Fibocom L830-EB User manual

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L830-EBHardware User Manual Page 1 of 39
L830-EB Hardware User Manual
Version: V1.0.3
Update date: 2017.06.26

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Applicability Table
No.
Product model
Description
1
L830-EB-11
NA

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Copyright
Copyright © 2017 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Version Record
Version
Update
Remark
V1.0.0
2017-03-06
Initial version
V1.0.1
2017-04-05
1. Delete SSIC section and description
2. Modify power consumption and RF performance “TBD”
V1.0.2
2017-06-02
Update RF band support,Modify I2S support
V1.0.3
2017-06-24
1. Modify timing diagram
2. Update power consumption and RF performance data

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L830-EB Hardware User Manual Page 4 of 39
Contents
1 Preface...................................................................................................................................................... 6
1.1 Introduction ..................................................................................................................................... 6
1.2 Reference Standard........................................................................................................................ 6
1.3 Related Documents ........................................................................................................................ 6
2 Overview.................................................................................................................................................... 7
2.1 Introduction ..................................................................................................................................... 7
2.2 Specification.................................................................................................................................... 7
2.3 Application Framework.................................................................................................................... 8
2.4 Hardware Framework ..................................................................................................................... 9
3 Application Interface.................................................................................................................................. 9
3.1 M.2 Interface................................................................................................................................... 9
3.1.1 Pin Map............................................................................................................................... 10
3.1.2 Pin Definition........................................................................................................................11
3.2 Power Supply................................................................................................................................ 14
3.2.1 Power Supply...................................................................................................................... 15
3.2.2 Logic level........................................................................................................................... 16
3.2.3 Power Consumption........................................................................................................... 16
3.3 Control Signal ............................................................................................................................... 17
3.3.1 Module Start-Up.................................................................................................................. 18
3.3.1.1 Start-up Circuit.......................................................................................................... 18
3.3.1.2 Start-up Timing Sequence........................................................................................ 19
3.3.2 Module Shutdown............................................................................................................... 19
3.3.2.1 Software Shutdown.................................................................................................. 19
3.3.2.2 Hardware Shutdown................................................................................................. 20
3.3.3 Module Reset...................................................................................................................... 21
3.4 USB Interface................................................................................................................................ 22
3.4.1 USB Interface Definition..................................................................................................... 22
3.4.2 USB Interface Application................................................................................................... 22
3.5 USIM Interface.............................................................................................................................. 23
3.5.1 USIM Pins........................................................................................................................... 23
3.5.2 USIM Interface Circuit ........................................................................................................ 23
3.5.2.1 N.C. SIM Card Slot................................................................................................... 23
3.5.2.2 N.O. SIM Card Slot................................................................................................... 24
3.5.3 USIM Hot-Plugging............................................................................................................. 24

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3.5.4 USIM Design....................................................................................................................... 25
3.6 Status Indicator............................................................................................................................. 26
3.6.1 LED#1 Signal...................................................................................................................... 26
3.6.2 WOWWAN#........................................................................................................................ 27
3.7 Interrupt Control............................................................................................................................ 27
3.7.1 W_DISABLE1#................................................................................................................... 27
3.7.2 Body SAR........................................................................................................................... 27
3.8 Digital Audio.................................................................................................................................. 28
3.8.1 I2S Mode ............................................................................................................................ 28
3.8.2 PCM Mode.......................................................................................................................... 29
3.9 I2C Interface Description.............................................................................................................. 29
3.10 Clock Interface............................................................................................................................ 30
3.11 Configuration Interface................................................................................................................ 30
3.12 Other Interfaces.......................................................................................................................... 31
4 Radio Frequency..................................................................................................................................... 31
4.1 RF Interface .................................................................................................................................. 31
4.1.1 RF Interface Functionality................................................................................................... 31
4.1.2 RF Connector Characteristic.............................................................................................. 31
4.1.3 RF Connector Dimension................................................................................................... 31
4.2 Operating Band............................................................................................................................. 33
4.3 Transmitting Power....................................................................................................................... 33
4.4 Receiver Sensitivity....................................................................................................................... 34
4.5 GNSS............................................................................................................................................ 34
4.6 Antenna Design............................................................................................................................. 34
5 Structure Specification............................................................................................................................. 35
5.1 Product Appearance ..................................................................................................................... 35
5.2 Dimension of Structure ................................................................................................................. 35
5.3 M.2 Interface Model...................................................................................................................... 36
5.4 M.2 Connector .............................................................................................................................. 36
5.5 Storage.......................................................................................................................................... 37
5.5.1 Storage Life......................................................................................................................... 37
5.6 Packing ......................................................................................................................................... 37
5.6.1 Tray Package...................................................................................................................... 38
5.6.2 Tray size ............................................................................................................................. 39

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1 Preface
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L830-EB (hereinafter referred to as L830). With the assistance of the document and
other instructions, the developers can quickly understand the hardware functions of L830 modules and
develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
PCI_Express_M.2_Specification_Rev1.1
1.3 Related Documents
RF Antenna Application Design Specification
L8-Family System Driver Integration andApplication Guidance
L8-FamilyAT Commands Manual

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2 Overview
2.1 Introduction
The L830 is a highly integrated 4G cellular module which uses the standard PCIe M.2 interface.It supports
LTE FDD/WCDMA mode cellular communication.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 1,3,7,8,20,28,32
WCDMA/HSPA+: Band I, VIII
GPS/GLONASS: Not Support
CA
LTE inter-band CA
1 +3,7,20
3 +7,8,20,28,32
7 +20,28
LTE intra-band CA
3,7
Data
Transmission
LTE FDD
300Mbps DL/50Mbps UL(Cat 6)
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
Power Supply
DC 3.135V～4.4V, Typical 3.3V
Temperature
Normal Operating temperature：-10°C ～+55°C
Extended Operating temperature：-30°C ～+65°C
Storage temperature：-40°C ～+85°C
Physical
characteristics
Interface: M.2 Key-B
Dimension：30 x 42 x 2.3mm
Weight: About 5.8 g
Interface
Antenna
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1
Function Interface
USIM 3V/1.8V

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L830-EB Hardware User Manual Page 8 of 39
USB 2.0 x 1
I2S
I2C
EINT、System Indicator
Clock
Software
Protocol Stack
IPV4/IPV6
AT commands
3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands
Firmware update
USB
2.3 Application Framework
The peripheral applications for L830 module are shown in Figure 2-1:
Module
SIM USB
Power
Supply ON/OFF# RESET#
Control
EINT Indicator
Host application
Main ANT Div/GNSS ANT
SIM
Card
Figure2-1Application Framework

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2.4 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L830 module, including
baseband and RF functions.
Baseband contains the followings:
UMTS/LTE FDD controller/Power supply
NAND/internal LPDDR2 RAM
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front end
RF Filter
Antenna Connector
+3.3V
FUL_CARD_POWER_OFF#
RESET#
USB2.0
USIM
EINT
WOWWAN#
LED
I2S
I2C
CLOCK
Tunable ANT
Baseband
(UMTS/LTE FDD controller)
PMU
TX
LPDDR2
RAM
NAND
Div
FEM
Main
FEMiD
PA DCDC
PA
RF Transceiver
RX
RX
RF Part
TCXO
M.2 Key-B 75pin interface
Div/GNSS
ANT
Main ANT
GNSS
Figure 2-2 Hardware Framework
3 Application Interface
3.1 M.2 Interface
The L830 module uses standard M.2 Key-B interface, with a total of 75 pins.

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3.1.1 Pin Map
Figure 3-1 Pin Map
Note:
Pin “Notch” represents the gap of the gold fingers.

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L830-EB Hardware User Manual Page 11 of 39
3.1.2 Pin Definition
The pin definition is as follows:
Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
1
CONFIG_3
O
L
Connected to internal GND, L830
M.2 module is configured as the
WWAN-SSIC 0 interface type.
2
+3.3V
PI
Module main power input.
Power Supply
3
GND
GND
Power Supply
4
+3.3V
PI
Module main power input.
Power Supply
5
GND
GND
Power Supply
6
FULL_CARD_POWER_OFF#
I
Power on/off control signal,active
High.
CMOS
3.3/1.8V
7
USB D+
I/O
USB 2.0 D+ signal
0.3---3V
8
W_DISABLE1#
I
PU
WWAN Disable, active low.
CMOS 3.3V
9
USB D-
I/O
USB 2.0 D- signal
0.3---3V
10
LED1#
O
OD
System status LED, drain output.
CMOS 3.3V
11
GND
GND
Power Supply
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
O
PD
I2S serial clock
CMOS 1.8V
21
CONFIG_0
O
NC
Not connected, L830 M.2 module is
configured as the WWAN-SSIC 0
interface type.
22
I2S_RX
I
PD
I2S serial data input
CMOS 1.8V

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L830-EB Hardware User Manual Page 12 of 39
Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
23
WOWWAN#
O
PU
Wake up host signal
CMOS 1.8V
24
I2S_TX
O
PD
I2S serial data output
CMOS 1.8V
25
DPR
I
PU
Body SAR detection
CMOS 1.8V
26
W_DISABLE2#
I
PU
GPS Disable signal, active low. (Not
supported yet)
CMOS 1.8V
27
GND
GND
Power Supply
28
I2S_WA
O
PD
I2S clock for left and right channels
CMOS 1.8V
29
NC
NC
30
UIM_RESET
O
PP
USIM reset signal
1.8V/3V
31
NC
NC
32
UIM_CLK
O
PP
USIM clock signal
1.8V/3V
33
GND
GND
Power Supply
34
UIM_DATA
I/O
PU
USIM data signal, internal 4.7KΩ
pull-up.
1.8V/3V
35
NC
NC
36
UIM_PWR
O
USIM power supply
1.8V/3V
37
NC
NC
38
NC
NC
39
GND
GND
Power Supply
40
GNSS_SCL
O
PU
I2C serial clock signal, internal
4.7KΩpull-up
CMOS 1.8V
41
NC
NC
42
GNSS_SDA
I/O
PU
I2C serial data signal, internal 4.7KΩ
pull-up
CMOS 1.8V
43
NC
NC
44
GNSS_IRQ
I
PU
Reserved
CMOS 1.8V
45
GND
GND
Power Supply
46
SYSCLK
O
L
26MHz clock output
1.8V
47
NC
NC

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L830-EB Hardware User Manual Page 13 of 39
Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
48
TX_BLANKING
O
L
TDMA Timer output, external GPS
control signal.(not supported)
CMOS 1.8V
49
NC
NC
50
NC
NC
51
GND
GND
Power Supply
52
NC
NC
53
NC
NC
54
NC
NC
55
NC
NC
56
NC
NC
57
GND
GND
Power Supply
58
NC
NC
59
ANTCTL0
O
L
Tunable antenna control signal, bit0
(not supported yet).
CMOS 1.8V
60
COEX3
O
Reserved
61
ANTCTL1
O
L
Tunable antenna control signal, MIPI
RFFE SDATA, bit1 (not supported
yet).
CMOS 1.8V
62
COEX2
O
Reserved
63
ANTCTL2
O
L
Tunable antenna control signal, MIPI
RFFE SCLK, bit2 (not supported
yet).
CMOS 1.8V
64
COEX1
O
Reserved
65
ANTCTL3
O
Tunable antenna control signal, MIPI
RFFE VIO, bit3 (not supported yet).
CMOS 1.8V
66
SIM_DETECT
I
SIM card detect, external 390KΩ
pull-up.
CMOS 1.8V
67
RESET#
I
External reset input signal, internal
100KΩ pull-up.
CMOS 1.8V
68
NC
NC
69
CONFIG_1
O
L
Connected to internal GND, L830

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L830-EB Hardware User Manual Page 14 of 39
Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
M.2 module is configured as the
WWAN-SSIC 0 interface type.
70
+3.3V
PI
Module main power input.
Power Supply
71
GND
GND
Power Supply
72
+3.3V
PI
Module main power input.
Power Supply
73
GND
GND
Power Supply
74
+3.3V
PI
Module main power input.
Power Supply
75
CONFIG_2
O
L
Connected to internal GND, L830
M.2 module is configured as the
WWAN-SSIC 0 interface type.
Reset Value: The initial status after module reset, not the status when working
H: High Voltage Level
L: Low Voltage Level
PD: Pull-Down
PU: Pull-Up
T: Tristate
OD: Open Drain
PP: Push-Pull
PI: Power Input
PO: Power Output
Note:
The unused pins can be left floating.
3.2 Power Supply
The power interface of L830 module as shown in the following table:

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L830-EB Hardware User Manual Page 15 of 39
Pin
Pin Name
I/O
Pin Description
DC Parameter（V）
Minimum
Value
Typical
Value
Maximum
Value
2,4,70,72,74
+3.3V
PI
Power supply input
3.135
3.3
4.4
36
UIM_PWR
PO
USIM power supply
1.8V/3V
3.2.1 Power Supply
The L830 module should be powered through the +3.3V pins, and the power supply design is shown in
Figure 3-2:
Figure 3-2 Power Supply Design
The filter capacitor design for power supply as shown in the following table:
Recommended
capacitance
Application
Description
220uF x 2
Voltage-stabilizing capacitors
Reduce power fluctuations of the module in
operation, requiring capacitors with low ESR.
LDO or DC/DC power supply requires the
capacitor of no less than 220uF
The capacitor for battery power supply
can be reduced to 100uF
1uF,100nF
Digital signal noise
Filter out the interference generated from the
clock and digital signals
39pF,33pF
700/800, 850/900 MHz
frequency band
Filter out low frequency band RF interference
18pF,8.2pF,6.8pF
1800,2100,2600MHz frequency
band
Filter out medium/high frequency band RF
interference
The stable power supply can ensure the normal operation of L830 module; and the ripple of the power
supply should be less than 300mV in design. When the module operates with the maximum emission

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L830-EB Hardware User Manual Page 16 of 39
power, the maximum operating current can reach 1A, so the power source should be not lower than
3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:
Burst transmit Burst transmit
min:3.135V
Power supply Ripple≤300mV
Drop
VBAT≥3.135V
Figure 3-3 Power Supply Limit
3.2.2 Logic level
The L830 module 1.8V logic level definition as shown in the following table:
Parameters
Minimum
Typical
Maximum
Unit
1.8V logic level
1.71
1.8
1.89
V
VIH
1.3
1.8
1.89
V
VIL
-0.3
0
0.3
V
The L830 module 3.3V logic level definition as shown in the following table:
Parameters
Minimum
Typical
Maximum
Unit
3.3V logic level
3.135
3.3
3.465
V
VIH
2.3
3.3
3.465
V
VIL
-0.3
0
0.3
V
3.2.3 Power Consumption
In the condition of 3.3V power supply, the L830 power consumption as shown in the following table:

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L830-EB Hardware User Manual Page 17 of 39
Parameter
Mode
Condition
Average
Current(mA)
Ioff
Power off
Power supply, module power off
0.29
ISleep
WCDMA
DRX=6
3.0
DRX=8
1.8
DRX=9
1.5
LTE FDD
Paging cycle #64 frames (0.64 sec DRX cycle)
3.6
Radio Off
AT+CFUN=4,Flight mode
1.0
IWCDMA-RMS
WCDMA
WCDMA Data transfer Band I @+23.5dBm
687
WCDMA Data transfer Band V @+23.5dBm
623
WCDMA Data transfer Band VIII @+23.5dBm
597
ILTE-RMS
LTE FDD
LTE FDD Data transfer Band 1 @+23dBm
713
LTE FDD Data transfer Band 3 @+23dBm
733
LTE FDD Data transfer Band 5 @+23dBm
720
LTE FDD Data transfer Band 7 @+23dBm
735
LTE FDD Data transfer Band 8 @+23dBm
675
LTE FDD Data transfer Band 20 @+23dBm
685
LTE FDD Data transfer Band 28 @+23dBm
833
Note：
The data is the average of testing some samples.
3.3 Control Signal
The L830 module provides two control signals for power on/off and reset operations, the pin defined as
shown in the following table:
Pin
Pin Name
I/O
Reset Value
Functions
Type
6
FULL_CARD_P
OWER_OFF#
I
Power on/off signal
High: Power on
Low or floating: Power off
3.3V/1.8V
67
RESET#
I
Reset signal, internal 100KΩ pull-up,
active low.
1.8V

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L830-EB Hardware User Manual Page 18 of 39
3.3.1 Module Start-Up
3.3.1.1 Start-up Circuit
The FULL_CARD_POWER_OFF# pin needs an external 3.3V or 1.8V pull up for booting up. The
VDD(3.3V/1.8V) should be provided from the external circuit. Two methods for module starting up:
AP (Application Processor) controls the module start-up, and the circuit design is shown in Figure
3-4:
Automatically start-up when powered on, and the circuit design is shown in Figure 3-5:
Figure 3-4 Circuit for Module Start-up Controlled byAP
Figure 3-5 Circuit for Automatic Start-up

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3.3.1.2 Start-up Timing Sequence
After powering on, the module will start-up by pulling up the FULL_CARD_POWER_OFF# signal for more
than 20ms (100ms is recommended). Meanwhile, the module will output 1.8V voltage through VSD2_1V8
pin and start the initialization process. The start-up timing is shown in Figure 3-6:
≥20ms
+3.3V
FULL_CARD_POWER_OFF#
VSD2_1V8
tpr
RESET# ≥100ms
Module State OFF Initialization Activation(AT Command Ready)
10s
Figure 3-6 Timing Control for Start-up
Note:
The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2
interface. The above timing of VSD2_1V8 is only for reference.
tpr:The time for 3.3V power rail becomes stable due to the capacitor charging.If + 3.3 V keeps
constant supply, the delay time can be ignored.
3.3.2 Module Shutdown
The module can be shutdown by the following controls:
Shutdown
Control
Action
Condition
Software
SendingAT+CFUN=0 command
Normal shutdown.
Hardware
Pull down
FULL_CARD_POWER_OFF# pin
Only used when a hardware exception occurs
and the software control cannot be used.
3.3.2.1 Software Shutdown
The module can be shut down by sending AT+CFUN=0 command. When the module receives the
software shutdown command, the module will start the finalization process (the reverse process of
initialization), and it will be completed after tsd time(tsd is the time which AP receive OK of “AT+CFUN=0”,if
there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM

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L830-EB Hardware User Manual Page 20 of 39
card and some other parameters from memory, then clear the memory and PMU will be powered off.After
shutdown, the VSD2_1V8 voltage is also shut down. The software control timing is shown in Figure 3-7:
+3.3V
FULL_CARD_POWER_OFF#
VSD2_1V8 AT+CFUN=0
Module State Activation Finalization OFF
tsd
RESET#
≥100ms
Figure 3-7 Software Shutdown Timing Control
After the software shutdown, the FULL_CARD_POWER_OFF # pin will remain high which prevents the
module from restarting again. To enable the next restart, the FULL_CARD_POWER_OFF# pin should be
pulled low after shutting down.
Note:
The VSD2_1V8 signal is the internal PMU 1.8V output voltage which is not connected to the M.2
interface. The above timing of VSD2_1V8 is only for reference.
3.3.2.2 Hardware Shutdown
By pulling down the FULL_CARD_POWER_OFF# pin for more than 50ms (100ms is recommended), the
power management unit (PMU) of the module loses its power, and then the module will shut down by the
hardware. Because the PMU will lose its power by pulling down the FULL_CARD_POWER_OFF# pin, to
avoid damaging the module with power on/off procedures, it’s necessary to pull down RESET_N pin for
≧100ms before pulling down the FULL_CARD_POWER_OFF# pin. The hardware control timing is
shown in Figure 3-8:
+3.3V
FULL_CARD_POWER_OFF#
VSD2_1V8
Module State Activation PMU RESET OFF
≥10ms
RESET#
≥100ms
Figure 3-8 Hardware Shutdown Timing Control