Fibocom L850-GL Instructions for use

L850-GL Hardware User Manual
Version：V1.0.3
Update date：2/25/2017

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Applicability Table
No. Product model Description
1 L850-GL NA

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Copyright
Copyright © 2017Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Version Record
Version Update date Remark
V1.0.0 2016-12-08 Draft
V1.0.1 2016-12-16 Modify the PCIe Interface Application;
Update the Pin Definition: change pin65 to NC
V1.0.2 2017-02-09
Modify the description
Update the content of PCIe
Add the power Consumption of 3CA
V1.0.3 2017-02-25 Add product certification of warnings

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Contents
1 Foreword.......................................................................................................................................... 7
1.1 Introduction........................................................................................................................................... 7
1.2 Reference Standard............................................................................................................................ 7
1.3 Related Documents............................................................................................................................. 7
2 Overview...........................................................................................................................................8
2.1 Introduction........................................................................................................................................... 8
2.2 Specification..........................................................................................................................................8
2.3 Warnings............................................................................................................................................... 9
2.3.1 FCC Statement...................................................................................................................................9
2.3.2 IC Statement.....................................................................................................................................11
2.3.3 CE Statement................................................................................................................................... 12
2.4 CA combinations................................................................................................................................13
2.5 Application Framework..................................................................................................................... 14
2.6 Hardware Framework........................................................................................................................15
3 Application Interface...................................................................................................................15
3.1 M.2Interface........................................................................................................................................15
3.1.1 Pin Distribution................................................................................................................................. 16
3.1.2 Pin Definition.................................................................................................................................... 17
3.2 Power Supply..................................................................................................................................... 21
3.2.1 Power Supply................................................................................................................................... 21
3.2.2 Logic level......................................................................................................................................... 22
3.2.3 Power Consumption........................................................................................................................23
3.3 Control Signal.....................................................................................................................................25
3.3.1 Module Start-Up...............................................................................................................................25
3.3.1.1 Start-upCircuit.................................................................................................................................................25
3.3.1.2 Start-upTiming Sequence............................................................................................................................. 25
3.3.2 Module Shutdown............................................................................................................................26
3.3.3 Module Reset................................................................................................................................... 27
3.4 USB Interface..................................................................................................................................... 28
3.4.1 USB Interface Definition................................................................................................................. 28
3.4.2 USB2.0 Interface Application.........................................................................................................28
3.5 PCIe Interface.................................................................................................................................... 29
3.5.1 PCIe Interface Definition................................................................................................................ 29

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3.5.2 PCIe Interface Application..............................................................................................................29
3.6 USIMInterface.................................................................................................................................... 31
3.6.1 USIM Pins......................................................................................................................................... 31
3.6.2 USIM Interface Circuit.....................................................................................................................32
3.6.2.1 N.C. SIMCard Slot......................................................................................................................................... 32
3.6.2.2 N.O. SIM Card Slot........................................................................................................................................ 32
3.6.3 USIM Hot-Plugging..........................................................................................................................33
3.6.4 USIM Design.................................................................................................................................... 34
3.7 Status Indicator.................................................................................................................................. 34
3.7.1 LED#1Signal.....................................................................................................................................35
3.7.2 WOWWAN#......................................................................................................................................35
3.7.3 TX_BLANKING................................................................................................................................ 36
3.8 Interrupt Control................................................................................................................................. 36
3.8.1 W_DISABLE1#.................................................................................................................................36
3.8.2 BODYSAR........................................................................................................................................ 37
3.9 ClockInterface.................................................................................................................................... 37
3.10 ANT Tunable Interface....................................................................................................................37
3.11 Config Interface................................................................................................................................38
3.12 Other Interfaces............................................................................................................................... 38
4 Radio Frequency..........................................................................................................................39
4.1 RF Interface........................................................................................................................................ 39
4.1.1 RF Interface Functionality.............................................................................................................. 39
4.1.2 RFConnector Characteristic.......................................................................................................... 39
4.1.3 RF Connector Dimension...............................................................................................................39
4.2 Operating Band.................................................................................................................................. 41
4.3 Transmitting Power............................................................................................................................42
4.4 Receiver Sensitivity........................................................................................................................... 43
4.5 GNSS...................................................................................................................................................44
4.6 Antenna Design..................................................................................................................................45
5 Structure Specification.............................................................................................................. 47
5.1 Product Appearance..........................................................................................................................47
5.2 Dimension of Structure..................................................................................................................... 47
5.3 M.2 Interface Model...........................................................................................................................48
5.4 M.2 Connector....................................................................................................................................48

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5.5 Storage................................................................................................................................................49
5.5.1 Storage Life...................................................................................................................................... 49
5.6 Packing................................................................................................................................................49
5.6.1 Tray Package................................................................................................................................... 50
5.6.2 Tray size............................................................................................................................................51

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and
other instructions, the developers can quickly understand the hardware functions of L850 modules and
develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission
and reception (FDD);Part 1: Conformance specification
3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio
transmission and reception (TDD)
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission
and reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment
(SIM-ME) interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)
3GPP TS 36.124 V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment
(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
PCI Express M.2 Specification Rev1.0
1.3 Related Documents
L850 Module Performance Testing Report
RF Antenna Application Design Specification
L8-Family System Driver Integration and Application Guidance
L8-Family AT CommandsManual

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2 Overview
2.1 Introduction
L850 is a highly integrated 4G wireless communication module that adopts standard PCIe M.2 interface
and supports LTE FDD/LTE TDD/WCDMA/ system. It is applicable to most broadband communication
networks of the mobile operator across the world.
2.2 Specification
Specification
Operating Band
LTE FDD: Band 1,2,3,4,5,7,8,11,12,13,17,18,19,20,21,26,28,29,30,66
LTE TDD: Band 38, 39, 40, 41
WCDMA/HSPA+: Band 1,2,4,5,8
GNSS/Beidou: support
Data Transmission
LTE FDD 450Mbps DL/50Mbps UL(Cat 9)
LTE TDD
260Mbps DL/30Mbps UL(Cat 9)
When LTE TDD achieves maximum DL rate, its UL rate can
reach 10Mbps only
UMTS/HSPA+
UMTS:384 kbps DL/384 kbps UL
DC-HSDPA+:42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)
Power Supply DC 3.135V～4.4V,Typical 3.3V
Temperature
Normal operating temperature:-10°C ～+55°C
Expandoperating temperature:-20°C ～+70°C
Storage temperature: -40°C ～+85°C
Physical
characteristics
Interface: M.2 Key-B
Dimension：30 x 42 x 2.3mm
Weight: About5.8 g
Interface
Antenna
WWAN Main Antenna x 1
WWAN Diversity Antenna x 1

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Function Interface
USIM 3V/1.8V
USB 2.0（just for debugging）
PCIe 1.0 X1
W_Disable#
BodySar
LED
Clock
Tunable antenna
I2S(Reserved)
I2C(Reserved)
USB3.0(not supported yet)
Software
Protocol Stack IPV4/IPV6
AT commands 3GPP TS 27.007 and 27.005
Firmware update PCIe
Other feature
Multiple carrier
Windows MBIM support
Windows update
AGNSS
Note:
For normal operating temperature, LTE FDD Band 4 and 13 can support the temperature
ranging from -20℃to +60℃.
2.3 Warnings
2.3.1 FCC Statement
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.

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This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the maximum antenna gain allowed for use with this device is 5 dBi.
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed
This module can be used with Notebook or similar platform with similar dimension, antenna location and
RF characteristic.
3) For portable usage condition, this module has been SAR evaluated in Notebook host with
compliance result and can be used with this specific host as described in the certification
filing. Other host or platform needs separate approval.

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IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that
20 cm may be maintained between the antenna and users. The final end product must be labeled in a
visible area with the following: “Contains FCC ID: ZMOL850GL”. The grantee's FCC ID can be used only
when all FCC compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
2.3.2 IC Statement
Industry Canada statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to
the following two conditions:
1) this device may not cause interference, and
2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
1) l'appareil ne doit pas produire de brouillage, et
2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d'en compromettre le fonctionnement.
This Class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.
This device complies with RSS-310 of Industry Canada. Operation is subject to the condition that this
device does not cause harmful interference.
Cet appareil est conforme à la norme RSS-310 d'Industrie Canada. L'opération est soumise à la
condition que cet appareil ne provoque aucune interférence nuisible.

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This device and its antenna(s) must not be co-located or operating in conjunction with any other
antenna or transmitter, except tested built-in radios.
Cet appareil et son antenne ne doivent pas être situés ou fonctionner en conjonction avec une autre
antenne ou un autre émetteur, exception faites des radios intégrées qui ont été testées.
The County Code Selection feature is disabled for products marketed in the US/ Canada.
La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux
États-Unis et au Canada.
Radiation Exposure Statement:
This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your
body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
IC : 21374-L850GL
2.3.3 CE Statement
► EU Regulatory Conformance
Hereby, We, declares that the radio equipment type L850-GL is in compliance with
the Directive 2014/53/EU.
In all cases assessment of the final product must be mass against the Essential requirements of the
Directive 2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article
3.2 requirements.
The maximum antenna gain for is 5 dBi and the antenna separation distance is 20cm.
► Declaration of Conformity(should include manufacturer contact info.)
Please added certification standard in your user manual which depended on the test standards your
device performed., If the DoC should be a simplified version, please take below as reference, The
full text of the EU declaration of conformity is available at the following internet address: http//www.
fibocom.com
Fibocom Wireless Inc.

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2.4 CA combinations
CA Combinations
2CA Inter-band
1+3,5,18,19,20,21,26
2+4,5,12,13,17,29,30,66
3+5,7,8,19,20,28
4+5,12,13,17,29,30
5+7,30,66
7+20,28
12+30
13+66
29+30
2,3,4,7,40,41
3CA
Inter-band
1+3+7, 1+3+19, 1+3+20, 1+19+21
2+4+5, 2+4+13, 2+5+30, 2+12+30, 2+29+30
3+7+20, 3+7+28
4+5+30, 4+12+30, 4+29+30
5+66+2, 13+66+2
2 contiguous plus inter-band
2+2+5, 2+2+13
3+3+7, 3+7+7, 3+3+20
4+4+5, 4+4+13
5+66+66, 13+66+66, 66+66+2, 66+66+66

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2.5 Application Framework
The peripheralapplicationsfor L850 module are shown in Figure 2-1:
Figure2-1 Application Framework

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2.6 Hardware Framework
The hardware framework in Figure 2-2 shows the main hardware functions of L850 module, including
base band and RF functions.
Baseband contains the followings:
GSM/UMTS/LTE FDD controller/Power supply
NAND/internal LPDDR2 RAM
Application interface
RF contains the followings:
RF Transceiver
RF Power/PA
RF Front end
RF Filter
Antenna
Figure 2-2 Hardware Framework
3 Application Interface
3.1 M.2Interface
The L850 module applies standard M.2 Key-B interface, with a total of 75 pins.

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3.1.1 Pin Distribution
Figure 3-1 Pin Distribution
Note:
Pin “Notch” represents the gap of the gold fingers.

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3.1.2 Pin Definition
The pin definition is as follows:
Pin Pin Name I/O Reset Value Pin Description Type
1 CONFIG_3 O NC
NC,L850 M.2 module is configured as
the WWAN – PCIe,USB3.0 interface
type
2 +3.3V PI Power input Power Supply
3 GND GND Power Supply
4 +3.3V PI Power input Power Supply
5 GND GND Power Supply
6FUL_CARD_
POWER_OFF# I PU Power enable,Module power on input,internal pull up
CMOS
3.3/1.8V
7 USB D+ I/O USB Data Plus 0.3---3V
8 W_DISABLE1# I PD WWAN Disable,active low CMOS
3.3/1.8V
9 USB D- I/O USB Data Minus 0.3---3V
10 LED1# O T System status LED,Output open
drain,CMOS 3.3V CMOS 3.3V
11 GND GND Power Supply
12 Notch Notch
13 Notch Notch
14 Notch Notch
15 Notch Notch
16 Notch Notch
17 Notch Notch
18 Notch Notch
19 Notch Notch
20 I2S_CLK O PD I2S Serial clock,
Reserved CMOS 1.8V
21 CONFIG_0 GND
GND,L850 M.2 module is configured as
the WWAN – PCIe,USB3.0 interface
type
22 I2S_RX I PD I2S Serial receive data, CMOS 1.8V

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Pin Pin Name I/O Reset Value Pin Description Type
Reserved
23 WOWWAN# O PD Wake up host CMOS 1.8V
24 I2S_TX O PD I2S Serial transmit data,
Reserved CMOS 1.8V
25 DPR I PU Body SAR Detect,active low CMOS
3.3/1.8V
26 W_DISABLE2# I PU GNSS disable,active low,
Reserved
CMOS
3.3/1.8V
27 GND GND Power Supply
28 I2S_WA O PD I2S Word alignment/select,
Reserved CMOS 1.8V
29 USB3.0‐Tx‐OUSB3.0 Transmit data minus,
Not support now
30 UIM_RESET O L SIM reset signal 1.8V/3V
31 USB3.0‐Tx+ O USB3.0 Transmit data plus,
Not support now
32 UIM_CLK O L SIM clock Signal 1.8V/3V
33 GND GND Power Supply
34 UIM_DATA I/O L SIM data input/output 1.8V/3V
35 USB3.0‐Rx‐IUSB3.0 receive data minus,
Not support now
36 UIM_PWR O SIM power supply,3V/1.8V 1.8V/3V
37 USB3.0‐Rx+ I USB3.0 receive data plus,
Not support now
38 NC NC
39 GND GND Power Supply
40 GNSS_SCL O PU I2C Serial clock,
Reserved CMOS 1.8V
41 PETn0 O PCIe TX Differential signals
Negative
42 GNSS_SDA I/O PU I2C Serial data input/output,
Reserved CMOS 1.8V
43 PETp0 O PCIe TX Differential signals Positive

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Pin Pin Name I/O Reset Value Pin Description Type
44 GNSS_IRQ I PD GNSS Interrupt Request,
Reserved CMOS 1.8V
45 GND GND Power Supply
46 SYSCLK O PD 26M clock output 1.8V
47 PERn0 I PCIe RX Differential signals
Negative
48 TX_BLANKING O PD PA Blanking Timer CMOS 1.8V
49 PERp0 I PCIe RX Differential signals Positive
50 PERST# I T
PE-Reset is a functional reset to the
Add-In card as defined by the PCIe Mini
Card CEM specification
CMOS 3.3V
51 GND GND Power Supply
52 CLKREQ# O T
Clock Request is a reference clock
request signal as defined by the PCIe
Mini Card CEM specification; Also used
by L1 PM Substates
CMOS 3.3V
53 REFCLKN I PCIe Reference Clock signal
Negative
54 PEWAKE# O L PCIe PME Wake. Open Drain with pull
up on platform,active low CMOS 3.3V
55 REFCLKP I PCIe Reference Clock signal
Positive
56 RFE_RFFE2_
SCLK OMIPI Interface Tunable ANT, RFFE2 clock,Open Drain output
CMOS
3.3/1.8V
57 GND GND Power Supply
58 RFE_RFFE2_
SDATA OMIPI Interface Tunable ANT, RFFE2 data,Open Drain output
CMOS
3.3/1.8V
59 ANTCTL0 O Tunable ANT CTRL0 CMOS 1.8V
60 COEX3 O PD
Wireless Coexistence between WWAN
and WiFi/BT modules. IDC_UART_TXD,
Reserved
CMOS
3.3/1.8V
61 ANTCTL1 O Tunable ANT CTRL1 CMOS 1.8V
62 COEX2 I T Wireless Coexistence between WWAN
and WiFi/BT modules, IDC_UART_RXD CMOS 1.8V

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Pin Pin Name I/O Reset Value Pin Description Type
,Reserved
63 ANTCTL2 O Tunable ANT CTRL2 CMOS 1.8V
64 COEX1 O T
Wireless Coexistence between WWAN
and WiFi/BT modules, GNSS_EXT_FTA
,Reserved
CMOS 1.8V
65 NC NC
66 SIM_DETECT I PD SIM Detect,internal pull up(330KΩ),
active high CMOS 1.8V
67 RESET# I WWAN reset input,internal pull
up(10KΩ),active low CMOS 1.8V
68 NC NC
69 CONFIG_1 O GND
GND,L850 M.2 module is configured as
the WWAN – PCIe,USB3.0 interface
type
70 +3.3V PI Power input Power Supply
71 GND GND Power Supply
72 +3.3V PI Power input Power Supply
73 GND GND Power Supply
74 +3.3V PI Power input Power Supply
75 CONFIG_2 O GND
GND,L850 M.2 module is configured as
the WWAN – PCIe,USB3.0 interface
type
Reset Value: The initial status after modulereset, not the status when working.
H:High Voltage Level
L: Low Voltage Level
PD:Pull-Down
PU:Pull-Up
T:Tristate
OD:Open Drain
PP:Push-Pull
PI: Power Input
PO: Power Output
Note:
The unused pins can be left floating.