Fibocom L816-AM Instructions for use

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L816-AM Hardware User Manual
Version: 2.0.4
Update date: 2016.09.18

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Applicability Table
No.
Product model
Description
1
L816-AM
N/A

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Copyright
Copyright © 2016 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Version Record
Version
Update Date
Description
V2.0.0
2016-04-28
Initial version
V2.0.1
2016-07-19
Sections describe modifications
V2.0.2
2016-07-26
Modified description
V2.0.3
2016-07-28
Update part chart
V2.0.4
2016-09-18
Add product certification of warnings

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Contents
1 Foreword....................................................................................................................................... 6
1.1 Introduction........................................................................................................................................... 6
1.2 Reference Standard............................................................................................................................ 6
1.3 Related Documents............................................................................................................................. 6
2 Overview........................................................................................................................................7
2.1 Introduction........................................................................................................................................... 7
2.2 Specification..........................................................................................................................................7
2.3 Warnings............................................................................................................................................... 8
2.4 Application Framework..................................................................................................................... 11
2.5 Hardware Framework........................................................................................................................12
3 Application Interface................................................................................................................13
3.1 LGA Interface..................................................................................................................................... 13
3.1.1 Pin Distribution.............................................................................................................................. 13
3.1.2 Pin Definition.................................................................................................................................... 14
3.2 Power Supply..................................................................................................................................... 19
3.2.1 Power Supply................................................................................................................................... 19
3.2.2 Power Consumption........................................................................................................................21
3.3 Control Signal.....................................................................................................................................22
3.3.1 Module Start-up............................................................................................................................... 22
3.3.1.1 Start-up Circuit.............................................................................................................................22
3.3.1.2 Start-up Timing............................................................................................................................ 23
3.3.2 Module Shutdown............................................................................................................................24
3.3.3 Module Reset................................................................................................................................... 25
3.4 USB Interface..................................................................................................................................... 26
3.4.1 USB Interface Definition................................................................................................................. 26
3.4.2 USB Interface Application.............................................................................................................. 26
3.5 USIM Interface................................................................................................................................... 27
3.5.1 USIM Pins......................................................................................................................................... 27
3.5.2 USIM Interface Circuit.....................................................................................................................28
3.5.2.1 N.C. SIM Card Slot..................................................................................................................... 28
3.5.2.2 N.O. SIM Card Slot..................................................................................................................... 28
3.5.3 USIM Hot-Plugging..........................................................................................................................29
3.5.4 USIM Design.................................................................................................................................... 30

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3.6 GPIO.................................................................................................................................................... 30
3.6.1 FW_Ready........................................................................................................................................ 31
3.6.2 SMS_Ready......................................................................................................................................31
3.6.3 Wakeup_Host...................................................................................................................................31
3.6.4 PA_Blanking..................................................................................................................................... 32
3.7 Interrupt Control................................................................................................................................. 32
3.7.1 W_Disable#...................................................................................................................................... 32
3.7.2 BodySar.............................................................................................................................................33
3.8 Other Interfaces................................................................................................................................. 33
4 RF Interface................................................................................................................................ 34
4.1 Operating Band.................................................................................................................................. 34
4.2 Transmitting Power............................................................................................................................34
4.3 Receiver Sensitivity........................................................................................................................... 35
4.4 RF PCB Design..................................................................................................................................36
4.4.1 Trace Routing Principle.................................................................................................................. 36
4.4.2 RF Impedance Design.................................................................................................................... 36
4.5 Antenna Design..................................................................................................................................37
4.5.1 Antenna Design Requirements..................................................................................................... 37
5 Structure Specification............................................................................................................38
5.1 Product Appearance..........................................................................................................................38
5.2 Dimension of Structure..................................................................................................................... 39
5.3 Recommended Design for PCB Bonding Pad.............................................................................. 40
5.4 SMT Paster.........................................................................................................................................41
5.5 Storage................................................................................................................................................42
5.5.1 Storage Life...................................................................................................................................... 42
5.5.2 Workshop Life.................................................................................................................................. 42
5.5.3 Recommended baking standards:................................................................................................42
5.6 Packing................................................................................................................................................42
5.6.1 Tray Package....................................................................................................................................42

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L816-AM-00 (hereinafter referred to as L816-AM). With the assistance of the
document and other instructions, the developers can quickly understand the hardware functions of
L816-AM modules and develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1:
Conformance specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
Toolkit(USAT)
3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
1.3 Related Documents
RF Antenna Application Design Specification
FIBOCOM_L8 Family System Driver Integration and Application Guidance
L816-AM AT Commands Manual
L816-AM SMT Application Design Specification

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2 Overview
2.1 Introduction
The L816-AM module are highly integrated 4G wireless communication LGA modules, which supports
LTE FDD/WCDMA/GSM systems (3 modes and 7 bands).
2.2 Specification
Specification
Operating Band
LTE FDD: Band II,IV, XII
WCDMA/HSPA+: Band I,II,V(VI),VIII
GSM/GPRS/EDGE: 850/900/1800/1900MHz
Data
Transmission
LTE FDD
Rel.9, 10Mbps DL/5Mbps UL (Cat 1)
WCDMA / HSDPA /
HSUPA:
UMTS:384 kbps DL/384 kbps UL
HSDPA CAT 7:7.2 Mbps Down;HSUPA CAT 6:5.76 Mbps Up
GPRS/EDGE
GPRS:MSC 10, CS-4 80 Kbps Down/20Kbps Up
Power Supply
DC 3.3V～4.5V
Temperature
Operating: -10°C ～+55°C
Storage: -40°C ～+85°C
Physical
characteristics
Package: LGA 115 pins
Dimension:30.0 x 21.0 x 1.55mm
Weight:~2.4g
Interfaces
Antenna
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1
Function
Interface
USIM 3V/1.8V
USB 2.0 x 1
EINT, GPIO
USIM x 1
RF MIPI,RF GPO

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Software
AT commands
3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands
Firmware update
USB
2.3 Warnings
2.3.1 CE Statement
EU Regulatory Conformance:
Hereby, We, FIBOCOM Wireless Inc. declares that this device L816-AM is in compliance with the
essential requirements and other relevant provisions of Directive 1999/5/EC.
CE 0560
R&TTE Regulation:
In all cases assessment of the final product must be mass against the Essential requirements of the
R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.2
requirements.
The maximum antenna gain for frequency 900 is 3dBi; for frequency 1800 is 5dBi and the antenna
separation distance is 20cm.
2.3.2 FCC Statement
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular

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installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20cm between the radiator &
your body.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 5dBi.
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.

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End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that
20 cm may be maintained between the antenna and users. The final end product must be labeled in a
visible area with the following: “Contains FCC ID: ZMOL816AM and IC:21374-L816AM”. The grantee's
FCC ID & IC ID can be used only when all FCC&IC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
2.3.3 IC Statement
Industry Canada statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions:
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1) l'appareil ne doit pas produire de brouillage, et
2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this
device does not cause harmful interference.
Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la
condition que cet appareil ne provoque aucune interférence nuisible.
This device and its antenna(s) must not be co-located or operating in conjunction with any other
antenna or transmitter, except tested built-in radios.
Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre
antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.
The County Code Selection feature is disabled for products marketed in the US/ Canada.
La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux
États-Unis et au Canada.

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Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your
body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
2.4 Application Framework
The peripheral applications for L816-AM module are shown in Figure 2-1:
Figure2-1 Application Framework

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2.5 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L816-AM module, including
base band and RF functions.
Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply
NAND+LPDDR2 RAM
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front End
RF Filter
Figure 2-2 Hardware Framework

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3 Application Interface
3.1 LGA Interface
The L816-AM module applies LGA packaging, with a total of 115 pins.
3.1.1 Pin Distribution
Figure 3-1 Pin Map (TOP Perspective View)

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3.1.2 Pin Definition
The L816-AM pin definition is as follows:
Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
USB2.0
13
USB_DP
I/O
T
USB Data Positive
0.3---3V
14
USB_DN
I/O
T
USB Data Negative
0.3---3V
15
VBUS
PI
USB VBUS Supply
2.0---5.25V
SIM
17
SIM1_DATA
I/O
L
USIM data, internal 4.7KΩ pull-up
1.8V/3V
18
SIM1_RST
O
L
USIM reset
1.8V/3V
19
SIM1_CLK
O
L
USIM clock
1.8V/3V
20
VSIM1
PO
USIM power supply
1.8V/3V
26
SIM1_CD
I
USIM card detection with 390KΩ pull-
up, active high
1.8V
EINT
31
Wakeup_Modem
I
PD
Reserved
CMOS 1.8V
40
W_Disable#
I
PD
Disable WWAN
CMOS 1.8V
27
BodySar
I
PD
Body SAR detection
CMOS 1.8V
GPIO
28
FW_Ready
O
PD
FW_Ready output
CMOS 1.8V
29
SMS_Ready
O
PD
SMS_Ready output
CMOS 1.8V
30
USB_En/Disable
O
PD
Enable_Disable-USB Signal Output
CMOS 1.8V
33
PA_Blanking
O
PD
PA_Blanking output
CMOS 1.8V
42
GPIO_Modem
I/O
PD
Reserved
CMOS 1.8V
39
Wakeup_Host
O
PD
Wakeup_Host output
ANT
61
Main_ANT
I/O
Main antenna
68
DIV_ANT
I
Diversity antenna
ANT Tunable

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Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
9
RFE_RFFE2_VIO
PO
RFFE2 VIO for tunable ANT
1.8V
10
RFE_RFFE2_SCLK
O
Reserved
1.8V
11
RFE_RFFE2_SDATA
I/O
Reserved
1.8V
RF GPO
4
GPIO_RF1
O
RF_GPIO_1
2.3V
5
GPIO_RF2
O
RF_GPIO_2
2.3V
7
ASM_2V5
PO
ASM_2V5
2.5V
Module Control
32
Reset_N
I
Module reset input with 100KΩ pull-up
1.8V
41
Power_On/Off
I
Module power on/off signal.
Advise the customer to increase the
200KΩ pull-down
1.8V
Power
45
VBAT_BB
PI
-
Power input
Power supply
46
VBAT_PA
PI
-
Power input
Power supply
47
VBAT_PA
PI
-
Power input
Power supply
48
VBAT_TR
PI
-
Power input
Power supply
GND
1
GND
-
-
GND
Ground
2
GND
-
-
GND
Ground
3
GND
-
-
GND
Ground
6
GND
-
-
GND
Ground
8
GND
-
-
GND
Ground
12
GND
-
-
GND
Ground
16
GND
-
-
GND
Ground
21
GND
-
-
GND
Ground
22
GND
-
-
GND
Ground
23
GND
-
-
GND
Ground
24
GND
-
-
GND
Ground

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Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
25
GND
-
-
GND
Ground
34
GND
-
-
GND
Ground
35
GND
-
-
GND
Ground
36
GND
-
-
GND
Ground
37
GND
-
-
GND
Ground
38
GND
-
-
GND
Ground
43
GND
-
-
GND
Ground
44
GND
-
-
GND
Ground
49
GND
-
-
GND
Ground
50
GND
-
-
GND
Ground
51
GND
-
-
GND
Ground
52
GND
-
-
GND
Ground
53
GND
-
-
GND
Ground
54
GND
-
-
GND
Ground
55
GND
-
-
GND
Ground
56
GND
-
-
GND
Ground
57
GND
-
-
GND
Ground
58
GND
-
-
GND
Ground
59
GND
-
-
GND
Ground
60
GND
-
-
GND
Ground
62
GND
-
-
GND
Ground
63
GND
-
-
GND
Ground
64
GND
-
-
GND
Ground
65
GND
-
-
GND
Ground
66
GND
-
-
GND
Ground
67
GND
-
-
GND
Ground
69
GND
-
-
GND
Ground
70
GND
-
-
GND
Ground

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Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
TG1
GND
-
-
Thermal Ground
Ground
TG2
GND
-
-
Thermal Ground
Ground
TG3
GND
-
-
Thermal Ground
Ground
TG4
GND
-
-
Thermal Ground
Ground
TG5
GND
-
-
Thermal Ground
Ground
TG6
GND
-
-
Thermal Ground
Ground
TG7
GND
-
-
Thermal Ground
Ground
TG8
GND
-
-
Thermal Ground
Ground
TG9
GND
-
-
Thermal Ground
Ground
TG10
GND
-
-
Thermal Ground
Ground
TG11
GND
-
-
Thermal Ground
Ground
TG12
GND
-
-
Thermal Ground
Ground
TG13
GND
-
-
Thermal Ground
Ground
TG14
GND
-
-
Thermal Ground
Ground
TG15
GND
-
-
Thermal Ground
Ground
TG16
GND
-
-
Thermal Ground
Ground
TG17
GND
-
-
Thermal Ground
Ground
TG18
GND
-
-
Thermal Ground
Ground
TG19
GND
-
-
Thermal Ground
Ground
TG20
GND
-
-
Thermal Ground
Ground
TG21
GND
-
-
Thermal Ground
Ground
TG22
GND
-
-
Thermal Ground
Ground
TG23
GND
-
-
Thermal Ground
Ground
TG24
GND
-
-
Thermal Ground
Ground
TG25
GND
-
-
Thermal Ground
Ground
TG26
GND
-
-
Thermal Ground
Ground
TG27
GND
-
-
Thermal Ground
Ground
TG28
GND
-
-
Thermal Ground
Ground

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Pin
Pin Name
I/O
Reset
Value
Pin Description
Type
TG29
GND
-
-
Thermal Ground
Ground
TG30
GND
-
-
Thermal Ground
Ground
TG31
GND
-
-
Thermal Ground
Ground
TG32
GND
-
-
Thermal Ground
Ground
TG33
GND
-
-
Thermal Ground
Ground
TG34
GND
-
-
Thermal Ground
Ground
TG35
GND
-
-
Thermal Ground
Ground
TG36
GND
-
-
Thermal Ground
Ground
TG37
GND
-
-
Thermal Ground
Ground
TG38
GND
-
-
Thermal Ground
Ground
TG39
GND
-
-
Thermal Ground
Ground
TG40
GND
-
-
Thermal Ground
Ground
TG41
GND
-
-
Thermal Ground
Ground
TG42
GND
-
-
Thermal Ground
Ground
TG43
GND
-
-
Thermal Ground
Ground
TG44
GND
-
-
Thermal Ground
Ground
TG45
GND
-
-
Thermal Ground
Ground
H: High Voltage Level
L: Low Voltage Level
PD: Pull-Down
PU: Pull-Up
T: Tri-State
OD: Open Drain
PP: Push-Pull
PI: Power Input
PO: Power Output
Note:
The unused pins can be left floating.

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3.2 Power Supply
The power interface for L816-AM module is as follows:
Pin
Pin Name
I/O
Pin Description
DC Parameters （V）
Minimum
Value
Typical
Value
Maximum
Value
45
VBAT_BB
PI
Power input to BB
3.3
3.8
4.5
46
VBAT_PA
PI
Power input to RF PA
DC-DC
3.3
3.8
4.5
47
VBAT_PA
PI
Power input to RF PA
DC-DC
3.3
3.8
4.5
48
VBAT_TR
PI
Power input to
transceiver
3.3
3.8
4.5
15
VBUS
PI
USB power supply
2.0
3.8
5.25
20
VSIM1
PO
SIM1 power supply
1.8V/3V
3.2.1 Power Supply
The L816-AM module should be powered through the VBAT pins, and the power supply design is shown
in Figure 3-2:
Figure 3-2 Power Supply Design

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L816-AM Hardware User Manual Page
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The filter capacitor design for power supply is shown in the following table:
Recommended
capacitance
Application
Description
220uF x 2
Voltage-stabilizing capacitors
Reduce power fluctuations of the module in
operation, requiring capacitors with low ESR
LDO or DC/DC power supply requires the
capacitor of no less than 440uF
The capacitor for battery power supply
can be reduced to 100～220uF
1uF,100nF
Digital signal noise
Filter out the interference generated from the
clock and digital signals
39pF,33pF
850/900 MHz frequency band
Filter out low frequency band RF interference
18pF,8.2pF,6.8pF
1800/1900,2100MHz frequency
band
Filter out medium/high frequency band RF
interference
The stable power supply can ensure the normal operation of L816-AM module; and the ripple of the
power supply should be less than 165mV in design. When the module operates under GSM mode (Burst
transmit), the maximum operating current can reach 2A, so the power source should be not lower than
3.135V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:
Figure 3-3 Power Supply Limit