Fibocom L850-GL Instructions for use

L850-GL Hardware User Manual
Version：V1.0.3
Update date：2/25/2017

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Applicability Table
No. Product model Description
1 L850-GL NA

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Copyright
Copyright © 2017Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Version Record
Version Update date Remark
V1.0.0 2016-12-08 Draft
V1.0.1 2016-12-16 Modify the PCIe Interface Application;
Update the Pin Definition: change pin65 to NC
V1.0.2 2017-02-09
Modify the description
Update the content of PCIe
Add the power Consumption of 3CA
V1.0.3 2017-02-25 Add product certification of warnings

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Contents
1 Foreword.......................................................................................................................................... 7
1.1 Introduction........................................................................................................................................... 7
1.2 Reference Standard............................................................................................................................ 7
1.3 Related Documents............................................................................................................................. 7
2 Overview...........................................................................................................................................8
2.1 Introduction........................................................................................................................................... 8
2.2 Specification..........................................................................................................................................8
2.3 Warnings............................................................................................................................................... 9
2.3.1 FCC Statement...................................................................................................................................9
2.3.2 IC Statement.....................................................................................................................................11
2.3.3 CE Statement................................................................................................................................... 12
2.4 CA combinations................................................................................................................................13
2.5 Application Framework..................................................................................................................... 14
2.6 Hardware Framework........................................................................................................................15
3 Application Interface...................................................................................................................15
3.1 M.2Interface........................................................................................................................................15
3.1.1 Pin Distribution................................................................................................................................. 16
3.1.2 Pin Definition.................................................................................................................................... 17
3.2 Power Supply..................................................................................................................................... 21
3.2.1 Power Supply................................................................................................................................... 21
3.2.2 Logic level......................................................................................................................................... 22
3.2.3 Power Consumption........................................................................................................................23
3.3 Control Signal.....................................................................................................................................25
3.3.1 Module Start-Up...............................................................................................................................25
3.3.1.1 Start-upCircuit.................................................................................................................................................25
3.3.1.2 Start-upTiming Sequence............................................................................................................................. 25
3.3.2 Module Shutdown............................................................................................................................26
3.3.3 Module Reset................................................................................................................................... 27
3.4 USB Interface..................................................................................................................................... 28
3.4.1 USB Interface Definition................................................................................................................. 28
3.4.2 USB2.0 Interface Application.........................................................................................................28
3.5 PCIe Interface.................................................................................................................................... 29
3.5.1 PCIe Interface Definition................................................................................................................ 29

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3.5.2 PCIe Interface Application..............................................................................................................29
3.6 USIMInterface.................................................................................................................................... 31
3.6.1 USIM Pins......................................................................................................................................... 31
3.6.2 USIM Interface Circuit.....................................................................................................................32
3.6.2.1 N.C. SIMCard Slot......................................................................................................................................... 32
3.6.2.2 N.O. SIM Card Slot........................................................................................................................................ 32
3.6.3 USIM Hot-Plugging..........................................................................................................................33
3.6.4 USIM Design.................................................................................................................................... 34
3.7 Status Indicator.................................................................................................................................. 34
3.7.1 LED#1Signal.....................................................................................................................................35
3.7.2 WOWWAN#......................................................................................................................................35
3.7.3 TX_BLANKING................................................................................................................................ 36
3.8 Interrupt Control................................................................................................................................. 36
3.8.1 W_DISABLE1#.................................................................................................................................36
3.8.2 BODYSAR........................................................................................................................................ 37
3.9 ClockInterface.................................................................................................................................... 37
3.10 ANT Tunable Interface....................................................................................................................37
3.11 Config Interface................................................................................................................................38
3.12 Other Interfaces............................................................................................................................... 38
4 Radio Frequency..........................................................................................................................39
4.1 RF Interface........................................................................................................................................ 39
4.1.1 RF Interface Functionality.............................................................................................................. 39
4.1.2 RFConnector Characteristic.......................................................................................................... 39
4.1.3 RF Connector Dimension...............................................................................................................39
4.2 Operating Band.................................................................................................................................. 41
4.3 Transmitting Power............................................................................................................................42
4.4 Receiver Sensitivity........................................................................................................................... 43
4.5 GNSS...................................................................................................................................................44
4.6 Antenna Design..................................................................................................................................45
5 Structure Specification.............................................................................................................. 47
5.1 Product Appearance..........................................................................................................................47
5.2 Dimension of Structure..................................................................................................................... 47
5.3 M.2 Interface Model...........................................................................................................................48
5.4 M.2 Connector....................................................................................................................................48

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5.5 Storage................................................................................................................................................49
5.5.1 Storage Life...................................................................................................................................... 49
5.6 Packing................................................................................................................................................49
5.6.1 Tray Package................................................................................................................................... 50
5.6.2 Tray size............................................................................................................................................51

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and
other instructions, the developers can quickly understand the hardware functions of L850 modules and
develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission
and reception (FDD);Part 1: Conformance specification
3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio
transmission and reception (TDD)
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
PCI Express M.2 Specification Rev1.0
1.3 Related Documents
L850 Module Performance Testing Report
RF Antenna Application Design Specification
L8-Family System Driver Integration and Application Guidance
L8-Family AT CommandsManual

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2 Overview
2.1 Introduction
L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface
and supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication
networks of the mobile operator across the world.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66
LTE TDD: Band 38, 39, 40, 41
WCDMA/HSPA+: Band 1,2,4,5,8
GNSS/Beidou: support
Data Transmission
LTE FDD 450Mbps DL/50Mbps UL(Cat 9)
LTE TDD
260Mbps DL/30Mbps UL(Cat 9)
When LTE TDD achieves maximum DL rate, its UL rate can
reach 10Mbps only
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
Power Supply DC 3.135V～4.4V,Typical 3.3V
Temperature
Normal operating temperature:-10°C ～+55°C
Expandoperating temperature:-20°C ～+70°C
Storage temperature: -40°C ～+85°C
Physical
characteristics
Interface: M.2 Key-B
Dimension：30 x 42 x 2.3mm
Weight: About5.8 g
Interface
Antenna
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1

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Function Interface
USIM 3V/1.8V
USB 2.0（just for debugging）
PCIe 1.0 X1
W_Disable#
BodySar
LED
Clock
Tunable antenna
I2S(Reserved)
I2C(Reserved)
USB3.0(not supported yet)
Software
Protocol Stack IPV4/IPV6
AT commands 3GPP TS 27.007 and 27.005
Firmware update PCIe
Other feature
Multiple carrier
Windows MBIM support
Windows update
AGNSS
Note:
For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature
ranging from -20℃to +60℃.
2.3 Warnings
2.3.1 FCC Statement
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.

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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 5 dBi.
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
This module can be used with Notebook or similar platform with similar dimension, antenna location and
RF characteristic.
3) For portable usage condition, this module has been SAR evaluated in Notebook host with
compliance result and can be used with this specific host as described in the certification
filing. Other host or platform needs separate approval.