Hitachi AP1 Product guide

@HITACHI
#AP1
4-BIT SINGLE-CHIP
MICROCOMPUTER
DATA BOOK

#AP-1
4-BIT SINGLE-CHIP
MICROCOMPUTER
DATABOOK
.HITACHI

This advance data has been preliminarily prepared based on manuscript
translated in Japan. Use this information with caution, therefore, as the
accuracy
of the copy cannot be guaranteed. A revised, U.S. edition of this
technical data
is currently in preparation, and may be ordered by returning
the Business Reply Card at the back
of this publication.
When using this manual, the reader should keep the following in mind:
1. This manual may, wholly or partially, be subject to change without
notice.
2. All rights reserved: No one is permitted to reproduce
or duplicate, in
any form, the whole orpartofthismanual without Hitachi'spermission.
3. Hitachi will not be responsible for
any damage to the userthat may result
from accidents or
any other reasons during operation of his unit
according to this manual.
4. This manual neither ensures the enforcement
of any industrial
properties
or other rights, nor sanctions the enforcement right thereof.
Printed in U.S.A. Published: February 1985

INDEX
• GENERAL INFORMATION
• Quick Reference Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
.. 7
• Introduction of Packages ................................................................................. II
• Quality Assurance ...................................................................................... 19
• Reliability Test Data ..................................................................................... 25
• Design Procedure and Support Tools for 4-bit Single-chip Microcomputers ........................................ 31
• DATA SHEETS
• 4-bit Single-chip Microcomputer HMCS40 Series
HMCS44C (HD44801), HMCS44CL (HD44808)
........................................................... 38
HMCS45C (HD44820), HMCS45CL (HD44828)
........................................................... 60
HMCS46C (HD44840), HMCS46CL (HD44848)
........................................................... 82
HMCS47C (HD44860), HMCS47CL (HD44868)
........................................................... 108
• 4-bit Single-chip Microcomputer HMCS40 Series
Liquid Crystal Display Driving Type
LCD-III (HD44790, HD44795)
...................................................................... 137
LCD-IV (HD613901)
............................................................................... 174
• 4-bit Single-chip Microcomputer HMCS400 Series
HMCS404C (HD614042)
................................................................................ 221
HD614P080S ......................................................................................... 258
• Evaluation Chip for 4-bit Single-chip Microcomputers
HD44850E ........................................................................................... 292
HD44857E
................................................................... " ...................... 293
HD44797E
........................................................................................... 294
• NEW DEVICES
HMCS404AC (HD614048)
.............................................................................. 297
HMCS404CL (HD614045) .............................................................................. 335
NOTE: No new designs for HMCS 42/43/44A/45A/47 A/42C/42CL/43C/43CL
accepted after April 1984.
3

GENERAL
INFORMATION :
• Quick Reference Guide
• Introduction of Packages
• Quality Assurance
• Reliability Test Data
• Design Procedure and Support Tools
for 8-bit Single-chip Microcomputers

QUICK REFERENCE GUIDE
• CMOS 4-BIT SINGLE-CHIP MICROCOMPUTER HMCS40 SERIES
Family Name HMCS44CL
(HD44808)
(Type Name) HMCS44C
(HD44801)
!3 Supply Voltage (V)
3/5
:~ Power Dissipation (typ.) (mW) 0.4/0.9
II)
~ Max. I/O Terminal Voltage (V)
Vcc+
0.3
~ Operating Temperature Range *1
(oC)
-20 to+75
(,J Package
DP42, DP-42S
ROM (bits) 2,048 x 10
Memory 128x10*2
RAM (bits) 160 x 4
Registers 8
Stack Registers 4
'"
4-Bit Data Input
-
c:
0
.~
I/O Ports
4-Bit Data Output
-
c:
;::,
Discrete Output
32 -
u.
4-Bit Data Input/Output
4x4
Discrete Input/Output
1 x 16
External 2
Interrupts Timer/Counter 1
Instructions Number
of Instructions
71
Cycle Time
u,ts) 20/10
Built-in Clock Pulse Generator
Power on
Reset
No/Yes
Battery Back-up Halt
Evaluation Chip HD44850E
HD44857E
Reference
Page
174
*' Wide Temperature Range (-40 to + 85°C) version is available, except LCD·IV
*2 Pattern Memory
*3 LCD DRIVE FUNCTION
Common 4
LCD Segment 32
Drive
Duty Static, 1/2, 1/3, 1/4
Bias
1/2,1/3
Display Capability 4x32 Matrix (1/4 Duty)
Expandable using the LCD Driver HD44100H.
7
HMCS45CL
(HD44828)
HMCS45C
(HD44820)
3/5
0.4/0.9
Vcc+
0•3
-20to+75
FP-54, DP-64S
2,048 x 10
128x10*2
160x 4
6
4 -
4x1
44 -
4x6
1 x 16
2
1
71
20/10
No/Yes
Halt
HD44850E
HD44857E
196

QUICK REFERENCE GUIDE -----------------------------
HMCS46CL HMCS47CL LCD-m·3
LCD_IV·' (HD44848) (HD44868) (HD44795,
HMCS46C
HMCS47C
(HD613901)
(HD44840) (HD44860) HD44790)
3/5 3/5 3/5 3/5
0.4/9 0.4/9
0.4/6
0.8/13.5
VCC+
0•3 Vcc+0.3
VCC+
0•3 Vcc+0.3
-20to+75
-20 to +75
-20to +75 -20to+75
DP-42, Dp·42S
FP-54, DP-64S
FP-BO FP-BO
4,096 x 10
4,096 x 10 2,048 x 10 4,096 x 10
128 X 10d
256x4
256 x 4
160x4 256x4
8 6 6 6
4 4 4 4
--
4x1 4x1
- 4x1 4x1 4x1
32 -44 -32 -32 -
4x4
4)(6
4x2 4x~
1 x 16
1x 16
1 x 16 1 x 16
2 2 2 2
1"
1 1 1
71 71 71
71
20/5 20/5 20/10 20/5
Yes
NolYes NolYes
Yes
No
Halt Halt Halt Halt
HD44857E HD44857E HD44797E HD44797E
218 244 273 310
8

QUICK REFERENCE GUIDE
• CMOS 4·BIT SINGLE·CHIP MICROCOMPUTER HMCS400 SERIES
Familv Nama (TVpe Name)
(~~~~~~~)
HMCS404AC* HMQS404CL* HD614POSOSt
tl SupplV Voltage (V)
4to 6 4.5 to 6.0 2.7 to 6.0 4.5
to 5.5
:; Power Dissipation (typ) (mW)
9.0
13.5 4.5
9.0
iii! Max. I/O Terminal Voltage (V)
VCC-40
VCC-40 VCC-40
VCC-40
oJu
~ Operating Temperature Range
(OC)
-20 to +75
-20to +75
-20 to +75 -20 to +75
6 Package
FP-64, DP-64S FP-64, DP-64S FP·64, DP-64S DC-64SP
°4,096-word x 10-bit
with standard
EPROM 2764
Memory ROM (bits) 4096 x 10 4096 x 10 4096 x 10 o8,192-word x 10-bit
with standard
EPROM 27128
RAM (bits)
256x4
256 x 4
256x4
576x4
Registers 7 7 7 7
Stack Registers 16 16 16 16
l!;
4xl
4xl 4xl
4xl
0 4-Bit
Input
.~
2xl
2 xl
2 xl
2xl
c 4-Bit
Output
4x4
:I
I/O Ports 58
IL. 58
4x4
58
4x4
58
4x4
4-Bit Input/Output
4x5
4x5
4x5
4x5
l-Bit Input/Output
1 x 16 1 x 16 1 x 16 1 x 16
External 2 2 2 2
Interrupts Timer/Counter 2 2 2 2
Serial Interface 1 1 1 1
Number
of Instructions
99
99
99
99
Instructions Cvcle Time
U.s)
2 1.33 4 1.33
Built-in Clock Pulse Generator
Yes (External drive is possible)
Others Low Power Dissipation Mode (Stop mode, Stand-bv mode)
Reference
Page
357 394 396 398
* Under Development
t EPROM on the Packege TVpe
9

INTRODUCTION OF PACKAGES
Hitachi microcomputer devices are offered in a variety of
packages, to meet various user requirements.
1. Package Classification
When selecting suitable packaging, please refer to the
Package Classifications given in Fig. I for pin insertion, surface
mount,
and multi-function types, in plastic and ceramic.
Package Classification
Pin Insertion Type
Surface Mounting Type
Multi·function Type
DIP; DUAL IN LINE PACKAGE
S·DIP; SHRINK DUAL IN LINE PACKAGE
PGA: PIN GRID ARRAY
FLAT·DIP; FLAT DUAL IN LINE PACKAGE
FLAT·QUIP; FLAT QUAD IN LINE PACKAGE
CC: CHIP CARRIER
SOP;SMALL OUTLINE PACKAGE
FPP; FLAT PLASTIC PACKA.GE
PLCC;PLASTIC LEADED CH1P CARRIER
LCC ; LEADLESS CHIP CARRI·ER
Plastic
DIP
Ceramic DIP
Shrink Type Plastic DIP
Shrink Type Ceramic DIP
SOP (Plastic)
FPP (Plastic)
PLCC (Plastic)
LCC
(Glass Sealed Ceramic)
Fig. 1 Package Classification according to Material and Printed Circuit Board Mounting Type
11

INTRODUCTION OF PACKAGES------------------------
2. Type No. and Package Code Indication
The Hitachi type No. for 4-bit single-chip microcomputer devices
is followed
by package material and outline specifications, as shown
below.
The package type used for each device is identified by code as
Type No. Indication
follows, illustrated in the data sheet of each device.
When ordering, please write the package code next to the type
number.
HDxxxxxS
T
Package Code Indication
(Note) HDXXXPXXXX stands for Type No.
of EPROM on the package type
microcomputer device.
Package Classification
HMCS40 Series
No Indication; Plastic DIP
S; Shrink Type Plastic DIP
HMCS400 Series
F; FPP
P; Plastic DIP
S; Shrink Type Plastic DIP
DP-64S
Additional Outline
S; Shrink type
SP; EPROM on the shrink package type
12

3, Package Dimensional Outline
Hitachi 4-bit single-chip microcomputer devices employ the pack-
ages shown in Table I according to PCB mounting method.
Table 1 Package List
Mounting
method
Package classification
Standard outline (DIP)
Pin insertion
type
Shrink outline (S-DIP)
FPP
Surface mounting type
Flat package
FPC
Multi·function
type
EPROM on the package type
Plntie DIP
• OP-28
051 ....
h1 51_
0' -15' k--'\..O.20-0.31
• DP-42 13.4
21 22
~ '.H~
1l0.-1~ \
13
Package material Package
code
Plastic DP-28
DP-42
DP-28S
Plastic DP-42S
DP-64S
FP·54
Plastic
Fp·64
Fp·80
FP-100
Ceramic
FC·80
Ceramic DC·64SP
(Unit:mml
(Unit: mm)

INTRODUCTION OF PACKAGES------------------------
Shrink Type PII.tic DIP
• DP·28S
B.B
5.1 mix
14
(Unit: mm)
• DP-42S
140
11.1 miX.
I 0
~
21
22
(Unit: mm)
14

------------------------INTRODUCTION OF PACKAGES
• DP·64S
(Unit: mm)
I Flat Plastic Package I
• FP·54
(Unit: mm)
(Unit: mml
15

INTRODUCTION OF PACKAGESs-------------------------
• FP-IO
• FP·100
IFlat Package of Ceramic I
• Fe·80
28.0
0"5
2.9mB.
2.5I1111X.
0.2 to 0.38
16
(Unit: mm)
(Unit: mm)
(Unit: mm)

--------------------------------------------------INTRODUCTIONOFPACKAGES
.DC-64SP
I
~. 0.",0.11
-L~4 ~. L ,-"."'"-
',-==-
¥ ! -_0.05
~ ""' ..,
4. Mounting Method
Package lead pins are surface treated with solder coating or
plating to facilitate PCB mounting. The lead pins are connected
to the package
by eutectic solder. Common connecting method
of leads and precautions are explained as follows:
4.1 Mounting Methods of Pin Insertion Type Package
Insert lead pins into the PCB through-holes (usually about
4>0.8mm). Soak leads in a wave solder tub.
Lead pins held
by the through-holes enable handling of the
package through the sqldering process, and facilitate automated
soldering. When soldering leads in the wave solder tub,
do not
get solder on the package.
4.2 Mounting Method of Surface Mount Type Package
Applythe specified quantity of solder pasteto the pattern on
any printed board bythescreen printing method, to temporarily
fix the package to the board. The solder paste melts when heated
in a reflowing furnace, and package leads and the pattern
of the
printed board are fixed by the surface tension
of the melted
solder and self alignment.
Thesize
of the pattern where leads are attached should be 1.1
to 1.3 times the leads' width, depending on paste material or
furnace adjustment.
The temperature
of the reflowing furnace is dependent on
packaging material and type. Fig. 2 lists the adjustment of the
reflowing furnace for
FPP. Pre-heat the furnace to 150
0
C. Sur-
face temperature
of the resin should be kept at 235
0 C maximum
for
JO minutes or less.
(I) The temperature of the leads should be kept at 260° for 10 minutes
or less.
(2) The temperature of the resin should be kept at 235
0
for 10 minutes
or less.
(3) Below is shown the temperature profile when soldering a package
by the reflowing method.
17
'"
"
'"
'"
0.
E
~
Fig.2 Reflowing Furnace Adjustment
for FPP
IUnit:mm)
Time~
Employ adequate heating or temperature control equipment
to prevent damage to the plastic package epoxy-resin material.
When using an infrared heater, avoid long exposure
at tempera-
tures higher thanthe glass transition point
of epoxy-resin(about
150
0
C), which may cause package damage and loss of reliability
characteristics. Equalize the temperature inside and outside
of
packages by reducing the heat of the upper surface of the
packages.
FPP leads may easily bend in shipment or during handling,
and impact solderingonto the printed board. Heat the bent leads
again with a soldering iron to reshape them.
Use a rosin flux when SOldering, Do not use chloric flux
because the chlorine in the flux has a tendency to remain
on the
leads and reduce reliability.
Use alcohol, chlorothene orfreon to
wash away rosin flux from packages. These solvents should not
'remain on the packages for an excessive length
of time, because
the package markings may disappear.