Fibocom H330 Instructions for use

H330 HSPA+ Module
Hardware User Manual
Version: V1.0.0
Date: 2012-05-29
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H330 HSPA+
Confide
n
This docu
m
(Fibocom).
engineerin
g
requiremen
t
subject to c
of G&T.
Copyrig
Transmittal
,
contents a
n
be held liab
or design p
a
Copyright
©
Revisio
n
V
e
V
1
Tradem
a
The FIBOC
service na
m
Copyright
©
Module Hard
n
tial Ma
t
m
ent contain
s
Fibocom of
f
g
efforts that
t
s specifical
hange. Dis
c
ht
,
reproducti
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n
d communi
c
le for paym
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tent are re
s
©
1999-2010
n
Histor
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rsion
1
.0.0
a
rks Not
OM Logo is
m
es or Logo
s
©
1999-2012
ware User M
a
t
erial
s
informatio
n
f
ers this inf
o
use the pr
o
ly provided
c
losure of th
o
n, dissemi
n
c
ation there
o
e
nt of dama
s
erved.
Shenzhen
G
y
Date
2012-05-2
9
ice
registered
b
s
are the pr
o
Shenzhen
G
a
nual
n
highly co
n
o
rmation as
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o
ducts desi
g
to Fibocom
is informati
o
n
ation and/
o
o
f to others
ges. All rig
h
G
&T Indust
r
9
Initial
b
y Shenzhe
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perty of th
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G
&T Indust
r
n
fidential to
S
a
service to
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ned by Fib
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by the cust
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p
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r
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G&T Indu
s
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espectiv
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m
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henzhen
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its custom
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com. The i
n
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mers. All s
p
p
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t
his docum
e
ress authori
b
y patent gr
a
m
ent Co., L
t
Rem
a
s
trial Devel
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e owners.
m
ent Co., L
t
G
&T Industri
a
e
rs, to supp
o
n
formation
p
p
ecification
s
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hibited wit
h
e
nt as well a
zation are
p
a
nt or regist
t
d. All right
s
a
rks
o
pment Co.,
t
d. All right
s
a
l Develop
m
o
rt applicati
o
p
rovided is
b
s
supplied h
h
out the writ
t
s utilization
p
rohibited.
O
ration of a
u
s
reserved.
Ltd. All oth
e
s
reserved.
Page 2 of 44
m
ent Co., Lt
d
o
n and
b
ased upon
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t
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of its
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H330 HSPA+
1Prefac
e
1.1
S
1.2
S
2Introdu
2.1
P
2.2
P
2.3
P
3Macha
n
3.1
D
3.2
R
4Hardw
a
4.1
B
4.2
P
4.
2
4.
2
5Hardw
a
5.1
P
5.
1
5.
1
5.
1
5.
1
5.2
O
5.
2
5.
2
5.
2
5.
2
5.3
5.
3
5.
3
5.4
U
5.
4
5.
4
Module Hard
e
.................
S
cope ........
S
tandards ..
ction ..........
P
roduct De
s
P
roduct Sp
e
P
roduct Ap
p
n
ical ...........
D
imension .
R
ecommen
d
a
re Scope ..
B
lock Diagr
a
P
in Definiti
o
2
.1Pin
M
2
.2Pin
D
a
re Interfac
e
P
ower Inter
f
1
.1VBA
T
1
.2Pow
e
1
.3VIO .
1
.4VRT
C
O
n/Off/Res
e
2
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D
2
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e
2
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e
2
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e
Indicator Si
g
3
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D
3
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a
U
SB Interfa
c
4
.1USB
4
.2USB
ware User M
a
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cription .....
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cification...
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earance ....
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PCB Desi
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m .............
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ap ............
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Page 3 of 44
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All manuals and user guides at all-guides.com

H330 HSPA+
5.5
U
5.
5
5.
5
5.6
U
5.
6
5.
6
5.
6
5.
6
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A
5.
7
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7
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5.
8
5.
8
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6Electri
c
6.1
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6.2
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7RF Int
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7.1
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7.
1
7.
1
7.2
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7.
2
7.
2
7.3
A
7.
3
7.
3
Module Hard
U
ART.........
5
.1UAR
T
5
.2UAR
T
U
SIM .........
6
.1USI
M
6
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M
6
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M
6
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M
A
nalog Aud
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7
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7
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D
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8
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O
the
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c
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h
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nvironme
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1
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Design N
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Page 4 of 44
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H330 HSPA+
1 Pref
a
1.1 Sc
o
This manu
a
the H330 H
This manu
a
availability
o
and softwa
r
1.2 Sta
n
3GPP
T
3GPP
T
(DTE-
D
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T
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T
radio i
n
3GPP
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3GPP
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resele
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3GPP
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Stage
2
3GPP
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T
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T
Modul
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specifi
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T
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Module Hard
a
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SPA+ mod
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IM and IC
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Page 5 of 44
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All manuals and user guides at all-guides.com

H330 HSPA+
2 Intr
o
2.1 Pro
d
H330 is a h
GSM/GPR
S
850/900/19
0
2.2 Pro
d
Product
F
Support
e
Data：
Physical
：
Environ
m
Module Hard
o
ductio
n
d
uct De
s
igh integrity
S
/EDGE GS
0
0/2100MH
z
d
uct Sp
e
F
eatures
e
d Bands：
• 4 Band
U
850/90
0
• 4 Band
G
850/90
0
• UMTS/H
• HSUPA
5
• HSDPA
2
• GSM 3
G
• EDGE (
E
• GPRS
m
：
• Size：3
3
• Height：
• Mountin
g
• Weight：
m
ental
• Operatin
ware User M
a
n
s
criptio
n
3G WCDM
A
M850/900/
D
z
.
e
cificati
o
U
MTS/HSP
A
0
/1900/210
0
G
SM
0
/1800/190
0
SDPA/HSU
5
.76Mbps (
C
2
1Mbps (C
a
G
PP release
E
-GPRS) m
u
m
ulti-slot cla
s
3
.8mm x 27
.
2.45 mm
g
：LGA
< 6 grams
g Tempera
t
a
nual
n
A
wireless
m
D
CS1800/P
C
o
n
A
(WCDMA
/
0
MHz
0
MHz
PA 3GPP r
e
C
at 6)
a
t 14)
7
u
lti-slot clas
s
s
s 12
.
8mm
t
ure：-30℃
m
odule, LG
A
C
S1900MH
z
/
FDD)
e
lease 7
s
12
~ +65℃
A
package,
1
z
and UMT
S
1
20 pin. It c
a
S
/HSDPA/H
S
a
n support
S
UPA/HSP
A
Page 6 of 44
A
+
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all-guides.com

H330 HSPA+
Perform
a
Operatin
g
Current
C
Tx Powe
r
Rx Sensi
t
Interface
Connect
o
Connecti
v
Module Hard
• Storage
a
nce
g
Voltage
• Voltage:
C
onsumpti
o
• 2mA (Sl
e
• 3G Idle:
• 3G Talk:
• 2G Talk:
r
(Typical)
• UMTS/H
• GSM 85
0
• GSM 18
0
• EDGE 8
5
• EDGE 1
8
t
ivity(Typi
c
• UMTS/H
• GSM：-
1
o
rs
• RF Thro
u
• Main An
t
• Diversit
y
v
ity
• 1*USB 2
• 2*UART
ware User M
a
Temperatu
r
3.6 ~ 4.2V
o
n(Typical)
e
ep Mode)
35mA
500mA
260mA (G
S
SPA Class
3
0
/900 MHz
C
0
0/1900 M
H
5
0/900 MH
z
8
00/1900 M
c
al)
SPA：-109
d
1
07dBm
u
gh Pads in
t
enna
y
Antenna
.0
a
nual
r
e：-40 ~℃
S
M PCL5)
3
(24dBm)
C
lass4 (33
d
H
z Class1 (
3
z
Class E2 (
2
Hz Class E
2
d
Bm
LGA, 2 x
m
+85℃
d
Bm)
3
0dBm)
2
7dBm)
2
(26dBm)
m
ini-UFL in
P
P
CIe model
Page 7 of 44
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H330 HSPA+
Data Fea
t
HSPA+
EDGE
GPRS
CSD
SMS
V
oice Fe
a
Module Hard
• MUX Ov
• Multiple
• SPI Sup
p
• I2C Sup
p
• I2S Sup
p
t
ures
• Embedd
e
• Max upli
n
• Max do
w
• Multi-slo
t
(4 Down;
4
• Coding
S
• Multi-slo
t
(4 Down;
4
• Coding
S
• UMTS
• GSM
• MO / M
T
• Cell bro
a
a
tures
• Telepho
n
ware User M
a
er UART1
Profiles ove
p
ort
p
ort
p
ort
e
d TCP/IP
a
n
k 5.76Mbp
w
nlink 21Mb
p
t
class 12
4
Up; 5 Tot
a
S
cheme M
C
t
class 12
4
Up; 5 Tot
a
S
cheme CS
1
T
Text and
P
a
dcast
n
y
a
nual
r USB
a
nd UDP/IP
s
p
s
a
l)
C
S1-MCS9
a
l)
1
-CS4
P
DU modes
protocol st
a
a
ck
Page 8 of 44
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H330 HSPA+
Audio C
o
Characte
Control/
S
AT Com
m
Accesso
r
Regulato
Module Hard
• Analog
a
• Voice c
o
o
ntrol
• Broad g
a
• Echo su
p
• Noise s
u
• Side ton
e
r Set
• IRA
• GSM
• UCS2
• HEX
S
tatus Indi
c
• GPIO’s
• A/D
• RTC
m
and Set
• G&T pro
• GSM 07
.
• GSM 07
.
r
ies
• Firmwar
e
• User Ma
• Develop
e
ry and Ap
p
• FCC
ware User M
a
a
nd Digital
A
o
ders EFR/
H
a
in control
p
pression
u
ppression
e
c
ations
prietary AT
.
05
.
07
e
Loader T
o
nual
e
r Kit
p
rovals
a
nual
A
udio
H
R/FR/AMR
commands
o
ol over US
B
B
/UART
Page 9 of 44
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H330 HSPA+
2.3 Pro
d
H330
H
Top Vi
e
Botto
m
Module Hard
w
• RoHS
• CE
• RRB
d
uct Ap
p
H
SPA+ Mod
u
e
w：
m
View：
w
are User M
a
p
earanc
e
u
le Appear
a
a
nual
e
a
nce is belo
w
w
。
Page 10 of 4
4
4
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