Fibocom L860-GL-16 Installation instructions

FIBOCOM L860-GL-16
Hardware Guide
Version: 1.0.0
Date: 2020-09-28
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Applicability Type
No.
Product Model
Description
1
L860-GL-16
NA
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Copyright
Copyright © 2019 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other reasons.
Unless otherwise specified, the document only serves as the user guide. All the statements, information
and suggestions contained in the document do not constitute any explicit or implicit guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
FCC Conformance information
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the
instructions, require that the host product manufacturer must notify to Fibocom Wireless Inc.XXXX that
they wish to change
the antenna trace design. In this case, a Class II permissive change application is required to be filed
by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new
application) procedure followed by a Class II permissive change application.
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End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window
on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains
FCC ID: ZMOL860GL16”
“Contains IC: 21374-L860GL16 “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
Antenna type
PIFA
Antenna type
PIFA
Bands
Peak Gain
Bands
Peak Gain
WCDMA B2
4
LTE B17
3
WCDMA B4
3
LTE B25
4
WCDMA B5
3
LTE B26
3
LTE B2
4
LTE B30
1
LTE B4
3
LTE B38
4
LTE B5
3
LTE B41
4
LTE B7
4
LTE B48
1
LTE B12
3
LTE B66
3
LTE B13
3
LTE B71
3
LTE B14
3
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible
for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC
authorization.
Manual Information to the End User
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The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
List of applicable FCC rules
This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and
15.407 part 15B requirements for Modular Approval.
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter
rules) listed on the grant, and that the host product manufacturer is responsible for compliance to
any other FCC rules that apply to the host not covered by the modular transmitter grant of
certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also
contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that
the final host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
This device is intended only for OEM integrators under the following conditions: (For
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module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.
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Change History
Version
Author
Date
Remark
V1.0.0
Shu Ying
2020-09-28
Draft version
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Contents
1Foreword......................................................................................................................10
1.1 Introduction.................................................................................................................10
1.2 Reference Standard ...................................................................................................10
1.3 Related Documents ....................................................................................................10
2Overview ......................................................................................................................11
2.1 Introduction.................................................................................................................11
2.2 Specification ...............................................................................................................11
2.3 CA Combinations........................................................................................................13
2.4 Application Framework ...............................................................................................15
2.5 Hardware Block Diagram............................................................................................15
2.6 Antenna Configuration................................................................................................16
3Application Interface...................................................................................................17
3.1 M.2 Interface ..............................................................................................................17
Pin Map .........................................................................................................................17
Pin Definition ................................................................................................................. 18
3.2 Power .........................................................................................................................22
Power Supply ................................................................................................................23
Logic Level ....................................................................................................................24
Power Consumption...................................................................................................... 25
3.3 Control Signal.............................................................................................................26
Module Start-Up ............................................................................................................27
3.3.1.1 Start-up Circuit...........................................................................................................................27
3.3.1.2 Start-up Timing Sequence .........................................................................................................27
Module Shutdown ......................................................................................................... 28
Module Reset ................................................................................................................29
PCIe Link State .............................................................................................................31
3.3.4.1 D0 L1.2......................................................................................................................................32
3.3.4.2 D3cold L2.....................................................................................................................................32
Timing Application ......................................................................................................... 34
3.4 PCIe Interface ............................................................................................................34
PCIe Interface Definition ............................................................................................... 35
PCIe Interface Application............................................................................................. 36
3.5 USIM Interface............................................................................................................37
USIM1 Pins ...................................................................................................................38
USIM Interface Circuit...................................................................................................38
3.5.2.1 N.C. SIM Card Slot ....................................................................................................................38
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3.5.2.2 N.O. SIM Card Slot....................................................................................................................39
USIM Hot-Plug .............................................................................................................. 39
USIM Design ................................................................................................................. 40
3.6 Status Indicator...........................................................................................................40
LED#1 Signal ................................................................................................................ 40
WOWWAN# ..................................................................................................................41
3.7 Interrupt Control..........................................................................................................42
W_DISABLE1#..............................................................................................................42
BODYSAR..................................................................................................................... 42
ANT_CONFIG ............................................................................................................... 43
3.8 ANT Tunable Interface................................................................................................43
3.9 Configuration Interface ...............................................................................................44
3.10 I2C Interface...............................................................................................................44
I2C Pins......................................................................................................................... 44
4Radio Frequency .........................................................................................................45
4.1 RF Interface................................................................................................................45
RF Interface Functionality ............................................................................................. 45
RF Connector Characteristic.........................................................................................45
RF Connector Dimension..............................................................................................45
RF Connector Assembly ............................................................................................... 47
4.2 Operating Band ..........................................................................................................48
4.3 Transmitting Power.....................................................................................................49
4.4 Receiver Sensitivity ....................................................................................................50
Dual Antennas Receiver Sensitivity .............................................................................. 50
Four Antennas Receiver Sensitivity .............................................................................. 51
4.5 GNSS .........................................................................................................................52
4.6 Antenna Design..........................................................................................................52
5ESD Characteristics ....................................................................................................54
6Structure Specification ...............................................................................................55
6.1 Product Appearance ...................................................................................................55
6.2 Dimension of Structure ...............................................................................................55
6.3 M.2 Interface Model....................................................................................................56
6.4 M.2 Connector............................................................................................................57
6.5 Storage.......................................................................................................................58
6.6 Packing ......................................................................................................................58
Tray Package ................................................................................................................58
Tray Size ....................................................................................................................... 60
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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L860-GL-GL (hereinafter referred to as L860). With the assistance of the document
and other instructions, the developers can quickly understand the hardware functions of L860 modules
and develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission
and reception (FDD); Part 1: Conformance specification
3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio
transmission and reception (TDD)
3GPP TS 36.521-1 V13.4.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-
ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit (USAT)
3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
PCI Express M.2 Specification Rev1.2
1.3 Related Documents
FIBOCOM Design Guide_RF Antenna
FIBOCOM L860 Series AT Commands_V3.4.1
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2 Overview
2.1 Introduction
L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE
FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the
world.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 2, 4, 5, 7, 12, 13, 14, 17, 25, 26, 29, 30, 66, 71
LTE TDD: Band 38, 41(HPUE), 48
LAA Band 46 Receiver only
4x4MIMO support: Band 2, 4, 7, 25, 30, 38, 41, 48, 66
WCDMA/HSPA+: Band 2, 4, 5
GNSS
Support GPS, BDS, GLONASS, Galileo
LTE
3GPP Release 13
UMTS
3GPP Release 12
Data Transmission
LTE FDD
LTE FDD: 1Gbps DL (Cat 16)/50Mbps UL (Cat 13)
LTE TDD
LTE TDD: 756Mbps DL (Cat 16)/90Mbps UL (Cat 13)
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSPA+:42 Mbps DL (Cat 24)/5.76 Mbps UL (Cat6)
Carrier Aggregation
5CA Downlink /2*ULCA (Intra band) UL 64QAM Support
Power Supply
DC 3.135V-4.4V, Typical 3.3V
Temperature
Normal operating temperature: -10°C-+55°C
Extended operating temperature: -20°C-+65°C
Storage temperature: -40°C-+85°C
Physical
Characteristics
Interface: M.2 Key-B
Dimension：30×42×2.3mm
Weight: About 6.2 g
Interface
Antenna Connector
WWAN Antenna×4
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Specification
Support 4×4 MIMO
Function Interface
Dual SIM, 1.8V/3V
PCIe 2.0×1
USB 2.0 (For debug)
USB 3.0 (For debug)
W_Disable#
BodySAR
LED
Tunable antenna
UART
Software
Protocol Stack
IPV4/IPV6
AT Commands
3GPP TS 27.007 and 27.005
Firmware Update
PCIe
Other Feature
Multiple carrier
Windows MBIM support
Windows update
OS
Windows10/Linux/Android
Note:
B42 disabled as of FCC certification, support pending regulatory approval.
When temperature goes beyond normal operating temperature range of -10°C-+55°C, RF
performance of module may be slightly off 3GPP specifications.
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2.3 CA Combinations
UL CA Combination
2CA
Intra-band
5B,7C,41C,66B,66C
DL CA Combination
2CA
Inter-band
2+4, 5, 12, 13, 14, 29, 30, 46,48, 66,71
4+5, 12, 13, 29, 30, 46,48,71
5+7, 30, 46, 66,48
12+30, 66
13+46, 66,48
14+30, 66
25+26, 41, 46
26+41
29+30, 66
30+66
41+46
46+66
48+66
Intra-band (non-contiguous)
2, 4, 7, 25, 41,48, 66
Intra-band (contiguous)
2, 5, 7, 38, 41, 48, 66
3CA
Inter-band
2+4+5, 2+4+12, 2+4+13,2+4+71, 2+5+30 ,2+5+48,
2+12+30, 2+29+30, 2+5+66, 2+13+66, 2+14+30,
2+14+66, 2+30+66, 2+5+46, 2+13+46, 2+46+66,
2+12+66,2+13+48,2+66+71
4+5+30, 4+12+30, 4+29+30
5+30+66, 5+46+66,5+48+66
12+30+66, 13+46+66, 13+48+66,14+30+66, 29+30+66
2 intra-band (non-contiguous)
plus inter-band
2+2+5, 2+2+12, 2+2+13, 2+2+30, 2+2+66, 2+4+4,
2+46+46,2+66+66,2+2+4,2+2+14,2+2+71,2+2+46
4+4+5, 4+4+12, 4+4+13, 4+46+46,
5+66+66,4+4+7,5+5+66,5+48+48
12+66+66, 13+66+66, 46+46+66, 29+66+66,
30+66+66,13+48+48,14+66+66,46+66+66,48+48+66,66
+66+71
2 intra-band (contiguous) plus
inter-band
2+5+5, 2+46+46, 2+66+66
4+46+46, 5+5+30, 5+5+66, 5+46+46, 5+66+66,
4+5+5,5+48+48,5+66+66,5+5+46,7+7+46,7+46+46,
13+46+46, 13+66+66, 25+41+41, 26+41+41,
46+46+66,13+48+48,13+66+66, 48+66+66,
48+48+66,66+66+71
Intra-band (non-contiguous)
41, 66
Intra-band (contiguous)
41,48
4CA
Inter-band
2+5+30+66, 2+12+30+66, 2+14+30+66
2 intra-band (non-contiguous)
plus 2 inter-band
2+2+5+66, 2+2+12+30, 2+2+12+66, 2+2+13+66,
2+5+66+66, 2+12+66+66, 2+13+66+66, 5+30+66+66,
29+30+66+66,1+1+3+7,
2+2+4+71,2+2+14+66,2+2+66+71,2+14+66+66,2+66+6
6+71,
2 intra-band (contiguous) plus
2 inter-band
2+5+5+30, 2+5+5+66, 2+5+46+46, 2+13+46+46,
2+46+46+46, 2+46+46+66, 2+5+66+66, 2+13+66+66,
2+66+66+71,
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DL CA Combination
4+46+46+46, 5+5+30+66, 5+46+46+66, 13+46+46+66,
66+46+46+46, 13+48+66+66,13+48+48+66,
2 intra-band (contiguous) plus
2 intra-band (contiguous)
5+5+66+66,5+5+46+46,7+7+46+46,48+48+66+66,
2 intra-band (contiguous) plus
2 intra-band (non-contiguous)
5+5+66+66,2+2+46+46,46+46+66+66,
2+2+5+5,2+2+66+66,4+4+5+5,48+48+66+66,
3 intra-band (contiguous) plus
inter-band
2+46+46+46, 3+40+40+40, 4+46+46+46, 5+46+46+46,
13+46+46+46, 25+41+41+41,
66+46+46+46,7+46+46+46,
Intra-band (non-contiguous)
41
Intra-band (contiguous)
48,41
5CA
2 intra-band (contiguous) plus 2
intra-band (contiguous) plus
inter-band
2+46+46+46+46,
46+46+46+46+66,2+5+5+66+66,13+48+48+66+66,48+4
8+48+66+66
2 intra-band (contiguous) plus 3
inter-band
2+5+5+30+66
2 intra-band (contiguous) plus 2
intra-band (non-contiguous)
plus inter-band
2+5+5+66+66 , 2+2+5+66+66,
2+2+13+66+66,13+48+48+66+66
3 intra-band (contiguous) plus 2
intra-band (non-contiguous)
2+2+46+46+46,
3 intra-band (contiguous) plus 2
inter-band
2+5+46+46+46, 2+13+46+46+46, 2+46+46+46+46,
2+46+46+46+66, 4+46+46+46+46, 5+46+46+46+66,
13+46+46+46+66, 46+46+46+46+66
3 intra-band (contiguous) plus 2
intra-band (contiguous)
46+46+46+66+66,5+5+46+46+46,7+7+46+46+46
4 intra-band (contiguous) plus
inter-band
2+46+46+46+46, 5+46+46+46+46, 13+46+46+46+46,
46+46+46+46+66
Intra-band (contiguous)
41,48
Intra-band (non-contiguous)
41
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2.4 Application Framework
The peripheral applications for L860 module are shown in Figure 2-1:
Module
SIM1 USB2.0
Power
Supply ON/OFF# RESET#
Control
EINT Indicator
Host application
D/G(AUX1) ANT Main ANT
SIM
Card
PCIe
e-SIM
M2(AUX3) ANT M1(AUX2) ANT
Figure 2-1 Application framework
2.5 Hardware Block Diagram
The hardware block diagram in Figure 2-2 shows the main hardware functions of L860 module, including
baseband and RF functions.
Baseband contains the followings:
UMTS/LTE controller
PMU
NAND/internal LPDDR4 RAM
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front end
RF Filter
Antenna Connector
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Baseband
(LTE FDD/LTE TDD/UMTS controller)
PMU
M.2 Key-B 75pin interface
RF
Transceiver
NAND
TX
Main RX Duplexer
PA DCDC
XB LNA
UB PA
Main MB
FEMiD
Main LB
FEMiD
RF SAW
M (Main)
ANT
M1(AUX2)
ANT
M1(AUX3)
ANT
D/G(AUX1)
ANT
RF Part
SAW
GNSS
SAW
Main HB
FEMiD
TRX SAW
XB LNA
Coupler
Tiplexer
MB/HB FEM
(4×4 MIMO)
MB/HB FEM
(4×4 MIMO)
Div
MB/HB/UB
FEM
Div
LB FEM
GNSS
LNA
RF SAW
GNSS
Extractor
Tiplexer
GNSS
SAW
Div RX
4th Div RX
3rd Div RX
SAW
LPDDR4
RAM
DigRF RX
TCXO
VDD_IO_1V8
GPIO
+3.3V
FULL_CARD_POWER_OFF#
RESET#
PCIe
USB2.0
USB3.0
USIM1
EINT
WOWWAN#
LED
I2C
MIPI_RFFE
UART_TX
UART_RX
Tunable ANT
Figure 2-2 Hardware block diagram
2.6 Antenna Configuration
L860 module support four antennas and the configuration is as below table:
Antenna Connector
Function Description
Band Configuration
M
Main ANT
All supported bands transmit & receive
M1
MIMO1 ANT
4×4 MIMO supported bands receive
M2
MIMO2 ANT
4×4 MIMO supported bands receive
D/G
Diversity & GNSS ANT
All supported bands and GNSS receive
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3 Application Interface
3.1 M.2 Interface
The L860 module applies standard M.2 Key-B interface, with a total of 75 pins.
Pin Map
Figure 3-1 Pin map
Note:
Pin “Notch” represents the gap of the gold fingers.
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
10
8
6
4
38
36
34
32
30
28
26
24
22
2
NC
I2C_IRQ#(1.8V)
I2C_SDA(1.8V, I2C Slave/Master)
I2C_SCL(1.8V, I2C Slave/Master)
+3.3V
+3.3V
+3.3V
ANT_CONFIG(1.8V)
SIM1_DETECT(1.8V)
COEX_TXD(1.8V)
COEX_RXD(1.8V)
COEX3(1.8V)
RFE_RFFE_SDATA
Notch
LED1#(3.3V OD)
W_DISABLE1#(3.3/1.8V)
FULL_CARD_POWER_OFF#(3.3/1.8V)
+3.3V
PEWAKE# (3.3V)
CLKREQ# (3.3V)
PERST# (3.3V)
NC
20
USB D+
GND
GND
+3.3V
UIM1_RESET
UART_RX(1.8V, mux for GPIO)
W_DISABLE2#(3.3/1.8V)
ANT_TUNER_1V8(1.8V, mux for GPIO)
UART_TX(1.8V, mux for ANT_TUNER_CFG/GPIO)
Notch
USB3.0-Tx‐
GND
DPR(3.3/1.8V)
WOWWAN#(1.8V)
CONFIG_0
Notch
Notch
Notch
USB D-
CONFIG_2
VIO_CFG
GND
CONFIG_1
RESET#(1.8V)
ANTCTL3(1.8V)
ANTCTL2(1.8V)
ANTCTL1(1.8V)
ANTCTL0(1.8V)
GND
REFCLKP
REFCLKN
GND
PERp0
PERn0
GND
PETp0
PETn0
GND
USB3.0-Rx+
USB3.0-Rx‐
GND
GND
CONFIG_3
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
3
41
1
11
21
23
GPIO(1.8V)
Notch
Notch
Notch
USB3.0-Tx+
NC
UIM1_PWR
UIM1_DATA
UIM1_CLK
RFE_RFFE_SCLK
9
7
5
39
37
35
33
31
29
27
25
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FIBOCOM L860-GL Series Hardware Guide Page 18 of 60
Pin Definition
The pin definition is as follows:
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
1
CONFIG_3
O
NC
NC, L860 M.2 module is configured as
the WWAN –PCIe, USB3.0 interface
type
2
+3.3V
PI
-
Power input
Power Supply
3
GND
-
-
GND
Power Supply
4
+3.3V
PI
-
Power input
Power Supply
5
GND
-
-
GND
Power Supply
6
FULL_CARD_
POWER_OFF#
I
PU
Power enable, module power on input,
internal pull up
3.3/1.8V
7
USB D+
I/O
USB data plus, only for debug
0.3---3V
8
W_DISABLE1#
I
PD
WWAN disable, active low
3.3/1.8V
9
USB D-
I/O
USB data minus, only for debug
0.3---3V
10
LED1#
OD
T
System status LED, output open drain,
CMOS 3.3V
3.3V
11
GND
-
-
GND
Power Supply
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
GPIO
O
PD
GPIO(High-z)
UART_RTS (Reserved)
1.8V
21
CONFIG_0
NC
NC, L860 M.2 module is configured as
the WWAN –PCIe, USB3.0 interface
type
22
UART_TX
O
PD
UART_TX, MUX for
ANT_TUNER_CONFIG/GPIO(High-z)
1.8V
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FIBOCOM L860-GL Series Hardware Guide Page 19 of 60
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
23
WOWWAN#
O
PD
Wake up host,
Reserved
1.8V
24
ANT_TUNER_1V8
PO
IO
PD
1.8V output for ANT Tuner
GPIO(High-z)
UART_CTS (Reserved)
Power Supply
/1.8V
25
DPR
I
PD
BodySAR detect, active low
3.3/1.8V
26
W_DISABLE2#
I
PD
GNSS disable, active low,
Reserved
3.3/1.8V
27
GND
-
-
GND
Power Supply
28
UART_RX
I
PD
UART_RX, MUX for GPIO(High-z)
1.8V
29
USB3.0_TX-
O
USB3.0 transmit data minus,
only for debug
30
UIM_RESET
O
L
SIM reset signal
1.8V/3V
31
USB3.0_TX+
O
USB3.0 transmit data plus,
only for debug
32
UIM_CLK
O
L
SIM clock signal
1.8V/3V
33
GND
-
-
GND
Power Supply
34
UIM_DATA
I/O
L
SIM data input/output
1.8V/3V
35
USB3.0_RX-
I
USB3.0 receive data minus,
only for debug
36
UIM_PWR
O
SIM power supply, 1.8V/3V
1.8V/3V
37
USB3.0_RX+
I
USB3.0 receive data plus,
only for debug
38
NC
NC
39
GND
-
-
GND
Power Supply
40
I2C_SCL
I
PU
Master I2C1 CLK
1.8V
41
PETn0
O
PCIe TX differential signal
Negative
42
I2C_SDA
I/O
PU
Master I2C1 DATA
1.8V
43
PETp0
O
PCIe TX differential signal
Positive
44
I2C_IRQ#
O
PD
I2C1 INT, Wake up I2C HOST
1.8V
45
GND
-
-
GND
Power Supply
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FIBOCOM L860-GL Series Hardware Guide Page 20 of 60
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
46
NC
NC
47
PERn0
I
PCIe RX differential signal
Negative
48
NC
NC
49
PERP0
I
PCIe RX differential signal
Positive
50
PERST#
I
PU
Asserted to reset module PCIe
interface default. If module went into
core dump, it will reset whole module,
not only PCIe interface.
Active low, internal pull up (10KΩ)
3.3V
51
GND
-
-
GND
Power Supply
52
CLKREQ#
O
PU
Asserted by device to request a PCIe
reference clock be available (active
clock state) in order to transmit data. It
also used by L1 PM Sub states
mechanism, asserted by either host or
device to initiate an L1 exit.
Active low, internal pull up (10KΩ)
3.3V
53
REFCLKN
I
PCIe reference clock signal
Negative
54
PEWAKE#
O
L
Asserted to wake up system and
reactivate PCIe link from L2 to L0, it
depends on system whether supports
wake up functionality.
Active low, open drain output and
should add external pull up (100KΩ) on
platform
3.3V
55
REFCLKP
I
PCIe reference clock signal, Positive
56
RFFE_SCLK
O
PD
MIPI interface tunable ANT,
RFFE clock
1.8V
57
GND
GND
Power Supply
58
RFFE_SDATA
I/O
PD
MIPI interface tunable ANT,
RFFE data
1.8V
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