Fibocom L810-MiniPCIe Instructions for use

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L810-MiniPCIe
Hardware User Manual
Version: 2.0.0
Update date: 2015.10.31

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Applicability Table
No.
Product model
Description
1
L810-GL-MiniPCIe
NA

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Copyright
Copyright ©2015Fibocom Wireless Inc. All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Version Record
Version
Update Date
Description
V1.0.0
2015-02-12
Initial Version
V1.0.1
2015-05-08
Update the structure chart to make the logo for the module location
hole become much clearer；
Update SIM name in pin definition
V1.0.2
2015-08-25
Update the company logo
V2.0.0
2015-10-31
Adjust document content and format

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Contents
1 Foreword....................................................................................................................................... 6
1.1 Introduction........................................................................................................................................... 6
1.2 Reference Standard............................................................................................................................ 6
1.3 Reference Document.......................................................................................................................... 6
2 Interface Description..................................................................................................................7
2.1 Mini PCIe Interface.............................................................................................................................. 7
2.2 Antenna Interface.............................................................................................................................. 10
3 Power Supply.............................................................................................................................11
3.1 Power Supply Requirements........................................................................................................... 11
3.2 Power Supply Timing Requirement................................................................................................ 11
3.2.1 Rising Time....................................................................................................................................... 11
3.2.2 Falling Time...................................................................................................................................... 12
3.3 Logic Level..........................................................................................................................................12
3.4 Power Supply Filtering...................................................................................................................... 13
3.5 Power Consumption.......................................................................................................................... 13
4 Radio Frequency....................................................................................................................... 14
4.1 Frequency Band Partition.................................................................................................................14
4.2 Requirements for Antenna............................................................................................................... 15
5 Interface Application................................................................................................................16
5.1 USB Interface..................................................................................................................................... 16
5.1.1 USB Interface Description..............................................................................................................16
5.1.2 USB Interface Application.............................................................................................................. 17
5.2 USIM Interface................................................................................................................................... 17
5.2.1 Signal Description for USIM Card.................................................................................................17
5.2.2 USIM Interface Application Description....................................................................................... 18
5.3 Digital Audio Interface.......................................................................................................................19
5.3.1 Audio Interface................................................................................................................................. 19
5.3.2 I2S Application Description............................................................................................................ 19
5.3.3 Application Description for PCM Mode........................................................................................ 19
5.4 UART Interface.................................................................................................................................. 20
5.4.1 UART Interface Description........................................................................................................... 20
5.4.2 UART Interface Application............................................................................................................20

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5.4.3 WAKE_HOST................................................................................................................................... 21
5.5 Reset signal........................................................................................................................................ 21
5.6 LPG Signal..........................................................................................................................................22
5.7 W_DISABLE Signal........................................................................................................................... 23
6 Product Structure..................................................................................................................... 24
6.1 Boundary Dimension......................................................................................................................... 24
6.2 Product Weight...................................................................................................................................24
6.3 Environmental Temperature............................................................................................................ 24
7 Product Packaging................................................................................................................... 25
7.1 Palletizing process is shown in Figure 7-1：................................................................................ 25
7.2 Pallet size............................................................................................................................................25

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1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L810-MiniPCIe. With the assistance of the document and other instructions,
developers can quickly understand the performance of L810-MiniPCIe and develop products.
1.2 Reference Standard
The design of the product complies with the following standards:
Mini PCI Express Card Electromechanical Specification Revision 1.0-2003
1.3 Reference Document
L810 Module Hardware User Manual
L810 Module Performance Testing Report
Guidance for L8-Family System Drive Program
RF Antenna Application Design Description
EVK-GT8230 User Manual

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2 Interface Description
The chapter gives a detailed introduction of the functional interface and antenna interface of
L810-MiniPCIe.
2.1 Mini PCIe Interface
Except for 4 digital voice pins, L810-MiniPCIe module applies standard Mini PCIe interface. And the pin
definition is as follows:
Pin
Pin name
I/O
Reset Value
Pin description
Type
Power input
2
3.3VAUX
PI
-
3.3V input power
Power supply
24
3.3VAUX
PI
-
3.3V input power
Power supply
39
3.3VAUX
PI
-
3.3V input power
Power supply
41
3.3VAUX
PI
-
3.3V input power
Power supply
52
3.3VAUX
PI
-
3.3V input power
Power supply
4
GND
-
-
Ground
Power supply
9
GND
-
-
Ground
Power supply
15
GND
-
-
Ground
Power supply
18
GND
-
-
Ground
Power supply
21
GND
-
-
Ground
Power supply
26
GND
-
-
Ground
Power supply
27
GND
-
-
Ground
Power supply
29
GND
-
-
Ground
Power supply
34
GND
-
-
Ground
Power supply
35
GND
-
-
Ground
Power supply
37
GND
-
-
Ground
Power supply
43
GND
-
-
Ground
Power supply
50
GND
-
-
Ground
Power supply
SIM card interface

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Pin
Pin name
I/O
Reset Value
Pin description
Type
8
USIM_VCC
PO
-
Power supply for external USIM
card
1.8V/3V
10
USIM_IO
I/O
L
USIM data signal
1.8V/3V
12
USIM_CLK
O
L
USIM clock signal
1.8V/3V
14
USIM_RST
O
L
USIM reset signal
1.8V/3V
USB
36
USB_D-
I/O
T
USB D- signal
0.3---3V
38
USB_D+
I/O
T
USB D+ signal
0.3---3V
Other functions
20
W_DISABLE
I
PU
Low effective, and enters Flight
mode
3.3V
42
LPG
O
PU
Network status indicator, output
signal
3.3V
17
WAKE_HOST
O
PU
Wake up host
3.3V
RESET
22
PERST#
I
PU
External reset signal
3.3V
Digital voice
45
I2S2_CLK
O
PD
I2S clock
CMOS 1.8V
47
I2S2_TX
O
PD
I2S data transmit
CMOS 1.8V
49
I2S2_RX
I
PD
I2S data receive
CMOS 1.8V
51
I2S_WA0
O
PD
I2S left and right channel clock
(LRCK)
CMOS 1.8V
Serial port
11
UART1_RX
I
PU
UART1 data receive signal
3.3V
13
UART1_TX
O
PU
UART1 data transmit signal
3.3V
23
UART1_CTS
I
PU
UART1 clear to send signal
3.3V
25
UART1_RTS
O
PU
UART1 request to send signal
3.3V
NC
1
-
3
-
5
-
6
-

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Pin
Pin name
I/O
Reset Value
Pin description
Type
7
-
16
-
19
-
28
-
30
-
31
-
32
-
33
-
40
-
44
-
46
-
48
-
PI: Power Input
H: High Voltage Level
L: Low Voltage Level
PD: Pull-Down
PU: Pull-Up
T: Tristate
OD: Open Drain
PP: Push-Pull
Note:
The unused pins can be left floating in case of circuit design.

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2.2 Antenna Interface
L810-MiniPCIe antenna adopts 50 ohm RF interface and supports main and diversity antennas. It adopts
HIROSE U.FL-R-SMT(01) antenna connector.
Figure2-1 Antenna Interface
Please refer to the following website for more information about RF connector:
http://www.hirose-connectors.com/

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3 Power Supply
The circuit and PCB layout design for power supply are very important to the whole product, and the
design shall be conducted in accordance with the recommended design requirements.
3.1 Power Supply Requirements
The 3.3VAUX power supply for the module should meet the requirement as follows:
Parameter
Minimum value
Typical value
Maximum value
Unit
Operating Voltage Range
3.0
3.3
3.6
V
Note:
The Operating Voltage Range MUST never be exceeded. If the power source is under the
minimum value, the module will shutdown automatically; and may cause permanent hardware
failure if it goes above 3.6V.
3.2 Power Supply Timing Requirement
3.2.1 Rising Time
As for the power supply to the module, the rising time for voltage after powering on is described in Figure
3-1:
Figure3-1 Rising Time for Power Supply
Timing description
Requirement
Tr1
Rising time from 2.5V to 3.3V
less than 5 ms

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Note:
If the Tr1 is over spec., it will affect the module when starting up.
During the process of starting-up, PERST# shall keep high.
3.2.2 Falling Time
As for the power supply to the module, before the supply voltage rises again, the falling time for the power
supply is shown in Figure 3-2:
Figure 3-2 Falling Time for Power Supply
Timing description
Requirement
Td1
Falling time from 3.3V to 2.5V
less than 45 ms
Note:
If the Td1 is over spec., it will affect the module next time when it starts up.
3.3 Logic Level
3.3VAUX is the power supply for the module, and it is the reference voltage level for indicating signals and
digital signals.
The effective voltage ranges listed in the following tables:
Parameter
Minimum value
Recommended value
Maximum value
Unit
3.3VAUX
3.0
3.3
3.6
V
VIH
2.1
3.3
3.6
V
VIL
-0.5
0
0.8
V

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3.4 Power Supply Filtering
Filter capacitor for the supply circuit of 3.3VAUX can be designed as follows:
Recommended
capacitance
Application
Description
330uF
Capacitor for power supply
To reduce the power supply
fluctuation during call
1uF,100nF
Digital signal noise
To filter out the interference from
clock and digital signals
39pF,33pF
700MHz, 850/900MHz frequency band
To filter out the radio-frequency
interference
18pF,8.2pF,
6.8pF
1700/1800/1900MHz, 2100/2300MHz,
2500/2600MHz frequency band
To filter out the radio-frequency
interference
3.5 Power Consumption
Please refer to the Module’s Hardware User Guide for the details.
GSM system adopts non-continuous emission method, which is 217Hz bursts and the maximum current
will reach 2A. In case of circuit design, the power drop should be considered and withstand the maximum
2A current. In case of PCB design, the width of the power traces must be sufficient to support the
maximum current. If the design requirements are not followed, the module might shutdown while it is
working.

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4 Radio Frequency
4.1 Frequency Band Partition
L810-MiniPCIe provides two radio frequency connectors for the master and diversity respectively, and the
master is used to receive and transmit RF signal, and the diversity is used to receive the RF signal.
Antenna operating bands are listed in the following tables:
Operating Band
Description
Mode
Tx (MHz)
Rx (MHz)
Band 1
IMT 2100MHz
LTE FDD/WCDMA
1920 - 1980
2110 - 2170
Band 3
DCS 1800MHz
LTE FDD/GSM
1710 - 1785
1805 - 1880
Band 5
CLR 850MHz
LTE FDD/WCDMA/GSM
824 - 849
869 - 894
Band 7
IMT-E 2600Mhz
LTE FDD
2500 - 2570
2620 - 2690
Band 8
E-GSM 900MHz
LTE FDD/WCDMA/GSM
880 - 915
925 - 960
Band 20
EUDD 800MHz
LTE FDD
832 - 862
791 - 821
Band 34
IMT 2100MHz
TDSCDMA
2010 - 2025
Band 38
IMT-E 2600MHz
LTE TDD
2570 - 2620
Band 39
TDD 1900MHZ
LTE TDD/TDSCDMA
1880 - 1920
Band 40
IMT 2300MHz
LTE TDD
2300 - 2400
Band 41
BRS/EBS 2500MHZ
LTE TDD
2496 - 2690

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4.2 Requirements for Antenna
Connection and design for antenna are very important to product, and the module provides two antenna
connectors:
Main antenna
Diversity antenna
Main antenna requirements for L810-MiniPCIe
Frequency range
The most proper antenna to adapt the frequencies should be used.
Bandwidth (GSM/EDGE)
GSM900: 80 MHz
GSM1800(DCS): 170 MHz
Bandwidth (WCDMA)
WCDMA band 1(2100): 250 MHz
WCDMA band 8(900): 80 MHz
Bandwidth (LTE)
LTE band 1(2100): 250 MHz
LTE Band 3(1800): 170 MHz
LTE band 5(850): 70 MHz
LTE band 7(2600): 190 MHz
LTE Band 8(900): 80 MHz
LTE band 20(800): 71 MHz
LTE band 38(2600): 50 MHz
LTE Band 39(1900): 40 MHz
LTE band 40(2300): 100 MHz
LTE band 41(2500): 194 MHz
Bandwidth (TD-SCDMA)
TD-SCDMA A(2100):15 MHz
TD-SCDMA F(1900):40MHz
Impedance
50Ohm
Input power
> 33dBm(2 W) peak power GSM
> 23dBm average power WCDMA & LTE &TD-SCDMA
Recommended
standing-wave ratio
≤ 2:1
The RF traces must have 50 Ohm impedance. If the impedance is not matched, the RF performance will
reduce.

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5 Interface Application
5.1 USB Interface
5.1.1 USB Interface Description
Pin
Pin name
I/O
Pin description
Voltage range
36
USB_D-
I/O
USB D- signal
0.3---3V
38
USB_D+
I/O
USB D+ signal
0.3---3V
L810-MiniPCIe supports USB 2.0 and is compatible with USB1.1. The corresponding USB driver shall be
installed according to the Windows system before it can be used in PC.
After L810-MiniPCIe is inserted into PC, the USB driver will map 3 COM ports and 3 NCM ports on the
Windows system, which are shown as follows:
Two COM ports can be used to send AT Commands
One COM port can be used to capture LOG information for debugging software
Three NCM ports are virtual network ports, which can be used to initiate the data service
Note:
One COM port can be used for Modem COM port to initiate the data service. Since the speed of
Modem COM port is not sufficient for the 150Mbps downlink speed requirement for LTE, so it’s
not recommended to be used. Modem COM port can only be used to initiate data service in the
case that NCM port can’t be used.

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5.1.2 USB Interface Application
Reference circuit diagram is shown in Figure 5-1:
Figure 5-1 Reference Circuit Diagram for USB Interface
For T101 and T102, it is required to use 1pF TVS diodes or any with lower capacitance, it is
recommended to use 0.5pF TVS diodes. USB_D+ and USB_D- are high speed differential signal lines,
and the maximum transfer rate is 480Mbps, the following shall be noted in the case of PCB Layout:
USB_D+ and USB_D- signal lines should have the equal length and should be parallel, and right
angle wiring should be avoid.
USB_D+ and USB_D- signal lines should be wrapped with GND at the ends.
USB 2.0 differential signal lines should be routed on the layer that is next to the ground layer.
The impedance of differential lines should be 90 Ohm.
5.2 USIM Interface
5.2.1 Signal Description for USIM Card
Pin
Pin name
I/O
Pin description
Voltage
8
USIM_VCC
O
Power supply for external USIM card
1.8V/3V
10
USIM_IO
I/O
USIM data signal
1.8V/3V
12
USIM_CLK
O
USIM clock signal
1.8V/3V
14
USIM_RST
O
USIM reset signal
1.8V/3V

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5.2.2 USIM Interface Application Description
Recommended circuit diagram for USIM is shown in Figure 5-2:
Figure 5-2 Recommended USIM Circuit Diagram
Note:
In order to improve the EMC performance, the SIM card slot should be placed close to the
module. The filter capacitors on the signal lines should be placed close to SIM card pins. The
ESD device (e.g. TVS diodes) shall be added close to the SIM card pins for ESD protection. The
capacitance for ESD devices should be lower than 33pF.

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5.3 Digital Audio Interface
5.3.1 Audio Interface
L810-MiniPCIe supports I2S digital audio interface, and it supports the ordinary l2S mode and PCM mode.
The signal level of the l2S interfaces is 1.8V.
Description for l2S signals is as follows:
Pin
Pin name
I/O
Pin description
Voltage
45
I2S2_CLK
O
I2S clock
CMOS 1.8V
47
I2S2_TX
O
I2S data transmit
CMOS 1.8V
49
I2S2_RX
I
I2S data receive
CMOS 1.8V
51
I2S_WA0
O
I2S left and right channel clock (LRCK)
CMOS 1.8V
5.3.2 I2S Application Description
L810-MiniPCIe
Signal direction
Audio CODEC I2S Port
I2S2_CLK
I2S_CLK
I2S2_TX
I2S_SDIN
I2S2_RX
I2S_SDOUT
I2S2_WA0
I2S_LRCK
Description:
l2S interface can be configured as master or slave mode.
It supports multiple audio sampling rates (44.1KHz, 32KHz, 24KHz, 16KHz, 8KHz).
5.3.3 Application Description for PCM Mode
L810-MiniPCIe
Signal flow direction
Audio CODEC PCM Port
I2S2_CLK(PCM_CLK, PCM clock signal)
PCM_CLK (PCM clock signal)
I2S2_TX(PCM_DOUT, PCM data output)
PCM_DIN (PCM data input)
I2S2_RX(PCM_DIN, PCM data input)
PCM_DOUT (PCM data
output)
I2S2_WA0(PCM_SYNC, PCM frame
sync signal)
PCM_SYNC (PCM frame sync
signal)

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Description:
PCM mode interface can be configured as master or slave mode.
It supports short frame sync for 16, 32, 48, and 64 bit mode.
It supports burst and continuous transmission modes.
It supports clock length trigger for frame sync signal and rising/falling edge trigger for data
transmission.
It supports various audio sampling rates (48KHz, 44.1KHz, 32KHz, 24KHz, 22.5KHz,
16KHz, 12KHz, 11.025KHz and 8KHz).
Note:
Because of the timing of I2S mode is simpler than PCM mode, it is recommended to use I2S
mode for audio transmission. For PCM mode, the audio quality issues caused by the PCM timing
adjusting must be avoided.
5.4 UART Interface
5.4.1 UART Interface Description
L810-MiniPCIe provides one four-line UART, and the user can receive and send AT command through
UART1 and auto baud rate is supported.
Pin
Pin name
I/O
Pin description
Voltage
11
UART1_RX
I
UART1 data receive signal
3.3V
13
UART1_TX
O
UART1 data transmit signal
3.3V
23
UART1_CTS
I
UART1 clear to send signal
3.3V
25
UART1_RTS
O
UART1 request to send signal
3.3V
5.4.2 UART Interface Application
Uart Rx/Tx signal direction shows in the following tables::
MCU(DTE)
Signal flow direction
L810-MiniPCIe module (DCE)
RXD
UART1_TXD
TXD
UART1_RXD
Note:
The voltage level for L810-MiniPCIe UART is 3.3V, and voltage matching should be handled
when connecting to DTE.