Fibocom L860-GL Instructions for use

FIBOCOM_L860-GL
Hardware User Manual
Version：1.0.2
Date：2018-07-28

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Copyright
Copyright © 2018 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End user
must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be
co-located or operating in conjunction with any other antenna or transmitter.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless
otherwise specified, the document only serves as the user guide. All the statements, information and suggestions
contained in the document do not constitute any explicit or implicit guarantee.

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This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed
antenna gain is as following table showed:
Operating Band
Antenna Gain（dBi）
WCDMA BAND II
8.5
WCDMA BAND IV
5.5
WCDMA BAND V
9.07
LTE BAND 2
9
LTE BAND 4
6
LTE BAND 5
9.41
LTE BAND 7
9
LTE BAND 12
8.85
LTE BAND 13
10.31
LTE BAND 14
10.38
LTE BAND 17
9.74
LTE BAND 25
9
LTE BAND 26（814-824）
8.51
LTE BAND 26（824-849）
8.56
LTE BAND 30
1
LTE BAND 38
9
LTE BAND 41
5.5
LTE BAND 66
6
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
Host manufacturer is responsible for ensuring that the host continues to be compliant with the Part 15
subpart B unintentional radiator requirements after the module is installed and operational.

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The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit guarantee.
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator
will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that
20 cm may be maintained between the antenna and users. The final end product must be labeled in a
visible area with the following: “Contains FCC ID: ZMOL860GL”. The grantee's FCC ID can be used only
when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.

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This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareilne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non
contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre la source de
rayonnement et votre corps.\
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible
at all times when installed in the host device; otherwise, the host device must be labeled to display the Innovation,
Science and Economic Development Canada certification number for the module, preceded by the words “Contains
transmitter module IC: 21374-L860GL
L'étiquette de certification Innovation, Sciences et Développement économique Canada d'un module doit être
clairement visible en tout temps lorsqu'elle est installée dans le dispositif hôte. sinon, le périphérique hôte doit être
étiqueté pour afficher le numéro de certification Innovation, Sciences et Développement économique Canada du
module, précédé des mots "Contient le module émetteur IC: 21374-L860GL.
The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed
antenna gain is as following table showed

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L'antenne doit être installée de telle sorte que 20 cm soient maintenus entre l'antenne et les utilisateurs,
et le gain d'antenne maximal autorisé est indiqué dans le tableau suivant.
Operating Band/
Bande d'opération
Max allowed Gain/
Max autorisé Gain
(dBi)
WCDMA BAND II
8.50
WCDMA BAND IV
5.50
WCDMA BAND V
8.76
LTE BAND 2
9.00
LTE BAND 4
6.00
LTE BAND 5
8.25
LTE BAND 7
9.00
LTE BAND 12
8.76
LTE BAND 13
9.09
LTE BAND 14
9.13
LTE BAND 17
8.79
LTE BAND 25
9.00
LTE BAND 26
（824-849）
8.25
LTE BAND 30
1.00
LTE BAND 38
9.00
LTE BAND 41
5.50
LTE BAND 66
6.00

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Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Version Record
Version
Update date
Remark
V1.0.0
2018-01-25
Draft version
V1.0.1
2018-03-09
1. Add UL CA combinations description.
2. Modify pin definition and description.
V1.0.2
2018-07-19
1. Modify module timing
2. Change tray package type
3. Modify CA Combinations
4. And add RF performance parameters and power consumption
V1.0.3
2018-07-28
1. Modify B41 HPUE maximum TX power description
2. Delete Band21/Band32 Related Information
Applicability Table
No.
Product model
Description
1
L860-GL-01
NA

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Contents
1 Foreword ..................................................................................................................................................11
1.1 Introduction ....................................................................................................................................11
1.2 Reference Standard.......................................................................................................................11
1.3 Related Documents .......................................................................................................................11
2 Overview.................................................................................................................................................. 12
2.1 Introduction ................................................................................................................................... 12
2.2 Specification.................................................................................................................................. 12
2.3 CA combinations ........................................................................................................................... 13
2.4 Application Framework.................................................................................................................. 15
2.5 Hardware Block Diagram.............................................................................................................. 15
2.6 Antenna Configuration .................................................................................................................. 16
3 Application Interface................................................................................................................................ 17
3.1 M.2 Interface ................................................................................................................................. 17
3.1.1 Pin Map............................................................................................................................... 17
3.1.2 Pin Definition....................................................................................................................... 18
3.2 Power Supply................................................................................................................................ 22
3.2.1 Power Supply...................................................................................................................... 22
3.2.2 Logic level........................................................................................................................... 24
3.2.3 Power Consumption ........................................................................................................... 24
3.3 Control Signal ............................................................................................................................... 26
3.3.1 Module Start-Up.................................................................................................................. 27
3.3.1.1 Start-up Circuit ......................................................................................................... 27
3.3.1.2 Start-up Timing Sequence........................................................................................ 27
3.3.2 Module Shutdown............................................................................................................... 28
3.3.3 Module Reset...................................................................................................................... 28
3.3.4 PCIe Reset ......................................................................................................................... 30
3.4 PCIe & USB .................................................................................................................................. 31
3.4.1 PCIe Interface..................................................................................................................... 31
3.4.1.1 PCIe Interface Definition .......................................................................................... 31
3.4.1.2 PCIe Interface Application........................................................................................ 32
3.4.2 USB Interface ..................................................................................................................... 34
3.4.2.1 USB Interface Definition........................................................................................... 34
3.4.2.2 USB2.0 Interface Application ................................................................................... 34

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3.5 USIM Interface .............................................................................................................................. 35
3.5.1 USIM1 Pins......................................................................................................................... 35
3.5.2 USIM2 Pins......................................................................................................................... 35
3.5.3 USIM Interface Circuit ........................................................................................................ 36
3.5.3.1 N.C. SIM Card Slot................................................................................................... 36
3.5.3.2 N.O. SIM Card Slot................................................................................................... 36
3.5.4 USIM Hot-Plugging............................................................................................................. 37
3.5.5 USIM Design....................................................................................................................... 38
3.6 Status Indicator ............................................................................................................................. 38
3.6.1 LED#1 Signal...................................................................................................................... 38
3.7 Interrupt Control ............................................................................................................................ 39
3.7.1 W_DISABLE1# ................................................................................................................... 39
3.7.2 BODYSAR .......................................................................................................................... 40
3.7.3 ANT_CONFIG..................................................................................................................... 40
3.8 ANT Tunable Interface .................................................................................................................. 40
3.9 Configuration Interface ................................................................................................................. 41
3.10 Other Interfaces .......................................................................................................................... 42
4 Radio Frequency..................................................................................................................................... 42
4.1 RF Interface .................................................................................................................................. 42
4.1.1 RF Interface Functionality................................................................................................... 42
4.1.2 RF Connector Characteristic .............................................................................................. 42
4.1.3 RF Connector Dimension ................................................................................................... 42
4.2 Operating Band............................................................................................................................. 44
4.3 Transmitting Power ....................................................................................................................... 45
4.4 Receiver Sensitivity....................................................................................................................... 46
4.4.1 Dual Antenna Receiver Sensitivity ..................................................................................... 46
4.4.2 Four Antenna Receiver Sensitivity ..................................................................................... 47
4.5 GNSS ............................................................................................................................................ 48
4.6 Antenna Design............................................................................................................................. 49
5 Structure Specification ............................................................................................................................ 51
5.1 Dimension of Structure ................................................................................................................. 51
5.2 M.2 Interface Model ...................................................................................................................... 51
5.3 M.2 Connector .............................................................................................................................. 52
5.4 Storage.......................................................................................................................................... 53

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5.4.1 Storage Life ........................................................................................................................ 53
5.5 Packing ......................................................................................................................................... 53
5.5.1 Tray Package...................................................................................................................... 53
5.5.2 Tray size ............................................................................................................................. 55

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L860-GL (hereinafter referred to as L860). With the assistance of the document and
other instructions, the developers can quickly understand the hardware functions of L860 modules and
develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio
transmission and reception (TDD)
3GPP TS 36.521-1 V13.4.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
Toolkit(USAT)
3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating
Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service
(CBS)
PCI Express M.2 Specification Rev1.1
1.3 Related Documents
RF Antenna Application Design Specification
L8-Family System Driver Integration and Application Guidance
L8-Family AT Commands Manual

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2 Overview
2.1 Introduction
L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE
FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the
world.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 29, 30, 66
LTE TDD: Band 38, 39, 40, 41
LAA Band 46 Receiver only
WCDMA/HSPA+: Band 1, 2, 4, 5, 8
GNSS/Beidou: support
Data
Transmission
LTE
1 Gbps DL/75 Mbps UL(Cat 16)
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSPA+:42 Mbps DL(Cat 24)//11.52 Mbps UL(Cat7)
Carrier
aggregation
5CA Downlink
Power Supply
DC 3.135V～4..4V, Typical 3.3V
Temperature
Normal operating temperature: -10°C ～+55°C
Extended operating temperature: -20°C ～+65°C
Storage temperature: -40°C ～+85°C
Physical
characteristics
Interface: M.2 Key-B
Dimension：30 x 42 x 2.3mm
Weight: About 6.2 g
Interface
Antenna
Connector
WWAN Antenna x 4
Support 4x4 MIMO
Function
Interface
Dual SIM, 3V/1.8V
PCIe 2.0 X1

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Specification
USB 2.0
USB 3.0(Reserved)
W_Disable#
Body Sar
LED
Tunable antenna
I2S(Reserved)
Software
Protocol Stack
IPV4/IPV6
AT commands
3GPP TS 27.007 and 27.005
Firmware update
PCIe
Other feature
Multiple carrier
Windows MBIM support
Windows update
AGNSS
Note:
When temperature goes beyond normal operating temperature range of -10°C~+55°C, RF
performance of module may be slightly off 3GPP specifications. For normal operating
temperature, LTE FDD Band 4 and 13 can support temperature ranging from -20℃ to +60℃.
2.3 CA combinations
DL CA Combinations
2CA
Inter-band
1+3, 5, 7, 8, 18, 19, 20, 26, 28, 38, 41, 46
2+4, 5, 12, 13, 14, 29, 30, 46, 66
3+5, 7, 8, 19, 20, 28, 38, 40, 41, 46
4+5, 12, 13, 29, 30, 46
5+7, 30, 46, 66
7+8, 20, 28, 32, 46
12+30, 66
13+46, 66
14+30, 66
25+26, 41, 46
26+41
29+30, 66
30+66

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DL CA Combinations
41+46
46+66
Intra-band(non-contiguous)
1, 2, 3, 4, 7, 25, 41, 66
Intra-band(contiguous)
1, 2, 3, 5, 7, 40, 41, 66
3CA
Inter-band
1+3+5, 1+3+7, 1+3+8, 1+3+19, 1+3+20, 1+3+28, 1+3+38,
1+5+7, 1+7+8, 1+7+20, 1+7+28
2+4+5, 2+4+12, 2+4+13, 2+5+30, 2+12+30, 2+29+30,
2+5+66, 2+13+66, 2+14+30, 2+14+66, 2+30+66, 2+5+46,
2+13+46, 2+46+66, 2+12+66
3+5+7, 3+7+8, 3+7+20, 3+7+28
4+5+30, 4+12+30, 4+29+30
5+30+66, 5+46+66
12+30+66, 13+46+66, 14+30+66, 29+30+66
2 intra-band(non-contiguous) plus
inter-band
2+2+5, 2+2+12, 2+2+13, 2+2+30, 2+2+66, 2+4+4, 2+46+46,
2+66+66
3+7+7, 4+4+5, 4+4+12, 4+4+13, 4+46+46, 5+66+66
12+66+66, 13+66+66, 46+46+66, 29+66+66, 30+66+66
2 intra-band(contiguous) plus
inter-band
1+3+3, 1+7+7, 1+40+40*, 1+41+41*
2+5+5*, 2+46+46, 2+66+66
3+3+5*, 3+3+7, 3+3+20, 3+3+28*, 3+7+7, 3+40+40,
3+41+41*, 3+3+41
4+46+46, 5+5+30*, 5+5+66, 5+46+46*, 5+66+66, 7+7+28*
13+46+46*, 13+66+66, 25+41+41*, 26+41+41*,
28+40+40*,46+46+66
Intra-band(non-contiguous)
41, 66
Intra-band(contiguous)
40*, 41*
4CA
Inter-band
1+3+5+7, 1+3+7+8, 1+3+7+20, 1+3+7+28
2+5+30+66, 2+12+30+66, 2+14+30+66
2 intra-band(non-contiguous) plus
2 inter-band
2+2+5+66, 2+2+12+30, 2+2+12+66, 2+2+13+66, 2+5+66+66,
2+12+66+66, 2+13+66+66, 5+30+66+66, 29+30+66+66*
2 intra-band(contiguous) plus
2 inter-band
1+3+3+5*, 1+3+3+7, 1+3+3+20*, 1+3+7+7, 1+7+7+28*,
1+3+40+40*,
2+5+5+30*, 2+5+5+66*, 2+5+46+46*, 2+13+46+46*,
2+46+46+46*, 2+46+46+66, 2+5+66+66, 2+13+66+66
3+3+7+20*, 3+3+7+28*, 3+7+7+28*, 3+28+40+40*,
4+46+46+46*, 5+5+30+66*, 5+46+46+66*, 13+46+46+66*,
66+46+46+46*
2 intra-band(contiguous) plus
2 intra-band(contiguous)
3+3+7+7
2 intra-band(contiguous) plus
2 intra-band(non-contiguous)
5+5+66+66
3 intra-band(contiguous) plus
inter-band
2+46+46+46, 3+40+40+40, 4+46+46+46, 5+46+46+46,
13+46+46+46, 25+41+41+41, 28+40+40+40, 66+46+46+46
Intra-band(non-contiguous)
41
Intra-band(contiguous)
40*
5CA
2 intra-band(contiguous) plus 2
intra-band(contiguous) plus inter-
band
1+3+3+7+7, 3+3+7+7+28*, 2+46+46+46+46*,
46+46+46+46+66*
2 intra-band(contiguous) plus 3
inter-band
1+3+3+7+20*, 1+3+7+7+28*, 2+5+5+30+66*

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DL CA Combinations
2 intra-band(contiguous) plus 2
intra-band(non-contiguous) plus
inter-band
2+5+5+66+66*
3 intra-band(contiguous) plus 2
intra-band(non-contiguous)
2+2+46+46+46*
3 intra-band(contiguous) plus 2
inter-band
2+5+46+46+46*, 2+13+46+46+46*, 2+46+46+46+46*,
2+46+46+46+66*, 3+28+40+40+40*, 4+46+46+46+46*,
5+46+46+46+66*, 13+46+46+46+66*, 46+46+46+46+66*
3 intra-band(contiguous) plus 2
intra-band(non-contiguous)
46+46+46+66+66*
4 intra-band(contiguous) plus
inter-band
2+46+46+46+46*, 3+40+40+40+40*, 5+46+46+46+46*,
13+46+46+46+46*, 46+46+46+46+66*
Intra-band(non-contiguous)
41*
Note:
* Those CA are not defined in 3GPP as of publication date, they are not fully applicable for SAR
test,support pending 3GPP approval.
2.4 Application Framework
The peripheral applications for L860 module are shown in Figure 2-1:
Module
SIM1 USB2.0
Power
Supply ON/OFF# RESET#
Control
EINT Indicator
Host application
D/G(AUX1) ANT Main ANT
SIM
Card
PCIe
SIM2
SIM
Card
M2(AUX3) ANT M1(AUX2) ANT
Figure2-1 Application Framework
2.5 Hardware Block Diagram
The hardware block diagram in Figure 2-2 shows the main hardware functions of L860 module, including
base band and RF functions.

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Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply
NAND/internal LPDDR4 RAM
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front end
RF Filter
Antenna Connector
Figure 2-2 Hardware Block Diagram
2.6 Antenna Configuration
L860 module support four antennas and the configuration is as below table:
Antenna Connector
Function Description
Band configuration
M
Main ANT
All supported bands transmit & receive
M1
MIMO1 ANT
4x4 MIMO supported bands receive
M2
MIMO2 ANT
4x4 MIMO supported bands receive
D/G
Diversity & GNSS ANT
All supported bands and GNSS receive

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3 Application Interface
3.1 M.2 Interface
The L860 module applies standard M.2 Key-B interface, with a total of 75 pins.
3.1.1 Pin Map
Figure 3-1 Pin Map
Note:
Pin “Notch” represents the gap of the gold fingers.

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3.1.2 Pin Definition
The pin definition is as follows:
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
1
CONFIG_3
O
NC
NC, L860 M.2 module is configured as
the WWAN –PCIe, USB3.0 interface
type
2
+3.3V
PI
-
Power input
Power Supply
3
GND
-
-
GND
Power Supply
4
+3.3V
PI
-
Power input
Power Supply
5
GND
-
-
GND
Power Supply
6
FULL_CARD_
POWER_OFF#
I
PU
Power enable, Module power on input,
internal pull up
CMOS
3.3/1.8V
7
USB D+
I/O
USB Data Plus
0.3---3V
8
W_DISABLE1#
I
PD
WWAN Disable, active low
CMOS
3.3/1.8V
9
USB D-
I/O
USB Data Minus
0.3---3V
10
LED1#
OD
T
System status LED, Output open drain,
CMOS 3.3V
CMOS 3.3V
11
GND
-
-
GND
Power Supply
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
O
PD
I2S Serial clock, Reserved
CMOS 1.8V
21
CONFIG_0
NC
NC, L860 M.2 module is configured as
the WWAN –PCIe, USB3.0 interface
type
22
I2S_RX
I
PD
I2S Serial receive data,
Reserved
CMOS 1.8V

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
FIBOCOM_L860-GL Hardware User Manual Page 19 of 55
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
23
WOWWAN#
O
PD
Wake up host, Reserved
CMOS 1.8V
24
I2S_TX
O
PD
I2S Serial transmit data, Reserved
CMOS 1.8V
25
DPR
I
PD
Body SAR Detect, active low
CMOS
3.3/1.8V
26
W_DISABLE2#
I
PD
GNSS disable, active low, Reserved
CMOS
3.3/1.8V
27
GND
-
-
GND
Power Supply
28
I2S_WA
O
PD
I2S Word alignment/select, Reserved
CMOS 1.8V
29
USB3.0_TX-
O
USB3.0 Transmit data minus,
Reserved
30
UIM_RESET
O
L
SIM reset signal
1.8V/3V
31
USB3.0_TX+
O
USB3.0 Transmit data plus, Reserved
32
UIM_CLK
O
L
SIM clock Signal
1.8V/3V
33
GND
-
-
GND
Power Supply
34
UIM_DATA
I/O
L
SIM data input/output
1.8V/3V
35
USB3.0_RX-
I
USB3.0 receive data minus, Reserved
36
UIM_PWR
O
SIM power supply, 3V/1.8V
1.8V/3V
37
USB3.0_RX+
I
USB3.0 receive data plus, Reserved
38
NC
NC
39
GND
-
-
GND
Power Supply
40
SIM2_DETECT
I
PD
SIM2 Detect, internal pull up(390KΩ),
active high
CMOS 1.8V
41
PETn0
O
PCIe TX Differential signals
Negative
42
UIM2_DATA
I/O
L
SIM2 data input/output
1.8V/3V
43
PETp0
O
PCIe TX Differential signals Positive
44
UIM2_CLK
O
L
SIM2 clock Signal
1.8V/3V
45
GND
-
-
GND
Power Supply
46
UIM2_RESET
O
L
SIM2 reset signal
1.8V/3V
47
PERn0
I
PCIe RX Differential signals
Negative
48
UIM2_PWR
O
SIM2 power supply, 3V/1.8V
1.8V/3V

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.
FIBOCOM_L860-GL Hardware User Manual Page 20 of 55
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
49
PERp0
I
PCIe RX Differential signals Positive
50
PERST#
I
PU
Asserted to reset module PCIe
interface default. If module went into
core dump, it will reset whole module,
not only PCIe interface.
Active low, internal pull up(10KΩ)
CMOS 3.3V
51
GND
-
-
GND
Power Supply
52
CLKREQ#
O
PU
Asserted by device to request a PCIe
reference clock be available (active
clock state) in order to transmit data. It
also used by L1 PM Sub states
mechanism, asserted by either host or
device to initiate an L1 exit.
Active low, internal pull up(10KΩ)
CMOS 3.3V
53
REFCLKN
I
PCIe Reference Clock signal
Negative
54
PEWAKE#
O
L
Asserted to wake up system and
reactivate PCIe link from L2 to L0, it
depends on system
whether supports wake up functionality.
Active low, open drain output and
should add external pull up on platform
CMOS 3.3V
55
REFCLKP
I
PCIe Reference Clock signal
Positive
56
RFFE_SCLK
O
PD
MIPI Interface Tunable ANT,
RFFE clock
CMOS 1.8V
57
GND
GND
Power Supply
58
RFFE_SDATA
I/O
PD
MIPI Interface Tunable ANT,
RFFE data
CMOS 1.8V
59
ANTCTL0
O
L
Tunable ANT CTRL0
CMOS 1.8V
60
COEX3
I/O
PD
Wireless Coexistence between WWAN
and WiFi/BT modules, based on BT-SIG
coexistence protocol. COEX_EXT_FTA,
Reserved
CMOS 1.8V
61
ANTCTL1
O
PD
Tunable ANT CTRL1
CMOS 1.8V