Fibocom SC138-NA Series Installation instructions

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FIBOCOM SC138-EAU Series Hardware Guide 1/88
FIBOCOM LTE Module (SC138-NA
Series)Hardware Guide
Version: V1.0.1
Date: 2021-04-18

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Applicability Type
No.
Product Model
Description
1
SC138-NA

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Copyright
Copyright ©2020 Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Note
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.

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Revision History
Version
Author
Reviewer
Approver
Date
Description
V1.0.0
Tan Qiuye
Tu Min
Chen
Guojiang
2020-12-29
Initial version
V1.0.1
Ye Xincai
Huang
Feng
Tu Min
Li Xiyi
Chen
Guojiang
2021-04-18
First revision, Adding W-20
version; Updating some RF
parameters.

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Contents
1About This Document ...................................................................................................8
1.1 Description.......................................................................................................................8
1.2 References ......................................................................................................................8
1.3 Related Documents .......................................................................................................10
2Product Overview........................................................................................................11
2.1 Product Introduction.......................................................................................................11
2.2 Performance ..................................................................................................................11
2.3 Pin Definition..................................................................................................................19
2.3.1 Pin Distribution .............................................................................................................. 19
2.3.2 Pin Description .............................................................................................................. 19
3Application Interface...................................................................................................35
3.1 Power ............................................................................................................................35
3.1.1 Power Input ...................................................................................................................35
3.1.2 VRTC............................................................................................................................. 37
3.1.3 Power Output ................................................................................................................38
3.2 Control Signal ................................................................................................................38
3.2.1 Startup and Shutdown ..................................................................................................38
3.2.2 Volume Control..............................................................................................................41
3.3 SPMI Interface...............................................................................................................41
3.4 USB Interface ................................................................................................................41
3.5 UART.............................................................................................................................45
3.6 SPI.................................................................................................................................46
3.7 (U) SIM ..........................................................................................................................46
3.8 SDIO Interface...............................................................................................................48
3.9 GPIO..............................................................................................................................49
3.10 I2C..................................................................................................................................50
3.11 ADC ...............................................................................................................................51
3.12 I2S Interface ..................................................................................................................51

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3.13 Battery Power Supply Interface......................................................................................52
3.14 Motor Drive Interface .....................................................................................................52
3.15 LCM...............................................................................................................................52
3.16 TP..................................................................................................................................54
3.17 Camera..........................................................................................................................55
3.17.1 Camera 1.......................................................................................................................57
3.17.2 Camera 2.......................................................................................................................57
3.17.3 Camera 3.......................................................................................................................58
3.17.4 Camera 4.......................................................................................................................59
3.17.5 Design Considerations..................................................................................................60
3.18 Sensor ...........................................................................................................................61
3.19 Audio .............................................................................................................................62
3.19.1 Audio Interface Definition..............................................................................................62
3.19.2 Microphone Circuit Design............................................................................................ 63
3.19.3 Handset Circuit Design .................................................................................................64
3.19.4 Earphone Interface Circuit Design................................................................................64
3.19.5 Speaker Circuit Design .................................................................................................65
3.20 Forced Downloading Interface Design ...........................................................................65
3.20.1 Circuit Reference Design .............................................................................................. 66
3.21 WIFI/BT Antenna............................................................................................................66
3.21.1 WIFI/BT Band................................................................................................................66
3.21.2 Circuit Reference Design .............................................................................................. 67
3.22 GNSS Antenna ..............................................................................................................67
3.22.1 GNSS Band...................................................................................................................67
3.22.2 Circuit Reference Design .............................................................................................. 68
3.23 Antenna Requirements ..................................................................................................69
4RF PCB Layout Design Guide ....................................................................................71
5WIFI and Bluetooth......................................................................................................74
5.1 WIFI Overview ...............................................................................................................74
5.2 WIFI Performance Indicators .........................................................................................74

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5.3 Bluetooth Overview........................................................................................................76
5.4 Bluetooth Performance Indicators..................................................................................77
6GNSS ............................................................................................................................78
6.1 Overview........................................................................................................................78
6.2 Performance Index.........................................................................................................78
7Electrical, ALT and RF Performance..........................................................................79
7.1 Recommended Parameters ...........................................................................................79
7.2 Operating Current ..........................................................................................................79
7.3 Electrostatic Protection ..................................................................................................80
8Structural Specification ..............................................................................................81
8.1 Product Appearance ......................................................................................................81
8.2 Structure Size ................................................................................................................81
8.3 Reference PCB Bonding Pad Design.............................................................................81
9Production and Storage..............................................................................................82
9.1 SMT Patch.....................................................................................................................82
9.2 Packaging and Storage..................................................................................................82
Appendix A Abbreviations ................................................................................................83
Appendix B GPRS Coding Scheme .................................................................................86
Appendix C GPRS Multi-slot.............................................................................................87
Appendix D EDGE Modulation and Coding Mode ..........................................................88

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1 About This Document
1.1 Description
The document describes information on electrical characteristics, RF performance, structural dimension,
application environment, etc. of SC138-NA series modules. With the help of this document and other
related documents, the application developer can quickly understand the hardware functions of SC138-
NA series modules and develop the hardware of the product.
1.2 References
This product is designed with reference to the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio transmission
and reception (FDD); Part 1: Conformance specification
3GPP TS 36.521-1 V12.9.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: U(U)SIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
((U)SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (U(U)SIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (U(U)SIM) Application Toolkit
(USAT)
3GPP TS 36.124V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
IEEE 802.11n WLAN MAC and PHY, October 2009 + IEEE 802.11-2007 WLAN MAC and PHY, June

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2007
IEEE Std 802.11b, IEEE Std 802.11n, IEEE Std 802.11a, IEEE Std 802.11g, IEEE Std 802.11ac
IEEE 802.11-2007 WLAN MAC and PHY, June 2007
Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0+
HS, August 6, 2009
Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009
Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/5.0.2, December 07,2017

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1.3 Related Documents
FIBOCOM SC138 Series SMT Design Guide

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2 Product Overview
2.1 Product Introduction
SC138 series intelligent modules integrate core devices such as Baseband, eMCP, PMU, Transceiver
and PA, and support remote communication modes of FDD/TDD-LTE, WCDMA, and multiple types,
WIFI/BT short-range wireless transmission technology and GNSS wireless positioning
technology(SC138-W support WiFi/BT only). SC138-NA series modules are embedded in the open
Android operating system and support multiple interfaces such as MIPI/USB/UART/SPI/I2C, so they are
the preferred schemes for the core system of wireless intelligent products. The corresponding network
type and the band of SC138 modules are shown in the following table:
Table 2-1 Available band of SC138-NA
Mode
Band
WCDMA
Band 2/4/5
FDD-LTE
Band 2/4/5/7/12/13/14/17/25/26/66/71
TDD-LTE
Band 41/48
WIFI 802.11a/b/g/n/ac
2402-2482 MHz；5170-5835MHz
BT5.0
2402-2480 MHz
GNSS
GPS +GLONASS +BeiDou
2.2 Performance
SC138-NA modules are packaged with LCC+LGA and have a total of 276 pins, including 148 LCC pins
and 128 LGA pins, with the dimensions of 41 mm × 41 mm × 2.8 mm. They can be embedded in various
M2M product applications, and are applicable to the development of intelligent POS, cash register, robot,
unmanned aerial vehicle, home automation, security monitoring, multimedia terminal and other intelligent
devices. The following table describes the detailed performance parameters of SC138 series modules.

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Table 2-2 Performance and specification
Performance
Description
Power supply
DC 3.5 V–4.2 V
Typical voltage: 3.8 V
Application processor
Kyro™260 8 core architecture 64-bit processor; the main frequency
is up to 2 GHz
Storage
16 Gb LPDDR4X+32 GB eMMC Flash (optional)
Power level
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE FDD bands
Class 3 (23dBm±2dB) for LTE TDD bands
WCDMA characteristics
Support 3GPP R9 DC-HSPA+
Support 16-QAM, 64-QAM and QPSK modulation
CAT8 HSUPA: maximum uplink rate: 11.4 Mbps
CAT24 DC-HSPA+: maximum downlink rate: 42 Mbps
LTE characteristics
Support FDD/TDD R12 CAT4 (UL CAT5 DL CAT4 )
Support 1.4 M-20 M RF bandwidth
Downlink supports multi-user MIMO
Maximum uplink rate: 75 Mbps; maximum downlink rate: 150 Mbps
VLAN characteristics
Support 2.4 G and 5 G WLAN wireless communication, and 802.11
a, 802.11 b, 802.11 g, 802.11 n, 802.11 ac and other types, with the
maximum rate up to 433 Mbps
Bluetooth characteristics
BT5.0
Satellite positioning
GPS +GLONASS +BeiDou
SMS
Text and PDU mode
Point-to-point MO and MT
SMS cell broadcast
SMS storage: It is stored in the module by default.
LCD interface
1 set of 4-Lane MIPI_DSI interfaces, with the maximum support of
2,520 × 1,080

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Performance
Description
1 set of DP over type-C interface with developing functions
Camera interface
3 sets of 4-Lane MIPI_CSI interfaces, with the maximum rate up to
2.5 Gbps per Lane, which supports the maximum 25 MP pixel.
Audio interface
Audio input:
3 sets of analog MIC inputs
Internal integration bias
Audio output:
Class AB stereo earphone output
Class AB differential handset output
Class D differential speaker power amplifier output
USB interface
USB 2.0 high speed (HS) interface, with the maximum data
transmission rate of 480 Mbps
USB 3.1 super speed (SS) interface, with the maximum data
transmission rate of 5 Gbps
Support USB OTG.
(U)SIM interface
2 sets of (U)SIM interfaces, supporting (U)SIM: 1.8 V/3 V self-
adaption
Support dual-SIM dual standby and hot plug functions (off by
default).
UART interface
3 sets of UART serial ports, with the maximum rate up to 4 Mbps,
wherein:
1 set of four-wire serial port supporting RTS and CTS hardware
flow control
1 set of two-wire serial port
1 set of two-wire debugging serial port
SDIO interface
Support SD 3.0 and 4 bits SDIO; SD supports hot plug.
I2C interface
6 sets of I2C interfaces, which can be used for TP, Camera, Sensor
and other peripherals

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Performance
Description
ADC interface
Universal 15-bit precise ADC
RTC
Supported
Antenna interface
TRX antenna, DRX antenna, GNSS antenna and WIFI/BT antenna
interfaces
Physical characteristics
Dimensions: 41mm × 41mm × 2.8mm
Package: 148 LCC + 128 LGA
Weight: 9.6±1g
Temperature range
Operating temperature: –30°C to 75°C1)
Expansion temperature: –40°C~85°C 2）
Storage temperature: –40°C to 85°C
Software upgrade
USB/OTA/SD
RoHS
Conform to RoHS standard.
1) When the modules work in this temperature range, their functions are normal, and relevant
performance meets the requirements of 3GPP standard.
2) When the modules work in this temperature range, their functions are normal, but relevant
performance may not meet the requirements of 3GPP standard. And the temperature return
to Operating temperature, the performance meets the requirements of 3GPP standard.
FCC Warning
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
Note:

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15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note
notice that any deviation(s) from the defined parameters of the antenna trace, as described by the
instructions, require that the host product manufacturer must notify to Fibocom wires Inc. that they wish
to change
the antenna trace design. In this case, a Class II permissive change application is required to be filed
by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new
application) procedure followed by a Class II permissive change application.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window
on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains
FCC ID: ZMOSC138NA”
“Contains IC: 21374-SC138NA “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.
Antenna Installation
(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.

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Technical
WCDMA/LTE
B2/4/7/25/41/66
WCDMA/LTE
B5/12/13/14/17/26/71
LTE
B48
Bluetooth
WiFi
2.4G
WiFi
5G
Antenna
Gain
1dBi
0.5dBi
-0.13dBi
1dBi
1dBi
2dBi
Antenna
type
Dipole
In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible
for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC
authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the

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interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
List of applicable FCC rules
This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and
15.407 requirements for Modular Approval.
The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter
rules) listed on the grant, and that the host product manufacturer is responsible for compliance to
any other FCC rules that apply to the host not covered by the modular transmitter grant of
certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also
contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that
the final host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
This device is intended only for OEM integrators under the following
conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.

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Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20 cm between the radiator & your body.
Déclaration d'exposition aux radiations Cet
équipement est conforme Canada limites d'exposition aux radiations dans un environnement
non contrôlé. Cet équipement doit être installé et utilisé à distance minimum de 20cm
entre le radiateur et votre corps.
This device complies with license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science
and Economic Development Canada’s licence-exempt RSS standard(s).
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR
d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts
de licence.
L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This radio transmitter (IC: 21374-SC138NA) has been approved by Industry Canada to operate with the
antenna types listed below with the maximum permissible gain indicated. Antenna types not included in
this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for
use with this device.
Le présent émetteur radio (21374-SC138NA) a été approuvé par Industrie Canada pour fonctionner avec
les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non
inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits
pour l'exploitation de l'émetteur.

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2.3 Pin Definition
2.3.1Pin Distribution
"NC" stands for No Connect. The pin at this position is reserved, and no connection is required.
2.3.2Pin Description
Note:

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Table 2-3 Description of I/O parameters
Type
Description
IO
Input/output
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
The pins of SC138 modules are described in the following table:
Pin Name
Pin No.
I/O
Pin Description
Remarks
Power
VBAT
4,5,6
PI
Main power supply input
-
VRTC
126
PI/PO
RTC power supply pin
-
VREG_CAM0_
DVDD_1P104
226
PO
1.1 V voltage output
-
VREG_L9A_1P
8
129
PO
1.8 V voltage output
-
VREG_L12A_1
P8
122
PO
1.8 V voltage output
-
VREG_CAM_A
F_2P8
224
PO
2.8 V voltage output
-
VREG_L22A_2
P96
28
PO
SD power supply
-
VREG_L19A_1
P8
26
PO
(U)SIM 1 power supply
1.8 V/3 V self-
adaption
VREG_L20A_1
21
PO
(U)SIM 2 power supply
1.8 V/3 V self-