Fibocom L830-EA M.2 Instructions for use

L830-EA M.2 Module
Hardware User Manual
Version：V1.0.3
Date：2015.09.19

L830-EA M.2 Module Hardware User Manual Page
2
of
45
Copyright
Copyright ©2015 Fibocom Wireless Inc . All rights reserved.
Without the prior written permission of the copyright holder, any company or individual is prohibited to
excerpt, copy any part of or the entire document, or transmit the document in any form.
Attention
The document is subject to update from time to time owing to the product version upgrade or other
reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,
information and suggestions contained in the document do not constitute any explicit or implicit
guarantee.
Trademark
The trademark is registered and owned by Fibocom Wireless Inc.
Versions
Version
Date
Remarks
V1.0.0
2015-06-05
Initial Version
V1.0.1
2015-06-16
Update the supported Cat of HSPA ;
Update the description of digital voice ;
Update the description of USB and Win8/Android switch ;
Update the consumption
V1.0.2
2015-07-07
Update part of error description
V1.0.3
2015-09-19
Delete the Band25, Update the parameters of GPS, and update the
logo

L830-EA M.2 Module Hardware User Manual Page
3
of
45
Applicability Table
No.
Type
Note
1
L830-EA
NA
The difference of L830-EA M.2 wireless module as listed below:
Model No.
LTE FDD
WCDMA
GSM/GPRS/EDGE
L830-EA
Band
1,2,3,4,5,7,8,9,13,17,18,19,20,26,29
Band
1,2,4,5,6,8
850/900/1800/1900MHz

L830-EA M.2 Module Hardware User Manual Page
4
of
45
Content
1 Foreword.................................................................................................................................................................... 7
1.1 Introduction.....................................................................................................................................................7
1.2 Reference Standard......................................................................................................................................7
2 Product Overview..................................................................................................................................................... 9
2.1 Description......................................................................................................................................................9
2.2 Specifications................................................................................................................................................. 9
2.3 Appearance.................................................................................................................................................. 14
3 Structure...................................................................................................................................................................15
3.1 Dimension Diagram of Structure.............................................................................................................. 15
3.2 Application Interface Description..............................................................................................................16
3.3 M.2 Connector............................................................................................................................................. 17
4 Hardware Introduction........................................................................................................................................... 18
4.1 Pin Definitions..............................................................................................................................................18
4.1.1 Pin Map............................................................................................................................................. 18
4.1.2 Description of Pins...........................................................................................................................19
5 Hardware Interface.................................................................................................................................................23
5.1 Power Interface........................................................................................................................................... 23
5.1.1 Power Supply................................................................................................................................... 23
5.1.2 VIO_1V8............................................................................................................................................23
5.2 Power on/off and Reset Signal................................................................................................................. 24
5.2.1 Power on /off Signal........................................................................................................................ 24
5.2.1.1 Power on Signal................................................................................................................... 24
5.2.1.2 Power off signal.................................................................................................................... 25
5.2.1.3 The Recommended Design of Power on/off................................................................... 26
5.2.2 RESET Signal.................................................................................................................................. 26
5.3 Status Indicating Signal............................................................................................................................. 27
5.3.1 Status Indicating Pin....................................................................................................................... 27
5.4 USB /SSIC Interface................................................................................................................................... 28
5.4.1 USB Interface................................................................................................................................... 28
5.4.2 USB SSIC Interface.........................................................................................................................29
5.5 USIM Interface.............................................................................................................................................29
5.5.1 USIM Pins......................................................................................................................................... 29

L830-EA M.2 Module Hardware User Manual Page
5
of
45
5.5.2 USIM Interface Design....................................................................................................................30
5.5.2.1 “Normal Closed” SIM Card Circuit Design....................................................................... 30
5.5.2.2 “Normally Open” SIM Circuit Design.................................................................................30
5.5.3 Points for Attention in USIM Design............................................................................................. 31
5.5.4 USIM Hot-Plugging..........................................................................................................................32
5.5.4.1 Hardware Connection..........................................................................................................32
5.5.4.2 Software Settings................................................................................................................. 32
5.6 Digital Audio................................................................................................................................................. 33
5.6.1 I2S Interface..................................................................................................................................... 33
5.6.2 PCM Port Description..................................................................................................................... 33
5.7 Win8/Android Switch Control Interface................................................................................................... 34
5.8 W_DISABLE# Interface............................................................................................................................. 35
5.8.1 Description of WWAN_DISABLE# Interface...............................................................................35
5.8.2 GPS_DISABLE# Interface............................................................................................................. 35
5.9 TX_BLANKING Interface........................................................................................................................... 35
5.10 WAKEUP_Host Interface.........................................................................................................................36
5.11 BODY_SAR Interface............................................................................................................................... 36
5.12 I2C Interface.............................................................................................................................................. 36
5.13 Clock Interface.......................................................................................................................................... 37
5.14 Config Interface......................................................................................................................................... 37
5.15 RF Interface............................................................................................................................................... 37
5.15.1 RF Connector Interface................................................................................................................ 37
5.15.2 RF Connecting Seat......................................................................................................................38
5.15.3 Main Performance of RF Connector.......................................................................................... 39
5.16 Other Interfaces........................................................................................................................................ 39
6 Electrical and Environmental Features............................................................................................................... 39
6.1 Electrical Features...................................................................................................................................... 39
6.2 Environmental Features.............................................................................................................................40
7 RF Interface............................................................................................................................................................. 41
7.1 Operating Frequency Band....................................................................................................................... 41
7.2 Receiving Sensitivity...................................................................................................................................42
7.3 GNSS............................................................................................................................................................ 43
7.4 RF PCB Design........................................................................................................................................... 43
7.4.1 Wiring Principle................................................................................................................................ 43

L830-EA M.2 Module Hardware User Manual Page
6
of
45
7.4.2 Impedance Design...........................................................................................................................43
7.5 Antenna Design........................................................................................................................................... 44
7.5.1 Main Antenna Design Requirements........................................................................................... 44

L830-EA M.2 Module Hardware User Manual Page
7
of
45
1 Foreword
1.1 Introduction
The document describes the electrical characteristics, RF performance, dimensions and application
environment, etc. of L830-EA M.2 wireless modules. With the assistance of the document and other
instructions, developers can quickly understand the performance of L830-EA M.2 wireless modules and
develop products.
1.2 Reference Standard
The design of the product compiles with the following standards ：
3GPP TS 27.007 -v6.9.0: AT command set for User Equipment (UE)
3GPP TS 27.005 -v6.0.1: Use of Data Terminal Equipment -Data Circuit terminating Equipment
(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)
3GPP TS 23.040 -v6.9.0: Technical realization of Short Message Service (SMS)
3GPP TS 24.011 -v6.1.0: Point- to - Point (PP) Short Message Service (SMS) support on mobile
radio interface
3GPP TS 27.010 -v6.0.0: Terminal Equipment to User Equipment (TE-UE) multiplexer protocol
3GPP TS 27.060 -v6.0.0: Packet domain; Mobile Station (MS) supporting Packet Switched services
3GPP TS 25.304-v6.10.0: User Equipment (UE) procedures in idle mode and procedures for cell
reselection in connected mode
3GPP TS 25.308 -v6.4.0: High Speed Downlink Packet Access (HSDPA); Overall description;
Stage 2
3GPP TS 25.309 -v6.6.0: FDD enhanced uplink; Overall description; Stage 2
3GPP TS 23.038 -v6.1.0: Alphabets and language - specific information
3GPP TS 21.111 -v6.3.0: USIM and IC card requirements
3GPP TS 31.111 -v6.11.0 "USIM Application Toolkit (USAT)"
3GPP TS 45.002 -v6.12.0: Multiplexing and multiple access on the radio path
3GPP TS 51.014 -v4.5.0: Specification of the SIM Application Toolkit for the Subscriber Identity
Module - Mobile Equipment (SIM-ME) interface
3GPP TS 51.010 -1 -v6.7.0: Mobile Station (MS) conformance specification; Part 1: Conformance
specification
3GPP TS 22.004 -v6.0.0: General on supplementary services
3GPP TS 23.090 -v6.1.0: Unstructured Supplementary Service Data (USSD); Stage 2

L830-EA M.2 Module Hardware User Manual Page
8
of
45
3GPP TS 24.008 v6.19, Mobile radio interface Layer 3 specification;
3GPP TS 25.101 V7.18.0: User Equipment (UE) radio transmission and reception (FDD)
3GPP TS 36.101 V9.18.0: User Equipment (UE) radio transmission and reception
3GPP TS 36.104 V9.13.0: Base Station (BS) radio transmission and reception
3GPP TS 36.106 V9.4.0: FDD Repeater radio transmission and reception
3GPP TS 36.113 V9.5.0: Base Station (BS) and repeater ElectroMagnetic Compatibility (EMC)
3GPP TS 36.124 V9.2.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals
and ancillary equipment
3GPP TS 36.133 V9.18.0: Requirements for support of radio resource management
3GPP TS 34.121-1 version 7.2.0: The requirements and this test apply to all types of UTRA for the
FDD UE
3GPP TS 36.521-1 User Equipment (UE) conformance specification; Radio transmission and
reception; Part 1: Conformance testing
3GPP TS 34.122 V5.7.0: Technical Specification Group Radio Access Network; Radio transmission
and reception (TDD)
3GPP TS 45.005 9.4.0: Digital cellular telecommunications system (Phase 2+); Radio transmission
and reception

L830-EA M.2 Module Hardware User Manual Page
9
of
45
2 Product Overview
2.1 Description
L830-EA M.2 modules are highly integrated 4G wireless modules, supports 3 modes 16 bands that
including the main 4G/3G/2G modes (LTE FDD/ WCDMA/ /GSM) and with wide bands, but not TDD
mode in China. These bands support the main operators of Europe and North America and the cellular
network of parts of the Asia .
2.2 Specifications
Specification
Operating Frequency
Range
L830-EA
LTE FDD: Band 1,2,3,4,5,7,8,9,13,17,18,19,20,26,29
WCDMA HSPA+: Band 1,2,4,5,6,8
GSM/GPRS/EDGE: 850/900/1800/1900MHz
LTE inter-band CA
1 +5,8,18,19,26
2 +4,5,13,17,29
3 +5,8,19,20,26
4 +5,13,17,29
7 +3,20
LTE intra-band CA
4
GNSS
Supported
Weight
5.7 grams
Data Rate
LTE FDD
Cat6 (300Mbps DL,50Mbps UL)
UMTS/HSDPA/HSUPA
3GPP Rel.10
DC-HSDPA 42Mbps(Cat 24)
HSUPA 5.76Mbps(Cat6)
GSM 3GPP release 7
EDGE (E-GPRS) multi-slot class 33(296kbps DL,
236.8kbps UL)
GPRS multi-slot class 33 (107kbps DL,85.6kbps
UL)
Physical
Dimension ：42x 30 x 2.3 mm

L830-EA M.2 Module Hardware User Manual Page
10
of
45
Characteristics
Interface ：M.2
Environment
Operating Temperature：-30℃~ +65℃
Storage Temperature：-40℃~ +85℃
Performance
Operating Voltage
Voltage：3.135V ~ 4.4V Normal：3.3V
Current
Consumption
(Typical Value)
5mA (Sleep Mode)
LTE FDD DATA：750mA
WCDMA：580mA
2G Talk：300mA (GSM PCL5)
Interface
RF Interface
Antenna ：Mainx1，Diversityx1
Function Interface
1 x USB 2.0，Multiple Profiles over USB，USB SSIC
SIM Support ，I2C Support，I2S/PCM Support
GPIO，Clock
Data Features
Protocol Stack
External TCP/IP and UDP/IP protocol stack
EDGE
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~9
GPRS
Multi-slot class 33 (5 Down; 4 Up; 6 Total)
Coding Scheme MCS1~4
CSD
UMTS(14.4kbps)，GSM(9.6kbps)
USSD
Support
SMS
MO / MT Text and PDU modes
Cell broadcast
Audio
not supported yet
Character Set
IRA，GSM，UCS2，HEX
AT Commands
FIBOCOM proprietary AT commands
GSM 07.05
GSM 07.07

L830-EA M.2 Module Hardware User Manual Page
11
of
45
Accessories
Firmware Loader Tool over USB
User Manual
Developer Kit
Note:
1. Please make sure the temperature for device will not be higher than 65˚C.
2. The minimum distance between the user and/or any bystander and the radiating structure of the
transmitter is 20cm.
3. Assessment of compliance of the product with the requirements relating to the Radio and
Telecommunication Terminal Equipment Directive (EC Directive 1999/5/EC) was performed by
PHOENIX TESTLAB (Notified Body No.0700),

L830-EA M.2 Module Hardware User Manual Page
12
of
45
Note:
Federal Communications Commission (FCC) Declaration of Conformity
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device has been tested and found to comply with the limits for a Class B digital , pursuant to Part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiated radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
FCC Caution:
Changes or modifications not expressly approved by the party responsible for compliance could void the
user‘s authority to operate the equipment.
RF Exposure Information
This device meets the government’s requirements for exposure to radio waves.
This device is designed and manufactured not to exceed the emission limits for exposure to radio
frequency (RF) energy set by the Federal Communications Commission of the U.S. Government.

This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In
order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to
the antenna shall not be less than 20cm (8 inches) during normal operation.
IMPORTANT NOTE:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC

L830-EA M.2 Module Hardware User Manual Page
13
of
45
compliance requirement of the end product, which integrates this module. 20cm minimum distance has to
be able to be maintained between the antenna and the users for the host this module is integrated into.
Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled
environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority
to operate this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation
with the antenna while this end product is installed and operated. The end user has to be informed that
the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end
user has to also be informed that any changes or modifications not expressly approved by the
manufacturer could void the user's authority to operate this equipment. If the size of the end product is
smaller than 8x10cm, then additional FCC part 15.19 statement is required to be available in the users
manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference and (2) this device must accept any
interference received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID:
ZMOL830". If the size of the end product is larger than 8x10cm, then the following FCC part 15.19
statement has to also be available on the label: This device complies with Part 15 of FCC rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference
and (2) this device must accept any interference received, including interference that may cause
undesired operation.

L830-EA M.2 Module Hardware User Manual Page
14
of
45
2.3 Appearance
The product appearance of L830-EA M.2 wireless module is shown as below:
Top View：
Figure 2- 1 Top View
Bottom view:
Figure 2- 2 Bottom View
L830-EA

L830-EA M.2 Module Hardware User Manual Page
15
of
45
3 Structure
3.1 Dimension Diagram of Structure
Figure 3- 1 Dimension Diagram of Structure

L830-EA M.2 Module Hardware User Manual Page
16
of
45
3.2 Application Interface Description
L830-EA M.2 module uses 75-pin gold fingers as the external interface, the size of the module please
refer to the section 3.1.As shown in Figure 4-2, L830-EA M.2 module uses the 75-pin fingers interface
( 67 pins are the signal interface and 8 pins are notch) .About the naming rules of M.2, L830-EA adopts
the Type 3042-S3-B (30mmx42mm,the maximum thickness of element layer of Top surface is 1.5mm , the
thickness of PCB is 0.8mm , Key ID is B ) .

L830-EA M.2 Module Hardware User Manual Page
17
of
45
3.3 M.2 Connector
Recommend to use the M.2 connector from LOTES, the type is APCI0026-P001A, the package of
connector design please refer to the relevant specifications.
As shown in Figure 3-2:
Figure 3- 2 APCI0026-P001A M.2 connector dimension

L830-EA M.2 Module Hardware User Manual Page
18
of
45
4 Hardware Introduction
4.1 Pin Definitions
4.1.1 Pin Map
CONFIG_2
75
74
+3.3V
GND
73
72
+3.3V
GND
71
70
+3.3V
CONFIG_1
69
68
CLK32K
RESET#
67
66
SIM_DETECT
ANTCTL3
65
64
NC
ANTCTL2
63
62
NC
ANTCTL1
61
60
NC
ANTCTL0
59
58
NC
GND
57
56
NC
NC
55
54
NC
NC
53
52
NC
GND
51
50
NC
NC
49
48
TX_BLANKING
NC
47
46
SYSCLK
GND
45
44
GNSS_IRQ
NC
43
42
GNSS_SDA
NC
41
40
GNSS_SCL
GND
39
38
NC
SSIC-RXP
37
36
UIM_PWR
SSIC-RXN
35
34
UIM_DATA
GND
33
32
UIM_CLK
SSIC-TXP
31
30
UIM_RESET
SSIC-TXN
29
28
I2S_WA
GND
27
26
W_DISABLE2#
DPR
25
24
I2S_TX
WOWWAN#
23
22
I2S_RX
CONFIG_0
21
20
I2S_CLK
Notch
Notch
Notch
Notch
Notch
Notch
Notch
Notch
GND
11
10
LED1#(3.3V)
USB D-
9
8
W_DISABLE1#(3.3V)
USB D+
7
6
FUL_CARD_POWER_OFF#(1.8V)
GND
5
4
+3.3V
GND
3
2
+3.3V

L830-EA M.2 Module Hardware User Manual Page
19
of
45
CONFIG_3
1
Figure 4-2 Pin Diagram (TOP View)
4.1.2 Description of Pins
Pins of L830-EA M.2 modules are described in the table below:
Pin#
PIN Name
I/O
Reset
Value
Idle
Value
Description
1
CONFIG_3
O
L
L
The internal connected with GND,
L830-EA M.2 module shall configure
as the WWAN-SSIC0 interface type.
2
+3.3V
PI
Main power supply, voltage range:
3.135V ~ 4.4V
3
GND
GND
4
+3.3V
PI
Main power supply, voltage range:
3.135V ~ 4.4V
5
GND
GND
6
FUL_CARD_POWER_OFF#
I
PU
PU
Power off control signal, internal
200K pull-down resistor, CMOS 1.8V
7
USB D+
I/O
USB2.0 signal +
8
W_DISABLE1#
I
PD
PU
WWAN Disable, Low active,
CMOS 3.3V
9
USB D-
I/O
USB2.0 signal -
10
LED1#
O
OD
OD
System status LED, drain output ,
active low , CMOS 3.3V
11
GND
GND
12
Notch
Notch
13
Notch
Notch
14
Notch
Notch
15
Notch
Notch
16
Notch
Notch
17
Notch
Notch
18
Notch
Notch
19
Notch
Notch
20
I2S_CLK
O
PD
T
I2S serial clock，CMOS 1.8V ,

L830-EA M.2 Module Hardware User Manual Page
20
of
45
(Not supported yet )
21
CONFIG_0
O
NC
NC
Not connected.
L830-EA M.2 module shall configure
as the WWAN-SSIC0 interface type.
22
I2S_RX
I
PD
T
I2S serial data input, CMOS 1.8V ,
(Not supported yet )
23
WOWWAN#
O
PD
PU
The module wake-up Host device
signal, active low, CMOS 1.8V
24
I2S_TX
O
PD
T
I2S serial data output，CMOS 1.8V ,
(Not supported yet )
25
DPR
I
PD
PU
Body SAR Detect，CMOS 1.8V
26
W_DISABLE2#
I
PD
PU
GPS Disable signal, active low,
CMOS 1.8V（not supported yet）
27
GND
GND
28
I2S_WA
O
PD
T
I2S left and right channel clock
(LRCK) , CMOS 1.8V ,
(Not supported yet )
29
SSIC-TXN
O
USB SSIC Transmit data minus
30
UIM_RESET
O
PP
PP
USIM card reset signal
31
SSIC-TXP
O
USB SSIC Transmit data plus
32
UIM_CLK
O
PP
PP
USIM card clock signal
33
GND
GND
34
UIM_DATA
I/O
PU
PU
USIM card data signal，
internal 4.7K pull-up resistor
35
SSIC-RXN
I
USB SSIC Receive data minus
36
UIM_PWR
O
SIM card power supply output，
1.8V/3.0V
37
SSIC-RXP
I
USB SSIC Receive data plus
38
NC
NC
39
GND
GND
40
GNSS_SCL
O
PU
PU
I2C serial data clock signal，
internal 4.7K pull-up resistor，
CMOS 1.8V