Hitachi S10mini OD.RING User manual

First Edition, November 1998, SME-1-102(A) (out of print)
Second Edition, October 2002, SME-1-102(B) (out of print)
Third Edition, November 2007, SME-1-102(C) (out of print)
Fourth Edition, October 2008, SME-1-102(D)
All Rights Reserved, Copyright ©1998, 2008, Hitachi, Ltd.
The contents of this publication may be revised without prior notice.
No part of this publication may be reproduced in any form or by any means without permission
in writing from the publisher.
Printed in Japan.
BI-KB-KO<IC-NS> (FL-MW20, AI8.0)

SAFETY PRECAUTIONS
Be sure to read this manual and all other attached documents carefully before installing,
operating inspecting or conducting maintenance on this unit. Always use this unit properly.
Be sure to carefully read the information about the device, the safety information and precautions
before using this unit. Be sure that the person(s) responsible for maintenance receives and
understands this manual completely.
This manual divides the safety precautions into DANGERs and CAUTIONs.
: Failure to observe these warnings may result in death or serious injury.
: Failure to observe these cautions may result in injury or property
damage.
Failuretoobserveany may lead to serious consequences.
All of these DANGERs and CAUTIONs provide very important precautions and should
always be observed.
Additional safety symbols representing a prohibition or a requirement are as follows:
: Prohibition. For example, “Do not disassemble” is represented by:
: Requirement. For example, if a ground is required, the following will be shown:
DANGER
CAUTION
CAUTION

DANGER
 Devise an emergency stop circuit, interlock circuit, and other similar circuits
outside the programmable controller. Disregarding this rule may result in
damage to the equipment or cause an accident if the programmable controller
fails.
 Keep it in mind that this hardware unit operates on a high voltage. If the user
touches a high-voltage terminal inadvertently during connection or
disconnection of this hardware unit or its cable, he or she may suffer from an
electric shock. Also, this hardware unit may be damaged due to a short
circuit or noise. Be sure to switch off the hardware unit before connecting or
disconnecting it or its cable.
CAUTION
 This hardware unit may fail if the ambient temperature is too high. The
hardware unit may also malfunction due to interference by electromagnetic
waves from adjacent hardware. To dissipate heat and reduce
electromagnetic interference, provide the specified mount of space between
the cubicle and this hardware unit and between the hardware unit and other
ones.
 After installing this hardware unit, measure temperatures near the in-cubicle
controller and the mount base during operation, and check whether the
measurements are within the limits. If the specified amount of space cannot
be provided or the measured temperature is too high, use a cooling fan.
 At an extremely high temperature, this hardware unit may fail. Secure the
mount base to a vertical surface. If the mount base is secured horizontally,
heat does not dissipate efficiently, resulting in an extremely high temperature.
This may further cause the hardware unit to fail or its parts to deteriorate.
 This hardware unit may be damaged due to static electricity. Ground yourself
before setting switches or connecting or disconnecting cables or connectors
with the hardware unit.
 This hardware unit may be damaged during its installation or removal unless
the following rules are observed:
• Check that the connector pins are not damage (bent or broken), are aligned
straight and are free from dust.
• Move the hardware unit along an imaginary vertical surface to the face of the
mount base. If the product is inserted or removed slantwise from the
connector on the mount base, connector pins may be bent.

REQUIREMENT
Electric shock hazards exist so that you might suffer burns or become
electrocuted. Further, the system might malfunction due to noise interference.
Therefore, ground the line ground (LG), frame ground (FG), and shield wire
(SHD) as directed below:
• Insulate the mount base from the enclosure. To keep the mount base
insulated, avoid removing the insulation sheets that are supplied with the mount
base.
• The LG is a ground terminal for power supply noise. The FG and SHD are
ground terminals for the noise in the communication module and other external
interface lines. To avoid interference between the ground terminals,
separately ground the LG and FG.
• Ground the module’s FG by shorting it to the mount base’s FG terminal. Note,
however, that the FG terminal for each remote I/O line or JPCN-1 line must be
connected separately to a single place on the terminating side.
REQUIREMENT
 A surge voltage may cause hardware units to malfunction or to be damaged.
Where a coil such as one in an electromechanical relay is connected to the
PCs’ OK output circuit, protect the relay with a surge-absorbing diode that is
capable of withstanding a peak inverse voltage of at least 10 times the circuit
voltage and has a forward current equal to or larger than the load current.
 Excessive accumulation of heat in the cubicle may cause a fire or hardware
failure. When the temperature in the cubicle reaches 48°C or higher, the
maximum output current of the power supply module is limited. At 55°C, for
instance, it is limited to 5.85 A. Where this is very likely, install a cooling fan
in the cubicle or reduce the number of modules installed therein.
 If the battery is handled improperly, it may catch fire or explode. Some used
batteries may still have a considerable amount of charge. To deliver such
used batteries to a waste disposal site safely, follow the general rules for
collection, packing, and transportation. For concrete methods of packing and
transportation, consult with professionals of your local waste disposal
business.

PROHIBITION
If a part in a module is damaged, do not replace the part, but replace the faulty
module in its entirety, except when the part is the battery for the CPU.

WARRANTY AND SERVICING
Unless a special warranty contract has been arranged, the following warranty is applicable to this
product.
1. Warranty period and scope
Warranty period
The warranty period for this product is for one year after the product has been delivered to the
specified delivery site.
Scope
If a malfunction should occur during the above warranty period while using this product under
normal product specification conditions as described in this manual, please deliver the
malfunctioning part of the product to the dealer or Hitachi Engineering & Services Co., Ltd.
The malfunctioning part will be replaced or repaired free of charge. If the malfunctioning is
shipped, however, the shipment charge and packaging expenses must be paid for by the
customer.
This warranty is not applicable if any of the following are true.
 The malfunction was caused by handling or use of the product in a manner not specified in
the product specifications.
 The malfunction was caused by a unit other than that which was delivered.
 The malfunction was caused by modifications or repairs made by a vendor other than the
vendor that delivered the unit.
 The malfunction was caused by a relay or other consumable which has passed the end of its
service life.
 The malfunction was caused by a disaster, natural or otherwise, for which the vendor is not
responsible.
The warranty mentioned here means the warranty for the individual product that is delivered.
Therefore, we cannot be held responsible for any losses or lost profits that result from the
operation of this product or from malfunctions of this product. This warranty is valid only in
Japan and is not transferable.
2. Range of services
The price of the delivered product does not include on-site servicing fees by engineers.
Extra fees will be charged for the following:
 Instruction for installation and adjustments, and witnessing trial operations.
 Inspections, maintenance and adjustments.
 Technical instruction, technical training and training schools.
 Examinations and repairs after the warranty period is concluded.
 Even if the warranty is valid, examination of malfunctions that are caused by reasons
outside the above warranty scope.

This manual provides information for the following hardware product:
<Hardware product>
OD.RING (LQE010/LQE015)
<Changes added to this manual>
Description of added changes Page
Section 6.5, “Replacing or Adding On the Module” is newly added. 6-9
In addition to the above changes, all the unclear descriptions and typographical errors found are also
corrected without prior notice.

Revision record
Revision No. Revision Record (revision details and reason for revision) Month, Year Remarks
A First Edition November 1998
D Section 6.5, “Replacing or Adding On the Module” is
newly added.
October 2008

i
PREFACE
We greatly appreciate your purchase of the optical dual ring (OD.RING: Optical Dual RING) module,
an option for the CPU. This manual describes the operation of the OD.RING module. We request
that you read this manual carefully to assure correct use of this product.
This option module is available in two types: standard model and environmentally resistant model.
The environmentally resistant model has thicker platings and coatings than those for the standard
model.
The model number of the environmentally resistant model is marked by adding the suffix “-Z” to the
model number of the standard model.
(Example)
Standard model: LQE010
Environmentally resistant model: LQE010-Z
This manual is applicable to both the standard model and environmentally resistant models.
Although the descriptions contained in this manual are based on the standard model, follow the
instructions set forth in this manual for proper use of the product even if you use the environmentally
resistant model.
<Trademarks>
Microsoft® Windows® operating system is registered trademarks of Microsoft Corporation in the
United States and/or other countries.
NOTE
The OD.RING microprogram is stored in flash memory and no addition software
for this module need not be loaded.

ii
CONTENTS
1 BEFORE USE ..................................................................................................................... 1-1
1.1 CPU Mount Base ............................................................................................................. 1-2
1.2 Installing Optional Modules............................................................................................. 1-2
1.3 Grounding ........................................................................................................................ 1-4
1.4 Replacing Modules .......................................................................................................... 1-4
2 SPECIFICATIONS.............................................................................................................. 2-1
2.1 Use ................................................................................................................................... 2-2
2.2 Specifications................................................................................................................... 2-2
3 NAMES AND FUNCTIONS OF EACH PART AND CABLING..................................... 3-1
3.1 Names and Functions of Each Part .................................................................................. 3-2
3.2 Cabling............................................................................................................................. 3-3
4 USER GUIDE...................................................................................................................... 4-1
4.1 Operation.......................................................................................................................... 4-2
4.2 Transfer Cycle.................................................................................................................. 4-3
4.3 Synchronism of Transfer Data ......................................................................................... 4-4
4.4 Memory Transfer Area..................................................................................................... 4-5
4.5 Failures and Avoidance.................................................................................................... 4-6
4.6 RAS Table...................................................................................................................... 4-11
4.7 Hold Operation/Clear Operation.................................................................................... 4-12
5 OPERATION....................................................................................................................... 5-1
5.1 Startup Procedure............................................................................................................. 5-2
5.2 Setting Switches............................................................................................................... 5-3
5.3 Powering Up .................................................................................................................... 5-4
5.4 Editing Parameters ........................................................................................................... 5-5
5.4.1 Organization of OD.RING support system functions .............................................. 5-5
5.5 Data Transmission ........................................................................................................... 5-7
6 MAINTENANCE ................................................................................................................ 6-1
6.1 Maintenance and Checking.............................................................................................. 6-2
6.2 Test/Maintenance Program (T/M) ................................................................................... 6-3
6.2.1 Executing T/M ......................................................................................................... 6-4

iii
6.2.2 T/M1 (internal loopback test).................................................................................. 6-4
6.2.3 T/M2 (external loopback test) ................................................................................. 6-5
6.2.4 T/M3 (offline communication data check).............................................................. 6-6
6.3 Handling an Optical Fiber Cable and Connector............................................................. 6-7
6.4 Replacing Optical Fiber Cables....................................................................................... 6-8
6.5 Replacing or Adding On the Module .............................................................................. 6-9
6.6 Optical Level Measurement........................................................................................... 6-13
6.6.1 Optical receiving level measurement .................................................................... 6-13
6.6.2 Locating a fault portion ......................................................................................... 6-15
6.6.3 Optical transmitting level measurement................................................................ 6-16
7 TROUBLESHOOTING ...................................................................................................... 7-1
7.1 Trouble Detection and Solution....................................................................................... 7-2
7.2 Error Display and Countermeasures................................................................................ 7-4
7.2.1 CPU indicators display messages ............................................................................ 7-5
7.3 Monitoring a Specific Module......................................................................................... 7-6
7.4 Error Freeze ..................................................................................................................... 7-7
7.5 Communication Trace ................................................................................................... 7-10
7.5.1 Trace buffer structure ............................................................................................ 7-10
7.5.2 Structure of trace control table .............................................................................. 7-11
7.5.3 Trace data structure ............................................................................................... 7-13
7.5.4 Trace events and trace processing ......................................................................... 7-14
APPENDIX ............................................................................................................................. A-1
A.1 Optical Fiber Cables ....................................................................................................... A-2
A.1.1 Types of optical fiber cables................................................................................... A-2
A.1.2 Optical fiber cable specifications ........................................................................... A-4
A.1.3 Recommended cables ............................................................................................. A-5
A.2 Trouble Report................................................................................................................ A-7

iv
FIGURES
Figure 1-1 CPU Mount Base ............................................................................................... 1-2
Figure 1-2 Optional Module Insertion Slots........................................................................ 1-2
Figure 1-3 Optional Module Mounting Method.................................................................. 1-3
Figure 1-4 Grounding .......................................................................................................... 1-4
Figure 3-1 Front of OD.RING Module................................................................................ 3-2
Figure 3-2 Optical Fiber Cable Connection ........................................................................ 3-3
Figure 3-3 Handling Optical Fiber Cables........................................................................... 3-4
Figure 4-1 Example of System Configuration..................................................................... 4-2
Figure 4-2 Memory Transfer ............................................................................................... 4-2
Figure 4-3 Transfer Cycle.................................................................................................... 4-3
Figure 4-4 Areas Set by Each Module................................................................................. 4-5
Figure 4-5 Data Flow in Normal Operation of Primary Ring and Secondary Ring ............ 4-6
Figure 4-6 When One Ring is Disconnected at One Place.................................................. 4-7
Figure 4-7 When One Ring is Disconnected at Several Places ........................................... 4-7
Figure 4-8 When Both Primary Ring and Secondary Ring are Disconnected at
Same Place......................................................................................................... 4-8
Figure 4-9 When Primary Ring or Secondary Ring is Disconnected at Several Places ...... 4-8
Figure 4-10 When Adjacent Multiple Modules Stop (Power Failure) .................................. 4-9
Figure 4-11 When Nonadjacent Multiple Modules Stop (Power Failure) ............................ 4-9
Figure 4-12 When the Primary Ring and Secondary Ring are Disconnected at
Different Places................................................................................................ 4-10
Figure 4-13 Structure of RAS Table.................................................................................... 4-11
Figure 5-1 Startup Procedure............................................................................................... 5-2
Figure 5-2 Front View of CPU............................................................................................ 5-4
Figure 5-3 Organization of OD.RING Support System Functions...................................... 5-5
Figure 5-4 Front View of the CPU (RUN State) ................................................................. 5-7
Figure 6-1 Connecting Optical Fiber Cables (T/M2) .......................................................... 6-5
Figure 6-2 A Sample System Configuration ....................................................................... 6-9
Figure 6-3 Example of Optical Receiving Level Measurement ........................................ 6-14
Figure 6-4 Locating a Faulty Portion................................................................................. 6-15
Figure 6-5 Example of Optical Transmitting Level Measurement.................................... 6-17
Figure 7-1 Error Freeze Information Format....................................................................... 7-7
Figure 7-2 Stack Frame Format........................................................................................... 7-9
Figure 7-3 Trace Buffer Structure ..................................................................................... 7-10
Figure 7-4 Structure of Trace Control Table ..................................................................... 7-11

v
Figure 7-5 Setting Mask Data ⎯Example 1 .................................................................... 7-12
Figure 7-6 Setting Mask Data ⎯Example 2 .................................................................... 7-12
Figure 7-7 Trace Data Structure........................................................................................ 7-13
Figure 7-8 Details of Frame Header.................................................................................. 7-13
Figure 7-9 Trace Factor..................................................................................................... 7-15
Figure 7-10 Error Status on Transmission .......................................................................... 7-15
Figure 7-11 Error Status on Reception................................................................................ 7-16

vi
TABLES
Table 3-1 Setting of Module No. Switch ............................................................................... 3-2
Table 4-1 Expressions for Calculating Transfer Cycle .......................................................... 4-3
Table 4-2 Memory Transfer Area .......................................................................................... 4-5
Table 4-3 Failures and RAS Table....................................................................................... 4-12
Table 5-1 Setting of Module No. Switch and CPL No. Switch ............................................. 5-3
Table 5-2 Settable Address Ranges ....................................................................................... 5-6
Table 6-1 Check Items ........................................................................................................... 6-2
Table 6-2 Types and Functions of T/M Routines .................................................................. 6-3
Table 6-3 Notes on Handling................................................................................................. 6-7
Table 7-1 CPU Indicators Display Messages......................................................................... 7-5
Table 7-2 Error Codes............................................................................................................ 7-8
Table 7-3 Correspondence between Trace Events and Trace Processing............................ 7-14
Table 7-4 Details of Error Status ......................................................................................... 7-16
Table A-1 Types of Optical Fiber Cables (for the LQE010) ................................................. A-2
Table A-2 Optical Fiber Cables (for the LQE015) ................................................................ A-3
Table A-3 Optical Fiber Cable Specifications (for the LQE010) .......................................... A-4
Table A-4 Optical Fiber Cable Specifications (for the LQE015) .......................................... A-4

1 BEFORE USE

1 BEFORE USE
1-2
1.1 CPU Mount Base
Use of optional modules requires a CPU mount
base. There are three types of CPU mount
bases:
2-slot mount base (model: HSC-1020)
4-slot mount base (model: HSC-1040)
8-slot mount base (model: HSC-1080)
Figure 1-1 CPU Mount Base On the 8-slot mount base, for example, up to
eight modules can be installed.
1.2 Installing Optional Modules
PS slot: A slot into which the CPU power supply
(LQV000) module is inserted.
CPU slot: A slot into which the CPU module
(LQP000 or LQP010) is inserted.
Slots 0 to 7: Slots into which optional modules
are inserted.
Figure 1-2 Optional Module Insertion Slots
CAUTION
Insert OD.RING modules sequentially into the slots, starting from the leftmost
one, without creating any empty slots in between.
CPU mount
base
Option slots
CPU optional
module
CPU module
CPU power
supply
module
CPU 0
1
67
45 23
1

1 BEFORE USE
1-3
Note the following when installing the optional module:
 As shown in Figure 1-3, install the optional module upright on the CPU mount base. Installing
the optional module aslant on the mount base may bend a connector pin. If the pin is bent, the
optional module may malfunction.
Figure 1-3 Optional Module Mounting Method
CAUTION
When the CPU mount base is located over the head because of the cabinet
structure used, take care not to mount the optional modules aslant by using a
stepladder or the like.
Bad example Good example

1 BEFORE USE
1-4
1.3 Grounding
* Class D grounding is defined in the Technical Standard for Electrical
Facilities of Japan. This standard states that the grounding resistance
must be 100 ohms for equipment operating on 300 VAC or less, and
500 ohms or less for devices that shut down automatically within 0.5
seconds when shorting occurs in low tension lines.
Figure 1-4 Grounding
REQUIREMENT
 In frame ground (FG) cabling, connect the FG terminal of each module with
external terminals to the cubicle ground connection of the mount base. Apply
Class D grounding from the cubicle ground connection of the mount base.
 Use a ground wire whose diameter is 2 mm2 or larger.
1.4 Replacing Modules
CAUTION
Be sure to turn off the power supply when replacing the optional module.
Failure to observe this rule may destroy software.
Class D grounding*
Grounding terminal
Mount base
Grounding terminal