C
Storage temperature: -40°C~95°C
Software update
USB/OTA/SD
RoHS
Comply with RoHS standard
Note:
When the module is operating within this temperature range, the functions of it are normal and the
relevant performance meets the 3GPP standard.
2.3 Functional Block Diagram
Functional diagram shows the main hardware features of the SU806 series module：
Baseband
Wireless transceiver
PMU
Memory
Peripheral interface

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--Communication expansion interface (USB/UART/I2C/SDIO/SPI)
--(U)SIM card interface
--MIPI DSI interface
--MIPI CSI Interface
-- Analog audio interface
Baseband
PMU
TXM
Duplex
SAW
Transceiver
LCM UARTTP
ADC
RESET
PWRKEY
26M
XO
VBAT
SAW
PA
ANT_MAIN ANT_DIV ANT_GNSS
Tx
PRx
Air Interface Memory
ConnectivityMultimedia
CAM
ANT_WIFI/BT
VRTC
LPDDR3
SDRAM
eMMC
Power
Switch
AUDIO
I2CSPI (U)SIM SDIO GPIO USB VoL key
DRx
SAW
SAW
LNA
PRx
Control
Figure 2-1 Functional block diagram

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2.4 Pin Definition
2.4.1 Pin Assignment
Figure 2-2 Pin assignment (top view)
Note:
“NC”represent No Connect, the pin of this position is reserved and does not need to be connected.

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2.4.2 Pin Descriptions
Table 2-4 Parameter and acronym definitions
Symbol
Description
IO
Input/Output
DI
Digital Input
DO
Digital Output
PI
Power Input
PO
Power Output
AI
Analog Input
AO
Analog Output
OD
Open Drain
Pin descriptions of SU806 series module are presented in the following table:
Table 2-5 Pin description
Pin Name
Pin
Number
I/O
Functional Description
Note
Power supply
VBAT
1,2,145,1
46
PI
Main power input
-
VRTC
126
PI/PO
RTC clock power supply
-
VDD1V85
111
PO
IO voltage output
-
VDD1V8
125
PO
Camera IO voltage output
-
VDDCAMMOT
152
PO
Power output for camera moto
-
VDDSDCORE
38
PO
Power output for SD card, 3V
by default
-
VDDSDIO
32
PO
Power output for SD IO, 3V by
default
-
VDDSIM1
26
PO
Power output for (U)SIM card 1
-

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Pin Name
Pin
Number
I/O
Functional Description
Note
VDDSIM2
21
PO
Power output for (U)SIM card 2
-
VDDCAMA
129
PO
Output for camera analog
power, 2.8V by default
-
VDDCAMCORE
151
PO
Output for camera digital power
-
VDD2V8
228
PO
2.8V voltage output
-
VIB_DRV_N
28
PO
Vibrator drive output
Can be configured as or
LDO mode
GND
3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89,
120, 122, 130, 132, 135, 140, 143, 144, 147, 148,
149, 150, 160-178, 180-182, 184-186, 188, 189,
192, 193, 198, 200, 201, 208, 209, 211-218, 221,
235, 245, 246, 250, 251, 262
Ground
Battery supply interface
CHARGE_SEL
127
DI
Charge modes select
Reserved
VBAT_SNS
133
AI
Battery voltage sense
-
VBAT_THERM
134
AI
Battery thermistor output
-
SENSE_N
258
AI
Battery fuel gauge negative
input
Reserved
SENSE_P
259
AI
Battery fuel gauge positive
input
Reserved
Key
KEY_FORCE_BOO
T
46
DI
Force download
Active low
KEY_VOL_UP
95
DI
Volume+ key
Active low
KEY_VOL_DOWN
96
DI
Volume- key
Active low
KEY_PWR_ON
114
DI
Power key 1
Active low
KEY_RESIN_N
179
DI
Reset key
Active low, support two
key(KEY_PWR_ON&
KEY_RESIN_N)reset and
one key(KEY_PWR_ON)

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Pin Name
Pin
Number
I/O
Functional Description
Note
reset
CBL_PWR_N
261
DI
Power on key 2, just have
power on function
Active low
(U)SIM card interface
UIM2_DATA
20
I/O
(U)SIM card 2 data
-
UIM2_CLK
19
DO
(U)SIM card 2 clock
-
UIM2_RST
18
DO
(U)SIM card 2 reset
-
UIM2_DET
17
DI
(U)SIM card 2 hot plug
detection
Disabled by default,
cannot used as general
GPIO
UIM1_DATA
25
I/O
(U)SIM card 1 data
-
UIM1_CLK
24
DO
(U)SIM card 1 clock
-
UIM1_RST
23
DO
(U)SIM card 1 reset
-
UIM1_DET
22
DI
(U)SIM card 1 hot plug
detection
Disabled by default,
cannot used as general
GPIO
SDIO interface
SD_DET
45
DI
SD card detect
Active low
SD_DATA3
44
I/O
SD card data 3
-
SD_DATA2
43
I/O
SD card data 2
-
SD_DATA1
42
I/O
SD card data 1
-
SD_DATA0
41
I/O
SD card data 0
-
SD_CMD
40
I/O
SD card command
-
SD_CLK
39
DO
SD card clock
-
I2C interface
SENSOR_I2C_SCL
91
DO
I2C clock
For sensor by default
SENSOR_I2C_SDA
92
I/O
I2C data
For sensor by default

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FIBOCOM SU806 Series Hardware Guide Page 20 of 91
Pin Name
Pin
Number
I/O
Functional Description
Note
TP_I2C_SCL
47
DO
I2C clock
For touch panel by default
TP_I2C_SDA
48
I/O
I2C data
For touch panel by default
CAM_I2C_SCL0
83
DO
I2C clock
For rear camera by
default
CAM_I2C_SDA0
84
I/O
I2C data
For rear camera by
default
CAM_I2C_SCL1
239
DO
I2C clock
For front/depth camera by
default
CAM_I2C_SDA1
240
I/O
I2C data
For front/depth camera by
default
USB interface
USB_VBUS
141,142
PI
USB 5V input
-
USB_DP
14
AI/AO
USB HS data+
-
USB_DM
13
AI/AO
USB HS data-
-
USB_ID
16
DI
USB OTG detection
-
UART interface
UART0_TX
34
DO
UART0 data transmission
-
UART0_RX
35
DI
UART0 data reception
-
UART0_CTS
36
DI
UART0 clear to send
-
UART0_RTS
37
DO
UART0 request to send
-
UART1_TX
94
DO
UART1 data transmission
Debug_UART serial port
UART1_RX
93
DI
UART1 data reception
UART2_TX
226
DO
UART2 data transmission
Reserved
UART2_RX
225
DI
UART2 data reception
Reserved
SPI interface
SPI_CLK
116
DO
SPI clock
-
SPI_CS
117
DO
SPI chip selects
-