
xiv 2036947-001 © 2013 by General Electric Company. All rights reserved.
Table of Contents
1.5.4 DINAMAP®Models PRO Series 100-400 and ProCare ............................................................... 22
1.6 Theory of Operation ................................................................................................................................................ 23
1.6.1 Digital System Processor (DSP) / Display Board........................................................................... 23
1.6.2 Main Board..................................................................................................................................................... 25
1.6.3 User-Interface Keypad & Volume/Alarm Keypad Boards........................................................ 26
1.6.4 Video Decoder Board ................................................................................................................................ 26
1.6.5 Recorder Board ............................................................................................................................................26
1.6.6 Communications Board ........................................................................................................................... 26
1.6.7 MSpO2Connector Board ......................................................................................................................... 26
1.6.8 MSpO2Carrier Board................................................................................................................................. 27
1.6.9 FECG/UA Board............................................................................................................................................. 27
1.6.10 MECG Board................................................................................................................................................27
1.6.11 Dual Ultrasound Board.......................................................................................................................... 27
1.6.12 Isolated Power Supply Board.............................................................................................................. 28
1.6.13 Front-End Motherboard......................................................................................................................... 28
1.6.14 Memory Battery........................................................................................................................................28
Chapter 2: Installation ........................................................................................................ 29
2.1 Time Required for Installation.............................................................................................................................. 29
2.2 Environmental Requirements .............................................................................................................................. 29
2.3 Tool Requirements .................................................................................................................................................... 29
2.4 Installation Procedure ............................................................................................................................................. 29
2.4.1 Strip Chart Recorder Paper Load......................................................................................................... 29
2.4.2 Peripheral Connections............................................................................................................................ 31
2.4.3 Power Cord Attachment........................................................................................................................... 31
2.4.4 System Conguration ............................................................................................................................... 31
Chapter 3: Maintenance and Checkout .......................................................................... 35
3.1 Procedures Schedule............................................................................................................................................... 35
3.1.1 Environmental Requirements................................................................................................................ 36
3.2 Tool Requirements .................................................................................................................................................... 36
3.3 Maintenance and Checkout Procedures........................................................................................................ 36
3.3.1 Visual Inspection..........................................................................................................................................36
3.3.2 Cleaning (Thermal Print Head) .............................................................................................................. 37
3.3.3 Transducer Checks..................................................................................................................................... 37
3.3.4 Functional Checks....................................................................................................................................... 38
3.3.5 Pattern Memory Check............................................................................................................................. 49
3.3.6 NIBP Calibration Check............................................................................................................................. 52
3.3.7 Electrical Safety Tests ............................................................................................................................... 52