Fibocom SC806 Instructions for use

SC806 Hardware User Manual
Version: V2.0.0
Update date: April 27, 2018

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Version history
Version
Update date
Description
V1.0.0
02-23-2017
Initial version
V1.0.1
06-19-2017
1. Modify SD card power L12 description
2. Modify the PMU_GPIO voltage description
3. Modify the LED charging indicator pin description
4. Modify motor drive pin description
5. Modify the mandatory download pin description
6. Modify WIFI reception sensitivity 802.11g rate
7. Add SC806-CN-02 product description
V1.0.2
01-12-2018
Add headphone MIC design note
V2.0.0
04-27-2018
Optimized version
Add supported band descriptions of other sc806 models

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Copyright
Copyright© 2017 Fibocom Wireless Inc.All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt,
copy any part of or the entire document, or distribute the document in any form.
Notice
The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless
otherwise specified, the document only serves as the user guide.All the statements, information and suggestions
contained in the document do not constitute any explicit or implicit guarantee.
The statements should be displayed in the user manual:
changes or modifications not expressly approved by the party responsible for compliance could void the user’s
authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to
avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall
not be less than 20cm (8 inches) during normal operation.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

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This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and
users, and the Max allowed antenna gain is as following table showed:
Operating Band
Antenna Gain（dBi）
WCDMA BAND II
8.05
WCDMA BAND IV
5.50
WCDMA BAND V
12.1
LTE BAND 2
8.55
LTE BAND 4
6.00
LTE BAND 5
12.6
LTE BAND 12
12.6
LTE BAND 13
12.6
LTE BAND 17
12.6
BT/WIFI Test Gain
Antenna Gain（dBi）
2.4G WiFi
2.5
WIFI 5G
2.1
2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions
above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements
required with this module installed
Host manufacturer is responsible for ensuring that the host continues to be compliant
with the Part 15 subpart B unintentional radiator requirements after the module is
installed and operational.
IMPORTANT NOTE: In the event that these conditions can not be met (for example
certain laptop configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that
20 cm may be maintained between the antenna and users. The final end product must be labeled in a
visible area with the following: “Contains FCC ID: ZMOSC806AM”.The grantee's FCC ID can be used
only when all FCC compliance requirements are met.

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Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module inthe user’s manual of the end product which integrates this module.The end user
manual shall include all required regulatory information/warning as show in this manual.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Applicable model
S/N
Product model
Description
1
SC806-CN-00
NA
2
SC806-CN-02
Do not support LTE diversity reception. Others are the same as
SC806-CN-00.
3
SC806-AM-00
support 5G WIFI
4
SC806-AB-00
support 5G WIFI
5
SC806-AE-00
support 5G WIFI
6
SC806-CN-01
NA

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Contents
Version history................................................................................................................................................ 2
Applicable model............................................................................................................................................5
Contents......................................................................................................................................................... 6
Table index..................................................................................................................................................... 9
Figure index ..................................................................................................................................................11
1Foreword .............................................................................................................................................. 12
1.1 Introduction............................................................................................................................12
1.2 Reference Standards................................................................................................................12
1.3 Related documents..................................................................................................................12
2Product Overview..................................................................................................................................13
2.1 Description............................................................................................................................. 13
2.2 Main Performance................................................................................................................... 13
2.3 Hardware Diagram.................................................................................................................. 15
3Application Interface .............................................................................................................................16
3.1 LCC+LGA Interface................................................................................................................16
3.1.1 Pin Distribution ...............................................................................................................17
3.1.2 Pin Definition.................................................................................................................. 17
3.2 Power..................................................................................................................................... 26
3.2.1 Power Supply.................................................................................................................. 26
3.2.2 Lithium Battery Charge and Battery Management..............................................................28
3.2.3 RTC Power...................................................................................................................... 28
3.2.4 Power Output ..................................................................................................................29
3.3 Control Signal......................................................................................................................... 30
3.3.1 Module Startup................................................................................................................ 30
3.3.2 Module Shutdown and Restart.......................................................................................... 31
3.3.3 Sleep/wakeup..................................................................................................................32
3.3.4 Reset...............................................................................................................................32
3.4 USB Interface......................................................................................................................... 32
3.5 UART Interface ......................................................................................................................34
3.6 USIM Interface....................................................................................................................... 34
3.7 SDIO Interface........................................................................................................................36
3.8 GPIO Interface........................................................................................................................37

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3.9 I2C Interface........................................................................................................................... 38
3.10 ADC Interface ........................................................................................................................39
3.11 Motor Drive Interface.............................................................................................................. 39
3.12 LCM Interface........................................................................................................................39
3.13 Touch Screen Interface............................................................................................................ 40
3.14 Camera Interface..................................................................................................................... 41
3.14.1 Front camera ...................................................................................................................41
3.14.2 Rear camera ....................................................................................................................42
3.14.3 Design note.....................................................................................................................42
3.15 Sensor Design......................................................................................................................... 44
3.16 Audio..................................................................................................................................... 44
3.16.1 Audio interface definition.................................................................................................44
4Antenna Interface ..................................................................................................................................45
4.1 MAIN/DRX Antenna .............................................................................................................. 45
4.1.1 Operating bands...............................................................................................................45
4.1.2 Reference Design.............................................................................................................46
4.2 WIFI/BTAntenna ...................................................................................................................47
4.2.1 Operating band................................................................................................................ 47
4.2.2 Reference design............................................................................................................ 47
4.3 GNSS Antenna........................................................................................................................48
4.3.1 Operating band................................................................................................................ 48
4.3.2 Reference design .............................................................................................................48
4.4 Antenna Requirement..............................................................................................................49
5Other Interfaces..................................................................................................................................... 50
6RF PCB Layout Design Guide................................................................................................................ 50
7WIFI and Bluetooth............................................................................................................................... 52
7.1.1 WIFI overview ................................................................................................................ 52
7.1.2 WIFI performance parameters .......................................................................................... 52
7.1.3 Bluetooth overview.......................................................................................................... 54
7.1.4 Bluetooth performance parameters.................................................................................... 54
8GNSS................................................................................................................................................... 55
8.1.1 Overview ........................................................................................................................ 55
8.1.2 Performance parameters...................................................................................................55
9Electrical Characteristics and Reliability .................................................................................................55

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9.1 Recommended Parameters....................................................................................................... 55
9.2 Charge Parameters ..................................................................................................................56
9.3 Operating Current ...................................................................................................................56
9.4 RF Transmitting Power............................................................................................................57
9.5 RF Receiver Sensitivity........................................................................................................... 58
9.6 Electrostatic Protection............................................................................................................ 58
10 Structural specification ...................................................................................................................59
10.1 Product appearance .................................................................................................................59
10.2 Structural Dimension............................................................................................................... 60
10.3 Recommended PCB Welding Plate Design................................................................................ 61
10.4 SMT Patch ............................................................................................................................. 61
10.5 Storage...................................................................................................................................61
10.5.1 Storage life......................................................................................................................61
10.5.2 Workshop life.................................................................................................................. 62
10.5.3 Baking............................................................................................................................ 62
10.6 Packaging...............................................................................................................................62
10.6.1 Tray packaging................................................................................................................62
10.6.2 Tray dimension................................................................................................................ 64
11 Appendix ATerm Abbreviations.............................................................................................................65
12 Appendix B GPRS Encoding Scheme.............................................................................................. 68
13 Appendix C GPRS Multislot........................................................................................................... 69
14 Appendix D EDGE Modulation and Encoding Method .....................................................................70

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Table index
Table 4 SC806-AM-00 Supported band................................................................................................... 13
Table 7 Main performance parameters..................................................................................................... 13
Table 8 I/O parameter definition ............................................................................................................. 17
Table 9 Pin description........................................................................................................................... 18
Table 10 Power supply parameters..........................................................................................................26
Table 11 Power supply filter capacitor design .......................................................................................... 27
Table 12 VRTC parameters.....................................................................................................................29
Table 13 Power description.....................................................................................................................29
Table 14 startup/shutdown pin definition................................................................................................. 30
Table 15 USB pin definition................................................................................................................... 32
Table 16 module internal USB trace length..............................................................................................33
Table 17 UART interface pin definition................................................................................................... 34
Table 18 USIM pin definition................................................................................................................. 34
Table 19 SDIO pin definition..................................................................................................................36
Table 20 GPIO list.................................................................................................................................37
Table 21 I2C pin definition..................................................................................................................... 38
Table 22 ADC pin definition................................................................................................................... 39
Table 23 Motor pin definition................................................................................................................. 39
Table 24 LCM pin definition .................................................................................................................. 40
Table 25 TP pin definition ......................................................................................................................40
Table 26 Front camera pin definition....................................................................................................... 41
Table 27 Rear camera pin definition................................................................................................... 42
Table 28 Module internal MIPI trace length.............................................................................................43
Table 29 Sensor control pin description...................................................................................................44
Table 30 Audio interface definition .........................................................................................................44
Table 31 MAIN/DRX antenna interface definition....................................................................................45
Table 32 Module operating band.............................................................................................................45
Table 33 WIFI/BT antenna interface definition.........................................................................................47
Table 34 WIFI/BT operating band...........................................................................................................47
Table 35 GNSS antenna interface definition............................................................................................. 48
Table 36 GNSS operating band...............................................................................................................48
Table 37 Module antenna requirement.....................................................................................................49
Table 38 WIFI transmission power table ............................................................................................. 52

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Table 39 WIFI reception sensitivity ........................................................................................................ 53
Table 40 BT rate and version information................................................................................................ 54
Table 41 BT performance parameters...................................................................................................... 54
Table 42 GNSS positioning performance................................................................................................. 55
Table 43 Recommended parameters ........................................................................................................ 55
Table 44 Charge parameters.................................................................................................................... 56
Table 45 Operating current..................................................................................................................... 56
Table 46 Module RF transmitting power..................................................................................................57
Table 47 Module RF receiver sensitivity..................................................................................................58
Table 48 ESD performance..................................................................................................................... 59
Table 49 GPRS encoding scheme............................................................................................................68
Table 50 Multilevel multislot allocation...................................................................................................69
Table 51 EDGE modulation and encoding method ...................................................................................70

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Figure index
Figure 1 Hardware Block Diagram.......................................................................................................... 16
Figure 2 Pin Distribution (TOP perspective) ............................................................................................17
Figure 3 Power Design........................................................................................................................... 27
Figure 4 Power Voltage Drop Example....................................................................................................28
Figure 5 VRTC Reference Design Circuit Diagram..................................................................................29
Figure 6 Button Startup Circuit...............................................................................................................30
Figure 7 Drive Circuit Startup.................................................................................................................31
Figure 8 Startup Time Slot......................................................................................................................31
Figure 9 Shutdown Time Slot ................................................................................................................. 32
Figure 10 USB Interface Circuit Diagram................................................................................................33
Figure 11 USIM Card Interface Circuit Diagram......................................................................................35
Figure 12 MAIN/DRX Antenna Connection ............................................................................................ 46
Figure 13 WIFI/BTAntenna Connection .................................................................................................47
Figure 14 GNSS Antenna Connection ..................................................................................................... 49
Figure 15 Two-layer PCB Microstrip Structure ........................................................................................ 50
Figure 16 Two-layer PCB Coplanar Waveguide Structure......................................................................... 51
Figure 17 Four-layer PCB Coplanar Waveguide Structure (reference ground layer3)...................................51
Figure 18 Four-layer PCB Coplanar Waveguide Structure (reference ground layer4)...................................51
Figure 19 Module ProductAppearance.................................................................................................... 59
Figure 20 Structural Dimension .............................................................................................................. 60
Figure 21 Recommended PCB Welding Plate Design (Unit: mm)..............................................................61
Figure 22 Tray Packaging....................................................................................................................... 63
Figure 23 Tray Dimension......................................................................................................................64

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1Foreword
1.1 Introduction
This document describes the electrical characteristics, RF performance, structure size, application environmentand
other information ofSC806 module. With the help of this document and other related documents, application
developers can quickly understand the hardware functions of SC806 module and implement the hardware
development of products..
1.2 Reference Standards
This design of the product complies with the following standards:
3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission and
reception (FDD);Part 1: Conformance specification
3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio transmission and
reception (TDD)
3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission and
reception; Part 1: Conformance testing
3GPP TS 21.111 V10.0.0: USIM and IC card requirements
3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-ME)
interface
3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)
application
3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM)Application Toolkit(USAT)
3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and
ancillary equipment
3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)
3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE -
DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
1.3 Related documents
N/A

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2Product Overview
2.1 Description
Fibocom’s SC806 module is a smart module based on the Qualcomm MSM8909 platform. The SC806 integrates
core components such as Baseband, EMCP, PMU, Transceiver, and PA to support multi-standard long-distance
communication modes such as FDD/TDD-LTE, WCDMA, TD-SCDMA, CDMA, CDMA2000-EVDO, GSM, and
WIFI/BT short-distance wireless transmission technology. It supports GNSS wireless positioning technology.
SC806 is embedded with Android operating system, and has various interfaces such as MIPI/USB/UART/SPI/I2C.
It is the optimal solution for the core system of wireless smart products.
The SC806 module supports multiple formats and frequency bands. The corresponding standard and frequency
band are as follows:
Table1SC806-AM-00 Supported band
Mode
Band
WCDMA
Band 2/4/5
FDD-LTE
Band2/4/5/12/13/17
WIFI802.11 a/b/g/n
2412-2462 MHz，5180-5825 MHz
BT4.1 LE
2402-2480 MHz
GNSS
GPS /GLONASS /BeiDou
The SC806 is a module with 210 pins, including 146 LCC pins and 64 LGA pins. The size is 40.5mm × 40.5mm ×
2.8mm. It can be embedded in various M2M products through welding plate. It is very suitable for the development
of mobile devices such as on-board computers, multimedia devices, smart homes, and Internet of Things devices.
2.2 Main Performance
The following table describes the detailed performance parameters of the SC806
Table2Main performance parameters
Performance
Description
Power
DC 3.3-4.5V, typical voltage: 3.8V
Application CPU
Qualcomm’s® MSM8909:Quad-ARM®Cortex™-A7application processors
up to 1.1GHz + 512KB L2 cache
Multimedia CPU
QDSP6 v5 Core
Operating frequency691.2MHz
768KB L2

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Memory
8Gb LPDDR3+ 8 GB eMMC Flash
Operating system
Android Lollipop
Power class
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE FDD bands
GSM/GPRS/EDGE characteristics
R99：
CSD transmission rate: 9.6kbps, 14.4kbps
GPRS：
Support GPRS multi-slot class 33
Coding formats: CS-1/CS-2/CS-3 and CS-4
frame maximum 5Rx time slots
EDGE：
Support EDGE multi-slot class 33
Support GMSK and 8-PSK
Uplink encoding format:CS 1-4 and MCS 1-9
Downlink encoding format:CS 1-4 and MCS 1-9
WCDMAcharacteristics
Support3GPP R8 DC-HSPA+
Support16-QAM，64-QAM and QPSK modulation
3GPP R6 CAT6 HSUPA: Maximum uplink rate 5.76Mbps
3GPP R8 CAT24 DC-HSPA+: Maximum downlink rate 42Mbps
CDMA/EVDOcharacteristics
Support CDMA 1X Advanced，1XEV-DOr0/-DOrA
Maximum uplink rate 1.8Mbps, maximum downlink rate3.1Mbps
TD-SCDMAcharacteristics
Support CCSA Release 4
Maximum uplink rate 2.2Mbps, maximum downlink rate 4.2Mbps
LTEcharacteristics
Support FDD/TDD CAT4
Support 1.4-20MRF bandwidth
Downlink support multi-userMIMO
Maximum uplink rate50Mbps, maximum downlink rate 150Mbps
WLANcharacteristics
2.4G wifiSupport802.11b/g/n，5G wifiSupport802.11a/n
Maximum rate 150Mbps
SupportAP mode
Bluetoothcharacteristics
BT4.1（BR/EDR+BLE)
Satellite positioning
GPS/GLONASS/BeiDou
Short Message（SMS）
Text and PDU modes
Point to point MO and MT
SMS cell broadcast
SMS storage: stored by default in the module
LCMinterface
4 sets MIPI_DSI, each set supports up to 1.5Gbps
SupportWVGA（2 sets MIPI_DSI）, up to 720P (4 sets MIPI_DSI)
24bit color depth
Camera interface
Use MIPI_CSI, each set supports up to 1.5Gbps and supports 2 cameras
Rear camera uses 2 sets MIPI_CSI, up to 8MP pixels
Front camera uses 1 set MIPI_CSI, up to 5MP pixels
Audio Interface
Audio Input:
3 analog microphone inputs with integrated internal bias
Audio output:
Class AB stereo headphone output
Class AB differential handset output
Class D differential speaker amplifier output

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USBinterface
Support USB2.0 high speed mode, data transmission rate up to 480 Mbps
Support USB OTG (add 5V power supply chip)
SIMinterface
2 sets USIM card interface
Support USIM/SIM card: 1.8V and 2.95V
Support dual card dual standby (software support required)
UARTinterface
2 sets serial ports
A set four-wire serial port supporting RTS and CTS hardware flow control
A set two-wire serial port for Debug
Maximum speed to 4Mbps
SDIOinterface
Support SD3.0, 4bit SDIO; SD card supports hot plug
I2Cinterface
3 sets I2C, high speed up to 3.4Mbps for TP, Camera, Sensor and other
peripherals
ADCinterface
3 sets for input voltage detection, battery temperature detection, and universal
ADC
Real-time clock
Support
Antennainterface
MAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interface
Physical characteristics
Size: 40.5mm * 40.5mm * 2.85mm
Package: 146 LCC pin + 64 LGA pin
Weight: about 9.2g
Temperature range
Operating temperature: -30°C - 70°C 1)
Storage temperature: -40°C - 85°C
Software update
Via USB/OTA/SD
RoHS
RoHS Compliant
Note:
1）When the module is operating in this temperature range, the functions of the module are normal, and the
relevant performance of the module meets the 3GPP standard.
2.3 Hardware Diagram
The following hardware diagram shows the main hardware functions of the SC806 module, including the
following:
Baseband
Wireless transceiver
PMU
Storage
Peripheral interface
-- Communication expansion interface (USB/UART/I2C/SDIO)

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--USIM card interface
--MIPI DSI interface
--MIPI CSI interface
--Analog audio interface
Figure1Hardware Block Diagram
3Application Interface
3.1 LCC+LGAInterface
SC806module adopts LCC+LGA packaging, with a total of 210 pins, including 146 LCC pins and 64 LGA pins.

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3.1.1Pin Distribution
Figure2Pin Distribution (TOP perspective)
Note: The pin “NC” stands for No connect, ie the pin for this position is a reserved pin and does not need to be
connected.
3.1.2Pin Definition
Table3I/O parameter definition
Type
Description
IO
input/output

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DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
The SC806’s pin functions and electrical characteristics are described in the following table:
Table4Pin description
Power
Pin Name
Pin No.
I/O
Pin Description
Note
VBAT_BB
1,2
PI
Baseband power input
Input voltage range: 3.3 ~ 4.5V, recommend
3.8V
VBAT_RF
145,146
PI
RF power input
Voltage range: 3.3 ~ 4.5V, recommend 3.8V
VDD_1V8_L5
111
PO
1.8Vvoltage output
Drive current200mA
VDD_1V8_L6
125
PO
1.8V voltage output
Drive current200mA
VDD_2V85_L17
129
PO
2.85V voltage output
Drive current420mA
VDD_SD_L12
32
PO
SD card pull-up resistor
power supply, 2.95V
Drive current50mA
VDD_SD_L11
38
PO
SD card power supply,
2.95V
Drive current600mA
VDD_USIM1_L14
26
PO
SIM card 1 power supply
2.95/1.8 Vadjustable, 55mA
VDD_ USIM2_L15
21
PO
SIM card 2 power supply
2.95/1.8 Vadjustable, 55mA
VRTC
126
I/O
RTC clock power supply
pin
Voltage range: 2.0 ~3.25V, recommend 3.0 V
GND
3,7,12,15,27,51,62,
Ground

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69,76,78,85,86,88,
89,120,122,130,
132,135,140,143,
144,147,148,149,
150,160,161,162,
163,164,165,166,
167,168,169,170,
171,172,173,174,
175,176,177,178,
180,181,182,184,
185,186,188,189,
192,193,198,200,
201,208,209
Battery
Pin Name
Pin No.
I/O
Pin Description
Note
BATT_CON_TEMP
134
AI
Battery temperature
detection pin
NTC resistor connected to battery
VBAT_ SNS
133
AI
Battery voltage detection
pin
BATT_ID
194
AI
Battery position detection
CHARGE_SEL
127
DI
Charge scheme selection
pin
Grounding uses the module’s external charge
scheme, and floating uses the module’s
built-in charge scheme. Default is floating
VREF_BATT_THERM
187
AO
Battery temperature
detection circuit reference
voltage
LED_CHARGE_N
191
DI
Charge status indicator
pin
Connect indicator negative
Button
Pin Name
Pin No.
I/O
Pin Description
Note
KEY_ON/OFF
114
DI
Analog switch button
Low effect

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KEY_VOL_UP
95
DI
Volume +
Low effect
KEY_VOL_DOWN
96
DI
Volume -
Low effect
KEY_RST_N
179
DI
Reset pin
PMIC reset input, low effect
USIM interface
Pin Name
Pin No.
I/O
Pin Description
Note
USIM1_DIO
25
I/O
SIM card 1 data signal
USIM1_CLK
24
DO
SIM card 1 clock signal
USIM1_RST
23
DO
SIM card 1 reset signal
USIM1_ DET
22
DI
SIM card 1 plug detection
pin
Fixed level when not in use
USIM2_DIO
20
I/O
SIM card 2 data signal
USIM2_CLK
19
DO
SIM card 2 clock signal
USIM2_RST
18
DO
SIM card 2 reset signal
USIM2_ DET
17
DI
SIM card 2 plug detection
pin
Fixed level when not in use
SDcard interface
Pin Name
Pin No.
I/O
Pin Description
Note
SD_D3
44
I/O
SD card data interface
SD_D2
43
I/O
SD card data interface
SD_D1
42
I/O
SD card data interface
SD_D0
41
I/O
SD card data interface
SD_CLK
39
DO
SD card clock
SD_CMD
40
I/O
SD cardcommand
interface
SD_DET
45
DI
SD card detection
Low level is effective
I2Cinterface