Fibocom L811-EB User manual

L811-EB Hardware User Manual
Version: 1.0.2
Update date: 2017.06.15

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L811-EB Hardware User Manual Page 2 of 47
Applicability Table
No.
Product model
Description
1
L811-EB-00
NA

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Copyright
Copyright © 2017 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Version Record
Version
Update Date
Description
V1.0.0
2017-03-16
Initial release.
V1.0.1
2017-05-16
Update the power consumption and receiver sensitivity.
V1.0.2
2017-06-15
Remove the description of system switch control, and update the voltage
of POWER_ON/OFF#.

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L811-EB Hardware User Manual Page 4 of 47
Contents
1 Foreword ...........................................................................................................................7
1.1 Introduction..........................................................................................................................7
1.2 Reference Standard.............................................................................................................7
1.3 Related Documents..............................................................................................................7
2 Overview............................................................................................................................8
2.1 Introduction..........................................................................................................................8
2.2 Specification.........................................................................................................................8
2.3 Application Framework.........................................................................................................9
2.4 Hardware Framework.........................................................................................................10
3 Application Interface ......................................................................................................10
3.1 LGA Interface.....................................................................................................................10
3.1.1 Pin Distribution.....................................................................................................................11
3.1.2 Pin Definition....................................................................................................................... 12
3.2 Power Supply.....................................................................................................................18
3.2.1 Power Supply...................................................................................................................... 19
3.2.2 RTC Power Supply............................................................................................................. 20
3.2.3 1.8V Power Supply............................................................................................................. 21
3.2.4 Power Consumption........................................................................................................... 21
3.3 Control Signal ....................................................................................................................23
3.3.1 Module Start-Up.................................................................................................................. 23
3.3.1.1 Start-up Circuit ............................................................................................................................... 23
3.3.1.2 Start-up Timing Sequence.............................................................................................................. 23
3.3.2 Module Shutdown............................................................................................................... 24
3.3.2.1 Software Shutdown........................................................................................................................ 24
3.3.2.2 Hardware Shutdown....................................................................................................................... 25
3.3.3 Module Reset...................................................................................................................... 25
3.4 USB Interface.....................................................................................................................26
3.4.1 USB Interface Definition..................................................................................................... 27
3.4.2 USB Interface Application .................................................................................................. 27
3.5 USIM Interface...................................................................................................................28
3.5.1 USIM Pins........................................................................................................................... 28
3.5.2 USIM Interface Circuit ........................................................................................................ 28
3.5.2.1 N.C. SIM Card Slot......................................................................................................................... 28

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3.5.2.2 N.O. SIM card slot.......................................................................................................................... 29
3.5.3 USIM Hot-Plugging............................................................................................................. 30
3.5.4 USIM Design....................................................................................................................... 30
3.6 UART Interface ..................................................................................................................31
3.6.1 UART Interface Definition................................................................................................... 31
3.6.2 UART Interface Application................................................................................................ 31
3.7 Status Indicator..................................................................................................................32
3.7.1 CORE DUMP...................................................................................................................... 32
3.7.2 LPG Signal.......................................................................................................................... 32
3.7.3 WAKEUP_HOST................................................................................................................ 33
3.7.4 PA_BLANKING................................................................................................................... 33
3.8 Interrupt Control.................................................................................................................34
3.8.1 WAKEUP............................................................................................................................ 34
3.8.2 W_DISABLE#..................................................................................................................... 35
3.8.3 BODY_SAR........................................................................................................................ 35
3.9 Digital Audio.......................................................................................................................35
3.9.1 I2S Mode ............................................................................................................................ 36
3.9.2 PCM Mode.......................................................................................................................... 36
3.10 I2C Interface Description..................................................................................................37
3.11 Clock Interface.................................................................................................................38
3.12 ADC Interface ..................................................................................................................38
3.13 Other Interfaces ...............................................................................................................38
4 RF Interface.....................................................................................................................39
4.1 Operating Band..................................................................................................................39
4.2 Transmitting Power............................................................................................................39
4.3 Receiver Sensitivity............................................................................................................40
4.4 RF PCB Design..................................................................................................................41
4.4.1 Trace Routing Principle...................................................................................................... 41
4.4.2 Impedance Design.............................................................................................................. 41
4.5 Antenna Design..................................................................................................................42
4.5.1 Antenna Design Requirements .......................................................................................... 42
5 Structure Specification ..................................................................................................43
5.1 Product Appearance ..........................................................................................................43
5.2 Dimension of Structure.......................................................................................................43

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5.3 Recommended Design for PCB Bonding Pad....................................................................44
5.4 SMT...................................................................................................................................44
5.5 Storage ..............................................................................................................................45
5.5.1 Storage Life ........................................................................................................................ 45
5.5.2 Workshop Life..................................................................................................................... 45
5.5.3 Recommended baking standards:...................................................................................... 45
5.6 Packing ..............................................................................................................................45
5.6.1 Tray Package...................................................................................................................... 46
5.6.2 Tray size ............................................................................................................................. 47

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L811-EB Hardware User Manual Page 7 of 47
1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L811-EB-00 module. With the assistance of the document and other instructions, the
developers can quickly understand the hardware functions of L811-EB modules and develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1:
Conformance specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio
transmission and reception (FDD);Part 1: Conformance specification
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio
transmission and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application
Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile
terminals and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
1.3 Related Documents
The performance test report of L811-EB module
RF Antenna Application Design Specification
Fibocom Digital Voice
L8-Family System Driver Integration and Application Guidance
L8-Family AT Commands Manual

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L811-EB Hardware User Manual Page 8 of 47
EVK-GT8230 Hardware User Manual
L811 SMT Application Design Specification
2 Overview
2.1 Introduction
The L811-EB is a highly integrated 4G wireless communication module, which supports LTE
FDD/WCDMA/GSM systems.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 1, 3, 5, 7, 8, 20, 28
WCDMA/HSPA+: Band I, V,VIII
GSM/GPRS/EDGE: 850/900/1800/1900MHz
Data Transmission
LTE FDD
150Mbps DL/50Mbps UL(Cat 4)
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
GPRS/EDGE
GPRS:107kbps DL/85.6kbps UL(multi-slot class 33)
EDGE(E-GPRS):296kbps DL/236.8kbps UL
(multi-slot class 33)
Power Supply
DC 3.3V～4.4V, Typical 3.8V
Temperature
Normal Operating temperature: -30°C ～+75°C
Extreme Operating temperature: -40°C ～+85°C
Storage temperature: -40°C ～+85°C
Physical
characteristics
Interface: LGA 144 PIN
Dimension: 32 x 26 x 2.3 mm
Weight: About 4.5 g
Interface
Antenna
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1
Function Interface
USIM 1.8V/3.0V
USB 2.0 x 1

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L811-EB Hardware User Manual Page 9 of 47
4-line UART x 1
I2S
I2C
EINT、System Indicator
Clock
ADC x 1
JTAG/MIPI(Trace)
Software
Protocol Stack
Embedded TCP/IP and UDP/IP protocol stack
AT commands
3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT commands
Firmware update
USB
Note:
The RF performance of the module may be slightly beyond the 3GPP specifications when the
temperature exceeds the normal operating temperature range of -30°C～+75°C.
2.3 Application Framework
The peripheral applications for L811-EB module are shown in Figure 2-1:
Module
SIM USB
Power
Supply
VRTC VSD2_1V8
ON/OFF# RESET#
Control
EINT Indicator
Host application
UART
Main ANT
Main ANT
Div ANT
Div ANT
SIM
Card
Figure2-1 Application Framework

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L811-EB Hardware User Manual Page 10 of 47
2.4 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L811-EB module, including
Baseband and RF functions.
Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply
Internal LPDDR2 RAM and NAND
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front end
RF Filter
Antenna
VBAT
POWER_ON/OFF#
RESET_N
VRTC
1V8
USB2.0
USIM
UART
EINT
INDICATOR
I2S
I2C
CLOCK
ADC
JTAG
MIPI
HSIC
Tunable ANT
Main ANT
Diversity ANT
Baseband
(GSM/UMTS/LTE FDD controller)
PMU
TX
LPDDR2
RAM&
NAND
Div RF
Front
END
Main RF
Front
END
PA DCDC
PA
RF Transceiver
RX
RX
RF Part
TCXO
LGA 144PIN Interface
Figure 2-2 Hardware Framework
3 Application Interface
3.1 LGA Interface
The L811-EB module applies LGA packaging, with a total of 144 pins.

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L811-EB Hardware User Manual Page 11 of 47
3.1.1 Pin Distribution
Figure 3-1 Pin Distribution
Note:
Pin “NB” represents No ball, namely, no pin at this position.

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L811-EB Hardware User Manual Page 12 of 47
3.1.2 Pin Definition
The pin definition is as follows:
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
USB2.0
A11
VBUS
PI
USB VBUS Supply
2.0---5.25V
A12
USB_DN
IO
T
USB Data Minus
0.3---3.0V
A13
USB_DP
IO
T
USB Data Plus
0.3---3.0V
SIM
D15
VSIM1
PO
USIM power supply
1.8V/3.0V
E15
SIM1_RST
O
L
USIM reset
1.8V/3.0V
F15
SIM1_CLK
O
L
USIM clock
1.8V/3.0V
G15
SIM1_DATA
IO
L
USIM data,internal pull up(4.7KΩ)
1.8V/3.0V
H15
SIM1_CD
I
T
USIM detect, pull up(390KΩ)
High active
1.8V
F14
SIM1_DP
IO
PD
USB data plus for USIM card
(not support now)
G14
SIM1_DN
IO
PD
USB data minus for USIM card
(not support now)
UART1
A9
UART1_TXD
O
PU
UART1 transmit Data
CMOS 1.8V
A10
UART1_RXD
I
PD
UART1 receive Data
CMOS 1.8V
K14
UART1_RTS
O
PU
UART1 Request To Send
CMOS 1.8V
L14
UART1_CTS
I
PU
UART1 Clear To Send
CMOS 1.8V
EINT
J15
WAKEUP
I
L
Wake up module
CMOS 1.8V
K15
W_DISABLE#
I
L
Disable WWAN
CMOS 1.8V
H14
EINT3
I
L
ACM/MBIM interface switch
(Reserved)
CMOS 1.8V
J14
BODY_SAR
I
L
Body sar detect
CMOS 1.8V
System Status Indicator

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L811-EB Hardware User Manual Page 13 of 47
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
A4
CORE_DUMP
O
PD
Core dump indicator
CMOS 1.8V
A5
LPG
O
PD
LPG indicator
CMOS 1.8V
A7
WAKEUP_HOST
O
PD
WAKEUP Host(AP)
CMOS 1.8V
L15
PA_BLANKING/
TRIG_OUT
O
PD
PA blanking output/Monitoring Signal
Output
CMOS 1.8V
I2S
N9
I2S2_WA0
O
PD
I2S L/R channel clock
CMOS 1.8V
N10
I2S2_TX
O
PD
I2S transmit data
CMOS 1.8V
N11
I2S2_RX
I
PD
I2S receive data
CMOS 1.8V
N12
I2S2_CLK
O
PD
I2S serial clock
CMOS 1.8V
I2C
M11
I2C_SDA
IO
PU
I2C serial data,pull up(4.7KΩ)
CMOS 1.8V
M12
I2C_SCL
O
PU
I2C serial clock,pull up(4.7KΩ)
CMOS 1.8V
Clock
A3
FSYS2_26M
O
L
26MHz clock output,1.8V
1.8V
A8
CLK32K
O
PD
32kHz clock output,1.8V
1.8V
ADC
C10
ADC
I
General purpose A/D,1.2V max
voltage
ANT
J1
ANT_MAIN
IO
Main antenna
E1
ANT_DIV
I
Diversity antenna
ANT Tunable
B5
RFE_RFFE1_SDATA
IO
RFFE1 serial data for tunable ANT
1.8V
B4
RFE_RFFE1_SCLK
O
RFFE1 serial clock for tunable ANT
1.8V
B3
RFE_RFFE1_VIO
PO
RFFE1 VIO for tunable ANT
1.8V
HSIC(not support now)
B12
USB_HSIC_STRB
IO
High speed Inter IC clock

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L811-EB Hardware User Manual Page 14 of 47
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
C12
USB_HSIC_DATA
IO
High speed Inter IC data
C4
IPC_HOST_WAKEUP
O
PU
IPC host wakeup
CMOS 1.8V
C5
IPC_TRIG_OUT
O
PD
IPC trig out
CMOS 1.8V
C7
IPC_TRIG_IN
I
PU
IPC trig in
CMOS 1.8V
C8
IPC_SLAVE_WAKEU
P
I
PD
IPC slave wakeup
CMOS 1.8V
NC
D13
NC
Not connected
E13
NC
Not connected
D14
NC
Not connected
E14
NC
Not connected
B13
NC
Not connected
C13
NC
Not connected
B14
NC
Not connected
C14
NC
Not connected
JTAG
L5
TDO
O
T
Serial Data Out
M10
TDI
I
PU
Serial Data Input
M7
TMS
I
PU
State machine control signal
M9
TCK
I
PD
JTAG clock input
M5
TRST_N
I
PD
Reset/Module enable
M6
TRIG_IN
I
PD
Monitoring Signal Input
CMOS 1.8V
MIPI2 Trace
L7
MIPI2_TRC_CLK
O
PD
MIPI2 trace clock
CMOS 1.8V
L6
MIPI2_TRC_DATA0
IO
PD
MIPI2 trace data0
CMOS 1.8V
L9
MIPI2_TRC_DATA1
IO
PD
MIPI2 trace data1
CMOS 1.8V
L10
MIPI2_TRC_DATA2
IO
PD
MIPI2 trace data2
CMOS 1.8V

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L811-EB Hardware User Manual Page 15 of 47
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
L11
MIPI2_TRC_DATA3
IO
PD
MIPI2 trace data3
CMOS 1.8V
Module Control
N7
RESET_N
I
Module reset input,pull up(100KΩ)
1.8V
N8
POWER_ON/OFF#
I
Module Power ON/OFF# signal,pull
down (200KΩ)
1.8V
Power
N3
VBAT
PI
-
Power input
Power supply
N4
VBAT
PI
-
Power input
Power supply
M3
VBAT
PI
-
Power input
Power supply
M4
VBAT
PI
-
Power input
Power supply
N5
VRTC
PO
-
VRTC power supply
Power supply
N6
VSD2_1V8
PO
-
1.8V Power supply
Power supply
B8
GND
-
-
GND
Power supply
B9
GND
-
-
GND
Power supply
B10
GND
-
-
GND
Power supply
B11
GND
-
-
GND
Power supply
C11
GND
-
-
GND
Power supply
F13
GND
-
-
GND
Power supply
L12
GND
-
-
GND
Power supply
M13
GND
-
-
GND
Power supply
L13
GND
-
-
GND
Power supply
G13
GND
-
-
GND
Power supply
H13
GND
-
-
GND
Power supply
J13
GND
-
-
GND
Power supply
K13
GND
-
-
GND
Power supply
A6
GND
-
-
GND
Power supply
B2
GND
-
-
GND
Power supply

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L811-EB Hardware User Manual Page 16 of 47
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
B6
GND
-
-
GND
Power supply
B7
GND
-
-
GND
Power supply
C1
GND
-
-
GND
Power supply
C2
GND
-
-
GND
Power supply
C3
GND
-
-
GND
Power supply
C6
GND
-
-
GND
Power supply
C9
GND
-
-
GND
Power supply
C15
GND
-
-
GND
Power supply
D1
GND
-
-
GND
Power supply
D2
GND
-
-
GND
Power supply
D3
GND
-
-
GND
Power supply
D4
GND
-
-
GND
Power supply
D12
GND
-
-
GND
Power supply
E2
GND
-
-
GND
Power supply
E3
GND
-
-
GND
Power supply
F1
GND
-
-
GND
Power supply
F2
GND
-
-
GND
Power supply
F3
GND
-
-
GND
Power supply
G1
GND
-
-
GND
Power supply
G2
GND
-
-
GND
Power supply
G3
GND
-
-
GND
Power supply
H1
GND
-
-
GND
Power supply
H2
GND
-
-
GND
Power supply
H3
GND
-
-
GND
Power supply
J2
GND
-
-
GND
Power supply
J3
GND
-
-
GND
Power supply
K1
GND
-
-
GND
Power supply

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L811-EB Hardware User Manual Page 17 of 47
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
K2
GND
-
-
GND
Power supply
K3
GND
-
-
GND
Power supply
K4
GND
-
-
GND
Power supply
K12
GND
-
-
GND
Power supply
L1
GND
-
-
GND
Power supply
L2
GND
-
-
GND
Power supply
L3
GND
-
-
GND
Power supply
L4
GND
-
-
GND
Power supply
L8
GND
-
-
GND
Power supply
M2
GND
-
-
GND
Power supply
M8
GND
-
-
GND
Power supply
M14
GND
-
-
GND
Power supply
N13
GND
-
-
GND
Power supply
A1
GND
-
-
GND
Power supply
A15
GND
-
-
GND
Power supply
N1
GND
-
-
GND
Power supply
N15
GND
-
-
GND
Power supply
TG1
GND
-
-
Thermal Ground
-
TG2
GND
-
-
Thermal Ground
-
TG3
GND
-
-
Thermal Ground
-
TG4
GND
-
-
Thermal Ground
-
TG5
GND
-
-
Thermal Ground
-
TG6
GND
-
-
Thermal Ground
-
TG7
GND
-
-
Thermal Ground
-
TG8
GND
-
-
Thermal Ground
-
TG9
GND
-
-
Thermal Ground
-
TG10
GND
-
-
Thermal Ground
-

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L811-EB Hardware User Manual Page 18 of 47
Pin
Pin Name
I/O
Reset Value
Pin Description
Type
TG11
GND
-
-
Thermal Ground
-
TG12
GND
-
-
Thermal Ground
-
TG13
GND
-
-
Thermal Ground
-
TG14
GND
-
-
Thermal Ground
-
TG15
GND
-
-
Thermal Ground
-
TG16
GND
-
-
Thermal Ground
-
H: High Voltage Level
L: Low Voltage Level
PD:Pull-Down
PU:Pull-Up
T: Tristate
OD:Open Drain
PP:Push-Pull
Note:
The unused pins can be left floating.
3.2 Power Supply
The power interface of L811-EB module as shown in the following table:
Pin
Pin Name
I/O
Pin Description
DC Parameter （V）
Minimum
Value
Typical
Value
Maximum
Value
N3,N4,M3,M4
VBAT
PI
Power input
3.3
3.8
4.4
A11
VBUS
PI
USB power supply
2.0
3.8
5.25
N5
VRTC
PO
VRTC power supply
1.71
1.8
1.89
N6
VSD2_1V8
PO
1.8V power supply
1.71
1.8
1.89
D15
VSIM1
PO
SIM1 power supply
1.8V/3.0V

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L811-EB Hardware User Manual Page 19 of 47
3.2.1 Power Supply
The L811-EB module should be powered through the VBAT pins, and the power supply design is shown in
Figure 3-2:
Figure 3-2 Power Supply Design
The filter capacitor design for power supply is shown in the following table:
Recommended
capacitance
Application
Description
220uF x 2
Capacitor for steady voltage
Reduce power fluctuations of the module in
operation, requiring capacitor with low ESR
LDO or DCDC power supply requires the
capacitor of no less than 440uF
The capacitor for battery power supply
can be reduced to 100～220uF
1uF, 100nF
Digital signal noise
Filter out the interference generated from the
clock and digital signals
39pF, 33pF
700/850/900 MHz frequency
band
Filter out low frequency band RF interference
18pF, 8.2pF,
6.8pF
1700/1800/1900/2100/2500/
2600MHz frequency band
Filter out medium/high frequency band RF
interference
The stable power supply can ensure the normal operation of L811-EB module, and the ripple of the power
supply should be less than 300mV in design. When the module operates under GSM mode (Burst
transmit), the maximum operating current can reach 2A, so the power source should be not lower than
3.3V, or the module may shut down or reboot. The power supply limits are shown in Figure 3-3:

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L811-EB Hardware User Manual Page 20 of 47
Figure 3-3 Power Supply Limits
3.2.2 RTC Power Supply
The VRTC is the power supply for the RTC inside the module and it can be used as the backup power
supply for the RTC. When the module is powered up by supplying the VBAT power, the VRTC will output
1.8V voltage. The VRTC parameters are as follows:
Parameters
Minimum Value
Typical Value
Maximum Value
Unit
VRTC output voltage
1.71
1.8
1.89
V
VRTC input voltage
(normal clock)
1.0
1.8
1.89
V
VRTC input current
(normal clock)
10
20
uA
The reference design circuit for VRTC as the backup power supply for RTC is shown in Figure 3-4:
Figure3-4 VRTC Reference Design Circuit
Instructions for VRTC (which works as the backup power supply for RTC):
R1 is a current limiting resistor, which is used to limit the charging current for VRTC, and the
recommended resistance value is 10KΩ.
Burst transmit Burst transmit
min:3.3V
VBAT Ripple≤300mV
Drop
VBAT≥3.3V