Fibocom H350 Series Instructions for use

H350 LGA Serials Module
Hardware User Manual
Version: V1.0.1
Date: 2013-10-23

H350 LGA Serials Module Hardware User Manual Page 2 of 37
Confidential Material
This document contains information highly confidential to Fibocom Wireless Inc. (Fibocom). Fibocom offers this
information as a service to its customers, to support application and engineering efforts that use the products
designed by Fibocom. The information provided is based upon requirements specifically provided to Fibocom
by the customers. All specifications supplied herein are subject to change. Disclosure of this information to
other parties is prohibited without the written consent of Fibocom.
Copyright
Copy, Reproduce, Distribute and/or Edit of this document or part of it as well as utilization of its contents and
communication thereof to others without express authorization are prohibited. Offenders will be held liable for
payment of damages. All rights created by patent grant or registration of a utility model or design patent are
reserved. Copyright ©2013 Fibocom Wireless Inc. All rights reserved.
Trademarks Notice
The FIBOCOM Logo is registered by Fibocom Wireless Inc. All other product or service names or logos are the
property of their respective owners. Copyright ©2013 Fibocom Wireless Inc. All rights reserved.
Revision History
Version
Date
Remarks
V1.0.0 2013-09-11 Initial Version
V1.0.1 2013-10-23 Update descriptions for ADC, POWER OFF and RESET.
Update dimensions and PCB layout design.

H350 LGA Serials Module Hardware User Manual Page 3 of 37
Applicability Table
No.
Type
Note
1 H350-A50-00
2 H350-A30-00
Here are the module comparisons:
Model No.
GSM/GPRS/EDGE Band(MHz)
WCDMA Band(MHz)
HSDPA
(Mbps)
HSUPA
(Mbps)
H350-A30-00 900/1800 900/2100 7.2 5.76
H350-A50-00
900/1800
900/2100
21
5.76

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Contents
1Preface..................................................................................................................................................................................................... 6
1.1 Scope......................................................................................................................................................................................... 6
1.2 Standards................................................................................................................................................................................. 6
2Introduction .......................................................................................................................................................................................... 7
2.1 Description.............................................................................................................................................................................. 7
2.2 Specifications ......................................................................................................................................................................... 7
2.3 Appearance............................................................................................................................................................................. 9
3Mechanical...........................................................................................................................................................................................10
3.1 Dimensions ...........................................................................................................................................................................10
3.2 PCB Layout Design.............................................................................................................................................................11
4Hardware Overview..........................................................................................................................................................................12
4.1 Block Diagram......................................................................................................................................................................12
4.2 Pin Definition........................................................................................................................................................................13
4.2.1 Pin Map.........................................................................................................................................................................13
4.2.2 Pin Description...........................................................................................................................................................14
5Hardware Interface...........................................................................................................................................................................19
5.1 Power Interface....................................................................................................................................................................19
5.1.1 VBAT ...............................................................................................................................................................................19
5.1.2 Power Consumption ................................................................................................................................................19
5.1.3 VIO ..................................................................................................................................................................................21
5.1.4 VRTC...............................................................................................................................................................................21
5.2 ON/OFF and Reset..............................................................................................................................................................22
5.2.1 Pin Definition..............................................................................................................................................................22
5.2.2 Power ON Signal........................................................................................................................................................22
5.2.3 Power off Signal.........................................................................................................................................................23
5.2.4 Reset Signal.................................................................................................................................................................24
5.3 Indicator Signal....................................................................................................................................................................25
5.3.1 Pin Description...........................................................................................................................................................25
5.3.2 Indicator Description...............................................................................................................................................25
5.4 USB Interface........................................................................................................................................................................26
5.4.1 USB Interface Description......................................................................................................................................26

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5.4.2 USB Interface Application......................................................................................................................................26
5.5 UART Interface .....................................................................................................................................................................27
5.5.1 UART Interface Description...................................................................................................................................27
5.5.2 UART Design ...............................................................................................................................................................28
5.5.3 Ring Indicator.............................................................................................................................................................29
5.6 USIM.........................................................................................................................................................................................29
5.6.1 USIM Interface............................................................................................................................................................29
5.6.2 USIM Design................................................................................................................................................................30
5.6.3 USIM Design Notice .................................................................................................................................................30
5.6.4 USIM Hot Plug ............................................................................................................................................................31
5.7 Digital Audio.........................................................................................................................................................................31
5.7.1 I2S ...................................................................................................................................................................................32
5.7.2 I2C...................................................................................................................................................................................32
5.7.3 PCM Mode Interface ................................................................................................................................................32
5.8 ADC Interface .......................................................................................................................................................................33
5.9 Others......................................................................................................................................................................................33
6Electrical and Environmental Features......................................................................................................................................34
6.1 Electrical Features...............................................................................................................................................................34
6.2 Environmental Features ...................................................................................................................................................34
7RF Interface..........................................................................................................................................................................................35
7.1 Operation Frequency Band.............................................................................................................................................35
7.1.1 Main Antenna.............................................................................................................................................................35
7.2 RF PCB Design......................................................................................................................................................................35
7.2.1 Layout Guideline .......................................................................................................................................................35
7.2.2 Impedance...................................................................................................................................................................35
7.3 Antenna Design...................................................................................................................................................................35
7.3.1 Main Antenna Design Requirements ................................................................................................................35

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1Preface
1.1 Scope
This manual provides the electrical, mechanical and environmental requirements for properly integrating the
H350 serials wireless communications module. This manual gives a complete set of hardware features and
functions that may be provided by H350, ensures the users can quickly and conveniently develop wireless
communications using H350 Module.
1.2 Standards
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)
3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment (DTE-DCE)
interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)
3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile radio
interface
3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol
3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services
3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell
reselection in connected mode
3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description; Stage 2
3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2
3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information
3GPP TS 21.111 -v6.3.0: USIM and IC card requirements
3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path
3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity Module -
Mobile Equipment (SIM-ME) interface
3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 22.004 -v6.0.0: General on supplementary services
3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2
3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;

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2Introduction
2.1 Description
H350 serials are highly integrated 3G wireless communication modules, support GSM / GPRS / EDGE and UMTS /
HSDPA / HSUPA / HSPA+.
2.2 Specifications
Specifications
UMTS (WCDMA/FDD): 900/2100MHz
Bands
GSM/GPRS/EDGE: 900/1800MHz
Data
UMTS/HSDPA/HSUPA 3GPP release 7
HSUPA 5.76Mbps (Cat 6)
HSDPA 21Mbps (Cat 14) or 7.2Mbps (Cat 8)
GSM 3GPP release 7
EDGE (E-GPRS) multi-slot class 33(296kbps DL, 236.8kbps UL)
GPRS multi-slot class 33(67kbps DL, 53.6kbps UL)
Physical
Dimension: 29.8mm x 17.8mm x 2.00mm
Interface: LGA
Weight: 2.5 grams
Environment
Operating Temperature: -30℃~ +85℃
Storage Temperature: -40℃ ~ +85℃
Performance
Operating Voltage Voltage: 3.3V ~ 4.2V Normal: 3.8V
Operating Current
(Typical Value)
2mA (Sleep Mode)
3G Idle: 13mA
3G Talk: 500mA
2G Talk: 260mA (GSM PCL5)
Tx Power
(Typical Value)
Class 4 (2W) : 900 MHz, GSM
Class 1 (1W) : 1800 MHz, GSM
Class E2 (0.5W) : 900 MHz, EDGE
Class E2 (0.4W) : 1800 MHz, EDGE
Class 3 (0.25W) : 900/2100 MHz, WCDMA

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Rx Sensitivity
(Typical Value)
UMTS/HSPA: -109dBm
GSM: -108dBm
Interfaces
RF Interface
Antenna
Connectivity
1 x USB 2.0
2 x UART
MUX Over UART1
Multiple Profiles over USB
SPI Support
I2C Support
I2S Support
PCM, HSIC, GPIO, A/D, RTC
Data Features
Protocol Stack Embedded TCP/IP and UDP/IP protocol stack
EDGE
Multi-slot class 33(5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~9
GPRS
Multi-slot class 33(5 Down; 4 Up; 6 Total)
Coding Scheme CS1~4
CSD UMTS(14.4kbps), GSM(9.6kbps)
USSD Support
SMS
MO / MT Text and PDU modes
Cell broadcast
Voice Features
Digital Audio
Voice coders: EFR/HR/FR/AMR
Audio Control Gain Control
Character Set
IRA
GSM
UCS2
HEX
AT Commands
FIBOCOM proprietary AT commands
GSM 07.05

H350 LGA Serials Module Hardware User Manual Page 9 of 37
GSM 07.07
Accessories
Firmware Loader Tool over USB/UART
User Manual
Developer Kit
2.3 Appearance
The following picture shows the H350 Wireless Communication Module.
Top view:
Figure 2-1 Top View
Bottom view:
Figure 2-2 Bottom View

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3Mechanical
3.1 Dimensions
Figure 3-1 Mechanical Specifications

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3.2 PCB Layout Design
Figure 3-2 Recommended PCB Layout

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4Hardware Overview
4.1 Block Diagram
110-pin LGA Connector Interface
Figure 4-1 Block Diagram

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4.2 Pin Definition
4.2.1 Pin Map
TOP (View)
Figure 4-2 Pin Definition

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4.2.2 Pin Description
The logic electrical lever of H350 is 1.8V. The following table shows H350 pin description:
Pin#
Pin Name
I/O
Description
Power Supply
61 VBAT I
Module main power input, voltage range: 3.3V ~ 4.2V
62 VBAT I
63 VBAT I
64 VBAT I
65 VBAT I
66 VBAT I
59 VIO O 1.8V voltage output inside module
44 VRTC I/O Backup battery power input.
Power ON/OFF Signal
45 POWER_OFF I Power off signal
47 POWER_ON I Power on signal
Reset Signal
46 RESET_ALL_N I External reset signal
USIM
27 USIM_CD I USIM card insert detected.Low level activated.
26 USIM_VCC O USIM card supplies the power, 1.8V or 3.3V
25 USIM_RST O USIM card reset
24 USIM_CLK O USIM card clock
23 USIM_DATA I/O USIM card data
High Speed SIM
22 USIM_D+ High Speed SIM card USB data line+ (not supported)
21 USIM_D- High Speed SIM card USB data line- ( not supported)

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I2S
17 I2S2_CLK1 O I2S2 Clock SCLK1
18 I2S2_CLK0 O I2S2 l Clock SCLK0 (I2S2 use CLK0 by default)
14 I2S2_WA0 O I2S2 word alignment select
15 I2S2_TX O I2S2 transmit line
16 I2S2_RX I I2S2 receive line
USB
31 USB_DP I/O USB data line+
32 USB_DM I/O USB data line-
30 USB_ID — USB ID line
33 VUSB I USB Power Input
29 USB_TEST — USB TEST line
I2C
20 I2C_SDA I/O I2C data line
19 I2C_SCL O I2C clock line
UART1
12 UART1_RI O UART1 Ring Indicator
56 UART1_DSR I UART1 DTE Ready
55 UART1_DTR O UART1 DCE Ready
57 UART1_DCD O UART1 Carrier Detect
10 UART1_CTS I UART1 Clear To Send
11 UART1_RTS O UART1 Request To Send
8 UART1_TXD O UART1 Transmitted Data
9 UART1_RXD I UART1 Received Data
UART2
51 UART2_TXD O UART2 Transmitted Data

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50 UART2_RXD I UART2 Received Data
ADC
41 ADC1 I Analog digital converter 1
EINT
49 WAKE_UP I External wake-up interrupt, Low activity.
48 EINT2 I External interrupt, Low activity.
USB HSIC
35 HSIC_USB_DATA HSIC USB data signal ( not supported)
34 HSIC_USB_STRB HSIC USB pulse signal ( not supported)
Antenna
73 ANT I/O antenna interface, 50 ohm Impedance
Others
38 CLKOUT0 O Digital audio clock output
43 SMI O Sleep Mode Indicator
54 LPG O Status Indicator
52 MIPI_HSI_RX_RDY I MIPI signal (not supported)
53 MIPI_HSI_TX_DATA O MIPI data (not supported)
Not Connect
1 NC
2 NC
3 NC
4 NC
5 NC
6 NC
7 NC
13 NC

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36 NC
37 NC
39 NC
40 NC
42 NC
58 NC
GND
28 GND
60 GND
67 GND
68 GND
69 GND
70 GND
71 GND
72 GND
74 GND
75 GND
76 GND
77 GND
78 GND
79 GND
80 GND
81 GND
82 GND
83 GND
84 GND

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85 GND
86 GND
87 GND
88 GND
89 GND
90 GND
91 GND
92 GND
93 GND
94 GND
95 GND
96 GND
97 GND
98 GND
99 GND
100 GND
101 GND
102 GND
103 GND
104 GND
105 GND
106 GND
107 GND
108 GND
109 GND
110 GND

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5Hardware Interface
5.1 Power Interface
5.1.1 VBAT
H350 module requires a 3.3 V~ 4.2V DC power supply to provide 2A as GSM transmitter maximum current.
Input power supply requirements:
Parameter
Minimum Value
Recommended Value
Maximum Value
Unit
VBAT 3.3 3.8 4.2 V
Note:
1. Supply voltage fluctuations need to be lower than 300mV.
2. Supply voltage drop minimum value needs to be higher than 3.3V.
Filter capacitor description:
Recommended capacitor
Application
Description
1000uF GSM Transmit current serge
Minimizes power supply losses during transmit
bursts. Use high capacitance value as possible
as you can.
10nF, 100nF Digital signal noise Filtering interference from clock and data
sources
8.2pF, 10pF 1800/1900/2100 MHz bands Filters transmission EMI.
33pF, 39pF 850/900 MHz bands Filters transmission EMI.
5.1.2 Power Consumption
Parameter
Description
Condition
Typical Value
Unit
I off RTC mode 68.0 uA
I idle
Idle mode(GSM) MFRMS 5 12.1 mA
WCDMA DRX 8 12.5 mA
I sleep
Low power mode
(GSM) DRX
2 1.9
5 1.5
9 1.5
mA
Low power mode
(WCDMA) DRX
6 1.8
8 1.8
9 1.7
IGSM-RMS
GSM voice -
EGSM900 PCL
5
246.7
mA

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1 TX slot
1 Rx slot current
During TX slot
10 91.9
15 61.2
19 57.2
DCS1800 PCL
0 172.2
5 82.1
10 60.3
15 57.9
IGSM-MAX Peak current
During TX slot
EGSM900 PCL
5 1738.8
mA
10 415.9
15 135.3
19 124.2
DCS1800 PCL
0 1012.9
5 348.7
10
141.5
15 110.3
GPRS
EGSM900 PCL=5
GSM voice -
1Rx slot
TX slot
1 247.9
mA
4 373.7
EGSM900 PCL=10
GSM voice -
1Rx slot
TX slot
1 89.0
4 220.3
DCS1800 PCL=0
GSM voice -
1Rx slot
TX slot
1 172.4
4 259.8
DCS1800 PCL10
GSM voice -
1Rx slot
TX slot
1 60.3
4 101.2
EGPRS-RMS
EGSM900 PCL=8
GSM voice -
1Rx slot
TX slot
1
165.2
mA
4 493.2
EGSM900 PCL=15
GSM voice -
1Rx slot
TX slot
1
61.5
4 107.7
DCS1800 PCL=2 GSM voice -
1Rx slot
1 174.9
4 514.3